TW563215B - Mounting method and device for material to be junctioned having bumps - Google Patents

Mounting method and device for material to be junctioned having bumps Download PDF

Info

Publication number
TW563215B
TW563215B TW91113470A TW91113470A TW563215B TW 563215 B TW563215 B TW 563215B TW 91113470 A TW91113470 A TW 91113470A TW 91113470 A TW91113470 A TW 91113470A TW 563215 B TW563215 B TW 563215B
Authority
TW
Taiwan
Prior art keywords
pressure
adhesive
conductive particles
pressing
joined
Prior art date
Application number
TW91113470A
Other languages
English (en)
Chinese (zh)
Inventor
Akira Yamauchi
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Application granted granted Critical
Publication of TW563215B publication Critical patent/TW563215B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW91113470A 2001-06-20 2002-06-20 Mounting method and device for material to be junctioned having bumps TW563215B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001187160 2001-06-20

Publications (1)

Publication Number Publication Date
TW563215B true TW563215B (en) 2003-11-21

Family

ID=19026493

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91113470A TW563215B (en) 2001-06-20 2002-06-20 Mounting method and device for material to be junctioned having bumps

Country Status (3)

Country Link
JP (1) JP3966516B2 (ja)
TW (1) TW563215B (ja)
WO (1) WO2003001586A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385676B (zh) * 2007-06-26 2013-02-11 Sony Chem & Inf Device Corp An anisotropic conductive material, a connecting structure, and a method for manufacturing the same

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5099987B2 (ja) * 2005-07-25 2012-12-19 旭化成イーマテリアルズ株式会社 回路接続方法および接続構造体
JP4925405B2 (ja) * 2005-10-03 2012-04-25 旭化成イーマテリアルズ株式会社 接続構造体の製造方法
WO2009001605A1 (ja) * 2007-06-26 2008-12-31 Sony Chemical & Information Device Corporation 異方性導電材料、接続構造体及びその製造方法
JP5540916B2 (ja) * 2010-06-15 2014-07-02 デクセリアルズ株式会社 接続構造体の製造方法
JP5370694B2 (ja) * 2011-03-11 2013-12-18 デクセリアルズ株式会社 接続構造体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513120A (ja) * 1991-07-04 1993-01-22 Sharp Corp 異方性導電テープコネクタと光硬化性樹脂を用いた電子部品実装構造
JP2629502B2 (ja) * 1991-11-20 1997-07-09 富士通株式会社 半導体チップ搭載フィルムの接続方法
JP3241943B2 (ja) * 1994-09-16 2001-12-25 アルプス電気株式会社 回路接続方法
JP3438583B2 (ja) * 1998-05-08 2003-08-18 松下電器産業株式会社 異方導電性フィルムの接続方法
JP4311862B2 (ja) * 2000-05-29 2009-08-12 東レエンジニアリング株式会社 チップ実装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385676B (zh) * 2007-06-26 2013-02-11 Sony Chem & Inf Device Corp An anisotropic conductive material, a connecting structure, and a method for manufacturing the same

Also Published As

Publication number Publication date
WO2003001586A1 (en) 2003-01-03
JPWO2003001586A1 (ja) 2004-10-14
JP3966516B2 (ja) 2007-08-29

Similar Documents

Publication Publication Date Title
WO2000045431A1 (en) Method of packaging semiconductor device using anisotropic conductive adhesive
US6674178B1 (en) Semiconductor device having dispersed filler between electrodes
TW200829106A (en) Mounting method using thermal contact bonding head
TW563215B (en) Mounting method and device for material to be junctioned having bumps
TW201803958A (zh) 異向性導電膜、其製造方法及連接結構體
Wu et al. Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages
JP4916494B2 (ja) 圧着装置、圧着方法、および押圧板
Chowdhury et al. Thermo-mechanical analysis of thermal compression bonding chip-join process
KR20070047443A (ko) 도전성 접착제와 이 도전성 접착제를 이용한 단자간의 접속 방법
JP3520208B2 (ja) 回路基板への半導体素子の装着方法、及び半導体装置
Yasuda et al. Adhesive joining process and joint property with low melting point filler
Lee et al. Curing and bonding behaviors of anisotropic conductive films (ACFs) by ultrasonic vibration for flip chip interconnection
Suppiah et al. A review: Application of adhesive bonding on semiconductor interconnection joints
JP2013168443A (ja) 接続体の製造方法、及び接続方法
TW202028940A (zh) 曲面自對位接合裝置及其方法
JPH03225934A (ja) 半導体集積回路素子の接続方法
Ramkumar et al. A novel anisotropic conductive adhesive for lead-free surface mount electronics packaging
JP6257303B2 (ja) 接続体の製造方法、接続方法、及び接続体
Lee et al. Modelling the effect of voids in anisotropic conductive adhesive joints
KR20200027399A (ko) 레이저 접합 방법
JP3828122B2 (ja) 電気部品の接続方法
JP2004128259A (ja) 接合構造とこの接合構造を備えた電子機器
JP2003273294A (ja) 熱伝導シートおよびこれを用いた半導体装置
Kim et al. Thermal degradation of anisotropic conductive film joints under temperature fluctuation
KR100742654B1 (ko) 다층 구조 도전성 접착제와 이 다층 구조 도전성 접착제를이용한 단자간의 접속 방법 및 반도체 장치의 실장 방법

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees