JP3701221B2 - Film laminating method and apparatus - Google Patents

Film laminating method and apparatus Download PDF

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Publication number
JP3701221B2
JP3701221B2 JP2001256388A JP2001256388A JP3701221B2 JP 3701221 B2 JP3701221 B2 JP 3701221B2 JP 2001256388 A JP2001256388 A JP 2001256388A JP 2001256388 A JP2001256388 A JP 2001256388A JP 3701221 B2 JP3701221 B2 JP 3701221B2
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Prior art keywords
film
substrate
laminating
defective
roller
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JP2003062906A5 (en
JP2003062906A (en
Inventor
浩二 弘中
剛 石田
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株式会社 日立インダストリイズ
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/82Testing the joint
    • B29C65/8253Testing the joint by the use of waves or particle radiation, e.g. visual examination, scanning electron microscopy, or X-rays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/472Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00Flat articles, e.g. films or sheets
    • B29L2007/008Wide strips, e.g. films, webs

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method and an apparatus for laminating a film on a substrate surface, and in particular, between each substrate conveyed on a carrying path at a fixed interval and a laminating roller installed on the carrying path with a film fed from a film supply roll. The present invention relates to a film laminating method and an apparatus for laminating a film on each substrate surface by passing the film.
[0002]
[Prior art]
Conventionally, in liquid crystal production lines and semiconductor production lines that attach resist films to glass substrates and semiconductor substrates, an optical monitoring device has been installed downstream of the film laminating device to monitor the substrate surface after film lamination. Then, the film laminating condition in which a void exists between the substrate and the film or the film surface condition in which wrinkles are present in the film is inspected due to light reflection. And when a defective location etc. are detected, the means which removes the said defective board | substrate from a manufacturing line and does not perform a further process process with respect to a defective board is taken.
[0003]
Examples of the film laminating apparatus include those described in JP-A-5-338041 and JP-A-6-210595.
[0004]
[Problems to be solved by the invention]
The substrate before film lamination is a normal product, but a defective substrate taken out from the production line after lamination is difficult to reuse because the surface of the substrate remains dirty even if the film is peeled off and reused.
[0005]
Then, when examining the defective substrate, it was found that the occurrence of voids caused by the film laminate was not caused by the film laminate, and the defect was not caused by the film laminate. That is, when the film was fed from the film supply roll, it was confirmed that the film already contained a defective part.
[0006]
Therefore, an object of the present invention is to provide a film laminating method capable of reducing the number of discarded normal substrates by attaching a good region of a film fed from a film supply roll to the substrate.
[0007]
[Means for Solving the Problems]
The feature of the present invention that achieves the above object is to monitor the state of the film before laminating the film on the substrate, determine whether or not the film includes a defective portion, and detect this when the defective portion is detected. The defective portion area of the film including the defective portion is discarded, and only the good region is attached to the substrate.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail based on the embodiments shown in the drawings.
In FIG. 1, reference numeral 1 denotes a film supply roll for the film 2, and the film 2 is formed by stacking a base film 2a, a resist film 2b, and a cover film 2c in a three-layer structure as shown in FIG.
[0009]
The film 2 is fed out from the film supply roll 1, and immediately, the cover film 2 c is peeled off and collected on the take-up roll 3. The film supply roll 1 holds a torque opposite to the direction in which the film 2 is fed out, and a constant tension is applied to the film 2 regardless of the amount of the film fed out.
4 is a guide roll, and 5 is a monitoring device for the film surface state.
[0010]
The monitoring device 5 has an optical sensor for monitoring the state of the film surface being fed out at an arbitrary sampling period, and performs digital color discrimination by color component (RGB) detection and brightness / darkness detection. The defective portions of the film 2 are uneven thickness and discoloration in the resist film 2b, and the color components and brightness are different from those of the non-defective film. Therefore, thickness unevenness or discoloration is detected by an optical sensor, and the measurement result is transferred to the control device 6. The determination unit in the control device 6 determines how close the film color is to a non-defective product with the degree of coincidence (0 to 999). An arbitrary threshold value is provided for the degree of coincidence, and at each sampling, when it is larger than the threshold value, it is determined to be good, and when it is small, it is determined to be bad. deep. Reference numeral 6 a denotes an operation panel attached to the control device 6.
[0011]
Reference numeral 7 denotes an inter-substrate processing apparatus, in which two rows of cuts are provided in the width direction of the resist film 2b in the film 2, and the resist film 2b between the cuts is peeled off to expose the base film 2a.
[0012]
The resist film 2b remaining on the base film 2a is attached to the substrate. Therefore, the interval between the two rows of cuts is the sum of the interval between the substrates conveyed continuously and the length at which the resist film of each substrate is not desired to be attached.
[0013]
A film tension holding roller 8 has a slit on the roller surface, sucks the film 2 and rotates in the direction opposite to the film conveyance (feeding out) direction, and the film tension from the downstream laminating roller 9 to the film tension holding roller 8. Is kept constant. Reference numeral 10 denotes a guide roller having a torque sensor for measuring the film tension value from the laminating roller 9 to the film tension holding roller 8, and the detected torque is sent to the control device 6 to hold the film tension so that the film tension is always constant. The rotational speed of the roller 8 is controlled by the control device 6.
[0014]
Reference numeral 11 denotes a guide roller for avoiding contact between the laminating roller 9 and the film 2 when the substrate 12 is not transported from the upstream on the transport path for a predetermined time or more. In the state of waiting for substrate conveyance from the upstream machine, the guide roller 11 descends to avoid contact between the film 2 and the laminating roller 9. At the time of film lamination, the guide roller 11 rises and conveys the film only between the rolls from the guide roller 10 to the laminating roller 9. In addition, 9a is a backup roll which keeps the pressurization amount (linear pressure) of the lamination roller 9 uniform.
[0015]
13 is a heat retaining device for keeping the substrate 12 continuously transported at a constant interval, 14 is a transport device for transporting the substrate from the upstream device to this apparatus, 15 is a substrate transport support roller, and 16 is First substrate nip roller for transporting the substrate after lamination, 17 is a film nip roller for transporting the film, 18 is a substrate 12 and the substrate 12 that are continuously laminated and connected by the film 2, and a laser cutter, etc. A substrate separating apparatus 19 for separating the substrate, 19 is a substrate transport supporting roller capable of moving up and down, 20 is a film discarding roller, and 21 is a second substrate nip roller for transporting the laminated substrate.
[0016]
As will be described later, the film discarding roller 20 can move in the range of the downstream position of the film nip roller 17 from the position shown in the drawing in the transport direction of the substrate 12 or the film 2 in the transport direction. When moving in the upstream or downstream direction, the substrate transporting support roller 19 is lowered by the control device 6 so as not to obstruct the movement.
[0017]
Reference numeral 22 denotes a discharging device for discharging the separated substrate, 23 a waste film guide, 24 a waste film winding roll, and 25 a pressing roller for attaching the waste film to the winding roll 24.
Since the film 2 is the resist film 2b on the take-up roll 24 side, when the waste film is pressed against the take-up roll 24 by the pressing roller 25, it can be attached and wound by the adhesiveness of the resist film 2a.
[0018]
The control device 6 includes a RAM for storing various data such as a teaching result for the laminating process input from the operation panel 6a and a device dependent data, and a ROM storing a laminating process flow program. , A hard disk, a central processing unit composed of an interface for communicating signals between them, a driver device for sending an operation signal to each drive unit, a display screen for various data, and the like.
[0019]
The substrate 12 is subjected to a film laminating process using a plurality of substrates having the same length in the transport direction as a lot. If there is a change in the lot, the controller 6 transports the substrate and the film according to the length of the substrate. The setting can be made by slightly moving the position of each roller in the conveying direction.
[0020]
Next, the film lamination to the board | substrate 12 is demonstrated along the flow program of FIG.
First, the control device 6 is turned on and a teaching process in step (hereinafter abbreviated as S) 100 is performed.
[0021]
In the teaching process S100, the width L1 of the substrate 12, the length L2 of the substrate 13, the tip position P1 of the film 2 applied to the substrate 13, the attachment length D1 of the film 2 to the substrate 12, the substrate at the time of continuous lamination Input the data regarding the length D2 subjected to the interval processing, the set temperature data of the laminating roller 9 and the backup roller 9a, the data of the tension applied to the film 2, the number of substrates to be attached in the same lot, etc. It is stored in the RAM of the control device 6. In addition, the length of the film 2 from the inter-substrate processing apparatus 7 to the laminating roller 9 is an integral multiple of the length D1 of the film 2 attached to the substrate 12 and the length D2 subjected to the inter-substrate spacing process during continuous lamination. In this manner, the length of the resist film 2b to be attached remaining on the film 2 is matched with the attachment length D1 of each substrate 12 conveyed continuously with reference to the attachment tip position P1. ing. Each time the substrate spacing processing is performed by the inter-substrate processing device 7, each substrate to be pasted on the resist management film 2b of the length D1 on the film management data file F in the RAM of the control device 6 as shown in FIG. The film number n is attached in correspondence with 12 and stored.
[0022]
In the next operation preparation process S200, the control device 6 starts the operation preparation operation by the start button in the operation panel 6a. In preparation for operation, the position of each roller is slightly moved in the transport direction by the conveyor 26 shown in FIG. 6 so as to match the length of the substrate 12 input in the teaching process S100. Thereafter, the film supply roll 1, the take-up roll 3 and the film tension holding roller 8 are rotationally driven to hold the tension of the film set in the apparatus, and the film 2 is nipped by the film nip roller 17. Further, the film discard roller 20 and the take-up roll 24 are driven to rotate at a constant torque to prepare for discarding the film. The substrate carrying support roller 19 is raised for carrying in the substrate, then the guide roll 11 is lowered, and the laminating roller 9 and the backup roller 9a are retracted in the vertical direction from the carrying path position to avoid contact with the film 2. Then, temperature control is performed so that the laminating roller 9, the backup roller 9a, and the heat retaining device 13 are set to the temperature set in S100.
[0023]
In order to create the data of the film management file F, the film disposal roller 20 is moved to the vicinity of the film nip roller 17 by the conveyor 27 (see FIG. 6) to nip the film 2 and then drive downstream to transport the film 2. .
[0024]
At this time, the film number (No) n in the film management file F has the film number at the laminating roller entrance position as the first n = 1 and the rear part up to the inter-substrate processing apparatus 7 as n = n. The film position may be n = n. While the film is being transported, the surface state of the film 2 is monitored by the monitoring device 5, and as described above, if the degree of coincidence is equal to or less than the threshold value in the determination unit of the control device 6, Flag 1 is set in the film status column corresponding to n, and a defect detection display and a buzzer call are performed on the operation panel 6a or on the monitor screen. If no defect is detected, no flag is set and 0 is set in the film status column corresponding to film number n. As the film 2 is conveyed, the film number column and the film state column of the film management file F are stepped (shifted) toward the laminating roller entrance position as shown in FIG. In addition, during film conveyance in a preparation stage, the excess film 2 ahead of the winding roll 24 is wound up.
[0025]
Then, in the film state confirmation processing S300, the film state data of the film number n = 1 in the film management file F is read before the second and subsequent substrates are started to be carried. Next, the process proceeds to the film defect determination process S400, where it is confirmed whether the read film state data is 0. If it is 0, the first board carry-in process S600 is started assuming that the film to be attached is in a non-defective state. To do.
[0026]
On the other hand, if the film state data is 1 in the film defect determination process S400, this means that there is a defective part in the film to be pasted. Therefore, the process proceeds to the film disposal process S500 and the film nip roller 17 uses the laminate amount D1. A film having a length corresponding to one substrate including the defective portion = the defective portion region is fed, and the film 2 is wound around the take-up roll 24. If the film 2 is transported, the monitoring device 5 monitors the surface state of the film 2, sends the detection result to the control device 6, stores it in its RAM, and prepares the film management file F.
[0027]
When the disposal of the defective portion area of the film 2 including the defective portion at the laminating roller entrance position is completed, the process returns to the film state confirmation processing S300, and the film number n = 1 to be pasted that has reached the laminating roller entrance (immediately before) For film 2, the film state data is read out and the film defect determination process S400 determines again whether there is a defective portion. Proceed to the first substrate carrying-in process S500, and if there is, go to the film discarding process S500 and repeat the above process.
[0028]
Here, the process will be described assuming that the first substrate carrying-in process S500 has been performed.
In the first substrate carrying-in process S500, the conveyance device 14 corrects the inclination in the width direction of the substrate 12 with respect to the angle of the laminating roller 9, and then conveys the substrate 12 to an arbitrary position below the laminating roller 9.
[0029]
Thereafter, in the first laminating process S700, the substrate 12 is nipped by the laminating roller 9 and the backup roller 9a, the guide roller 11 is lifted, and the film 2 is pasted on the substrate 12 for the amount of laminating length D1 taught in advance. Since the film 2 is being transported during the lamination, the surface state of the film 2 is monitored by the monitoring device 5 as described above. Further, the inter-substrate processing apparatus 7 performs the above-described inter-substrate processing for removing the resist film 2b having the teach data amount D2 every time the film 2 corresponding to one substrate (teach data amount D1) is conveyed.
[0030]
When the film 2 attachment is completed, the process proceeds to the first substrate separation process S800. As shown in FIG. 7, the substrate 12 on which the film is attached is nipped by the first substrate nip roller 16, and the lamination roller 9 and the backup roller 9a. Retreat and guide roller 11 is lowered. Subsequently, the substrate separation device 18 cuts the substrate 12 and excess film, opens the film discard roller 20, and releases the film holding. Simultaneously with the opening, the excess film 2 is collected on the take-up roll 24.
[0031]
On the other hand, the substrate 12 is conveyed downstream by the amount of teach data D2 by the first substrate nip roll 16 and waits for the next substrate loading. Further, the film state data corresponding to each film number n in the film management file F is shifted by one film number. FIG. 7 shows a situation in which the film 2 is cut by the substrate separating device 18.
[0032]
Thereafter, the process proceeds to a film state confirmation process S900, and similarly to the film state confirmation process S300, the film state data of the film n = 1 in the film management file F is read out before starting the second and subsequent substrate loading, and the film defect judgment process S1000. It is confirmed whether or not flag 1 is present in the film status data.
[0033]
If the flag 1 is not present and the film 2 with the film number n = 1 is satisfactory, the process proceeds to the second and subsequent substrate carry-in processing S1200. In the second and subsequent substrate laminating processes S1300 and the second and subsequent substrate separating processes S1400, the same processes as the first and second substrate separating processes S700 and S800 are performed. The substrate 12 already laminated and staying in the apparatus is conveyed to the downstream separation position by the first substrate nip roller 16 and the second substrate nip roller 21 in synchronization with the laminating speed. FIG. 8 shows this state.
[0034]
The laminated substrate 12 separated in the second and subsequent substrate separation processes S1400 is transferred to the discharge device 22 by the second substrate nip roller 21, and the substrate is carried out to the downstream machine.
[0035]
If 1 is set in the film status data of the film number n = 1 in the film management file F in the film defect determination process S1000, the laminated substrate 12 is discharged in the substrate discharge process S1100.
[0036]
In the substrate discharge processing S1100, the second substrate is not carried in, but the substrate 12 that has been laminated by the first substrate nip roller 16 and the second substrate nip roller 21 as shown in FIG. Then, the film disposal roller 20 is moved to the vicinity of the film nip roller 17 by the conveyor 27, the film is nipped, and the film tension is maintained. Even during transport to the substrate separation position, the monitoring device 5 detects and monitors the film surface state. Then, the film 2 having a length corresponding to one substrate including the defective portion moves from the exit side of the laminating roller 9 to the substrate separating device 18 to prepare for disposal.
[0037]
The film separation device 18 is separated from the film 2 and the laminated substrate 12, and the laminated substrate is discharged.
If the laminated substrate is discharged in the substrate discharge or the second and subsequent substrate separation processing S1400 in this case, the remaining number of the substrates input in the teaching processing S100 is reduced by one for each discharge.
[0038]
In the substrate discharge state, there is no substrate 12 between the exit side of the laminating roller 9 and the substrate separating device 18, so the process returns to the film state confirmation processing S300 and the above processing is repeated.
[0039]
After separating the substrates in the second and subsequent substrate separation processing S1400, a continuous laminate judgment processing S1500 is executed, and it is determined whether there is a subsequent substrate by checking the remaining number of substrates inputted in the teaching processing S100. Then, the process returns to the film state confirmation process S900 and the above process is repeated until the remaining number of sheets becomes zero.
[0040]
As described above, according to the present embodiment, if there is a defective portion in the film 2, the film 2 in the region to be attached to the substrate including the defective portion is discarded as a defective portion region before being attached to the substrate 12. It is possible to avoid handling a defective substrate by attaching a film including a defective portion to a normal substrate 12, and to reduce the production cost.
[0041]
Since the monitoring device 5 is upstream of the inter-substrate processing apparatus, the monitoring result of the film surface state does not depend on the inter-substrate processing.
[0042]
In the film surface state monitoring by the monitoring device 5, when the defective part exists in the inter-substrate part (the part of the teach data D2 amount) described in FIG. 4, the inter-substrate part is the film management file F in FIG. Therefore, the film state column is set to 0 so that no record is left. By doing so, the consumption of the film 2 can also be reduced.
[0043]
The substrate separating apparatus 18 in FIG. 1 is arranged at a position where separation of laminated substrates and cutting of a film including a defective portion are possible, and the structure is simplified, but the film cutting including the defective portion is performed. If a dedicated cutter is provided in the vicinity of the downstream side of the film nip roller 17 or the like, the amount of defective parts that can be discarded can be reduced to the length of removal of defective parts from one substrate shown in FIG.
[0044]
In the embodiment of FIG. 1, the monitoring device 5 monitors the film itself fed out from the film supply roll 1, but an operator inspects the film in advance and detects a defective part display mark or the like. It may be a thing. In the embodiment of FIG. 1, a film is laminated on the upper surface of the substrate, but there are film supply rolls, a monitoring device, an inter-substrate processing device, etc. symmetrically with respect to the conveyance path, and there is a film on the lower surface of the substrate. May be laminated.
[0045]
Although the example of removing the resist film has been described as the inter-substrate processing apparatus, even if the tape is applied in the width direction on the resist film in the inter-substrate portion so that the resist film does not contact the front and rear end portions of the substrate. Good.
[0046]
【The invention's effect】
As described above, according to the present invention, it is possible to reduce the number of normal substrates discarded by attaching only the good region of the film fed from the film supply roll to the substrate.
[Brief description of the drawings]
FIG. 1 is a schematic view showing a laminating apparatus according to an embodiment of the present invention.
FIG. 2 is a view showing the structure of a film used in the laminating apparatus shown in FIG.
FIG. 3 is a diagram showing a film laminating flow program executed by the controller of the laminating apparatus shown in FIG. 1;
FIG. 4 is a diagram for explaining data input in teaching processing in the flow program of FIG. 3;
FIG. 5 is a diagram for explaining a film management file created by a control device based on a detection result obtained by a monitoring device in the laminating device of FIG. 1;
6 is a schematic view showing the operation preparation status of the laminating apparatus of FIG. 1. FIG.
7 is a schematic view showing a staying state of the first substrate laminated by the laminating apparatus of FIG. 1. FIG.
FIG. 8 is a schematic view showing a state in which the first substrate that has been laminated by the laminating apparatus of FIG. 1 is also laminated on the second substrate.
9 is a schematic view showing a situation in which a film is discarded when there is a defective portion in the film after being laminated on the first substrate by the laminating apparatus of FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Film supply roll 2 ... Film 2a ... Base film 2b ... Resist film 2c ... Cover film 3,24 ... Winding roll 5 ... Monitoring apparatus 6 ... Control apparatus 6a ... Operation panel 7 ... Inter-substrate processing apparatus 9 ... Laminating roller 9a ... Backup roller 12 ... Substrate 16 ... First substrate nip roller 17 ... Film nip roller 18 ... Substrate separator 20 ... Second substrate nip roller 21 ... Film discard roller 22 ... Discharge device

Claims (9)

  1. A method in which a film is pasted on the surface of each substrate by passing each substrate transported on the transport path at a fixed interval and a film fed from a film supply roll between laminating rollers installed on the transport path. Then, before the film is laminated on the substrate, the state of the film is monitored, it is determined whether or not the film contains a defective part, and when the defective part is detected, the area including the defective part of the film is discarded, In the film laminating method in which the good area is attached to the substrate,
    When the defective portion is detected, the film is disposed by retracting the laminating roller to avoid contact with the film, and the film is disposed on a take-up roll for film disposal. Lamination method.
  2.   2. The film laminating method according to claim 1, wherein when a defective portion is detected, a film having a length corresponding to one substrate including the defective portion is discarded as a defective portion area.
  3. In the film laminating method according to claim 1, after laminating the full Irumu the substrate, subjected to film failure judging by the film state confirmation process, when the defective determination is made, characterized by discharging the laminate already substrate Film laminating method.
  4.   4. The film laminating method according to claim 3, wherein when the laminated substrate is discharged, the film is nipped and the film tension is maintained.
  5.   The film laminating method according to claim 1, wherein when a defective portion is detected in a region where the film state is monitored and the inter-substrate processing of the film is performed, the inter-substrate processing is performed as it is and the good region is attached to the substrate. A film laminating method characterized by that.
  6.   2. The film laminating method according to claim 1, wherein the inter-substrate treatment is a treatment for removing the film layer corresponding to the inter-substrate and the region where the film layer of the film is not desired to contact the front and rear end portions of the substrate. A method for laminating a film, characterized in that it is a process of sticking a tape on the film layer of the corresponding film.
  7. A device that attaches film on the surface of each substrate by passing each substrate transported on the transport path at a fixed interval and the film fed from the film supply roll between the laminating rollers installed on the transport path. There,
    Monitoring means for monitoring the state of the film before laminating the film on the substrate, judging means for judging whether or not the film contains a defective part from the detection result obtained by the monitoring means, and when the judging means detects the defective part In a film laminating apparatus having means for discarding defective areas of a film and attaching good areas to a substrate,
    The laminating roller is retracted, and when the defective portion is detected, contact avoidance means with the film that forms a state avoiding contact with the film, and a winding roller that winds the film in a state avoiding the contact A film laminating apparatus comprising a conveying means for conveying the film.
  8.   8. The film laminating apparatus according to claim 7, further comprising means for performing inter-substrate processing on the film downstream of the monitoring means so that the film does not contact the front and rear end portions of the substrate. apparatus.
  9.   8. The film laminating apparatus according to claim 7, wherein the conveying means includes a film nip roller for nipping a film and a film discard roller, and the film discard roller is movable to the vicinity of the film nip roller to nip the film. A film laminating apparatus for holding film tension.
JP2001256388A 2001-08-27 2001-08-27 Film laminating method and apparatus Active JP3701221B2 (en)

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JP2001256388A JP3701221B2 (en) 2001-08-27 2001-08-27 Film laminating method and apparatus
TW091115066A TW577800B (en) 2001-08-27 2002-07-08 Method and apparatus for laminating film
KR10-2002-0050442A KR100463488B1 (en) 2001-08-27 2002-08-26 A method for laminating film an apparatus therefor

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JP2003062906A JP2003062906A (en) 2003-03-05
JP2003062906A5 JP2003062906A5 (en) 2003-03-05
JP3701221B2 true JP3701221B2 (en) 2005-09-28

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JP4627178B2 (en) * 2003-11-25 2011-02-09 大日本印刷株式会社 Laminating equipment
JP4456426B2 (en) 2004-07-06 2010-04-28 富士フイルム株式会社 Detection device
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