TWD177555S - 打線接合楔形工具之部分 - Google Patents
打線接合楔形工具之部分Info
- Publication number
- TWD177555S TWD177555S TW104305492F TW104305492F TWD177555S TW D177555 S TWD177555 S TW D177555S TW 104305492 F TW104305492 F TW 104305492F TW 104305492 F TW104305492 F TW 104305492F TW D177555 S TWD177555 S TW D177555S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- view
- wire bonding
- wedge tool
- tool
- Prior art date
Links
Abstract
【物品用途】;本設計係關於一種打線接合楔形工具。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。;圖式所揭露之點劃線表示本設計之邊界且為本案不主張設計之部分。;在兩個立體圖、前視圖、右側視圖、左側視圖及後視圖中之兩個折斷線指示對工具之細長部分之長度無限制。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/524,165 USD753739S1 (en) | 2015-04-17 | 2015-04-17 | Wire bonding wedge tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD177555S true TWD177555S (zh) | 2016-08-11 |
Family
ID=55484619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104305492F TWD177555S (zh) | 2015-04-17 | 2015-10-02 | 打線接合楔形工具之部分 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD753739S1 (zh) |
| JP (1) | JP1545849S (zh) |
| TW (1) | TWD177555S (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD868123S1 (en) | 2016-12-20 | 2019-11-26 | Coorstek, Inc. | Wire bonding wedge tool |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD771168S1 (en) * | 2014-10-31 | 2016-11-08 | Coorstek, Inc. | Wire bonding ceramic capillary |
| USD797826S1 (en) * | 2015-02-03 | 2017-09-19 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD797172S1 (en) * | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD797171S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD779566S1 (en) * | 2015-10-02 | 2017-02-21 | Pearson Engineering Limited | Plowing tine replacement section |
| US10612258B2 (en) | 2016-10-22 | 2020-04-07 | Master Spas, Inc. | Filter assembly having an outer filter element and an inner filter element removably installed within the outer filter element |
| USD835233S1 (en) | 2016-10-22 | 2018-12-04 | Master Spas, Inc. | Filter |
| USD815168S1 (en) * | 2017-05-23 | 2018-04-10 | Rpm Wood Finishes Group, Inc. | Cartridge for heat pump dispenser |
| CN107159530A (zh) * | 2017-06-16 | 2017-09-15 | 奉化市威优特电器有限公司 | 一种热熔胶枪的加热装置 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3690538A (en) * | 1970-02-25 | 1972-09-12 | Gaiser Tool Co | Bonding tool |
| US4030657A (en) * | 1972-12-26 | 1977-06-21 | Rca Corporation | Wire lead bonding tool |
| USD271741S (en) * | 1981-02-02 | 1983-12-13 | Eldon Industries, Inc. | Soldering iron tip |
| US4415115A (en) | 1981-06-08 | 1983-11-15 | Motorola, Inc. | Bonding means and method |
| US4600138A (en) * | 1984-07-25 | 1986-07-15 | Hughes Aircraft Company | Bonding tool and clamp assembly and wire handling method |
| US5217154A (en) | 1989-06-13 | 1993-06-08 | Small Precision Tools, Inc. | Semiconductor bonding tool |
| DE8910049U1 (de) * | 1989-08-22 | 1989-11-23 | Cooper Industries, Inc., Houston, Tex. | Lötwerkzeug |
| US5485949A (en) | 1993-04-30 | 1996-01-23 | Matsushita Electric Industrial Co., Ltd. | Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary |
| US5445306A (en) | 1994-05-31 | 1995-08-29 | Motorola, Inc. | Wedge wire bonding tool tip |
| US5683603A (en) * | 1995-04-19 | 1997-11-04 | Fortune; William S. | Electric soldering iron tip improvements |
| US6068174A (en) | 1996-12-13 | 2000-05-30 | Micro)N Technology, Inc. | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
| US5954260A (en) * | 1996-12-17 | 1999-09-21 | Texas Instruments Incorporated | Fine pitch bonding technique |
| JP3440190B2 (ja) | 1997-03-06 | 2003-08-25 | 株式会社新川 | ワイヤボンディング方法 |
| USD431434S (en) * | 1998-01-08 | 2000-10-03 | Hakko Corporation | Soldering iron tip |
| IT1305646B1 (it) | 1998-08-07 | 2001-05-15 | St Microelectronics Srl | Formazione di globuli d'oro saldati su piazzuole di collegamento esuccessiva coniatura della loro sommita' |
| US6158647A (en) | 1998-09-29 | 2000-12-12 | Micron Technology, Inc. | Concave face wire bond capillary |
| JP4010432B2 (ja) | 1999-01-29 | 2007-11-21 | ローム株式会社 | 電子部品におけるワイヤボンディング方法及びその装置 |
| US6646228B2 (en) * | 1999-08-18 | 2003-11-11 | Hyperion Innovations, Inc. | Cordless soldering iron |
| JP2002064117A (ja) | 2000-08-22 | 2002-02-28 | Mitsubishi Electric Corp | ワイヤボンディング方法、ワイヤボンディング装置および半導体装置 |
| JP3566678B2 (ja) | 2001-08-28 | 2004-09-15 | 京セラ株式会社 | ワイヤーボンディング用キャピラリー |
| JP2004087822A (ja) | 2002-08-27 | 2004-03-18 | Mitsubishi Materials Corp | ウェッジツール |
| JP3765778B2 (ja) | 2002-08-29 | 2006-04-12 | ローム株式会社 | ワイヤボンディング用キャピラリ及びこれを用いたワイヤボンディング方法 |
| WO2004049402A2 (en) | 2002-11-22 | 2004-06-10 | Saint-Gobain Ceramics & Plastics, Inc. | Zirconia toughened alumina esd safe ceramic composition, component, and methods for making same |
| US7249702B2 (en) | 2003-12-04 | 2007-07-31 | Kulicke And Soffa Industries, Inc. | Multi-part capillary |
| US7407080B2 (en) | 2004-04-02 | 2008-08-05 | Chippac, Inc. | Wire bond capillary tip |
| USD549255S1 (en) * | 2004-11-08 | 2007-08-21 | Dragos Axinte | Soldering iron tip |
| US7216794B2 (en) | 2005-06-09 | 2007-05-15 | Texas Instruments Incorporated | Bond capillary design for ribbon wire bonding |
| US8056794B2 (en) * | 2006-10-09 | 2011-11-15 | Kulicke And Soffa Industries, Inc. | Combination wedge bonding and ball bonding transducer |
| JP4989437B2 (ja) | 2007-12-14 | 2012-08-01 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| USD598721S1 (en) * | 2008-04-24 | 2009-08-25 | Luis Meza | Motorcycle maintenance tool |
| JP4595018B2 (ja) | 2009-02-23 | 2010-12-08 | 株式会社新川 | 半導体装置の製造方法およびボンディング装置 |
| US7918378B1 (en) | 2010-08-06 | 2011-04-05 | National Semiconductor Corporation | Wire bonding deflector for a wire bonder |
| JP5899907B2 (ja) | 2011-12-26 | 2016-04-06 | 富士電機株式会社 | ワイヤボンディング用のウェッジツール、ボンディング装置、ワイヤボンディング方法、および半導体装置の製造方法 |
| JP5510691B2 (ja) | 2012-09-26 | 2014-06-04 | Ｔｏｔｏ株式会社 | ボンディングキャピラリ |
| JP5376413B1 (ja) | 2013-01-25 | 2013-12-25 | Ｔｏｔｏ株式会社 | ボンディングキャピラリ |
| TWI511826B (zh) | 2013-01-25 | 2015-12-11 | Toto Ltd | Welding needle |
-
2015
- 2015-04-17 US US29/524,165 patent/USD753739S1/en active Active
- 2015-10-02 TW TW104305492F patent/TWD177555S/zh unknown
- 2015-10-06 JP JPD2015-21935F patent/JP1545849S/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD868123S1 (en) | 2016-12-20 | 2019-11-26 | Coorstek, Inc. | Wire bonding wedge tool |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1545849S (zh) | 2016-03-14 |
| USD753739S1 (en) | 2016-04-12 |
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