TWD177550S - 具有紋理尖端之陶瓷接合工具之部分 - Google Patents

具有紋理尖端之陶瓷接合工具之部分

Info

Publication number
TWD177550S
TWD177550S TW104304080F TW104304080F TWD177550S TW D177550 S TWD177550 S TW D177550S TW 104304080 F TW104304080 F TW 104304080F TW 104304080 F TW104304080 F TW 104304080F TW D177550 S TWD177550 S TW D177550S
Authority
TW
Taiwan
Prior art keywords
view
bonding tool
ceramic bonding
design
textured tip
Prior art date
Application number
TW104304080F
Other languages
English (en)
Chinese (zh)
Inventor
Cesar Alfaro
Russell Bell
Anne Cenedella
Steve Govorchin
Mark S Greenwell
Brian Seegmiller
Matthew Simpson
Original Assignee
闊斯泰股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 闊斯泰股份有限公司 filed Critical 闊斯泰股份有限公司
Publication of TWD177550S publication Critical patent/TWD177550S/zh

Links

TW104304080F 2015-02-03 2015-07-29 具有紋理尖端之陶瓷接合工具之部分 TWD177550S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/516,523 USD797171S1 (en) 2015-02-03 2015-02-03 Ceramic bonding tool with textured tip

Publications (1)

Publication Number Publication Date
TWD177550S true TWD177550S (zh) 2016-08-11

Family

ID=56090501

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104304080F TWD177550S (zh) 2015-02-03 2015-07-29 具有紋理尖端之陶瓷接合工具之部分
TW105302376F TWD178579S (zh) 2015-02-03 2015-07-29 具有紋理尖端之陶瓷接合工具之部分

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW105302376F TWD178579S (zh) 2015-02-03 2015-07-29 具有紋理尖端之陶瓷接合工具之部分

Country Status (3)

Country Link
US (2) USD797171S1 (ja)
JP (2) JP1560541S (ja)
TW (2) TWD177550S (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD855089S1 (en) * 2016-02-29 2019-07-30 Moldman Systems Llc Mixer assembly
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
USD877219S1 (en) * 2017-04-27 2020-03-03 Hakko Corporation Soldering tip

Family Cites Families (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2721250A (en) * 1953-01-15 1955-10-18 Milton N Franklin Inert gas welding torch nozzle
US3101634A (en) 1960-09-12 1963-08-27 Gulton Ind Inc Sonic welder
DE1439262B2 (de) 1963-07-23 1972-03-30 Siemens AG, 1000 Berlin u. 8000 München Verfahren zum kontaktieren von halbleiterbauelementen durch thermokompression
US3453142A (en) * 1966-03-14 1969-07-01 Air Reduction Welding electrode and composition
BE757977A (fr) * 1969-11-24 1971-04-01 Stoody Co Procede et electrode de soudage a l'arc pour acier inoxydable
US3690538A (en) 1970-02-25 1972-09-12 Gaiser Tool Co Bonding tool
US3698646A (en) * 1971-01-08 1972-10-17 Pfizer Composite carbon insert for gas shielded welding torch nozzle
US4030657A (en) 1972-12-26 1977-06-21 Rca Corporation Wire lead bonding tool
USD255318S (en) 1977-11-22 1980-06-10 Bakkeren Hans A Ultrasonic welding head for polypropylene strapping
US4343983A (en) * 1979-09-20 1982-08-10 Westinghouse Electric Corp. Non-consumable composite welding electrode
USD269521S (en) * 1980-12-02 1983-06-28 Aga Aktiebolag Nozzle component for a cutting torch
USD271741S (en) 1981-02-02 1983-12-13 Eldon Industries, Inc. Soldering iron tip
US4415115A (en) * 1981-06-08 1983-11-15 Motorola, Inc. Bonding means and method
US4405074A (en) * 1981-08-31 1983-09-20 Kulicke And Soffa Industries Inc. Composite bonding tool and method of making same
US4411411A (en) * 1983-02-22 1983-10-25 Barthelmess Casey E Cutting torch guide attachment
US4600138A (en) 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
USD297704S (en) 1985-03-11 1988-09-20 Carol Bulow Miniature welding torch with disposable tip
JPH0445241Y2 (ja) 1986-05-26 1992-10-23
JPS6380845U (ja) 1986-11-14 1988-05-27
USD305720S (en) 1987-02-09 1990-01-30 Olgesby & Butler Plc Soldering iron with removable cap
US5217154A (en) 1989-06-13 1993-06-08 Small Precision Tools, Inc. Semiconductor bonding tool
DE8910049U1 (de) 1989-08-22 1989-11-23 Cooper Industries, Inc., Houston, Tex. Lötwerkzeug
US5485949A (en) 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
US5816472A (en) 1994-01-28 1998-10-06 Hewlett-Packard Company Bonding tool for tape automated assembly
US5445306A (en) 1994-05-31 1995-08-29 Motorola, Inc. Wedge wire bonding tool tip
US5683603A (en) 1995-04-19 1997-11-04 Fortune; William S. Electric soldering iron tip improvements
US6068174A (en) 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
US5954260A (en) 1996-12-17 1999-09-21 Texas Instruments Incorporated Fine pitch bonding technique
JP3440190B2 (ja) 1997-03-06 2003-08-25 株式会社新川 ワイヤボンディング方法
USD431434S (en) 1998-01-08 2000-10-03 Hakko Corporation Soldering iron tip
JPH11354569A (ja) 1998-06-05 1999-12-24 Hitachi Ltd ワイヤボンディング方法および装置ならびに半導体装置の製造方法
IT1305646B1 (it) 1998-08-07 2001-05-15 St Microelectronics Srl Formazione di globuli d'oro saldati su piazzuole di collegamento esuccessiva coniatura della loro sommita'
US6158647A (en) 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
JP2000202622A (ja) * 1999-01-18 2000-07-25 Hakko Kk 電気ハンダゴテ
JP4010432B2 (ja) 1999-01-29 2007-11-21 ローム株式会社 電子部品におけるワイヤボンディング方法及びその装置
US6651864B2 (en) * 1999-02-25 2003-11-25 Steven Frederick Reiber Dissipative ceramic bonding tool tip
US6646228B2 (en) 1999-08-18 2003-11-11 Hyperion Innovations, Inc. Cordless soldering iron
US6213898B1 (en) * 1999-09-16 2001-04-10 Callaway Golf Company Golf ball with an aerodynamic surface on a polyurethane cover
JP3474513B2 (ja) * 2000-03-09 2003-12-08 沖電気工業株式会社 キャピラリ
AU144116S (en) 2000-05-23 2001-06-01 Pentel Kk A correction pen
JP2002064117A (ja) 2000-08-22 2002-02-28 Mitsubishi Electric Corp ワイヤボンディング方法、ワイヤボンディング装置および半導体装置
US6729527B2 (en) 2001-01-30 2004-05-04 Kulicke & Soffa Investments, Inc. Bonding tool with polymer coating
US6910612B2 (en) * 2001-07-17 2005-06-28 Kulicke & Soffa Investments, Inc. Capillary with contained inner chamfer
US6715658B2 (en) * 2001-07-17 2004-04-06 Kulicke & Soffa Investments, Inc. Ultra fine pitch capillary
JP3566678B2 (ja) 2001-08-28 2004-09-15 京セラ株式会社 ワイヤーボンディング用キャピラリー
JP2004087822A (ja) 2002-08-27 2004-03-18 Mitsubishi Materials Corp ウェッジツール
JP3765778B2 (ja) 2002-08-29 2006-04-12 ローム株式会社 ワイヤボンディング用キャピラリ及びこれを用いたワイヤボンディング方法
AU2003295874A1 (en) 2002-11-22 2004-06-18 Saint-Gobain Ceramics And Plastics, Inc. Zirconia toughened alumina esd safe ceramic composition, component, and methods for making same
US20040109980A1 (en) * 2002-12-10 2004-06-10 Chen Sam H. Grip tape with self-textured surface
US7261230B2 (en) * 2003-08-29 2007-08-28 Freescale Semiconductor, Inc. Wirebonding insulated wire and capillary therefor
US7249702B2 (en) * 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
USD517384S1 (en) 2004-01-22 2006-03-21 Pentel Kabushiki Kaisha Wire solder applicator
US7407080B2 (en) 2004-04-02 2008-08-05 Chippac, Inc. Wire bond capillary tip
US7320425B2 (en) * 2004-05-12 2008-01-22 Kulicke And Soffa Industries, Inc. Low-profile capillary for wire bonding
USD549255S1 (en) 2004-11-08 2007-08-21 Dragos Axinte Soldering iron tip
WO2006116288A2 (en) 2005-04-22 2006-11-02 Regents Of The University Of Michigan Rotatable multi-pin apparatus, and process for friction driven stitch welding and structural modification of materials
US7216794B2 (en) 2005-06-09 2007-05-15 Texas Instruments Incorporated Bond capillary design for ribbon wire bonding
US8056794B2 (en) 2006-10-09 2011-11-15 Kulicke And Soffa Industries, Inc. Combination wedge bonding and ball bonding transducer
JP4989437B2 (ja) 2007-12-14 2012-08-01 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
USD598721S1 (en) 2008-04-24 2009-08-25 Luis Meza Motorcycle maintenance tool
JP2009283814A (ja) 2008-05-26 2009-12-03 Toshiba Lighting & Technology Corp ワイヤーボンディング用キャピラリーおよび電子部品組立装置
JP4595018B2 (ja) 2009-02-23 2010-12-08 株式会社新川 半導体装置の製造方法およびボンディング装置
USD667857S1 (en) 2009-06-04 2012-09-25 Smk Co., Ltd. Electrode tip for resistive welders
US7918378B1 (en) 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder
WO2012021349A2 (en) * 2010-08-10 2012-02-16 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related process
CN102373428A (zh) * 2010-08-19 2012-03-14 鸿富锦精密工业(深圳)有限公司 涂层、具有该涂层的被覆件及该被覆件的制备方法
JP5734236B2 (ja) 2011-05-17 2015-06-17 株式会社新川 ワイヤボンディング装置及びボンディング方法
JP5899907B2 (ja) 2011-12-26 2016-04-06 富士電機株式会社 ワイヤボンディング用のウェッジツール、ボンディング装置、ワイヤボンディング方法、および半導体装置の製造方法
CN104684709A (zh) * 2012-06-26 2015-06-03 卡勒克密封技术有限责任公司 垫圈材料,垫圈,以及相关方法
JP5510691B2 (ja) 2012-09-26 2014-06-04 Toto株式会社 ボンディングキャピラリ
USD697956S1 (en) 2013-01-24 2014-01-21 Tesa Tape Inc. Ultrasonic welding sheath
TWI511826B (zh) 2013-01-25 2015-12-11 Toto Ltd Welding needle
JP5376413B1 (ja) 2013-01-25 2013-12-25 Toto株式会社 ボンディングキャピラリ
JP2014222729A (ja) 2013-05-14 2014-11-27 住友電気工業株式会社 半導体装置の製造方法及び半導体装置の製造装置
USD720785S1 (en) 2013-10-30 2015-01-06 Sei Optifrontier Co., Ltd. Electrode bar for optical fiber fusion splicer
USD741127S1 (en) 2013-11-14 2015-10-20 Robert Bosch Gmbh Glue applicator
USD735787S1 (en) * 2014-09-22 2015-08-04 Victor Equipment Company Tapered nozzle
USD744560S1 (en) * 2014-09-22 2015-12-01 Victor Equipment Company Tapered contact tip
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD753739S1 (en) * 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool

Also Published As

Publication number Publication date
USD824970S1 (en) 2018-08-07
JP1551108S (ja) 2016-06-06
JP1560541S (ja) 2016-10-11
USD797171S1 (en) 2017-09-12
TWD178579S (zh) 2016-10-01

Similar Documents

Publication Publication Date Title
TWD177551S (zh) 具有紋理尖端之陶瓷接合工具之部分
TWD177552S (zh) 具有紋理尖端之陶瓷接合工具之部分
TWD178405S (zh) 幫浦之部分
TWD178579S (zh) 具有紋理尖端之陶瓷接合工具之部分
TWD174896S (zh) 連接器之部分
TWD170583S (zh) 瓶子之部分
TWD178249S (zh) 鞋之部分
TWD177555S (zh) 打線接合楔形工具之部分
TWD172280S (zh) 圓柱形照明家具之部分
TWD175424S (zh) 瓶之部分
TWD170170S (zh) 智慧手機配件之肌膚水分計
TWD164733S (zh) 輪胎之部分(二)
TWD174020S (zh) 夾鉗控制鍵之部分(一)
TWD169243S (zh) 夾子之部分
TWD182766S (zh) 桌鋸
TWD181441S (zh) 伺服機構之部分
TWD174022S (zh) 打線接合用陶瓷焊針之部分
TWD186842S (zh) 工具梢之部分(一)
TWD179880S (zh) 觸控筆的部分
TWD181136S (zh) 保持環之部分
TWD177914S (zh) 手持切絲裝置之部分
TWD186469S (zh) 燈之部分
TWD182128S (zh) 觸控筆組合的部分
TWD186864S (zh) 磚之部分
TWD173436S (zh) 加熱握把之部分