TW564239B - Heating element comprising MoSi2 as primary component - Google Patents
Heating element comprising MoSi2 as primary component Download PDFInfo
- Publication number
- TW564239B TW564239B TW091132046A TW91132046A TW564239B TW 564239 B TW564239 B TW 564239B TW 091132046 A TW091132046 A TW 091132046A TW 91132046 A TW91132046 A TW 91132046A TW 564239 B TW564239 B TW 564239B
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- TW
- Taiwan
- Prior art keywords
- heating element
- mosi2
- impurities
- main component
- heating
- Prior art date
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 147
- 229910020968 MoSi2 Inorganic materials 0.000 title claims abstract description 67
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 69
- 239000012535 impurity Substances 0.000 claims abstract description 43
- 239000004065 semiconductor Substances 0.000 claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 claims abstract description 27
- 229910052906 cristobalite Inorganic materials 0.000 claims abstract description 20
- 229910052681 coesite Inorganic materials 0.000 claims abstract description 19
- 229910052682 stishovite Inorganic materials 0.000 claims abstract description 19
- 229910052905 tridymite Inorganic materials 0.000 claims abstract description 19
- 229910052742 iron Inorganic materials 0.000 claims abstract description 12
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 10
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910052700 potassium Inorganic materials 0.000 claims description 5
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 36
- 239000000377 silicon dioxide Substances 0.000 abstract description 13
- 238000009792 diffusion process Methods 0.000 abstract description 7
- 230000003647 oxidation Effects 0.000 abstract description 7
- 238000007254 oxidation reaction Methods 0.000 abstract description 7
- 239000000356 contaminant Substances 0.000 abstract 1
- 238000012856 packing Methods 0.000 abstract 1
- 239000010453 quartz Substances 0.000 description 23
- 239000000463 material Substances 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 14
- 239000000843 powder Substances 0.000 description 14
- 238000011109 contamination Methods 0.000 description 9
- 238000005245 sintering Methods 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 5
- 238000005485 electric heating Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000005238 degreasing Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000010298 pulverizing process Methods 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- 230000008016 vaporization Effects 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 101100273567 Arabidopsis thaliana CYCL1-1 gene Proteins 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 229910016006 MoSi Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/148—Silicon, e.g. silicon carbide, magnesium silicide, heating transistors or diodes
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- C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
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- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/018—Heaters using heating elements comprising mosi2
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Resistance Heating (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001358355A JP2003160380A (ja) | 2001-11-22 | 2001-11-22 | ＭｏＳｉ２を主成分とする発熱体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200300743A TW200300743A (en) | 2003-06-16 |
| TW564239B true TW564239B (en) | 2003-12-01 |
Family
ID=19169546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091132046A TW564239B (en) | 2001-11-22 | 2002-10-29 | Heating element comprising MoSi2 as primary component |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2003160380A (ja) |
| TW (1) | TW564239B (ja) |
| WO (1) | WO2003043952A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4515038B2 (ja) * | 2003-04-04 | 2010-07-28 | 日鉱金属株式会社 | ＭｏＳｉ２粉末、同粉末の製造方法、同粉末を用いた発熱体及び発熱体の製造方法 |
| JP4563022B2 (ja) * | 2003-12-01 | 2010-10-13 | 日鉱金属株式会社 | 板状発熱体からなる薄型高温電気加熱炉 |
| KR100885719B1 (ko) * | 2006-11-04 | 2009-02-26 | (주)위너테크놀로지 | 이규화 몰리브데넘 및 그 응용 |
| JP5122593B2 (ja) * | 2010-01-29 | 2013-01-16 | Ｊｘ日鉱日石金属株式会社 | ＭｏＳｉ２粉末、同粉末の製造方法、同粉末を用いた発熱体及び発熱体の製造方法 |
| JP7257830B2 (ja) * | 2019-03-18 | 2023-04-14 | 太平洋セメント株式会社 | 窒化ガリウムの粉砕方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08143365A (ja) * | 1994-11-15 | 1996-06-04 | Riken Corp | 二珪化モリブデンヒーター |
| JPH10324571A (ja) * | 1997-05-23 | 1998-12-08 | Riken Corp | 二珪化モリブデン系セラミックス発熱体及びその製造方法 |
| JP3657800B2 (ja) * | 1998-02-20 | 2005-06-08 | 株式会社リケン | 二珪化モリブデン系複合セラミックス発熱体及びその製造方法 |
| JP3681149B2 (ja) * | 1998-05-21 | 2005-08-10 | 株式会社日鉱マテリアルズ | 発熱材料 |
-
2001
- 2001-11-22 JP JP2001358355A patent/JP2003160380A/ja not_active Withdrawn
-
2002
- 2002-08-29 WO PCT/JP2002/008710 patent/WO2003043952A1/ja active Search and Examination
- 2002-10-29 TW TW091132046A patent/TW564239B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003043952A1 (fr) | 2003-05-30 |
| JP2003160380A (ja) | 2003-06-03 |
| TW200300743A (en) | 2003-06-16 |
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