TWD193438S - Jet ring for plasma processing unit - Google Patents

Jet ring for plasma processing unit

Info

Publication number
TWD193438S
TWD193438S TW107300619F TW107300619F TWD193438S TW D193438 S TWD193438 S TW D193438S TW 107300619 F TW107300619 F TW 107300619F TW 107300619 F TW107300619 F TW 107300619F TW D193438 S TWD193438 S TW D193438S
Authority
TW
Taiwan
Prior art keywords
plasma processing
processing unit
jet ring
article
design
Prior art date
Application number
TW107300619F
Other languages
English (en)
Chinese (zh)
Inventor
奥田浩司
田中基裕
Original Assignee
日商日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日立全球先端科技股份有限公司 filed Critical 日商日立全球先端科技股份有限公司
Publication of TWD193438S publication Critical patent/TWD193438S/zh

Links

TW107300619F 2017-07-31 2018-01-31 Jet ring for plasma processing unit TWD193438S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2017-16497F JP1598984S (enrdf_load_stackoverflow) 2017-07-31 2017-07-31
JP2017-016497 2017-07-31

Publications (1)

Publication Number Publication Date
TWD193438S true TWD193438S (zh) 2018-10-11

Family

ID=61274621

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107300619F TWD193438S (zh) 2017-07-31 2018-01-31 Jet ring for plasma processing unit

Country Status (3)

Country Link
US (1) USD871608S1 (enrdf_load_stackoverflow)
JP (1) JP1598984S (enrdf_load_stackoverflow)
TW (1) TWD193438S (enrdf_load_stackoverflow)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12387913B2 (en) 2022-07-08 2025-08-12 Tosoh Smd, Inc. Dynamic vacuum seal system for physical vapor deposition sputter applications

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US12293902B2 (en) 2018-01-19 2025-05-06 Applied Materials, Inc. Process kit for a substrate support
USD889335S1 (en) * 2018-10-03 2020-07-07 Vaughn C Jewell Disc
JP1640255S (enrdf_load_stackoverflow) * 2018-10-25 2019-09-02
USD917825S1 (en) * 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring
JP1659287S (enrdf_load_stackoverflow) * 2019-10-18 2020-05-11
USD974910S1 (en) * 2020-02-04 2023-01-10 Wilson Sporting Goods Co. Tennis ball container overcap
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1062662S1 (en) * 2023-03-30 2025-02-18 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
USD1063595S1 (en) * 2023-03-30 2025-02-25 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
JP1760971S (enrdf_load_stackoverflow) * 2023-08-31 2024-01-10

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12387913B2 (en) 2022-07-08 2025-08-12 Tosoh Smd, Inc. Dynamic vacuum seal system for physical vapor deposition sputter applications

Also Published As

Publication number Publication date
JP1598984S (enrdf_load_stackoverflow) 2018-03-05
USD871608S1 (en) 2019-12-31

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