TW543351B - Substrate adhesion enhancement to film - Google Patents
Substrate adhesion enhancement to film Download PDFInfo
- Publication number
- TW543351B TW543351B TW091107859A TW91107859A TW543351B TW 543351 B TW543351 B TW 543351B TW 091107859 A TW091107859 A TW 091107859A TW 91107859 A TW91107859 A TW 91107859A TW 543351 B TW543351 B TW 543351B
- Authority
- TW
- Taiwan
- Prior art keywords
- patent application
- substrate
- scope
- item
- metal foil
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 67
- 229910052751 metal Inorganic materials 0.000 claims abstract description 76
- 239000002184 metal Substances 0.000 claims abstract description 76
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- 238000005530 etching Methods 0.000 claims abstract description 28
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- 238000000034 method Methods 0.000 claims description 59
- 229920006254 polymer film Polymers 0.000 claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 238000003475 lamination Methods 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 229920002120 photoresistant polymer Polymers 0.000 claims description 14
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- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
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- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
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- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
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- AHICWQREWHDHHF-UHFFFAOYSA-N chromium;cobalt;iron;manganese;methane;molybdenum;nickel;silicon;tungsten Chemical compound C.[Si].[Cr].[Mn].[Fe].[Co].[Ni].[Mo].[W] AHICWQREWHDHHF-UHFFFAOYSA-N 0.000 description 1
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- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
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- FHIVAFMUCKRCQO-UHFFFAOYSA-N diazinon Chemical compound CCOP(=S)(OCC)OC1=CC(C)=NC(C(C)C)=N1 FHIVAFMUCKRCQO-UHFFFAOYSA-N 0.000 description 1
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- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical class [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53796—Puller or pusher means, contained force multiplying operator
- Y10T29/53804—Battery post and terminal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/846,705 US6629348B2 (en) | 2001-05-01 | 2001-05-01 | Substrate adhesion enhancement to film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW543351B true TW543351B (en) | 2003-07-21 |
Family
ID=25298703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091107859A TW543351B (en) | 2001-05-01 | 2002-04-17 | Substrate adhesion enhancement to film |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6629348B2 (enExample) |
| EP (1) | EP1386526A1 (enExample) |
| JP (1) | JP2005512305A (enExample) |
| KR (1) | KR20040015235A (enExample) |
| CN (1) | CN1284430C (enExample) |
| CA (1) | CA2445604C (enExample) |
| MY (1) | MY124850A (enExample) |
| TW (1) | TW543351B (enExample) |
| WO (1) | WO2002089546A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6696163B2 (en) * | 2000-07-18 | 2004-02-24 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
| US20020130103A1 (en) * | 2001-03-15 | 2002-09-19 | Zimmerman Scott M. | Polyimide adhesion enhancement to polyimide film |
| EP1378947A1 (en) * | 2002-07-01 | 2004-01-07 | Interuniversitair Microelektronica Centrum Vzw | Semiconductor etching paste and the use thereof for localised etching of semiconductor substrates |
| DE10241300A1 (de) * | 2002-09-04 | 2004-03-18 | Merck Patent Gmbh | Ätzpasten für Siliziumoberflächen und -schichten |
| US20070220745A1 (en) * | 2004-04-29 | 2007-09-27 | Siemens Aktiengesellschaft | Method for Producing Traverse Connections in Printed Circuit Board Sets |
| JP4742580B2 (ja) * | 2004-05-28 | 2011-08-10 | 住友化学株式会社 | フィルムおよびそれを用いた積層体 |
| WO2006004989A2 (en) * | 2004-06-30 | 2006-01-12 | University Of South Florida | Methof for etching microchannel networks within liquid crystal polymer substrates |
| CN100449801C (zh) * | 2004-09-30 | 2009-01-07 | 晶元光电股份有限公司 | 半导体发光元件组成 |
| JP4583939B2 (ja) * | 2005-01-14 | 2010-11-17 | 日東電工株式会社 | 配線回路基板の製造方法 |
| JP4627682B2 (ja) * | 2005-05-27 | 2011-02-09 | 株式会社日立ハイテクノロジーズ | 試料作製装置および方法 |
| CN100505988C (zh) * | 2005-11-01 | 2009-06-24 | 比亚迪股份有限公司 | 印刷线路板屏蔽层与补强材料之间的结合方法 |
| JP4918310B2 (ja) * | 2006-08-28 | 2012-04-18 | Ｊｘ日鉱日石金属株式会社 | プリント配線板製造用の金属製支持体 |
| US20080118730A1 (en) * | 2006-11-22 | 2008-05-22 | Ta-Hua Yu | Biaxially oriented film, laminates made therefrom, and method |
| JP4775314B2 (ja) * | 2007-05-11 | 2011-09-21 | ソニー株式会社 | 流路基板の製造方法 |
| JP5424317B2 (ja) * | 2009-08-18 | 2014-02-26 | 学校法人中部大学 | 積層プラスチックフィルム及びその製造方法 |
| JP5615253B2 (ja) | 2010-12-20 | 2014-10-29 | エスケー イノベーション シーオー．， エルティーディー． | 厚膜ポリイミドフレキシブル金属積層板の製造方法 |
| US9462688B2 (en) | 2011-09-07 | 2016-10-04 | Lg Chem, Ltd. | Flexible metal laminate containing fluoropolymer |
| US20150005799A1 (en) * | 2013-06-27 | 2015-01-01 | Boston Scientific Scimed, Inc. | Renal nerve modulation balloon having improved robustness |
| CN108990261A (zh) * | 2017-06-05 | 2018-12-11 | 昆山雅森电子材料科技有限公司 | 纳米金属基板及制备方法及含该基板的线路板的制备方法 |
| CN111551488B (zh) * | 2020-05-29 | 2021-09-07 | 复旦大学 | 一种层间粘附力的测试方法及测试样片制备方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US4382101A (en) | 1981-01-23 | 1983-05-03 | Uop Inc. | Method for increasing the peel strength of metal-clad polymers |
| JPS59218789A (ja) | 1983-05-06 | 1984-12-10 | 信越化学工業株式会社 | フレキシブルプリント配線基板およびその製造方法 |
| US4615763A (en) | 1985-01-02 | 1986-10-07 | International Business Machines Corporation | Roughening surface of a substrate |
| JPS61185994A (ja) | 1985-02-13 | 1986-08-19 | 信越化学工業株式会社 | 耐熱性フレキシブルプリント配線用基板およびその製造方法 |
| US4915983A (en) * | 1985-06-10 | 1990-04-10 | The Foxboro Company | Multilayer circuit board fabrication process |
| US4634631A (en) | 1985-07-15 | 1987-01-06 | Rogers Corporation | Flexible circuit laminate and method of making the same |
| US4863808A (en) | 1985-09-13 | 1989-09-05 | Gould Inc. | Copper-chromium-polyimide composite |
| US4806432A (en) | 1985-11-21 | 1989-02-21 | Shin-Etsu Chemical Co., Ltd. | Copper-foiled laminated sheet for flexible printed circuit board |
| JPH0611800B2 (ja) | 1986-01-23 | 1994-02-16 | 鐘淵化学工業株式会社 | 改良された耐熱性ポリイミドフイルム |
| EP0285669B1 (en) | 1986-10-14 | 1993-02-10 | Takiron Co. Ltd. | Functional film and process for its production |
| US5089346A (en) | 1989-03-23 | 1992-02-18 | Hitachi Chemical Company, Ltd. | Heat resistant adhesive composition and bonding method using the same |
| US5037482A (en) | 1990-02-16 | 1991-08-06 | Macdermid, Incorporated | Composition and method for improving adhesion of coatings to copper surfaces |
| EP0478320A3 (en) * | 1990-09-28 | 1993-06-30 | Kabushiki Kaisha Toshiba | Method for manufacturing printed circuit board |
| JPH04207097A (ja) * | 1990-11-30 | 1992-07-29 | Nitto Denko Corp | フレキシブル配線板 |
| JPH04262593A (ja) * | 1991-02-18 | 1992-09-17 | Hitachi Ltd | 多層配線構造体およびその製造方法とその用途 |
| JP3151840B2 (ja) * | 1991-03-11 | 2001-04-03 | 東レ株式会社 | フィルムキャリアテ−プ |
| US5367764A (en) * | 1991-12-31 | 1994-11-29 | Tessera, Inc. | Method of making a multi-layer circuit assembly |
| US5282312A (en) * | 1991-12-31 | 1994-02-01 | Tessera, Inc. | Multi-layer circuit construction methods with customization features |
| US5527998A (en) * | 1993-10-22 | 1996-06-18 | Sheldahl, Inc. | Flexible multilayer printed circuit boards and methods of manufacture |
| JPH0948864A (ja) | 1995-08-03 | 1997-02-18 | Kanegafuchi Chem Ind Co Ltd | ポリイミドフィルムの接着性改善方法及び接着性を改善したポリイミドフィルム |
| US5679230A (en) | 1995-08-21 | 1997-10-21 | Oak-Mitsui, Inc. | Copper foil for printed circuit boards |
| US6171714B1 (en) | 1996-04-18 | 2001-01-09 | Gould Electronics Inc. | Adhesiveless flexible laminate and process for making adhesiveless flexible laminate |
| JP2000289165A (ja) * | 1999-04-08 | 2000-10-17 | Kanegafuchi Chem Ind Co Ltd | 耐熱性ボンディングシート |
| US6177357B1 (en) | 1999-04-30 | 2001-01-23 | 3M Innovative Properties Company | Method for making flexible circuits |
-
2001
- 2001-05-01 US US09/846,705 patent/US6629348B2/en not_active Expired - Lifetime
-
2002
- 2002-04-11 JP JP2002586695A patent/JP2005512305A/ja active Pending
- 2002-04-11 WO PCT/US2002/011801 patent/WO2002089546A1/en not_active Ceased
- 2002-04-11 CN CNB028091981A patent/CN1284430C/zh not_active Expired - Fee Related
- 2002-04-11 EP EP02766766A patent/EP1386526A1/en not_active Withdrawn
- 2002-04-11 CA CA2445604A patent/CA2445604C/en not_active Expired - Fee Related
- 2002-04-11 KR KR10-2003-7014291A patent/KR20040015235A/ko not_active Ceased
- 2002-04-17 TW TW091107859A patent/TW543351B/zh not_active IP Right Cessation
- 2002-04-30 MY MYPI20021581A patent/MY124850A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US6629348B2 (en) | 2003-10-07 |
| MY124850A (en) | 2006-07-31 |
| EP1386526A1 (en) | 2004-02-04 |
| JP2005512305A (ja) | 2005-04-28 |
| CA2445604A1 (en) | 2002-11-07 |
| KR20040015235A (ko) | 2004-02-18 |
| CA2445604C (en) | 2010-12-14 |
| CN1284430C (zh) | 2006-11-08 |
| CN1505918A (zh) | 2004-06-16 |
| US20020162218A1 (en) | 2002-11-07 |
| WO2002089546A1 (en) | 2002-11-07 |
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| GD4A | Issue of patent certificate for granted invention patent | ||
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