TW573073B - Silver plating bath - Google Patents

Silver plating bath Download PDF

Info

Publication number
TW573073B
TW573073B TW89113612A TW89113612A TW573073B TW 573073 B TW573073 B TW 573073B TW 89113612 A TW89113612 A TW 89113612A TW 89113612 A TW89113612 A TW 89113612A TW 573073 B TW573073 B TW 573073B
Authority
TW
Taiwan
Prior art keywords
plating
bath
silver
cyanide
plating bath
Prior art date
Application number
TW89113612A
Other languages
English (en)
Chinese (zh)
Inventor
Yasuo Kato
Original Assignee
Ne Chemcat Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ne Chemcat Corp filed Critical Ne Chemcat Corp
Application granted granted Critical
Publication of TW573073B publication Critical patent/TW573073B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
TW89113612A 1999-08-12 2000-07-07 Silver plating bath TW573073B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22821199A JP4138171B2 (ja) 1999-08-12 1999-08-12 銀電気めっき浴

Publications (1)

Publication Number Publication Date
TW573073B true TW573073B (en) 2004-01-21

Family

ID=16872940

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89113612A TW573073B (en) 1999-08-12 2000-07-07 Silver plating bath

Country Status (3)

Country Link
JP (1) JP4138171B2 (ja)
KR (1) KR100576584B1 (ja)
TW (1) TW573073B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI680470B (zh) * 2015-01-13 2019-12-21 日商同和電子科技有限公司 覆銀銅粉、其製造方法及使用該覆銀銅粉之導電性糊以及使用該導電性糊之太陽電池用電極之製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6230778B2 (ja) * 2012-05-31 2017-11-15 日亜化学工業株式会社 光半導体装置用電解銀めっき液

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4024031A (en) * 1975-10-28 1977-05-17 Amp Incorporated Silver plating
JPS5919196B2 (ja) * 1978-12-21 1984-05-02 三菱電機株式会社 高速電解銀めつき方法
JPS6070197A (ja) * 1983-09-28 1985-04-20 Yaskawa Electric Mfg Co Ltd 銀合金めつき法
US4604167A (en) * 1984-01-26 1986-08-05 Shinko Electric Industries Co., Ltd. Silver plating solution and silver plating process and pretreatment solution therefor
JPH02228489A (ja) * 1989-02-28 1990-09-11 Agency Of Ind Science & Technol 高速度厚付け銀めっき法
JPH0459975A (ja) * 1990-06-29 1992-02-26 Electroplating Eng Of Japan Co 電子部品の銀メッキ方法
JPH09249988A (ja) * 1996-03-15 1997-09-22 Hitachi Cable Ltd 銀めっき方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI680470B (zh) * 2015-01-13 2019-12-21 日商同和電子科技有限公司 覆銀銅粉、其製造方法及使用該覆銀銅粉之導電性糊以及使用該導電性糊之太陽電池用電極之製造方法

Also Published As

Publication number Publication date
KR100576584B1 (ko) 2006-05-04
KR20010021142A (ko) 2001-03-15
JP4138171B2 (ja) 2008-08-20
JP2001049487A (ja) 2001-02-20

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