TWD201038S - 半導體製造裝置用密封蓋護罩 - Google Patents

半導體製造裝置用密封蓋護罩

Info

Publication number
TWD201038S
TWD201038S TW107306363F TW107306363F TWD201038S TW D201038 S TWD201038 S TW D201038S TW 107306363 F TW107306363 F TW 107306363F TW 107306363 F TW107306363 F TW 107306363F TW D201038 S TWD201038 S TW D201038S
Authority
TW
Taiwan
Prior art keywords
sealing cover
semiconductor manufacturing
manufacturing equipment
article
design
Prior art date
Application number
TW107306363F
Other languages
English (en)
Chinese (zh)
Inventor
Yusaku Okajima
Shuhei Saido
Hidenari Yoshida
Takafumi Sasaki
Original Assignee
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TWD201038S publication Critical patent/TWD201038S/zh

Links

TW107306363F 2018-05-18 2018-10-29 半導體製造裝置用密封蓋護罩 TWD201038S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-10931F JP1624334S (enrdf_load_stackoverflow) 2018-05-18 2018-05-18

Publications (1)

Publication Number Publication Date
TWD201038S true TWD201038S (zh) 2019-11-21

Family

ID=65269280

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107306363F TWD201038S (zh) 2018-05-18 2018-10-29 半導體製造裝置用密封蓋護罩

Country Status (3)

Country Link
US (1) USD916037S1 (enrdf_load_stackoverflow)
JP (1) JP1624334S (enrdf_load_stackoverflow)
TW (1) TWD201038S (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD230332S (zh) 2021-04-12 2024-03-11 美商蘭姆研究公司 (美國) 基板處理系統用台座
TWD235139S (zh) 2023-07-07 2024-12-01 美商蘭姆研究公司 (美國) 基板處理系統用台座
TWD236177S (zh) 2023-07-07 2025-02-01 美商蘭姆研究公司 (美國) 基板處理系統用台座
TWD239110S (zh) 2023-07-07 2025-07-01 美商蘭姆研究公司 (美國) 基板處理系統用台座

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11887878B2 (en) 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
USD947914S1 (en) * 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support
JP1700781S (ja) * 2021-03-22 2021-11-29 基板処理装置用断熱板
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD616390S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
JP1579504S (enrdf_load_stackoverflow) 2016-07-26 2017-06-19
JP1598442S (enrdf_load_stackoverflow) * 2017-08-09 2018-02-26
JP1620194S (enrdf_load_stackoverflow) * 2018-01-22 2018-12-10

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD230332S (zh) 2021-04-12 2024-03-11 美商蘭姆研究公司 (美國) 基板處理系統用台座
TWD232576S (zh) 2021-04-12 2024-08-01 美商蘭姆研究公司 (美國) 基板處理系統用台座
USD1057675S1 (en) 2021-04-12 2025-01-14 Lam Research Corporation Pedestal for a substrate processing system
TWD235139S (zh) 2023-07-07 2024-12-01 美商蘭姆研究公司 (美國) 基板處理系統用台座
TWD236177S (zh) 2023-07-07 2025-02-01 美商蘭姆研究公司 (美國) 基板處理系統用台座
TWD239110S (zh) 2023-07-07 2025-07-01 美商蘭姆研究公司 (美國) 基板處理系統用台座

Also Published As

Publication number Publication date
USD916037S1 (en) 2021-04-13
JP1624334S (enrdf_load_stackoverflow) 2019-02-12

Similar Documents

Publication Publication Date Title
TWD201038S (zh) 半導體製造裝置用密封蓋護罩
JP1666154S (ja) 喫煙用エアロゾル発生器のカバー
TWD189313S (zh) 用於半導體製造設備的承載器
TWD190344S (zh) Shield ring for plasma processing unit
TWD192740S (zh) 病患連接裝置的頭罩帶
TWD185737S (zh) 包裝盒
TWD184276S (zh) 用於沈積之晶圓載體
TWD183206S (zh) 用於沈積之晶圓載體
TWD192468S (zh) 真空吸塵器（三十九）
TWD193014S (zh) Sealing cover inner cover
TWD200593S (zh) 口腔用具之容器
TWD172230S (zh) 電子裝置之保護套
TWD192692S (zh) 真空吸塵器（五十三）
TWD192465S (zh) 真空吸塵器（九）
TWD193517S (zh) 氣炸鍋之容器之蓋
TWD191754S (zh) Packaging bag
TWD192132S (zh) 容器
TWD189808S (zh) 容器用蓋
MX2017011952A (es) Empaque.
TWD186298S (zh) 電子裝置保護盒
MX2015017022A (es) Precinto higienico para envases.
TWD185050S (zh) 密封蓋用外罩
PH12017500053A1 (en) Soft packet of cigarettes provided with a closing stamp
TWD174919S (zh) 基板處理裝置用氣體供給噴嘴
TWD193145S (zh) Cold box cover