577800 A7 B7 五、發明説明（i ) 【發明所屬的技術領域】 本發明是關於將薄膜疊層於基板表面的方法和其裝置 ，尤其是關於一種使保持預定間隔從運送路徑上運送而來 的各基板以及從薄膜供應滾輪送出的薄膜通過運送路徑上 所設置的疊層滾輪間，藉此將薄膜粘貼（疊層）於各基板 表面上的薄膜疊層方法和其裝置。 【習知技術】 過去，將抗蝕劑膜等黏貼於玻璃基板或半導體基板等 的液晶製造輸送路線或半導體製造輸送路線等是在薄膜疊 層裝置的下游設置用來監視薄膜叠層後之基板表面狀態的 光學監視裝置，用以檢查由於先的反射狀況等而在基板與 薄膜之間有空隙存在的薄膜叠層狀況或是在薄膜上有皺折 存在的薄膜表面狀態。 然後在檢測出有瑕疵部位等的情況下即採取從製造輸 送路線去除瑕疵基板，而且對於瑕疵基板不再施以加工處 理的手段。 另外，就薄膜叠層裝置來說，有日本特開平5 -3 3 8 0 4 1號公報或特開平6 - .2 1 0 5 9 5號公報所 記載者。 【發明所欲解決的課題】 薄膜疊層前的基板即使正常，但如果在疊層後成爲瑕 疵基板，則即使欲使薄膜剝離再加以利用，基板表面上也 本紙張尺度適用中國@家標準（CNS ) A4規格（210X297公楚） — -4- ----------- (請先閲讀背面之注意事項再填寫本頁)577800 A7 B7 V. Description of the invention (i) [Technical field to which the invention belongs] The present invention relates to a method and an apparatus for laminating a thin film on a substrate surface, and more particularly to a method for transporting a film at a predetermined interval from a transport path. Film lamination method and device for pasting (laminating) a film on the surface of each substrate by passing each substrate and the film delivered from the film supply roller through a lamination roller provided on a conveying path. [Know-how] In the past, a liquid crystal manufacturing conveyance route or a semiconductor manufacturing conveyance route that adhered a resist film or the like to a glass substrate or a semiconductor substrate was installed downstream of the thin film lamination device to monitor the substrate after the thin film lamination. An optical monitoring device for the surface state is used to check the state of the film lamination where there is a gap between the substrate and the film due to a prior reflection condition or the like, or the state of the film surface where a wrinkle exists on the film. Then, when a defective part is detected, a method is adopted to remove the defective substrate from the manufacturing conveyance route, and no processing is performed on the defective substrate. In addition, as for the thin film lamination apparatus, there are those described in Japanese Patent Application Laid-Open No. 5 -3 3 0 0 41 or Japanese Patent Application Laid-Open No. 6-.2 105 5 [Problems to be Solved by the Invention] Even if the substrate before film lamination is normal, if it becomes a defective substrate after lamination, even if the film is to be peeled off and reused, the paper surface applies the China @ 家 标准 ( CNS) A4 specification (210X297). -4- ----------- (Please read the precautions on the back before filling this page)
、1T •I# 經濟部智慧財產局員工消費合作社印製 577800 A7 B7 經濟部智慧財1局員工消費合作社印製 五、發明説明（2) 會有污垢殘留，以致再利用有其困難。 因此，在檢討瑕疵基板時發現了不同於因爲薄膜疊層 所產生的空隙等，而且應該不是起因於薄膜疊層的瑕疵。 亦即，從薄膜供應滾輪送出時，薄膜上已經有瑕疵部位存 在。 因此，本發明的目的在於提供一種可藉由將從薄膜供 應滾輪送出的薄膜之良好區域黏貼於基板上來降低正常基 板的丟棄數目的薄膜疊層方法。 【解決課題的手段】 用以達成上述目的的本發明之特徵爲：在將薄膜叠層 於基板之前監視薄膜的狀態，並且判斷薄膜上是否有瑕疵 部位，檢測出有瑕疵部位時即丟棄包含此瑕疵部位的薄膜 之瑕疵部位區域，然後僅將良好區域黏貼於基板上。 【圖面的簡單說明】 第1圖是本發明一實施形態的叠層裝置的槪略圖。 第2圖是第1圖所示的叠層裝置所使用之薄膜的構造 圖。 第3圖是第1圖所示的疊層裝置之控制裝置所執行的 薄膜叠層流程圖。 第4圖是第3圖的流程當中的指示處理所輸入的資料 的說明圖。 第5圖是根據第1圖的疊層裝置當中的監視裝置所獲 (請先閲讀背面之注意事 蟀 -項再填〗 裝-- 窝本頁) 訂 本紙張尺度適用中.國國家標準（CNS ) Α4規格（210 X 297公釐） -5- 577800 經濟部智慧財產局員工消費合作社印製 A7 _B7_五、發明説明（3) 得的檢測結果，利用控制裝置作成的薄膜管理檔案的說明 圖。 第6圖是第1圖的疊層裝置的運轉準備狀況槪略圖。 第7圖是利用第1圖的疊層裝置疊層完成的第一片基 板的停留狀態槪略圖。 第8圖是在利用第1圖的疊層裝置疊層完成的第一片 基板之後，也疊層於第二片基板的狀態槪略圖。 第9圖是在利用第1圖的疊層裝置疊層於第一片基板 後的薄膜上有瑕疵部位時丟棄薄膜的狀況槪略圖。 主要元件對照表 1:薄膜供應滾輪 2 :薄膜 2 a :底膜 2 b :抗蝕劑膜 2 c :覆蓋膜 3、捲取滾輪 4 :導輥 5 :監視裝置 6 :控制裝置 6 a :操作面板 7:基板間處理裝置 8:薄膜拉力保持滾輪 9 :疊層滾輪 本紙張尺度適用中國國家標準（CNS )八4規格（210 X 297公釐） (請先閲讀背面之注意事項再填寫本頁) -6- 577800 A7 B7 五、發明説明（ 4 經濟部智慧財產局員工消费合作社印說 y a 10 11 12 13 14 15 16 17 18 19 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 支承輥 導輪 導輪 基板 保溫裝置 運送裝置 基板運送支持滾輪 第一基板夾鉗滾輪 薄膜夾鉗滾輪 基板分離裝置 基板運送支持滾輪 薄膜丟棄滾輪 第二基板夾鉗滾輪 排出裝置 廢棄滾輪引導裝置 捲取滾輪 壓接滾輪 輸送帶 :輸送帶 【發明的實施形態】 •以下，根據圖面所示的實施形態來詳細說明本發B月。 在第1圖當中，符號1是薄膜2的薄膜供應滾輪，此 薄膜2是如第2圖所示，將底膜2 a、抗蝕劑膜2 b及覆 本紙張尺度適用中國國家標準（CNS ) A4規格（210Χ 297公釐） (讀先聞讀背面之注意事 --裝-- 吻事項再填寫本頁} 、11 -7- 577800 A7 ______B7_ 五、發明説明（5) 蓋膜2c重疊成3層構造。 (請先閲讀背面之注意事項再填寫本頁) 薄膜2從薄膜供應滾輪1送出時會立即使覆蓋膜2 c 剝離，剝離的覆蓋膜2 c是由捲取滾輪3所回收。對薄膜 供應滾輪1是施加與送出薄膜2的方向爲反方向的力矩， 而且是無關於薄膜的送出量，將一定的拉力施加於薄膜2 〇 符號4是導輥（guide roll) ，5是薄膜表面狀態的監 視裝置。 監視裝置5具有以預定的取樣周期監視（每隔一些時 間加以監視）所送出的薄膜面之狀態的光學感測器，用以 進行利用色彩成分（R G B )檢測及明暗檢測的數位色彩 判別。 薄膜2的瑕疵部位是抗蝕劑膜2 b的厚度不均或變色 等，與良好薄膜相比，在色彩成分及明度上有所差異。因 此，監視裝置5是利用光學感測器檢測薄膜的表面狀態， 並且將測量結果轉送至控制裝置6。 經濟部智慧財產局員工消资合作社印製 控制裝置6中的判定部是以一致度（0至9 9 9 )來 判定與良好之薄膜色彩有多接近。於一致度設定任意的臨 界値，並且進行取樣，大於該臨界値時判定爲良好，小於 該臨界値則判定爲瑕疵，判定結果會儲存在後述薄膜管理 資料檔案中。另外，符號6 a是附屬於控制裝置6的操作 面板。 符號7是基板間處理裝置，用來進行以下的基板間處 理：在薄膜2當中的抗蝕劑膜2 b的寬度方向，利用兩片 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -8- 577800 A7 _B7_ 五、發明説明（6) 圓盤切割器等切割出兩行裂縫，然後去除裂縫間的抗蝕劑 膜2b，使底膜2 a露出。 (請先閲讀背面之注意事項再填寫本頁) 接下來將殘留在底膜2 a上的抗蝕劑膜2 b黏貼於基 板上。因此，在基板間處理所去除的抗蝕劑膜2 b當中的 兩行裂縫的間隔（寬度）就是連續運送的基板間之間隔與 各基板之不要黏貼抗蝕劑膜的長度的和。 符號8是薄膜拉力保持滾輪，在滾輪表面具有開縫， 而且可吸引薄膜2然後朝向與薄膜之運送（送出）方向相 反的方向旋轉，並且使下游的疊層滾輪9至薄膜拉力保持 滾輪8爲止的薄膜拉力保持一定。10是具有用來測量叠 層滾輪9至薄膜拉力保持滾輪8爲止之薄膜拉力値的力矩 感測器的導輪（guide roller)，由力矩感測器檢測出的力 矩會送到控制裝置6，然後由控制裝置6控制薄膜拉力保 持滾輪8的旋轉速度，使薄膜拉力無論何時皆固定。 經濟部智慧財產局員工消资合作社印製 符號11是基板12從上游在運送路徑上未運送一定 時間以上時，用來避免叠層滾輪9與薄膜2接觸的導輪。 在來自上游機械的基板運送等待狀態下，導輪1 1會下降 以免薄膜2與疊層滾輪9接觸。另外，在進行薄膜叠層時 ，導輪1 1會上升，並且將薄膜從導輪1 0運送至叠層滾 輪9。此外，符號9 a是使疊層滾輪9的加壓量（線壓） 保持均一的支承輥（back up roll)。 符號1 3是用來使保持一定間隔連續運送而來的基板 ‘ 1 2保溫的保溫裝置，1 4是將基板從上游裝置搬入本裝 置的運送裝置，1 5是基板運送支持滾輪.，1 6是用來運 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -9- 577800 A7 B7 五、發明説明（7) (請先閲讀背面之注意事項再填寫本頁) 送疊層後之基板的第一基板夾鉗滾輪，17是用來運送薄 膜的薄膜夾鉗滾輪，1 8是利用雷射切割器等，使連續曼 層並且藉著薄膜2形成連結狀態的基板1 2與基板分開的 基板分離裝置，1 9是可上下移動的基板運送支持滾輪， 2 0是薄膜丟棄滾輪，2 1是用來運送疊層後之基板的第 二基板夾鉗滾輪。 薄膜丟棄滾輪2 0是如後文所述，可在圖示的位置到 薄膜夾鉗滾輪1 7之下游位置的範圍，朝向基板1 2或薄 膜2之運送路徑的運送方向前後移動。而且，朝向該上游 方向或下游方向移動時，基板運送支持滾輪1 9會藉由控 制裝置6而下降，以免造成移動的阻礙。 符號2 2是用來排出分離後之基板的排出裝置，2 3 是廢棄薄膜引導裝置，2 4是廢棄薄膜的捲取滾輪，2 5 是用來將廢棄薄膜黏貼於捲取滾輪2 4的壓接滾輪。 薄膜2的捲取滾輪2 4側爲抗蝕劑膜2 b，因此利用 壓接滾輪2 5將廢棄薄膜壓接於捲取滾輪2 4時，可利用 抗蝕劑膜2 a的粘著性黏貼而捲繞。 經濟部智慧財產局員工消費合作社印製 控制裝置6具有：用來保存上述各感測器的檢測結果 、從操作面板6 a輸入的昼層處理所需的指示資料以及與 裝置有關之資料等各種資料的RAM;用來儲存疊層處理 之流程的R Ο Μ ;硬碟；由在這些之間進行信號之交換的 介面部等構成的中央處理裝置或是將動作信號傳送至各驅 動部的驅動裝置，以及用來μ!不各種資料的監視器畫面等 〇 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） ' 一 -10· 577800 A7 B7 五、發明説明（8) (請先閲讀背面之注意事項再填寫本頁) 基板1 2是以聚集了運送方向之長度的複數片作爲一 批來進行薄膜疊層處理，但是在一批當中有變化時可配合 基板的長度，並且利用控制裝置6使進行基板或薄膜之運 送的各滾輪的位置在運送方向稍微移動而加以設定。 接下來，說明沿著第3圖的流程將薄膜疊層於基板 1 2的方法。 首先，打開控制裝置6的電源，然後進行步驟（以下 略稱爲S) 10 0的指示處理。 在指示處理S 1 0 0當中，先輸入第4圖所示的基板 1 2的寬度L 1、基板1 3的長度L2、薄膜2黏貼於基 板13的前端位置P1、薄膜2黏貼於基板12的長度 D 1、有關施以連續叠層時之基板間處理的長度D 2的資 料、疊層滾輪9及支承輥9 a等的設定溫度資料、施加於 薄膜2的拉力資料、以及在同一批進行黏貼的基板數目等 ，並且儲存於控制裝置6的RAM。 經濟部智慧財產局員工消費合作社印製 另外，基板間處理裝置7至疊層滾輪9之間的薄膜2 長度是薄膜黏貼於基板1 2的長度D 1以及進行連續疊層 時之基板間隔處理的長度D 2的整數倍，並且以黏貼前端 位置P 1爲基準，使殘留在薄膜2上所要黏貼的抗蝕劑膜 2 b的長度與連續運送而來的各基板1 2之黏貼長度D 1 一致。而且，每次在利用基板間處理裝置7進行基板間隔 處理時，對於長度D 1的各抗蝕劑膜2 b是如第5圖所示 ，在控制裝置6的RAM當中的薄膜管理資料檔案FI， 對應於所要黏貼的各基板1 2附上薄膜編號η，然後加以 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） -11 - 577800 經濟部智慧財產局員工消費合作社印製 A7 _B7 _五、發明説明（9) 儲存。 、 接下來的運轉準備處理S 2 0 0當中，控制裝置6是 藉由操作面板6 a中的啓動鈕而開始運轉準備動作。所謂 運轉準備是配合指示處理S 1 0 〇所輸入的基板1 2的長 度，並且利用第6圖所示的輸送帶2 6使各滾輪的位置在 運送方向稍微移動。然後，爲了保持本裝置內所設置的薄 膜的拉力，使薄膜供應滾輪1、捲取滾輪3、薄膜拉力保 持滾輪8旋轉，並且利用薄膜夾鉗滾輪1 7夾住薄膜2。 再以一定力矩驅動薄膜丟棄滾輪2 0及捲取滾輪2 4旋轉 ，以進行爲了丟棄薄膜的準備。使基板運送支持滾輪1 9 上升以搬入基板，接下來使導輪1 1下降，並且使疊層滾 輪9及支承輥9 a從運送路徑位置朝上下各方向退開，以 形成避免與薄膜2接觸的狀態，並且進行溫度控制，使疊 層滾輪9、支承輥9 a形成保溫裝置1 3在S 1 0 0所設 定的溫度設定。 爲了作成薄膜管理檔案F的資料，利用輸送帶2 7如 第6圖的虛線所示，使薄膜丟棄滾輪2 0移動至薄膜夾鉗 滾輪1 7附近而夾住薄膜，然後往下游測驅動而運送薄膜 2。 此時，薄膜管理檔案F當中的薄膜編號（No ) η是 以叠層滾輪入口位置的薄膜編號爲起頭η=1 ，將基板間 處理裝置7爲止的後部設定爲η = n，但是亦可再往後推 ，將感測器上面的薄膜位置設定爲η = η。運送薄膜時利 用監視裝置5監視薄膜2的表面狀態，控制裝置6的判定 本紙張尺度適用中國國家標準（CNS)A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) -12- 577800 A7 ____B7_ 五、發明説明（1() (許先閱讀背面之注意事項再填寫本頁) 部則是如前所述，如果一致度在臨界値以下即判定爲有瑕 疵部位，然後將標記1設定在與薄膜管理檔案F之薄膜編 號η對應的薄膜狀態欄，並且在操作面板6 a上及監視器 畫面上進行瑕疵檢出顯示及蜂音信號。未檢測出有瑕疵的 情況就不設立標記，而是將〇設定在與薄膜編號η對應的 薄膜狀態欄。然後，配合薄膜2的運送，薄膜管理檔案F 的薄膜編號欄以及薄膜狀態欄是如第5圖（b )所示，朝 向叠層滾輪入口位置逐漸歩進（位移）。另外，在準備階 段運送薄膜時，捲取滾輪2 4前方的多餘薄膜2會捲繞起 來。 然後，在薄膜狀態確認處理S 3 0 0當中，在開始搬 入第2片以後的基板之前，讀取薄膜管理檔案F中薄膜編 號n=l的薄膜狀態資料。 接下來，前進至薄膜瑕疵判斷處理S400，確認所 讀取的薄膜狀態資料是否爲0，若爲0則將之後所要黏貼 的薄膜視爲正常狀態，並且開始第一片基板搬入處理。 經濟部智慧財產局員工消资合作社印製 另一方面，在薄膜瑕疵判斷處理S 4 0 0中如果薄膜 狀態資料爲1，則表示在之後所要黏貼的薄膜上有瑕疵部 位，因此前進至薄膜丟棄處理S500，然後利用薄膜夾 鉗滾輪17輸送疊層量D1 (包食瑕疵部位相當於一片基 板份量的長度=瑕疵部位區域）的薄膜，薄膜2會逐漸捲 繞在捲取滾輪2 4上。另外，如果有進行薄膜2的運送， 監視裝置5就會監視薄膜2的表面狀態，檢測結果則是送 至控制裝置6而儲存於其RAM，可用來作成薄膜管理檔 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公嫠） " -13- 577800 經濟部智慧財產局員工消资合作社印製 A7 B7五、發明説明（j 案F 〇 在疊層滾輪入口位置丟棄有瑕疵部位的薄膜2的瑕疵 部位區域之後，回到薄膜狀態確認處理S 3 0 0，再對於 到達疊層滾輪入口的下一個所要黏貼的薄膜編號n=l( 剛剛η = 2的已位移而成爲η = 1 )的薄膜2讀取薄膜狀 態資料，並且利用薄膜瑕疵判斷處理S 4 0 0再度判斷是 否有瑕疵部位存在，如果沒有即前進至第一片基板搬入處 理S50 0，如果有則前進至薄膜丟棄處理S500，然 後重複上述處理。 在此假設是前進至第一片基板搬入處理S 5 0 0，並 且對於此處理加以說明。 在第一片基板搬入處理S 5 0 0是利用運送裝置1 4 ，相對於叠層滾輪9的角度來修正基板12之寬度方向的 傾斜，然後運送至叠層滾輪9下的任意位置。 然後，在第一片叠層處理S700，利用叠層滾輪9 、支承輥9 a夾住基板1 2，並且使導輪1 1上升，以事 先指示的疊層長度D 1量將薄膜2黏貼於基板1 2上。此 疊層中的薄膜2由於正受到運送，因此如前所述，是由監 視裝置5監視著薄膜2的表面狀態。而且，基板間處理裝 置7是在每次運送一片基板份量（指示資料量D 1 )的薄 膜2時，即進行用以去除指示資料量D 2之抗蝕劑膜2 b 的前述基板間處理。 黏貼好薄膜2之後，前進至第一片基板分離處理 S 8 0 0，並且如第7圖所示，利用第一基板夾鉗滾輪 本紙張尺度適用中國國家標準（CNS )八4規格（2丨0'〆297公釐） (請先閱讀背面之注意事項再填寫本頁) -14- 577800 經濟部智慧財產局員工消资合作社印製 A7 ___B7 _五、發明説明（^ 1 6夾住已貼有薄膜的基板1 2，並且使疊層滾輪9、支 承輥9 a退開，使導輪1 1下降。接下來利用基板分離裝 置1 8切割基板1 2以及多餘的薄膜，並且打開薄膜丟棄 滾輪2 0，使薄膜保持的狀態開放。 在開放的同時，多餘的薄膜2即回收至捲取滾輪2 4 〇 另一方面，基板1 2是藉由第一基板夾鉗滾輪1 6朝 向下游側僅運送指示資料D 2量，然後等待下一個基板的 搬入。並且，使與薄膜管理檔案F之各薄膜編號η對應的 薄膜狀態資料分別位移一個薄膜編號份量。另外，第7圖 顯示以基板分離裝置18切割薄膜2的狀況。 然後，前進至薄膜狀態確認處理S900，與薄膜狀 態確認處理S 3 0 0同樣地在開始搬入第二片以後的基板 之前，讀取薄膜管理檔案F中的薄膜η = 1的薄膜狀態資 料，並且在薄膜瑕疵判斷處理S 1 0 0 0確認於薄膜狀態 資料是否有標記1存在。 如果是沒有標記1，薄膜編號η=1的薄膜2爲良好 的薄膜，則前進至第二片以後基板搬入處理S 1 2 0 0。 然後在第二片以後基板疊層處理S 1 3 0 0、第二片以後 基板分離處理S 1 4 0 0當中，進行與前述第一片疊層處 理S 7 0 0、第一片基板分離處理S 8 0 0相同的處理。 已經疊層並且停留在裝置內的基板12是與疊層速度同步 ，由第一基板夾鉗滾輪1 6、第二基板夾鉗滾輪2 1朝下 游方向的分離位置運送。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X29*7公釐） (讀先閱讀背面之注意事項再填寫本頁) -15- 577800 經濟部智慧財產局員工消费合作社印製 A7 _B7五、發明説明（^ 第8圖即顯示此狀態。 在第二片以後基板分離處理S 1 4 0 0當中，由基板 分離裝置1 8分離的已疊層基板1 2是由第二基板夾鉗滾 輪2 1交給排出裝置2 2，然後將基板搬出至下游機械。 在薄膜瑕疵判斷處理S 1 〇 0 0當中，在薄膜管理槍 案F的薄膜編號η = 1的薄膜狀態資料中設定有1時是在 基板排出處理S 1 1 0 0進行已疊層之基板1 2的排出。 亦即，在此基板排出處理S 1 1 0 0並不搬入第二片 基板，而是如第9圖所示，利用第一基板夾鉗滾輪1 6、 第二基板夾鉗滾輪21將已叠層的基板12運送至第二基 板夾鉗滾輪2 1所在的基板分離位置，並且利用輸送帶 2 7使薄膜丟棄滾輪2 0移動至薄膜夾鉗滾輪1 7附近， 然後夾住薄膜以保持薄膜拉力。在運送至此基板分離位置 時，也是利用監視裝置5進行薄膜表面狀態的檢出監視。 而且，包含瑕疵部位之相當於一片基板份量的長度的薄膜 2會從叠層滾輪9的出口側朝向基板分離裝置18之間移 動，並且遭到丟棄》 藉由基板分離裝置1 8使薄膜2與已叠層之基板1 2 分離，並且排出已疊層的基板。 在此情況下的基板排出或是在第二片以後基板分離處 理S 1 4 0 0排出已疊層的基板之後，關於指示處理 S 1 〇 〇所輸入的基板數目是每次排出時即減少一片。 在基板排出狀態下，由於疊層滾輪9的出口側至基板 分離裝置1 8之間並沒有基板1 2存在，因此回到薄膜狀 本&張尺度適用中.國國家標準（CNS ) Α4規格（210Χ297公釐) 一 (請先閱讀背面之注意事項再填寫本頁) -16- 577800 經濟部智慧財產局員工消費合作社印t A7 B7五、發明説明（^ 態確認處理S 3 0 0，然後重複上述處理，包含瑕疵部位 之相當於一片基板份量的長度的薄膜2會在薄膜丟棄處理 S 5 0 0中捲繞於捲取滾輪2 4，然後會到薄膜狀態確認 處理S300，或是在第一片基板分離處理S800捲繞 於捲取滾輪2 4，再前進至薄膜狀態確認處理S 9 0 0。 在第二片以後基板分離處理S 1 4 0 0使基板分離之 後，執行連續叠層判斷處理S1500，並且對於指示處 理S 1 0 0所輸入的基板數目確認剩餘數目，以判斷是否 還有後續的基板，如果有則回到薄膜狀態確認處理 S 9 0 0，並且反覆上述處理直到剩餘數目變成0爲止。 如以上所說明，根據本實施形態，如果在薄膜2上有 瑕疵部位，則在黏貼於基板1 2之前，將包含瑕疵部位之 要黏貼於基板上的區域的薄膜視爲瑕疵部位區域加以丟棄 。因此，可避免在正常基板12貼上包含瑕疵部位的薄膜 而進行不良處理，且可謀求生產成本的降低。 監視裝置5是位於基板間處理裝置的上游，因此薄膜 表面狀態的監視結果並不會受到基板間處理的影響。 利用監視裝置5監視薄膜表面狀態時，瑕疵部位存在 於第4圖所說明的基板間部分（指示資料D 2量的部位） 時，該基板間部分並不屬於第5圖的薄膜管理檔案F的薄 膜編號η，因此薄膜狀態攔爲〇，並不會留下紀錄。藉此 亦可減少薄膜2的消耗。 第1圖中的基板分離裝置1 8是配置於可使已疊層之 基板彼此分離以及可切割包含瑕疵部位的薄膜的位置，因 本纸張尺度適用中.國國家標準（CNS ) Α4規格（210Χ297公釐） .裝----Ί--訂 (請先聞讀背面之注意事項再填寫本頁) i# -17- 577800 經濟部智慧財產局員工消費合作社印製 A7 ____B7_五、發明説明（^ 而可謀求構造的簡化，但是如果將專門用來切割包含瑕疵 部位的薄膜的切割裝置設置在薄膜夾鉗滾輪1 7的下游附 近等，則可將包含瑕疵部位之需丟棄薄膜的量從第9圖所 示的一片基板份量減少成瑕疵部位去除的長度。 第1圖的實施形態當中，監視裝置5是監視著從薄膜 供應滾輪1送出的薄膜，但也可以是由作業員站在薄膜前 ，以檢測出瑕疵部位顯示標誌等的方式。 另外，第1圖的實施形態是將薄膜疊層於基板的上面 ，但亦可以運送路徑爲交界而具有鏡面對稱的薄膜供應滾 輪或監視裝置、基板間處理裝置等，再將薄膜疊層於基板 的下面。 基板間處理裝置是以去除抗蝕劑膜的例子加以說明， 但亦可利用抗蝕劑膜的接著性將非接著性膠帶朝寬度方向 黏貼於基板間部分的抗蝕劑膜上，以免抗蝕劑膜與基板的 前後端部接觸。 再者，廢棄薄膜亦可利用壓接滾輪2 5壓接而捲繞於 第1圖所示的下側薄膜丟棄滾輪2 0，並且省略丟棄薄膜 引導裝置2 3或捲取滾輪2 4。在此情況下，壓接滾輪 2 5是設置在下側薄膜丟棄滾輪2 0的正下游。 如以上所說明，根據本發明，可藉由僅將從薄膜供應 滾輪送出的薄膜之良好區域黏貼於基板上來減少正常基板 的丟棄數目。 --------衣----Γ---1T------0 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210Χ297公釐） -18-1T • I # Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 577800 A7 B7 Printed by the Consumer Cooperative of the 1st Bureau of Intellectual Property of the Ministry of Economic Affairs 5. Description of the invention (2) There will be dirt residues, making reuse difficult. Therefore, when reviewing the defective substrate, it was found that it is different from voids and the like caused by the thin film stack, and should not be a defect caused by the thin film stack. That is, when it is fed out from the film supply roller, there are already flawed portions on the film. Therefore, an object of the present invention is to provide a thin film lamination method capable of reducing the number of discarded normal substrates by adhering a good area of the thin film fed from the thin film supply roller to a substrate. [Means for solving the problem] The present invention to achieve the above-mentioned object is characterized in that the state of the film is monitored before the film is laminated on the substrate, and whether there is a defective part on the film is judged, and the defective part is discarded and included when it is detected The defective area of the film of the defective area, and then only the good area is adhered to the substrate. [Brief Description of the Drawings] FIG. 1 is a schematic diagram of a laminating apparatus according to an embodiment of the present invention. Fig. 2 is a structural view of a thin film used in the laminating apparatus shown in Fig. 1. Fig. 3 is a flowchart of thin film lamination executed by a control device of the laminating apparatus shown in Fig. 1. Fig. 4 is an explanatory diagram of data input in the instruction processing in the flow of Fig. 3; Figure 5 is obtained from the monitoring device in the stacking device of Figure 1 (please read the precautions on the back-item and then fill in the package-nest page). The size of the revised paper is applicable. National National Standards ( CNS) A4 specification (210 X 297 mm) -5- 577800 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _B7_ V. Description of the invention (3) Explanation of the test results obtained using the control device's film management file Illustration. Fig. 6 is a schematic view showing the operational preparation status of the laminating apparatus of Fig. 1. Fig. 7 is a schematic view showing a staying state of the first substrate which is laminated using the laminating apparatus of Fig. 1; Fig. 8 is a schematic view showing a state in which the first substrate is laminated by the laminating apparatus of Fig. 1 and then laminated on the second substrate. Fig. 9 is a schematic view showing a state in which the film is discarded when a defective portion is laminated on the film after the first substrate is laminated by the laminating device of Fig. 1. Main components comparison table 1: film supply roller 2: film 2 a: base film 2 b: resist film 2 c: cover film 3, take-up roller 4: guide roller 5: monitoring device 6: control device 6 a: operation Panel 7: Inter-substrate processing device 8: Film tension holding roller 9: Laminated roller The paper size is applicable to China National Standard (CNS) 8 4 specifications (210 X 297 mm) (Please read the precautions on the back before filling this page ) -6- 577800 A7 B7 V. Description of the invention (4 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ya 10 11 12 13 14 15 16 17 18 19 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 Support roller guide wheel guide roller substrate heat preservation device transport device substrate transport support roller first substrate clamp roller film clamp roller substrate separation device substrate transport support roller film discard roller second substrate clamp roller ejection device discard roller guide device take-up roller Crimp Roller Conveyor Belt: Conveyor Belt [Inventive Embodiment] • The following is a detailed description of the month of this issue based on the embodiment shown in the figure. In Figure 1, the symbol 1 is the film supply roller for film 2. thin 2 is as shown in Figure 2, the base film 2 a, resist film 2 b and the size of the cover paper are applicable to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) --Installation-- Please fill in this page again for kisses}, 11 -7- 577800 A7 ______B7_ 5. Description of the invention (5) The cover film 2c is overlapped into a three-layer structure. (Please read the precautions on the back before filling this page) Film 2 When the film is fed from the film supply roller 1, the cover film 2c will be peeled off immediately. The peeled cover film 2c is recovered by the take-up roller 3. The film supply roller 1 is applied with a torque in the direction opposite to that of the film 2 Moreover, regardless of the amount of film sent, a certain pulling force is applied to the film. Symbol 4 is a guide roll, and 5 is a monitoring device for the surface state of the film. The monitoring device 5 has a predetermined sampling cycle to monitor (each An optical sensor that monitors the state of the film surface sent out at a certain time to perform digital color discrimination using color component (RGB) detection and light and dark detection. The defective part of the film 2 is the resist film 2 b Uneven thickness or discoloration, etc. Compared with a good film, the color composition and brightness are different. Therefore, the monitoring device 5 uses an optical sensor to detect the surface state of the film, and transmits the measurement result to the control device 6. The employee of the Intellectual Property Bureau of the Ministry of Economic Affairs consumes capital The judging unit in the cooperative print control device 6 judges how close it is to a good film color with a degree of consistency (0 to 9 9 9). An arbitrary threshold is set at the consistency degree, and sampling is performed. When the threshold is larger than the threshold, it is judged to be good, and when it is smaller than the threshold, it is judged to be defective. The judgment result is stored in the film management data file described later. In addition, reference numeral 6a denotes an operation panel attached to the control device 6. Reference numeral 7 is an inter-substrate processing device for performing the following inter-substrate processing: in the width direction of the resist film 2 b in the thin film 2, two pieces of this paper size are applied to the Chinese National Standard (CNS) A4 specification (210X297) (Centi) -8- 577800 A7 _B7_ V. Description of the invention (6) The disc cutter etc. cut two lines of cracks, and then removed the resist film 2b between the cracks to expose the base film 2a. (Please read the precautions on the back before filling this page.) Next, stick the resist film 2 b remaining on the base film 2 a to the substrate. Therefore, the interval (width) of the two rows of cracks in the resist film 2b removed by the inter-substrate processing is the sum of the interval between the substrates that are continuously transported and the length of each substrate that is not to be adhered to the resist film. Reference numeral 8 is a film tension holding roller, which has a slit on the surface of the roller, and can attract the film 2 and then rotate in a direction opposite to the direction in which the film is transported (sent out), and the downstream lamination roller 9 to the film tension holding roller 8 The film tension remains constant. 10 is a guide roller having a torque sensor for measuring the film tension 値 from the laminated roller 9 to the film tension holding roller 8; the torque detected by the torque sensor is sent to the control device 6, The control device 6 then controls the film pulling force to maintain the rotation speed of the roller 8 so that the film pulling force is fixed at any time. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the symbol 11 is a guide wheel used to prevent the laminated roller 9 from contacting the film 2 when the substrate 12 has not been transported on the transport path for more than a certain time from upstream. While the substrate is being transported from the upstream machine, the guide rollers 11 are lowered to prevent the film 2 from coming into contact with the laminated roller 9. In addition, when the film is laminated, the guide roller 11 is raised, and the film is conveyed from the guide roller 10 to the lamination roller 9. In addition, reference numeral 9a is a back up roll that keeps the pressing amount (linear pressure) of the lamination roller 9 uniform. Reference numerals 13 and 13 are substrates for continuously transporting substrates at a constant interval. 1 2 is a thermal insulation device for thermal insulation, 14 is a transportation device for carrying substrates from an upstream device into the device, and 15 is a substrate transportation support roller. 1 6 It is used to transport this paper. The size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) -9- 577800 A7 B7 V. Description of the invention (7) (Please read the precautions on the back before filling this page) The first substrate clamp roller of the substrate after the layer, 17 is a film clamp roller for transporting the film, and 18 is a substrate 1 2 that uses a laser cutter and the like to make continuous layers and form a connection state through the film 2. 19 is a substrate separating device separated from the substrate. 19 is a substrate support roller that can be moved up and down, 20 is a film discarding roller, and 21 is a second substrate clamp roller for conveying the laminated substrate. As described later, the film discarding roller 20 can move from the position shown in the figure to the position downstream of the film clamp roller 17 to the substrate 12 or the film 2 conveying direction. When moving in the upstream direction or the downstream direction, the substrate transport support roller 19 is lowered by the control device 6 so as not to hinder the movement. Reference numeral 2 is a discharge device used to discharge the separated substrate, 2 3 is a waste film guide device, 24 is a winding roller of the waste film, and 2 5 is a pressure used to adhere the waste film to the winding roller 24. Take the wheel. The winding roller 2 of the film 2 is on the 4 side with the resist film 2 b. Therefore, when the waste film is crimped onto the winding roller 2 4 by the crimping roller 25, the adhesive film 2 a can be used for adhesion. While winding. The printed consumer control device 6 of the Intellectual Property Bureau of the Ministry of Economic Affairs' employee consumer cooperative has various functions such as storing the detection results of the above sensors, instruction data required for daytime processing input from the operation panel 6a, and device-related data. RAM for data; ROM for storing the flow of stacked processing; hard disk; a central processing device composed of a mesa surface for exchanging signals between these, or a driver that transmits an operation signal to each drive unit Device, and monitor screens for various materials such as μ! This paper size applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) ′ -10 · 577800 A7 B7 V. Description of the invention (8) (please Read the precautions on the back before filling in this page.) Substrate 1 2 is a thin film stacking process in which multiple pieces with a length in the transport direction are collected. However, the length of the substrate can be matched when there is a change in the batch, and The position of each roller for carrying the substrate or the film is slightly moved in the carrying direction by the control device 6 and is set. Next, a method of laminating a thin film on the substrate 12 along the flow of FIG. 3 will be described. First, the power of the control device 6 is turned on, and then the instruction processing of step (hereinafter abbreviated as S) 100 is performed. In the instruction process S 1 0 0, first input the width L 1 of the substrate 12 shown in FIG. 4, the length L 2 of the substrate 1 3, and the film 2 stuck to the front end position P 1 of the substrate 13, and the film 2 is stuck to the substrate 12. Length D1, information on the length D2 of the inter-substrate processing when continuous lamination is applied, data on the set temperature of the lamination roller 9 and support roller 9a, etc., data on the tension applied to the film 2, and the same batch The number of boards to be pasted and the like are stored in the RAM of the control device 6. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs In addition, the length of the film 2 between the substrate processing device 7 and the lamination roller 9 is the length D 1 of the film adhered to the substrate 1 2 and the substrate interval processing during continuous lamination An integer multiple of the length D 2, and the length of the resist film 2 b to be pasted on the thin film 2 is made to be the same as the pasting length D 1 of each substrate 12 continuously conveyed based on the pasting tip position P 1 as a reference. . Moreover, each time the substrate interval processing is performed by the inter-substrate processing device 7, the resist film 2b of the length D1 is the thin film management data file FI in the RAM of the control device 6 as shown in FIG. Correspond to each substrate to be pasted 1 2 Attach the film number η, and then apply this paper size to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) -11-577800 Printed by A7, Consumer Cooperative of Intellectual Property Bureau, Ministry of Economic Affairs _B7 _V. Description of the invention (9) Storage. In the next operation preparation process S 2 0, the control device 6 starts the operation preparation operation by the start button on the operation panel 6 a. The preparation for operation refers to the length of the substrate 12 inputted in accordance with the instruction processing S 100, and the positions of the rollers are slightly moved in the conveying direction by the conveyor belt 26 shown in FIG. Then, in order to maintain the tension of the film provided in the device, the film supply roller 1, the take-up roller 3, and the film tension holding roller 8 are rotated, and the film 2 is clamped by the film clamp roller 17. Then, the film discarding roller 20 and the take-up roller 24 are driven to rotate with a certain torque to prepare for film discarding. Raise the substrate transport support roller 1 9 to carry in the substrate, then lower the guide roller 11 and lower the lamination roller 9 and the support roller 9 a from the transport path position in the up and down directions to avoid contact with the film 2 And temperature control to make the lamination roller 9 and the support roller 9 a form the heat insulation device 13 at the temperature set at S 100. In order to create the data of the film management file F, as shown by the dashed line in FIG. 6, the film discarding roller 20 is moved to the film clamp roller 17 near the film conveyor roller 27 to clamp the film, and then the film is driven and transported downstream. Film 2. At this time, the film number (No) η in the film management file F starts with the film number at the entrance position of the lamination roller η = 1, and the rear part up to the substrate processing device 7 is set to η = n, but it can also be Push back and set the position of the film on the sensor to η = η. When the film is transported, the monitoring device 5 monitors the surface state of the film 2 and the control device 6 judges that the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page)- 12- 577800 A7 ____B7_ V. Description of the invention (1 () (You may read the precautions on the back before filling this page). As described above, if the consistency is below the threshold, it is determined to be a defective part, and then the Mark 1 is set in the film status column corresponding to the film number η of the film management file F, and the defect detection display and buzzer signal are performed on the operation panel 6 a and the monitor screen. If no defect is detected, it will not be Set a mark, and set 0 to the film status column corresponding to the film number η. Then, in accordance with the transportation of the film 2, the film number column and the film status column of the film management file F are as shown in FIG. 5 (b). It gradually advances (displaces) toward the entrance position of the lamination roller. In addition, when the film is transported in the preparation stage, the excess film 2 in front of the take-up roller 24 is wound up. In the state confirmation processing S 3 0, before starting to carry in the second and subsequent substrates, read the film status data of the film number n = 1 in the film management file F. Next, proceed to the film defect judgment processing S400 to confirm Whether the read film status data is 0. If it is 0, the film to be pasted is regarded as normal, and the first substrate is moved in. Printing by the Consumers ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs If the film status data in the film defect judgment processing S 4 0 is 1, it indicates that there is a defective part on the film to be pasted, so proceed to the film discarding process S500, and then use the film clamp roller 17 to convey the lamination amount D1 ( The film covering the defective part is equivalent to a piece of substrate with a length equal to the length of the defective part), and the film 2 is gradually wound on the take-up roller 24. In addition, if the film 2 is transported, the monitoring device 5 monitors the film The surface state of 2 is sent to the control device 6 and stored in its RAM, which can be used to create a film management file. Standard (CNS) A4 specification (210X297) quotation -13- 577800 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (j Case F 〇 Discard defective parts at the entrance of the laminated roller After the defective part area of the film 2, return to the film state confirmation process S 3 0 0, and then for the next film to be pasted to reach the entrance of the lamination roller, the number n = l (just shifted from η = 2 to η = 1 ) Film 2 reads the film status data, and uses the film defect judgment process S 4 0 0 to determine whether there is a defective part again, if not, it proceeds to the first substrate carrying-in process S 50 0, and if there is, it proceeds to the film discarding process. S500, and then repeat the above process. It is assumed here that the process proceeds to the first substrate carrying-in process S500, and this process will be described. In the first substrate carrying-in process S500, the inclination in the width direction of the substrate 12 is corrected by the conveying device 1 4 with respect to the angle of the lamination roller 9 and then conveyed to an arbitrary position under the lamination roller 9. Then, in the first sheet lamination process S700, the substrate 12 is clamped by the lamination roller 9 and the support roller 9a, and the guide roller 11 is raised, and the film 2 is adhered to the lamination length D 1 indicated in advance. On the substrate 1 2. Since the film 2 in this stack is being transported, the surface state of the film 2 is monitored by the monitoring device 5 as described above. Furthermore, the inter-substrate processing device 7 performs the aforementioned inter-substrate processing for removing the resist film 2 b of the instruction data amount D 2 each time a thin film 2 of the substrate amount (the instruction data amount D 1) is transported. After the film 2 is pasted, proceed to the first substrate separation process S800, and use the first substrate clamp roller as shown in Figure 7. This paper is sized to the Chinese National Standard (CNS) 8-4 specifications (2 丨0'〆297 mm) (Please read the notes on the back before filling out this page) -14- 577800 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ___B7 _V. Description of the invention (^ 1 6 The substrate 12 with the film, and the lamination roller 9 and the support roller 9 a are retracted, and the guide roller 11 is lowered. Next, the substrate separation device 18 is used to cut the substrate 12 and the excess film, and the film is opened to discard the roller. 2 0, keep the film open. When the film is opened, the excess film 2 is recovered to the take-up roller 2 4 〇 On the other hand, the substrate 12 is moved to the downstream side only by the first substrate clamp roller 16 Transfer the amount of instruction data D 2 and wait for the next substrate to be carried in. In addition, the film status data corresponding to each film number η of the film management file F is shifted by one film number. In addition, FIG. 7 shows a substrate separation device. 18 cuts The state of the film 2. Then, proceed to the film state confirmation process S900, and read the film η = 1 in the film management file F before starting to carry in the second and subsequent substrates in the same manner as the film state confirmation process S300. The film status data, and the film defect judgment process S 1 0 0 0 confirms whether there is a mark 1 in the film status data. If there is no mark 1, and the film 2 with the film number η = 1 is a good film, proceed to the second The substrate is carried in after the wafer S 1 2 0 0. Then, during the second substrate after the substrate lamination process S 1 3 0 0 and the second substrate after the substrate separation process S 1 4 0 0, the lamination process with the first sheet is performed. S 7 0, the first substrate separation process S 8 0 0. The substrate 12 that has been laminated and stays in the device is synchronized with the lamination speed. The first substrate clamps the roller 16 and the second substrate. The clamp roller 21 is transported to the separated position in the downstream direction. This paper size applies to the Chinese National Standard (CNS) A4 size (210X29 * 7 mm) (read the precautions on the back before filling this page) -15- 577800 Economy Intellectual property A7 _B7 printed by the Bureau ’s Consumer Cooperatives V. Invention description (^ Figure 8 shows this state. In the second and subsequent substrate separation processing S 1 4 0 0, the laminated substrate 1 separated by the substrate separation device 18 2 is transferred from the second substrate clamping roller 2 1 to the discharge device 2 2, and then the substrate is carried out to the downstream machine. In the film defect determination process S 1 0 0 0, the film number η = 1 in the film management gun case F When 1 is set in the thin film state data, the laminated substrate 12 is discharged in the substrate discharge processing S 1 1 0 0. That is, the substrate discharge process S 1 1 0 0 is not carried into the second substrate here, but as shown in FIG. 9, the first substrate clamp roller 16 and the second substrate clamp roller 21 are stacked. The substrate 12 of the second layer is transported to the substrate separation position where the second substrate clamping roller 21 is located, and the film discarding roller 20 is moved to the vicinity of the film clamping roller 17 by the conveyor belt 2 7, and then the film is clamped to maintain the film tension . When the substrate is transported to this substrate separation position, the surface condition of the film is detected and monitored by the monitoring device 5. In addition, the film 2 having a length equivalent to one piece of the substrate including the defective portion is moved from the exit side of the lamination roller 9 toward the substrate separation device 18 and is discarded. The film 2 and the substrate 2 are separated by the substrate separation device 18 The laminated substrates 1 2 are separated, and the laminated substrates are discharged. In this case, after the substrate is discharged or after the second substrate separation processing S 1 400 is performed to discharge the laminated substrate, the number of substrates input for the instruction processing S 1 00 is reduced by one each time the substrate is discharged. . In the substrate discharge state, since there is no substrate 12 between the exit side of the lamination roller 9 and the substrate separation device 18, it returns to the thin-film version and the Zhang scale is applicable. National National Standard (CNS) Α4 specifications (210 × 297 mm) First (please read the precautions on the back before filling this page) -16- 577800 Employees' Cooperatives of Intellectual Property Bureau of the Ministry of Economic Affairs printed A7 B7 V. Invention Description (^ State confirmation processing S 3 0 0, then The above process is repeated, and the film 2 including the defect portion is equivalent to the length of a substrate. The film 2 is wound on the take-up roller 2 4 in the film discarding process S 500, and then the film state confirmation process S300 is performed, or One substrate separation process S800 is wound on the take-up roller 24, and then advances to the film state confirmation process S900. After the second substrate separation process S1400, the substrate is separated and a continuous stacking judgment is performed. Process S1500, and confirm the remaining number for the number of substrates inputted to instruct the process S100, to determine whether there are subsequent substrates, and if there is, return to the thin-film state confirmation process S900, and repeat the above Until the remaining number becomes 0. As described above, according to the present embodiment, if there is a defective part on the film 2, the film including the defective part and the region to be adhered to the substrate is adhered to the substrate before being adhered to the substrate 12. The area is regarded as a defective part and discarded. Therefore, it is possible to avoid a bad process of attaching a film including the defective part to the normal substrate 12 and to reduce the production cost. The monitoring device 5 is located upstream of the processing device between substrates, so the film The monitoring result of the surface state is not affected by the inter-substrate processing. When the surface state of the thin film is monitored by the monitoring device 5, when a defective portion exists in the inter-substrate portion (the portion of the instruction data D 2) described in FIG. 4, The part between the substrates does not belong to the thin film number η of the thin film management file F in FIG. 5, so the status of the thin film is 0, and no record is left. This can also reduce the consumption of the thin film 2. The substrate is separated in the first drawing The device 18 is disposed at a position where the laminated substrates can be separated from each other and a film including a defective portion can be cut. Applicable in China. National Standard (CNS) Α4 specification (210 × 297 mm). Equipment ---- Ί--Order (please read the precautions on the back before filling this page) i # -17- 577800 Intellectual Property of the Ministry of Economic Affairs A7 ____B7_ printed by the Bureau ’s Consumer Cooperative. V. Invention Description (^ and simplify the structure, but if a cutting device dedicated to cut the film containing the defective part is located near the downstream of the film clamp roller 17, etc., The amount of film to be discarded including the defective part can be reduced from the amount of one substrate shown in Fig. 9 to the length of the defective part. In the embodiment shown in Fig. 1, the monitoring device 5 monitors the feed from the film supply roller 1. The film may be a method in which an operator stands in front of the film to detect a defective part and display a mark. In addition, in the embodiment shown in FIG. 1, the film is laminated on the substrate, but a film supply roller or a monitoring device, an inter-substrate processing device, and the like having a mirror-symmetrical transport path as a boundary may be laminated on the substrate. Below. The inter-substrate processing apparatus is described by taking an example of removing a resist film, but a non-adhesive tape can also be adhered to the resist film in the width direction by using the adhesiveness of the resist film in order to prevent corrosion. The agent film is in contact with the front and rear ends of the substrate. Further, the waste film may be crimped by the crimping roller 25 to be wound around the lower film discarding roller 20 shown in Fig. 1, and the discarding film guide 23 or the take-up roller 24 may be omitted. In this case, the crimping roller 25 is disposed immediately downstream of the lower film discarding roller 20. As explained above, according to the present invention, it is possible to reduce the number of discards of a normal substrate by adhering only a good area of the film sent from the film supply roller to the substrate. -------- Cloths ---- Γ --- 1T ------ 0 (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 specifications (210 × 297 mm) -18-