TW539596B - Method of manufacturing a polymer or polymer/composite polishing pad - Google Patents
Method of manufacturing a polymer or polymer/composite polishing pad Download PDFInfo
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- TW539596B TW539596B TW089126585A TW89126585A TW539596B TW 539596 B TW539596 B TW 539596B TW 089126585 A TW089126585 A TW 089126585A TW 89126585 A TW89126585 A TW 89126585A TW 539596 B TW539596 B TW 539596B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249971—Preformed hollow element-containing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249971—Preformed hollow element-containing
- Y10T428/249972—Resin or rubber element
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249971—Preformed hollow element-containing
- Y10T428/249974—Metal- or silicon-containing element
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249976—Voids specified as closed
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249981—Plural void-containing components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249986—Void-containing component contains also a solid fiber or solid particle
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Description
539596 A7 --- —__B7 五、發明説明(1 ) 本發明有關製造一種聚合物為底質拋光墊,特別是一種 用以拋光半導體基材之拋光墊。 UJ· 6,〇99,954揭示一種製造用以拋光半導體基材之拋 光整’其包括步騾:在原位凝結一層黏性拋光材料,其意 ㈣直接在所製造拋光墊部分上凝結一層黏性拋光材料。該 抛光材料係一種彈性體或聚合物,其係在原位凝結並乾燥 於主板形之襯墊層上。該拋光材料固化並黏附於該襯墊 層。於本發明之前,進行分批製程以製造數量有限之拋光 塾。以某一批次分批製程製得之拋光墊與其他批次分批製 程製得者不同。存在可避免不同批次所製得拋光墊變化之 製造方法的需求。 本發明提出一種連續製法,其消除分批製程,並減少不 Π刀批所氣造之抛光塾間的變化。一種用於抛光半導體基 材之拋光墊製法,包括步騾:經由相繼製造站運輸形成經 運輸襯墊層之連續材料、將一種流體相聚合物組合物供應 至该經運輸襯墊層、將該經運輸襯墊層上之聚合物組合物 成形為具有經測量厚度之表層、在一固化爐中固化位於該 經運輸襯墊層上之聚合物組合物,將該聚合物組合物轉換 成一層附接於該經運輸襯墊層之固相拋光層,該固相聚合 物層對於用以掘光半導體基材之拋光塾提供一層固相掘光 層。 見在錄參考圖式’以實例方式描述本發明之具體實例, 根據圖式: 圖式簡單說明 -4 - A7 A7
圖1係連續製造用以拋光半導體基材之連續形式拋光墊的 裝置簡圖; 圖1A係一捲取軸之簡圖,該捲取軸上纏繞連續拋光墊; 圖2係連續調節用以拋光半導體基材之連續形式拋光墊的 裝置簡圖; 圖3係根據圖1所揭示之裝置所製造拋光墊的片段橫剖 面; 圖3 A係與圖3類似之圖,並揭示根據圖丨所揭示之裝置所 製造的其他拋光蟄;以及 圖3 B係與圖3類似之圖,並揭示根據圖1所揭示之裝置所 製造的其他拋光墊。 圖3揭示一種具有襯墊層(3〇2)之拋光墊(3〇〇) 一部分,其 上黏附或附接一上層抛光層(304)。拋光層(304)中沒有磨 姓粒子,所以拋光墊(300)習知為無磨蝕劑墊。根據其他具 體實例,拋光墊(3 0 0)變成一種固定磨蝕墊,其中磨蝕粒子 或微粒子(3 06)分布在該拋光層(304)中。圖3揭示該無磨蝕 劑墊,其係由沒有磨蝕粒子或微粒子(3〇6)之拋光層(304) 具象。 圖3A揭示具有襯墊層(302)與拋光層(304)之其他具體實 例拋光墊(300)的一部分。拋光層(302)中遍佈有分散開孔 (308) 〇 圖3B揭示具有襯蟄層(302)與拋光層(304)之其他具體實 例撤光塾(300)的一部分。据光層(302)中遍佈呈中空外殼 (3 1 0)形式之微元件。中空外殼(3 10)充滿氣體,例如大氣 -5- 本纸張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 539596 A7 B7 五、發明説明(3 ) 壓力或更大壓力之空氣。 或者,中空外殼(3 10)充滿習知拋 光流體,其係於習知為CMP(化學機械平坦化作用)之拋光 操作期間,該中空外殼(3 10)破損或穿洞釋放出來。該CMP 操作使用用以拋光半導體基材之拋光墊(300)。習知之拋光 流體係於拋光墊(3 00)與被拋光之半導體基材間之界面釋放 出來。 圖式元件符號說明 100代表裝置; 126 代表第三製造站; 102代表送料捲軸; 128 代表固化爐; 104代表驅動機構; 130 代表捲取軸; 106代表帶; 200 代表製置; 108代表電動機驅動滑輪; 201 代表製造站; 110代表連續輸送帶; 202 代表往復模衝模; 110a代表平坦部份; 204 代表固定模; 110b代表工作台支座; 205 代表多重齒; 110c代表支座構件; 208 代表製造站; 112代表驅動滚筒; 212 代表製造站; 112a代表空轉滾筒; 300 代表拋光蟄; 114代表第一製造站; 302 代表襯塾層; 116代表貯存槽; 304 代表流體相拋光層; 118代表噴嘴; 306 代表磨蝕粒子或微粒子; 120代表泵; 308 代表開孔;及 122代表第二製造站; 310 代表外殼。 124代表刮刀; -6 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 4 五、發明説明( 圖1揭不用以連續製:^土 〇、由& 、 化王連續形式拋光墊(300)之裝置 (1〇〇)。以連續製造代替分批製程。連續製造減少因分批製 私所致(不㈣光墊(3⑽)間變化。裝置(⑽)包括一個送 料捲軸(102),其上狞存以縱向連續形式螺旋包裏之槪整層 (302)。襯墊層(3G2)係不織纖維材料,或者—種不渗透隔 膜丄諸如-種聚酯膜。以_種驅動機構(iG4)機械性驅動送 料滾筒(102)使之以文担制速度旋轉。驅動機構(⑽)揭 示為例如-種帶(1G6)與電動機驅動滑輪(ig8),或者包括 例如一種電動機驅動撓性軸或電動機齒輪系。 圖1揭示該連續襯塾層(302)係由送料捲轴(1〇2)供應至一 連、貝輸送f (110) ’例如一種不銹鋼帶,其環繞在分開之驅 動滾筒(112)上。以一種使該輸送帶(11〇)與連續襯墊層 (302)同步直線運轉之速度電動機驅動該驅動滚筒(m)。 沿著每個驅動滾筒(112)與相對應空轉滾筒(n2a)間之空 間,由輸送帶(110)輸送襯墊層(3〇2)。空轉滾筒(112&)接 合觀塾層(3 02)以便正追蹤控制輸送帶〇1〇)與襯墊層 (3〇2)。輸送帶(110)具有平坦部分(n〇a),其承載於一個 工作台支座(110b)之平坦且水平表面,其平坦地支撐襯墊 層(3〇2),並經由相續之製造站(114)、(122)與(126)輸送 觀塾層(302)。呈滾筒形式之支座構件(11〇c)沿著輸送帶 (110)與觀塾層(3〇2)橫向邊緣分佈,以便正追縱控制該輸 送帶(1 10)與襯墊層(3〇2)。 第一製造站(1 14)包括一個貯存槽(1 16)與位於槽(1 16)出 口之噴嘴(1 1 8 )。將一種黏性流體狀態之聚合物組合物供應 L________ -7- 本纸張尺度適用中國國家標準⑴卿Μ規格(灿〉<297公爱) 539596
至才曰(116),並以噴嘴(118)分配至連續襯塾層(3〇2)上。噴 嘴(1 1 8 )之流速係由槽(丨丨6 )出口處之泵(丨2 〇 )控制。噴嘴 (118)與連續襯墊層(3〇2)同寬,使包括該流體狀態聚合物 組合物之拋光層(3 04)覆蓋襯墊層(302)。當輸送帶(11〇)輸 送該連續襯墊層(3〇2)通過製造站(11句時,將一層連續流 體相拋光層(304)供應至該襯墊層(3〇2)上。
裝 第二製造站(122)包括一個刮刀(124),其位於距離該連 續襯墊層(3 02)精確距離處,於其間界定一個清楚空間。當 輸送帶(1 1 0)輸送該連續襯墊層(3 〇2)與該流體相拋光層 (304)通過製造站(122)之刮刀(124)時,刮刀(124)將該流 體相掘光層(3〇4)連續成形為精確厚度。 訂
第二製造站(126)包括一個呈加熱隨道形式之固化爐 (128),其輸送該連續襯墊層(302)與精確厚度之拋光層 (304)。爐(128)將該流體相拋光層(3〇4)固化成連續固相拋 光層(3 0 4 )’其黏附於該連績槪塾層(3 〇 2)上。固化時間係 由溫度與通過爐(1 2 8)之速度控制。爐(1 2 8)係以燃料燃燒 或電燃燒’其係使用輕射加熱或強制對流加熱或二者兼 用。 取出爐(128)時,該連續襯墊層(302)黏附於一層連續固 相拋光層(304)上,使之包括一層連續拋光蟄(3〇〇)。該 連續拋光墊(30 0)係螺旋軋於一個捲取軸(130)上一圖ία, 其後依序為製造站(126)。捲取軸(130)係由第二驅動機構 (104)驅動。該捲取軸(130)與第二驅動機構(1〇4)包括一個 分離之製造站,其選擇性位於製造裝置(100)中。 -8- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 539596
根據圖3所揭示之拋光墊(300)的具體實例,藉由槽(ιΐ6) 供應呈黏性流體狀態聚合物混合物之高固體組份,例如一 種膠乳聚合物混合物或一種聚胺基甲酸乙酯聚合物混合 物。根據其他具體實例,該聚合物混合物包括一種對於波 長範圍約190毫微米至約3500毫微米之光學監測與偵測用 電磁輻小光束呈透明之組份。於爐(丨2 8 )中固化時,該聚合 物混合物形成一種經固化之連續拋光墊(3〇〇)。該流體狀態 聚合物混合物中不添加磨蝕粒子或微粒子(3〇6),所以該連 續拋光蟄(3〇〇)係一種無磨钱劑拖光塾(3〇〇)。 根據另一具體實例’包括磨姓粒子或微粒子(3〇6)作為該 泥體狀態聚合物混合物中之組份。該聚合物混合物成為夾 帶研磨粒子或微粒子(3 06)之母體。該連續拋光墊(3〇〇)變 成一種固定磨蝕劑拋光墊(3〇0),該該流體狀態聚合物混合 物中遍佈整個連續拋光層(3〇4)。 根據圖3A所揭示之拋光墊(300)具體實例,該聚合物混. 合物中包括一種呈發泡劑或起泡劑或氣體形式之夾帶組 份,作為夹帶有該組份之基質。於固化時,該發泡劑或起 泡劑或氣體作為揮發性物質而漏出,提供遍佈於連續拋光 層(304)中之開孔(3 08)。 根據圖3B所揭示之拋光墊(300)具體實例,該聚合物混合 物中包括一種呈微氣球或聚合中空外殼(31〇)形式之夾帶組 份’並且遍佈拋光層(304)中。外殼(3 10)填充有氣體。或 者’孩外殼(3 10)填充有一種拋光流體,於習知為CMP之拋 光操作期間使用拋光墊(3〇〇)時,當外殼(31〇)被磨蝕或破
裝 訂
539596 A7 B7 五、發明説明( 碎或刺破打開時’戎流體流散。或者,外殼(3丨G)係、水溶性 聚合微元件,其係於習知為CMp之拋光操作期間變得可溶 於水而打開。 於本發明之前’-種用以製造膠乳為底質拋光蟄之分批 方法包括··將高固體含量膠乳聚合物混合物置於一個模 中’將逐模置於—個爐中,然後於該爐中之該模内固化該 墊。因為該分批方法中可見到分批與位置變化性之故,用 以製造墊之分批方法使該墊中產生變化。 圖2揭示用於表面調節或表面精整該連續拋光墊(3()〇)之 額=裝置(200)。該裝置(200)包括一種與圖i所揭示相同輸 送π(πο)或者與圖1所揭示縱向部分相同之輸送帶(11〇)。 裝置(200)之輸送帶(u〇)具有驅動滾筒(1 12)與一個支撐已 輸出爐(126)之連續拋光墊(3〇〇)的平坦部分(n〇a)。裝置 (2〇〇)之輸送帶(11〇)將連續拋光墊(3()〇)輸送過製造站 (2〇1)、(2〇8)與(212)其中之一或多者,於該處時,在爐 (126)固化之後進一步處理該連續拋光墊(3〇〇)。揭示裝置 (2〇〇)具有額外平台支座(11〇b)與額外支座構件(11〇〇, 其均參照圖1般操作。 將該經固化拋光層(304)磨光使之露出所需之表面精整與 孩拋光層(304)之平面水準。在該拋光層(3〇4)表面上形成 王溝紋或其他刻紋之起伏。例如,一個工作站(2 〇 1)包括一 對壓縮成型模衝模,其具有一個往復模衝模(2〇2)與一個固 足模(204),其於模衝操作期間對彼此關閉。該往復模(2〇2) 面向連續拋光層(304)表面。模(202)上之多重齒(2〇5)穿透
A7 B7 8 五、發明説明( 孩連、㈣光層(3(34)表面。該模衝操作提供—種表面精 作。例如齒(2G5)在該拋光層(3()4)表面中印出溝紋圖型。 此外,例如,若有任何微氣球或中空外殼(31〇)存在該聚合 物此口物中,齒(2〇5)刺破位於連續拋光層(3〇4)表面者。 輸送帶(110)間歇地中止,當模(2()2)與(2()4)對彼此關閉時 變成靜止狀態。或者,於模(2G2)與(2(34)對彼此關閉期 間,模(202)與(204)與輸送帶(11〇)順著輸送方向同移 動。 其他製造站(208)包括一個旋轉鋸(21〇),其用以裁切核 連續拋光層(3 04)表面中之溝紋。鋸(21〇)係沿著預定路= 以一習知正交移動繪圖器移動,將該溝紋裁切成所需溝紋 圖型。 其他製造站(212)包括一個旋轉碾磨頭(214),用以將該 連績拋光層(3 04)表面磨光或碾磨成經選擇性粗糙化或光滑 化而具有所需之表面精整的平坦平面。此外,例如若有任 何微氣球或中空外殼(3 1〇)存在該聚合物混合物中,碾磨頭 (214)刺穿位於連續拋光層(3〇4)表面者。 製造站(202)、(210)與(212)之順序可與圖2所揭示之順 序不同。視情況需要,可除去製造站(202)、(21〇)與 (2 12)其中一或多者。捲取軸(13〇)與第二驅動機構〇4)包 括一個分離之製造站,其選擇性位於該製造裝置(2〇〇)之輸 送帶(110)末端,以包裏該固相連續拋光墊(3〇〇)。 採用本方法將一種聚合物液相固化成固相,因此製得該 混合組份之黏性可流動聚合物混合物。即使是一種不包括 ________ -11· 本紙張尺度適财g g家標準(CNS)八4規格(21()><297公爱) ---- 539596 A7 B7 五 發明説明(9 ) 溶劑為底質中間產物步騾之聚合物混合物,諸如一種射出 成型聚合物混合物,藉由將該聚合物組份碾磨成極小大 小,將該碾磨組份分散於濃縮液態分散液、傾淅,然後於 爐(1 2 8 )中溶融該經環磨組份以聚結該經碾磨組份,該聚合 物混合物亦可適用於揭示方法。 因為該原材料可以混合於大量均勻供料,並重複填滿槽 (1 1 6 ),完工產物之組成與性質變異最小化。該方法之連續 性質可以精確地控制連續拋光墊(3 00)之製造過程,由該連 續拋光墊(300)可將大量個別拋光墊(300)切成所需面積圖 型與大小。該大量個別拋光墊(3 00)具有最小組成與性質變 異。 -12- 本纸張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)
Claims (1)
- 539596 A8 B8 C8 D8 、申請專利範圍 5. 根據申請專利範圍第1項之方法,其另外包括步騾: 供應該流體相聚合物組合物作為一種夾帶有具有聚合 外殼之聚合微元件的基質,該聚合外殼包含拋光流體, 提供一種夾帶有該聚合微元件之拋光墊的固相拋光層。 6. 根據申請專利範圍第1項之方法,其另外包括步騾: 供應該流體相聚合物組合物作為一種夾帶有磨姓粒子 之基質,以提供一種夾帶有該磨蝕粒子之拋光墊的固相 抛光層。 7. 根據申請專利範圍第1項之方法,其另外包括步騾: 供應該流體相聚合物組合物一種構份,以提供具有孔 之固相拋光層。 8. 根據申請專利範圍第1項之方法,其另外包括步騾: 以一旋轉碾磨頭表面精整該固相聚合物混合物與襯墊 層。 9. 根據申請專利範圍第1項之方法,其另外包括步騾: 在一對壓縮成形模之間模衝該固相聚合物組合物與該 襯餐層。 10. 根據申請專利範圍第1項之方法,其另外包括步騾: 藉由在一對壓縮成形模之間模衝該固相聚合物組合物 與該襯塾層,刺穿該固相聚合物組合物中之中空外殼。 • 14- 本纸張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)裝 玎
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TW089126585A TW539596B (en) | 1999-12-14 | 2000-12-13 | Method of manufacturing a polymer or polymer/composite polishing pad |
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US (1) | US6428586B1 (zh) |
EP (1) | EP1268134A1 (zh) |
JP (1) | JP2003516872A (zh) |
KR (1) | KR20020072548A (zh) |
TW (1) | TW539596B (zh) |
WO (1) | WO2001043920A1 (zh) |
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-
2000
- 2000-12-11 KR KR1020027007561A patent/KR20020072548A/ko not_active Application Discontinuation
- 2000-12-11 JP JP2001545039A patent/JP2003516872A/ja active Pending
- 2000-12-11 US US09/734,089 patent/US6428586B1/en not_active Expired - Lifetime
- 2000-12-11 WO PCT/US2000/033550 patent/WO2001043920A1/en not_active Application Discontinuation
- 2000-12-11 EP EP00986317A patent/EP1268134A1/en not_active Withdrawn
- 2000-12-13 TW TW089126585A patent/TW539596B/zh active
Cited By (6)
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US9067297B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
US9067298B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
TWI513545B (zh) * | 2011-11-29 | 2015-12-21 | Nexplanar Corp | 具有基礎層及拋光表層之拋光墊 |
US9931729B2 (en) | 2011-11-29 | 2018-04-03 | Cabot Microelectronics Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
US9931728B2 (en) | 2011-11-29 | 2018-04-03 | Cabot Microelectronics Corporation | Polishing pad with foundation layer and polishing surface layer |
US9597769B2 (en) | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
Also Published As
Publication number | Publication date |
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EP1268134A1 (en) | 2003-01-02 |
JP2003516872A (ja) | 2003-05-20 |
WO2001043920A1 (en) | 2001-06-21 |
KR20020072548A (ko) | 2002-09-16 |
US6428586B1 (en) | 2002-08-06 |
US20020069591A1 (en) | 2002-06-13 |
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