TW529102B - Liquid processing apparatus - Google Patents

Liquid processing apparatus Download PDF

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Publication number
TW529102B
TW529102B TW090122013A TW90122013A TW529102B TW 529102 B TW529102 B TW 529102B TW 090122013 A TW090122013 A TW 090122013A TW 90122013 A TW90122013 A TW 90122013A TW 529102 B TW529102 B TW 529102B
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Taiwan
Prior art keywords
substrate
liquid
cup
airflow
processing
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TW090122013A
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Chinese (zh)
Inventor
Masaya Aoki
Satoshi Oka
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Tokyo Electron Ltd
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Publication of TW529102B publication Critical patent/TW529102B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
  • Cleaning In General (AREA)
  • Coating Apparatus (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

Cleaning processing unit (SCR) 21a according to one embodiment of liquid processing apparatus of the present invention, comprises a spin plate 41 for holding a substrate G supported on supporting pins 42 by means of holding pins 43, a motor 47 for rotating a spin plate 41 in a manner to permit the substrate G to make a planar rotation, a process cup 60 consists of an upper cup 61 capable of moving in the vertical direction which is arranged to surround the edge of the substrate G and a fixed under cup 62, and a buffer room 63 formed with the process cup 60. An air stream and/or a mist produced by the rotation of the substrate G are stayed within the buffer room 63, with the result that it is possible to prevent the air stream and/or the mist from hoisting and diffusing toward the substrate G.

Description

529102 A7 五、發明説明(1 ) [發明之目的] [發明所屬之技術領域及其領域之習知技術] (請先閲讀背面之注意事項再填寫本頁) 本發明係有關於譬如在液晶顯示裝置(LCD)用玻璃基 板或半導體晶圓等之基板施行預定之液體處理之旋轉型液 體處理裝置。 譬如,在液晶顯示器或半導體裝置之光蝕刻步驟中, 係使用通常被稱為旋轉型之液體處理裝置,將液晶顯示器 基板或半導體晶圓在面内自旋旋轉,施行洗淨、抗蝕器塗 布、顯像等之處理。 在旋轉型之液體處理裝置中,由於將基板大致水平地 保持,一邊面内旋轉,一邊對基板供給各種處理液,譬如 洗淨液或抗蝕劑液、顯像液、漱洗液等,此時,處理液自 基板不可避免的朝四方飛散。如此處理液之飛散係在停止 處理液之供給後為乾燥基板而旋轉基板時也會發生。529102 A7 V. Description of the invention (1) [Purpose of the invention] [Technical field to which the invention belongs and its conventional technology] (Please read the precautions on the back before filling this page) The present invention relates to, for example, liquid crystal display Device (LCD) A rotary liquid processing device that performs a predetermined liquid processing on a substrate such as a glass substrate or a semiconductor wafer. For example, in the photo-etching step of a liquid crystal display or a semiconductor device, a liquid processing device generally called a spin type is used to spin the liquid crystal display substrate or semiconductor wafer in-plane to perform cleaning and resist coating. , Development, etc. In a rotary liquid processing apparatus, the substrate is held substantially horizontally, and while the substrate is rotated in-plane, various processing liquids such as a cleaning liquid, a resist liquid, a developing liquid, and a washing liquid are supplied to the substrate. At this time, the processing liquid is inevitably scattered from the substrate toward the four sides. Such scattering of the processing liquid also occurs when the substrate is dried and the substrate is rotated after the supply of the processing liquid is stopped.

禮I 所以,以往將形成杯狀之處理容器(處理杯)如圍繞基 板地配置,又在處理杯底面設置有排洩口,將自基板飛散 之處理液撞上處理杯之内壁朝下方導引,自該排洩口排出 處理液。再者在處理杯底面設置與前述排洩口另一排氣 口’構成可排出處理杯内之環境氣體。 然而,上述旋轉型液體處理裝置,藉基板之旋轉發生 之含微粒等異物之氣流或在液體處理中自基板飛散之處理 液之霧氣並沒有全部的即時自設置於容器底面之排汽口或 排,口排出之情事。因此,有微粒或霧氣浮游於基板附近 附著在基板,附著在處理杯内壁等弄辦處理杯之問題。 本紙張尺度適用中國國家標準(CNS) A4規格(21〇χ297公釐) 4Li I Therefore, in the past, if a cup-shaped processing container (processing cup) is arranged around the substrate, a drain is provided on the bottom surface of the processing cup, and the processing liquid scattered from the substrate hits the inner wall of the processing cup and is guided downward. The treatment liquid is discharged from the drain. Furthermore, the bottom surface of the processing cup is provided with another exhaust port 'for the above-mentioned drain port, so that the ambient gas in the processing cup can be discharged. However, in the above-mentioned rotary liquid processing device, not all of the air flow containing particles and other foreign matter generated by the rotation of the substrate or the mist of the processing liquid scattered from the substrate during the liquid processing are not all immediately provided from the steam outlet or exhaust provided on the bottom surface of the container. , The mouth drains the matter. Therefore, there is a problem that particles or mist float in the vicinity of the substrate and adhere to the substrate, and attach to the inner wall of the processing cup to handle the processing cup. This paper size applies to China National Standard (CNS) A4 specifications (21 × 297 mm) 4

529102 五、發明説明(2 ) 再者在一邊供給預定之處理液,一邊施行液處理之 後,由於將附著於基板之處理液以旋轉基板掙脫旋轉乾燥 係基板之旋轉數變成更高,不只基板,連掙脫來自衝撞處 理杯内壁之處理液也變成容易發生多量之細小霧氣。如此 發生的霧氣等附著沿處理杯内壁上升之氣流飛揚在基板上 方’再度引起所謂附著於基板之問題。又,如此的霧氣等 也有變成微粒或污染原因之問題。 [發明必須達成之技術性問題] 本發明鑑於如此情況而達成,其目的係提供一種在基 板之液體處理中或液體處理後之自旋乾燥中可防止發生之 霧氣等因朝基板上方飛揚而引起基板污染之液體處理裝 置。再者,本發明係提供一種提高霧氣等處理裝置朝外排 出效率之液體處理裝置作為目的。 亦即,依據本發明之第丨觀點,提供一種在基板施行 預定的液體處理之液體處理裝置,其包含: 保持機構,用以保持基板; 處理液體供給機構,係供給預定的處理液至前述基 板; 旋轉機構,係與前述保持機構一起將前述基板作面内 旋轉;及 緩衝室,用以防止前述氣流及/或霧氣捲揚與朝前述基 板擴散。 再者,依據本發明之第2觀點,提供一種在基板施行 預定的液體處理之液體處理裝置,包含有: 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐〉 # (請先閲讀背面之注意事項再填寫本頁)529102 V. Description of the invention (2) Furthermore, after the predetermined processing liquid is supplied and the liquid processing is performed, since the processing liquid attached to the substrate is used to rotate the substrate to break away from the spin-drying substrate, the rotation number becomes higher, not only the substrate, Even the treatment liquid coming out of the inner wall of the collision processing cup has become a small amount of fine mist that is prone to occur. The adhesion of the mist and the like that occurred along the inner wall of the processing cup soared above the substrate 'again caused the problem of so-called adhesion to the substrate. In addition, there is a problem that such mist and the like become particles or cause of pollution. [Technical problems that must be achieved by the invention] The present invention has been achieved in view of such a situation, and an object thereof is to provide a mist or the like that can be prevented from being caused to fly above the substrate during liquid processing of the substrate or spin drying after the liquid processing. Liquid handling device for substrate contamination. Furthermore, the present invention aims to provide a liquid processing apparatus for improving the efficiency of discharging a processing apparatus such as a mist outward. That is, according to the first aspect of the present invention, there is provided a liquid processing apparatus that performs predetermined liquid processing on a substrate, including: a holding mechanism for holding the substrate; and a processing liquid supply mechanism for supplying a predetermined processing liquid to the substrate. A rotation mechanism that rotates the substrate in-plane together with the holding mechanism; and a buffer chamber to prevent the airflow and / or mist from being hoisted and diffused toward the substrate. Furthermore, according to the second aspect of the present invention, a liquid processing device for performing predetermined liquid processing on a substrate is provided, including: This paper size is applicable to China National Standard (CNS) A4 specifications (210X297 mm> # (Please read first (Notes on the back then fill out this page)

、可I :嬅 5 529102 A7 B7 五、發明説明(3 ) 保持機構,用以保持基板, 處理液供給機構,係供給預定的處理液至前述基板; 旋轉機構,係與前述保持機構一同將前述基板作面内 旋轉; 處理杯,係由圍繞前述基板周緣那樣配置之升降自如 的上杯與固定之下杯所構成;及 緩衝室,係形成於前述處理杯,滯留藉前述基板之旋 轉發生之氣流及/或霧氣,防止前述氣流及/或霧氣之捲揚 與朝前述基板擴散。 在如此的液體處理裝置,因處理之基板旋轉所產生之 氣流及/或霧氣之一部份導入緩衝室,在緩衝室内變弱了氣 流之氣勢,又,由於霧氣之間或撞上或衝撞壁面成長朝下 方落下等,霧氣等不會有再度的在基板上空飛揚污染基板 之情事,可保持製品之高品質。 依據本發明之第3觀點,提供一種在基板施行預定的 液體處理之液體處理裝置,包含有: 保持機構,用以保持基板; 處理液供給機構,係’供給預定的處理液至前述基板; 旋轉機構,係與前述保持機構一同將前述基板作面内 旋轉, 隔壁板,係傘狀設置於前述保持機構之下方,形成複 數個窗部;及 翼片,係設置於前述隔壁板上,將因前述旋轉機構之 驅動產生之氣流及/或霧氣導入前述窗部。 6 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 529102 五 、發明説明(4 A7 B7 依據本發明之第4觀點,提供一種在基板施行預定的 液體處理之液體處理裝置,包含有·· 、 保持機構,用以保持基板; 處理液供給機構,係供給預定的處理液至前述基板; 方疋轉機構’係與前述保持機構一同將前述基板作面内 旋轉; 隔壁板,係傘狀言曼置於前述保持機構之下方,形成複 數個窗部; 第1翼片,係將因前述旋轉機構之驅動產生之氣流及/ 或霧氣導入前述窗部而設置於前述隔壁板上; 處理杯,係由圍繞前述基板周緣那樣配置升降自如的 上杯與固定的下杯所構成;及 第2翼片,係將因前述旋轉機構之驅動產生之氣流及/ 或霧氣導入前述處理杯之下方,而設置於前述上杯之内周 壁。 在如此的液體處理裝置,由於在隔壁板設置有窗部, 在窗部設置有翼片(第i翼片),因基板旋轉所產生之氣流及 /或霧氣由於從窗部容易引進可提高排出效率。如此作可抑 制在處理杯内上升氣流之發生,可抑制霧氣等朝基板附 著。而且’由於設置且整流將氣流或霧氣導入上杯内周壁 下方之翼片(第2翼片),變成可更有效地朝窗部導入氣流, 變成可減低滯留於處理杯内之霧氣。在該情形,也藉併設 前述之緩衝室,變成能更確實地防止基板之污染。 [發明之構成及作用] 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐〉 529102 A7可 I: 嬅 5 529102 A7 B7 V. Description of the invention (3) A holding mechanism for holding a substrate, and a processing liquid supply mechanism for supplying a predetermined processing liquid to the aforementioned substrate; a rotating mechanism, together with the aforementioned holding mechanism, transfers the aforementioned The substrate is rotated in-plane; the processing cup is composed of a freely adjustable upper cup and a fixed lower cup arranged around the periphery of the substrate; and a buffer chamber is formed in the processing cup, which is held by the rotation of the substrate. The airflow and / or mist prevent the hoisting and diffusion of the airflow and / or mist toward the substrate. In such a liquid processing device, part of the airflow and / or mist generated due to the rotation of the processed substrate is introduced into the buffer chamber, and the momentum of the airflow is weakened in the buffer chamber, and because the mist or the collision or collision with the wall surface Growth and falling down, fog, etc. will not fly over the substrate and pollute the substrate again, which can maintain the high quality of the product. According to a third aspect of the present invention, there is provided a liquid processing apparatus that performs predetermined liquid processing on a substrate, including: a holding mechanism for holding the substrate; a processing liquid supply mechanism for supplying a predetermined processing liquid to the substrate; and rotating The mechanism rotates the substrate in-plane together with the holding mechanism, and the partition wall plate is arranged under the holding mechanism in an umbrella shape to form a plurality of window portions; and the wing plate is disposed on the partition wall plate. The airflow and / or mist generated by the driving of the rotating mechanism is introduced into the window portion. 6 (Please read the precautions on the back before filling this page) This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 529102 5. Description of the invention (4 A7 B7 According to the fourth aspect of the present invention, provide a A liquid processing device that performs a predetermined liquid processing on a substrate includes a holding mechanism for holding the substrate; a processing liquid supply mechanism for supplying a predetermined processing liquid to the substrate; a square-turn mechanism and the holding mechanism Rotate the above-mentioned substrate together in-plane; the next-door plate, which is umbrella-shaped, is placed below the holding mechanism to form a plurality of windows; the first wing is the airflow generated by the driving of the rotation mechanism and / or The mist is introduced into the window portion and installed on the partition wall; the processing cup is composed of an upper cup and a fixed lower cup arranged around the periphery of the substrate; and the second wing is formed by the rotation mechanism. The airflow and / or mist generated by the driving is introduced below the processing cup and is disposed on the inner peripheral wall of the upper cup. In such a liquid processing device, since the The partition plate is provided with a window portion, and a wing (i-th fin) is provided on the window portion. The airflow and / or mist generated by the rotation of the substrate can be easily introduced from the window portion to improve the discharge efficiency. This can suppress the processing cup. The occurrence of internal updrafts can suppress the adhesion of mist and the like to the substrate. Moreover, the airflow or mist is introduced into the fins (second fins) below the inner peripheral wall of the upper cup due to the installation and rectification, which makes it possible to introduce airflow to the window more effectively. It becomes possible to reduce the mist trapped in the processing cup. In this case, it is also possible to prevent the substrate from being contaminated by setting up the aforementioned buffer chamber in combination. [The composition and function of the invention] This paper standard is applicable to the Chinese national standard (CNS ) A4 size (210X297 mm) 529102 A7

五、發明説明(5 ) 以下’參閱附上圖式,就本發明之實施形態作詳細的 說明。 (請先閱讀背面之注意事項再填寫本頁) 第1圖表示本發明之液體處理裝置之一實施形態具有 洗淨處理裝置2la,21b之液晶顯示器基板G(基板G)之抗独 劑塗布、顯像處理系統1〇〇平面圖。 抗钱劑塗布、顯像處理系統100包含有: 卡®站(1),用以載置收容複數基板G之卡匣C; 處理部(2),係包含用以施行在基板g含抗蝕劑塗布及 顯像之一系列處理之複數只處理裝置; 界面部(3),係在與曝光裝置(圖未表示)之間用以施行 基板G之輸送, 訂| 在處理部2之兩端分別配置卡匣站1及界面部3。 -# 卡ϋ站1包含用以在卡匣C與處理部2之間施行基板G 搬送之搬送機構10。而且,在卡匣站1施行卡之搬入 出。再者,搬送機構10包含順著卡匣配列方向設置之搬送 路l〇a上可移動的搬送臂11,藉談搬送臂u在卡匣c與處理 部2之間施行基板〇之搬送。 處理部2分為前段部2a、中段部2b與後段部2c,在中央 分別具有搬送路12、13、14,在該等搬送路兩側配置有各 處理裝置。而且,在該等之間設置有中繼部15、16。 前段2a包含順著搬送路可移動的主搬送裝置17,在搬 送路12之一方側配置兩個洗淨處理裝置2ia、21b,搬送路 之他方側則配置紫外線照射裝置與冷卻裝置兩段地重疊之 處理構體25,加熱處理裝置兩段地重疊之處理構體26及冷 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 529102 A7 -----87 ___ 五、發明説明(6 ) 卻裝置兩段地重疊之處理構體27。 再者,中段部2b包含順著搬送路13可移動的主搬送裝 置18,在搬送路13之一方側整體設置有抗蝕劑塗布處理裝 置22及除去基板G周緣部抗蝕劑之周緣抗蝕劑除去裝置 23,在搬送路13之他方側則配置加熱處理裝置兩段地重疊 構成之處理構體28、加熱處理裝置與冷卻裝置上下重疊構 成之處理構體29及黏著處理裝置與冷卻裝置上下重疊構成 之處理構體30。 而且,後#又部2c包含順著搬送路14可移動的主搬送裝 置19,在搬送路14之一方侧配置三個顯像處理裝置24a、 24b、24c,搬送路14之他方側則配置有加熱處理裝置兩段 地重疊構成之處理構體31及同加熱處理裝置與冷卻裝置上 下重疊構成之處理構體32、33。 此外,處理部2在夾於搬送路一方側僅配置21a、抗蝕 副塗布處理裝置22、顯像處理裝置24a那樣旋轉系裝置,變 成在他方側僅配置加熱處理裝置或冷卻裝置等熱系處理裝 置之構造。 再者’中繼部15、16旋轉系裝置配置側部份係配置藥 液供給裝置34,而且設置用以施行主搬送裝置17、18、19 維護之空間35。 主搬送裝置17、18、19分別包含有水平面内兩方向之 X軸驅動機構、Y軸驅動機構及垂直方向之z軸驅動機構, 而且包含Z軸為令心旋轉之旋轉驅動機構,分別具有支撐 基板G之臂。 本紙張尺度適用中國國家標準(WS) A4規格(21〇\297公#)5. Description of the invention (5) The following is a detailed description of the embodiment of the present invention with reference to the attached drawings. (Please read the precautions on the back before filling this page.) Figure 1 shows one embodiment of the liquid processing device of the present invention. The liquid crystal display substrate G (substrate G) is provided with a cleaning treatment device 2la, 21b. 100 plan view of development processing system. The anti-money agent coating and development processing system 100 includes: a card® station (1) for loading a cassette C that houses a plurality of substrates G; a processing unit (2) that is used to perform a substrate g containing a resist A plurality of processing devices for a series of processing of coating and development of an agent; the interface section (3) is used to carry the substrate G between the exposure device (not shown in the figure), and is ordered at both ends of the processing section 2 The cassette station 1 and the interface section 3 are respectively configured. -# The carding station 1 includes a transfer mechanism 10 for transferring the substrate G between the cassette C and the processing unit 2. Furthermore, the card is carried in and out at the cassette station 1. The transport mechanism 10 includes a transport arm 11 that is movable along a transport path 10a arranged in the cassette arrangement direction. The transport arm u transfers the substrate 0 between the cassette c and the processing unit 2. The processing section 2 is divided into a front section 2a, a middle section 2b, and a rear section 2c. Each of the processing sections 2 has transport paths 12, 13, and 14 in the center, and processing devices are arranged on both sides of the transport paths. Further, the relay sections 15 and 16 are provided between these sections. The front section 2a includes a main conveying device 17 that can be moved along the conveying path. Two washing treatment devices 2ia and 21b are arranged on one side of the conveying path 12, and an ultraviolet irradiation device and a cooling device are arranged on the other side of the conveying path to overlap. The processing structure 25, the heating processing device overlapping the processing structure 26 in two sections, and the cold paper size apply the Chinese National Standard (CNS) A4 specification (210X297 mm) 529102 A7 ----- 87 ___ V. Description of the invention (6) A processing structure 27 overlapping two sections is installed. The middle section 2b includes a main transfer device 18 that is movable along the transfer path 13. A resist coating processing device 22 and a peripheral resist for removing the resist on the peripheral portion of the substrate G are provided on one side of the transfer path 13. The agent removing device 23 is arranged on the other side of the conveying path 13 with a processing structure 28 in which the heating processing device is overlapped in two stages, a processing structure 29 in which the heating processing device and the cooling device are stacked up and down, and an adhesive processing device and the cooling device are arranged up and down. The superposed processing structure 30. Furthermore, the rear part # 2 includes a main conveying device 19 that is movable along the conveying path 14, and three development processing devices 24a, 24b, and 24c are arranged on one side of the conveying path 14, and the other side of the conveying path 14 is provided. The heat treatment device 31 has a treatment structure 31 formed by overlapping two sections, and the heat treatment device and the cooling device 32, 33 are formed by overlapping with each other. In addition, the processing unit 2 is provided with only a rotary system such as 21a, an anti-corrosion coating processing device 22, and a development processing device 24a on one side sandwiched in the conveying path, and only a thermal system such as a heating processing device or a cooling device is disposed on the other side. Structure of the device. In addition, the relay unit 15, 16 is provided with a medicinal liquid supply device 34 on the rotation device arrangement side, and a space 35 is provided for performing maintenance on the main transfer devices 17, 18, and 19. The main conveying devices 17, 18, and 19 each include an X-axis drive mechanism, a Y-axis drive mechanism, and a vertical z-axis drive mechanism in two directions in a horizontal plane, and include a Z-axis rotation drive mechanism for centering rotation, each of which has a support Arm of substrate G. This paper size applies to China National Standard (WS) A4 specifications (21〇 \ 297 公 #)

(請先閲讀背面之注意事項再填窝本頁) .訂丨 .參_ 529102 A7 ____B7 五、發明説明(7 ) 主搬送裝置17具有搬送臂17a,當搬送機構1〇之搬送臂 11之間施行基板G之輸送,同時對前段部2a各處理裝置基 板G之搬入、搬出,而且具有在中繼部丨5之間施行基板G 輸送之機能。再者’主搬送裝置18具有搬送臂18a,在與中 繼部15之間施行基板G之輸送,同時對中段部2b各處理裝 置基板G之搬入、搬出,而且具有在中繼部16之間施行基 板G輸送之機能。更且,主搬送裝置19具有搬送臂丨9a,在 中繼部16之間施行基板G之輸送,同時對後段部2C之各處 理裝置基板G之搬入、搬出,而且具有在界面部3之間施行 基板G之輸送機能。此外,中繼部15、16也可作為冷卻板 之機能。 界面部3,包含有: 伸長部3 6 ’係在處理部2之間輸送基本G時,一時的保 持基板G ; 緩衝台37,係兩個設置在伸長部36兩侧,用以配置緩 衝卡匣;及 搬送機構38,係在該等與曝光裝置(圖未表示)之間施 行基板G之搬入出。 搬送機構38包含順著伸長部36及緩衝台37之配列方 向設置之搬送路38a上可移動的搬送臂39,由該搬送臂39 在處理部2與曝光裝置之間施行基板〇之搬送。 如此藉總括各處理裝置且整體化,可謀求省空間化及 處理之效率化。(Please read the precautions on the back before filling in this page). Order 丨. See _529102 A7 ____B7 V. Description of the invention (7) The main conveying device 17 has a conveying arm 17a. When the conveying mechanism 10 is between the conveying arms 11 The substrate G is conveyed, and at the same time, the substrate G of each processing device of the front section 2a is carried in and out, and the substrate G is conveyed between the relay sections 5 and 5. Furthermore, the 'main conveying device 18 has a conveying arm 18 a which conveys the substrate G between the relay section 15 and the substrate G of each processing device in the middle section 2 b, and also conveys the substrate G between the relay section 16. Carry out the function of substrate G transportation. Furthermore, the main transfer device 19 has a transfer arm 9a, which carries the substrate G between the relay sections 16 and simultaneously carries in and out the substrate G of each processing device of the rear section 2C, and further includes the interface section 3 The substrate G is conveyed. In addition, the relay sections 15 and 16 can also function as cooling plates. The interface section 3 includes: the extension section 3 6 ′ is used to temporarily hold the substrate G between the processing sections 2; the buffer table 37 is provided on both sides of the extension section 36 to configure the buffer card The cassette; and the conveying mechanism 38 are for carrying in and out of the substrate G between these and an exposure device (not shown). The conveying mechanism 38 includes a conveying arm 39 that is movable along a conveying path 38a arranged in the alignment direction of the elongated portion 36 and the buffer table 37, and conveys the substrate 0 between the processing unit 2 and the exposure device by the conveying arm 39. In this way, by integrating and integrating each processing device, space saving and efficiency of processing can be achieved.

在如此構成之抗蝕劑塗布、顯像處理系統1 〇〇、卡匣C 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 10 (請先閲讀背面之注意事項再填寫本頁)In this structure of the resist coating and development processing system 100, cassette C, the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 10 (Please read the precautions on the back before filling this page )

529102 A7529102 A7

五、發明説明(8 ) 内的基板G搬送至處理部2,在處理部2,首先以前段部2a 之處理構體25之紫外線照射裝置UV施行表面改質、洗淨處 理,以冷卻裝置冷卻之後,以洗淨處理裝置2U、21b施行 擦洗洗淨,以處理構體26中以其中的一個加熱處理裝置加 熱乾燥之後,以處理構體27中其中的一個冷卻裝置冷卻。 接著’搬送基板G至中段部2b,為提高抗蝕劑之固定 性,在處理構體30上段之黏著處理裝置作排水化處理,以 下段之冷卻裝置COL冷卻之後,以抗姓劑塗布處理裝置22 塗布抗餘劑,以周緣抗蝕劑除去裝置ER 23除去基板G周緣 多餘的抗蝕劑。接著,基板G以中段部2b之中一個加熱處 理裝置之一個作預烤處理,以處理構體29或30下段之冷卻 裝置冷卻。 其後,基板G自中繼部在主搬送裝置丨9透過界面部3搬 送至曝光裝置,所以預定的圖形曝光。而且,基板G再度 透過界面部3搬入,按照需要以後段部2C處理構體31、32、 33中,其中的一個經加熱處理裝置施行事後感光烘乾處理 之後’以顯像處理裝置24a、24b、24c的其中一個作顯像處 理’形成預定之回路圖形。顯像處理過之基板G在後段部 2c其中的一個加熱處理裝置施行事後烘焙處理之後,在其 中的一個冷卻裝置冷卻,藉主搬送裝置19、18、17及搬送 機構10收容至卡匣站1上預定之卡匣。 接著,就有關於本發明之洗淨處理裝置21 a詳細的說 明。第2圖表示洗淨處理裝置21a之概略構造平面圖及截面 圖,截面圖係在平面圖中之線AA截面圖。第3圖與第4圖也 11 (請先閲讀背面之注意事項再填寫本頁) 、一t— 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 529102 A7 ---------B7 _—__ 五、發明説明(9 ) 再表示洗淨處理裝置21a構成之平面圖及截面圖,第3圖之 截面圖係在平面圖中之線BB截面圖,第4圖之截面圖係在 平面圖中之線PQRS線截面圖。在此,第2圖到第4圖之各平 面圖表示相同者,在各截面圖為容易瞭解洗淨處理裝置21& 之構成,連線AA上、線BB上、線PQRS上沒有的構件也有 示出,另一方面,也雖有表示於截面圖但未表示於平面圖 之構件。 洗淨處理裝置21a設置於圖未表示之排水盆或箱内,其 有載置且保持基板G之保持機構之旋轉板41。在旋轉板41 上面,以適當的配置圖形離散的固定多數只支撐銷,當 載置基板G於旋轉板上時,基板〇係支撐於支撐銷“上,變 成在基板G不易產生彎曲等。再者,在旋轉板“上面固定 設置保持銷43,作為用以保持基板G四隅之手段。 基板G之升降藉頂件銷44施行,頂件銷44譬如設置有4 只。在旋轉板41形成用以通過該等頂件銷44之貫穿孔牦。 支撐銷42、止動銷43、頂件銷44之至少與基板G接觸部份 以所謂不弄傷基板G那樣的樹脂或橡膠構件構成較為理 想,凝轉板41譬如可使用不銹鋼等構成。 在旋轉板41之裏面中心部安裝樞轴46,插轴係旋轉機 構’譬如’安裝於固定在圖未表示之支撐構件之馬達Ο。 藉作動馬達47以預定速度旋轉樞軸46,旋轉板“與基板G 可-同作面内旋轉。此外,收容樞轴46一部份與馬達们之 驅動裝置收容容器48内也設置用以升降頂件鎖料之機構, 譬如’圖未表示之氣缸等。 本紙張尺度顧巾關家鮮(CNS) A4規格(210X297公楚 1 一---- -12 -V. Description of the invention The substrate G in (8) is transported to the processing section 2. In the processing section 2, first, the ultraviolet irradiation device UV of the processing structure 25 of the previous section 2a is subjected to surface modification, cleaning treatment, and cooled by a cooling device. After that, scrubbing and washing are performed with the washing treatment apparatuses 2U and 21b, and one of the heat treatment apparatuses in the treatment structure 26 is heated and dried, and then cooled by one of the cooling means in the treatment structure 27. Next, 'transfer the substrate G to the middle section 2b. In order to improve the fixation of the resist, the adhesive processing device at the upper section of the processing structure 30 is subjected to drainage treatment. After cooling by the cooling device COL at the lower section, the processing device is coated with an anti-name agent. 22 Apply the resist, and use the peripheral resist removing device ER 23 to remove excess resist on the peripheral edge of the substrate G. Next, the substrate G is pre-baked with one of the heating processing devices in the middle section 2b, and is cooled by the cooling device in the lower section of the processing structure 29 or 30. Thereafter, the substrate G is transferred from the relay section to the exposure device through the interface section 3 in the main transfer device 9, so that a predetermined pattern is exposed. Furthermore, the substrate G is carried in again through the interface portion 3, and one of the processing structures 31, 32, and 33 in the second portion 2C is processed as necessary, and one of the structures is subjected to a post-photosensitive drying treatment by the heating processing device to develop the processing devices 24a and 24b. One of the 24c is developed to form a predetermined circuit pattern. The image-processed substrate G is subjected to post-baking processing by one of the heating processing devices in the rear section 2c, and then cooled in one of the cooling devices, and is accommodated in the cassette station 1 by the main transfer device 19, 18, 17 and the transfer mechanism 10. On the predetermined cassette. Next, the cleaning treatment apparatus 21a of the present invention will be described in detail. Fig. 2 is a plan view and a cross-sectional view showing a schematic structure of the cleaning treatment device 21a. The cross-sectional view is a cross-sectional view taken along line AA in the plan view. Figures 3 and 4 are also 11 (please read the precautions on the back before filling out this page), a t — This paper size applies to China National Standard (CNS) A4 specifications (210X297 mm) 529102 A7 ----- ---- B7 ____ V. Description of the invention (9) The plan view and cross-sectional view of the structure of the cleaning treatment device 21a are shown again. The cross-sectional view of FIG. 3 is a cross-sectional view taken along line BB in the plan view, and a cross-sectional view of FIG. 4 The figure is a sectional view taken along the line PQRS in a plan view. Here, each of the plan views of FIGS. 2 to 4 shows the same, and in each cross-section view, it is easy to understand the structure of the cleaning treatment device 21, and components not shown on the line AA, the line BB, and the line PQRS are also shown. On the other hand, there are members that are shown in a sectional view but not shown in a plan view. The cleaning processing device 21a is installed in a drain basin or a box (not shown), and has a rotating plate 41 of a holding mechanism on which the substrate G is placed and held. On the rotating plate 41, only a plurality of support pins are discretely fixed in an appropriate arrangement pattern. When the substrate G is placed on the rotating plate, the substrate 0 is supported on the supporting pin ", which makes it difficult for the substrate G to bend. Etc. Alternatively, a holding pin 43 is fixedly provided on the "rotary plate" as a means for holding the substrate G. The raising and lowering of the substrate G is performed by the top member pins 44. For example, four top member pins 44 are provided. A through hole 牦 is formed in the rotating plate 41 so as to pass through the top pin 44. It is preferable that at least the contact portion of the support pin 42, the stopper pin 43, and the top pin 44 with the substrate G be made of a resin or rubber member that does not damage the substrate G. The condensing plate 41 may be made of stainless steel, for example. A pivot shaft 46 is attached to the center portion of the inner surface of the rotating plate 41, and the shaft rotating mechanism is, for example, mounted on a motor 0 fixed to a supporting member (not shown). By operating the motor 47 to rotate the pivot 46 at a predetermined speed, the rotating plate "can rotate in the same plane as the substrate G. In addition, a part of the storage pivot 46 and the motor's driving device storage container 48 are also provided for lifting Mechanisms for top material locking, such as the cylinders not shown in the figure. The paper size is Gu Jiaguan (CNS) A4 specification (210X297 Gong Chu 1 1 ---- -12-

、!· C請先閱讀背面之注意事項再填寫本頁} 529102 A7 五、發明説明(1〇 ) 在旋轉板41裏面形成自其中心向向外緣放射狀伸長 略矩形板狀之送風翼片49。該送風翼片49係在旋轉板41旋 轉時產生排氣或排液可順暢進入之氣流。送風翼片49之安 裝數量可任意地選擇。 在旋轉板41下方,兼作驅動裝置收容容器48之上部 壁,設置如圍繞樞軸46傘狀之隔壁板51。在隔壁板51之傾 斜面形成沿著周緣之窗部52,譬如八處,對各窗部52,完 成藉旋轉板41旋轉產生之氣流及/或霧氣導入窗部%任務 之翼片53設置突出隔壁板51上。而且,在窗52下方底面形 成之第2排& 口 54,自窗部52進入之氣流及/或霧氣構成徑 很短的排出路徑自第2排出口 54排出。 第5圖模式的表示來自窗部52之氣流及/或霧氣之排出 路徑祝明圖。將基板G向著箭頭8旋轉時,伴隨該旋轉發生 之乳流方向(箭頭S1)變成也再與箭頭8同樣旋轉方向,變成 #氣附著該氣流容易#動。|片53係一側面在氣流之下产 側固定於隔壁板51,再者由於安裝他側面時設置有坡度,L 錢流的上流側變成在較高位置,變成自藉翼片53形成略 垂直的開口部53a朝排氣室55容易引進氣流,又,變成自窗 和朝排氣室55也容易進人氣流。設在翼片53側面設置有 壁部53b枯,變成可更有效地自開口部53a及窗部52引進氣 流及/或霧氣。 第2排出口 54為自窗部52與開口部53a流入之氣流及/ 或霧氣之排出路徑變短,又,考慮氣流之流動,設置於對 冑部52而言成為氣流之下流側位置。如此作,由於自窗部 本紙張尺度適财關家標準(⑽A4規;7^297公釐了、! · C Please read the precautions on the back before filling in this page} 529102 A7 V. Description of the invention (1〇) In the rotating plate 41, a slightly rectangular plate-shaped air-supply fin extending radially from its center to the outer edge is formed. 49. The air-supply fin 49 generates an air flow that can be smoothly entered when the rotating plate 41 rotates. The installation number of the air supply fins 49 can be arbitrarily selected. Below the rotating plate 41, an upper wall of the drive device accommodating container 48 also serves as an umbrella-shaped partition wall plate 51 that surrounds the pivot 46. On the inclined surface of the partition plate 51, window portions 52 along the periphery are formed, for example, in eight places. For each window portion 52, the wings 53 that complete the task of introducing airflow and / or mist into the window portion generated by the rotation of the rotating plate 41 are provided to project On the partition wall 51. Further, a second row & port 54 formed on the bottom surface below the window 52 forms an exhaust path having a short diameter from the air flow and / or mist entering from the window part 52 and is discharged from the second discharge port 54. Fig. 5 is a diagram showing the exhaust path of the airflow and / or mist from the window 52. When the substrate G is rotated toward the arrow 8, the milk flow direction (arrow S1) accompanying the rotation becomes the same rotation direction as the arrow 8, and the direction becomes # 气 β The sheet 53 is fixed on the side wall 51 to the side wall under the airflow, and because the slope is installed when the side is installed, the upper side of the L money flow becomes a higher position, and it becomes a little vertical due to the wing 53 The opening portion 53a easily introduces airflow toward the exhaust chamber 55, and also becomes easy to enter the airflow from the window and toward the exhaust chamber 55. The wall portion 53b provided on the side of the fin 53 is dry, and it becomes possible to more effectively introduce airflow and / or mist from the opening portion 53a and the window portion 52. The second discharge port 54 is a path for shortening the flow of the airflow and / or mist flowing from the window portion 52 and the opening portion 53a. The second discharge port 54 is provided at a position on the downstream side of the airflow for the cymbal portion 52 in consideration of the flow of the airflow. In doing so, since the paper size of the self-windows is suitable for the family and family standards (⑽A4 regulation; 7 ^ 297 mm

、一Y (請先閱讀背面之注意事項再填寫本頁) 13 529102 A7 --—---- B7_ 五、發明説明(U ) ' ' ^ 朝第2排出口 54導出之氣流及/或霧氣之排出路徑變成走 向以箭頭S2表示之最短路徑,可提高排氣效率。 該情形,由於滯留在形成於窗部52下面之排氣室55之 氣μ或務氣之數量減低,可抑制來自窗部52逆流霧氣之發 生’再者’自順著隔壁板51外緣垂直地設置之壁部51a之孔 部56朝外部溜出再度飛揚於基板G上之霧氣數量變成可減 低。如此的效果在後述不設置緩衝室63的情形也可獲得。 此外,自排氣室55通過孔部56朝外部溜出之氣流及/或霧氣 多半在流入緩衝室63之後自第丨排出口 58排出。 在隔壁板51安裝有檢查、確認在旋轉板41之基板G保 持狀態之感測器57。作為該感測器57,譬如可使用光學式 感測器,譬如在第5圖所示,將由玻璃等透明構件構成之窗 部57a形成於隔壁板51,在該窗部57a下面可設置有感測器 57 °以感測器57檢查是否自止動銷43離開基板G配置,感 測器57檢出異常的狀態時,可作成牽連聯鎖,裝置不會動 作之構造。 洗淨處理裝置21a具有由如圍繞基板G周緣配置升降 自如的上杯61與固定之下杯62構成之處理杯60。在第2圖〜 第4圖所示截面圖表示上杯6丨上升到上升限定位置之狀 態。在處理杯60形成有緩衝室63,用以滯留因基板G旋轉 發生之氣流及/或霧氣,防止因霧氣等捲揚朝基板G擴散。 上杯61具有内周壁61a與外周壁61f,設置有橫架内周 壁61 a與外周壁61f之頂板61e。另一方面,下杯62具有外周 壁62a與底板62b,緩衝室63係由該等之内周壁61a、外周壁 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 14 .................--备------------------禮. (請先閲讀背面之注意事項再填寫本頁) 529102 A7 B7___ 五、發明説明(12 ) 61f、頂板61e、外周壁62a、底板62b所形成。 在下杯62之外周壁62a上部向外側形成第1突壁部 62c ’又在上杯61之外周壁61 f下部向内側形成第2突壁部 61g。如在第2圖〜第4圖所示,設將上杯61靜止在上升限度 位置時’在第1突壁部62c與第2突壁部61 g之間變成藉密封 構件66密封之構造。 第6(a)圖之截面圖雖表示上杯61下降狀態,但密封構 件66周圍之構造如擴大其部份之第6(b)圖截面圖所示,變 成在第1突壁部62c與第2突壁部61 g之間產生間隙之構造。 。亥間隙之見度積極地設置寬潤也可,反之狹窄也佳。上杯 61譬如在基板g之搬送時等可下降。 在上杯61之内周壁61 a内側形成緩衝室導向壁61 b,用 以將順著内周壁61a上升之氣流及/或霧氣導入緩衝室。再 者’為由該緩衝室導向壁61b導入之氣流及/或霧氣再度不 會朝基板G上飛揚,防護壁61c作成覆蓋緩衝室導向壁6比 上部形成於内周壁61a。導入緩衝室導向壁61a之氣流及/ 或霧氣除了附著於防護壁61c之霧氣等以外藉防護壁61〇改 變方向,通過形成於内周壁61a之通風孔68導入緩衝室63 内。 此外,為防止來自處理杯60内霧氣等擴散至洗淨處理 衣置21a整體,在上杯61之内周壁61a上部形成在内側傾斜 之錐形部61d。 在緩衝室63之底面四處形成第1排出口 58,在緩衝室 63内風速等減弱之氣流或由衝撞成長之霧氣或附著於嬖 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公楚) ------------------------___ (請先閲讀背面之注意事項再填寫本頁) 、一-T— 15 529102 A7 _ — B7________ 五、發明説明(13 ) 之霧氣等變成自該第1排出口 58可排出。再者,沿著隔壁板 51下降之氣流及/或霧氣或自設置於隔壁板51之窗部52與 開口部53a—旦朝排氣室55進入再度自孔部%排出之氣流 及/或霧氣,變成自内周壁61a下部流入緩衝室63内,該等 氣流及/或霧氣也自第1排出口 58排出。 如將第2圖〜第4圖相較就明白,緩衝室63變成有效利 用洗淨處理裝置21a四隅空間之構造,在線AA截面其寬度 較寬,在線BB截面其寬度具有狹窄形狀。藉如此利用洗淨 處理裝置21a四隅空間大大地確保緩衝室63之體積,以增大 可滯留於緩衝室63内之氣流及/或霧氣數量,控制處理杯6〇 内之氣流’可防止朝基板G上飛揚之氣流及/或霧氣之發生。 第7圖表示將第1排出口 58作為例子,除霧器安裝形態 之一例說明圖。在各自之第i排出口 58設置有除霧器67,在 除霧器67分離主要的液體成份係自排洩口 6几排出,另一方 面,氣體成份變成自排氣管67b排出。如此除霧器之安裝連 第2排出口 54也適用。此外所使用之除霧器形狀或霧氣成份 之捕集方法並非限定於第7圖所示形態。 第8圖表示設置於洗淨處理裝置21a之擦洗洗淨機構⑽ 之一實施形態截面圖。擦洗洗淨機構8〇譬如具有硬毛刷擦 洗機構71與鼓風洗淨機構72。在第8圖雖同時表示硬毛刷擦 洗機構71與鼓風洗淨機構72,但通常變成藉硬毛刷擦洗機 構71與鼓風洗淨機構72,但通常變成為藉硬毛刷擦洗機構 71之刷光洗淨(擦洗洗淨)先以施行,接著施行藉鼓風洗淨 機構72之刷光洗淨,一方之機構動作的時候,他方的機構 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 16 # (請先閲讀背面之注意事項再填窝本頁)1.Y (please read the precautions on the back before filling this page) 13 529102 A7 ------- B7_ 5. Description of the invention (U) '' ^ The airflow and / or mist leading to the second outlet 54 The exhaust path becomes the shortest path indicated by arrow S2, which can improve exhaust efficiency. In this case, since the amount of gas μ or service gas remaining in the exhaust chamber 55 formed below the window portion 52 is reduced, the occurrence of countercurrent mist from the window portion 52 can be suppressed, and furthermore, it can be perpendicular to the outer edge of the partition plate 51 The hole portion 56 of the ground-mounted wall portion 51a slips out to the outside and the amount of mist flying on the substrate G again can be reduced. Such an effect can be obtained even when the buffer chamber 63 is not provided later. In addition, the airflow and / or mist that slip out from the exhaust chamber 55 to the outside through the hole 56 are mostly discharged from the first discharge port 58 after flowing into the buffer chamber 63. A sensor 57 is mounted on the partition plate 51 to check and confirm the holding state of the substrate G on the rotating plate 41. As the sensor 57, for example, an optical sensor can be used. For example, as shown in FIG. 5, a window portion 57 a made of a transparent member such as glass is formed on the partition plate 51, and a sensor can be provided below the window portion 57 a. The sensor 57 ° uses the sensor 57 to check whether the stopper pin 43 is disposed away from the substrate G. When the sensor 57 detects an abnormal state, it can be constructed as an interlocking mechanism so that the device will not operate. The cleaning processing apparatus 21a includes a processing cup 60 composed of an upper cup 61 and a fixed lower cup 62 which are arranged to be raised and lowered around the periphery of the substrate G, for example. The cross-sectional views shown in Figs. 2 to 4 show a state in which the upper cup 6 is raised to the ascent limit position. A buffer chamber 63 is formed in the processing cup 60 to retain the airflow and / or mist generated by the rotation of the substrate G, and to prevent the dust from spreading toward the substrate G due to the mist or the like. The upper cup 61 has an inner peripheral wall 61a and an outer peripheral wall 61f, and a top plate 61e of a horizontal inner frame 61a and an outer peripheral wall 61f is provided. On the other hand, the lower cup 62 has an outer peripheral wall 62a and a bottom plate 62b, and the buffer chamber 63 is composed of the inner peripheral wall 61a and the outer peripheral wall. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 14 ... ..............-- Preparation ------------------ Ceremony. (Please read the notes on the back before filling this page) 529102 A7 B7___ 5. Description of the invention (12) 61f, top plate 61e, outer peripheral wall 62a, bottom plate 62b. A first protruding wall portion 62c 'is formed outwardly from the upper portion of the outer peripheral wall 62a of the lower cup 62, and a second protruding wall portion 61g is formed inward from the lower portion of the outer peripheral wall 61f of the upper cup 61. As shown in Figs. 2 to 4, when the upper cup 61 is stationary at the rising limit position, it is assumed that a structure is sealed between the first projection wall portion 62c and the second projection wall portion 61g by the sealing member 66. Although the cross-sectional view in FIG. 6 (a) shows the lowered state of the upper cup 61, the structure around the sealing member 66 is shown in the cross-sectional view in FIG. A structure in which a gap is formed between the second protruding wall portions 61 g. . The visibility of the Hai gap can be positively set to be wide, and vice versa. The upper cup 61 can be lowered, for example, during the transportation of the substrate g. A buffer chamber guide wall 61 b is formed on the inner side of the inner peripheral wall 61 a of the upper cup 61 to introduce the airflow and / or mist rising along the inner peripheral wall 61 a into the buffer chamber. Furthermore, the airflow and / or mist introduced by the buffer chamber guide wall 61b will not fly toward the substrate G again, and the protective wall 61c is formed on the inner peripheral wall 61a so as to cover the buffer chamber guide wall 6 more than the upper part. The airflow and / or mist introduced into the guide wall 61a of the buffer chamber is changed into direction by the protective wall 61o in addition to the mist or the like adhering to the protective wall 61c, and is introduced into the buffer chamber 63 through a ventilation hole 68 formed in the inner peripheral wall 61a. In addition, in order to prevent mist or the like from the treatment cup 60 from diffusing into the entire washing treatment clothes 21a, an upper portion of the inner peripheral wall 61a of the upper cup 61 is formed with a tapered portion 61d inclined on the inside. The first outlets 58 are formed around the bottom surface of the buffer chamber 63. The weakened airflow or the mist growing from the collision or the adhesion in the buffer chamber 63 adheres to the Chinese paper standard (CNS) A4 (210X297). ) ------------------------___ (Please read the notes on the back before filling out this page), one-T— 15 529102 A7 _ — B7________ 5. Description of Invention (13) The mist and the like of the invention (13) can be discharged from the first discharge port 58. Furthermore, the airflow and / or mist descending along the partition plate 51 or from the window portion 52 and the opening portion 53a provided in the partition plate 51-once enter the exhaust chamber 55 and enter the airflow and / or mist discharged from the hole portion% again. It flows into the buffer chamber 63 from the lower part of the inner peripheral wall 61a, and the airflow and / or mist are also discharged from the first discharge port 58. As can be seen by comparing Figs. 2 to 4, the buffer chamber 63 has a structure that effectively utilizes the space of the cleaning treatment device 21a. The line AA has a wider width, and the line BB has a narrower width. By using the space of the cleaning processing device 21a in this way, the volume of the buffer chamber 63 is greatly ensured to increase the amount of airflow and / or mist that can be retained in the buffer chamber 63. Controlling the airflow in the processing cup 60 can prevent the substrate from reaching the substrate. The occurrence of flying air and / or mist on G. Fig. 7 is an explanatory diagram showing an example of a defogger mounting configuration using the first discharge port 58 as an example. A mist eliminator 67 is provided at each of the i-th discharge port 58, and the main liquid components separated from the mist eliminator 67 are discharged from the discharge port 60. On the other hand, gas components are discharged from the exhaust pipe 67b. The installation of the demister even with the second discharge port 54 is also applicable. In addition, the shape of the mist eliminator or the method of capturing mist components is not limited to the form shown in FIG. FIG. 8 is a cross-sectional view showing one embodiment of the scrubbing and washing mechanism 设置 provided in the washing processing apparatus 21a. The scrubbing and cleaning mechanism 80 includes, for example, a bristle brush scrubbing mechanism 71 and a blower cleaning mechanism 72. Although FIG. 8 shows the bristle brush scrubbing mechanism 71 and the blast cleaning mechanism 72 at the same time, it usually uses the bristle brush scrubbing mechanism 71 and the blast cleaning mechanism 72, but usually uses the bristle brush scrubbing mechanism 71. The brushing and washing (brushing and washing) is performed first, and then the brushing and washing by the blast cleaning mechanism 72 is performed. When one of the institutions operates, the paper size of the other institution applies the Chinese National Standard (CNS) A4 Specifications (210X297mm) 16 # (Please read the precautions on the back before filling this page)

_、\吞 I 五、發明説明(14 ) 在設置於上杯61外圖未表示之箱子隅部等預定之待機位 待機。 硬毛刷擦洗機構71之構成並不限定,譬如可使用其有 將複數圓盤刷73在基板奸面一邊以一定的壓力接觸了一 邊旋轉驅動之刷子旋轉驅動部74與具有將該刷子旋轉驅動 4 74順著導板91送至基板⑽長邊方向圖未表示之刷子進 給機構者。再者,使用具有在基板G之短邊方向長度大致 相同長度之滾筒刷,也可使用一邊旋轉該滾筒刷,一邊在 :板G之長邊方向掃掠且施行擦洗洗淨之硬毛刷擦洗機 5支風洗淨機構7 2譬如包含有: 喷鳴75係、複數只,向著基板G表面自正上面排出洗 淨液; 洗淨液供給部(圖未表示),係供給洗淨液至該等喷嘴 75 ;及 ' 喷嘴進給機構(圖未表示),係將噴嘴75順著導板9〇送 至基板G之長邊方向。 此外,當藉鼓風洗淨機構72作鼓風洗淨時,通常能組 成可旋轉基板G之時序電路。 其次,就洗淨處理裝置21a之洗淨處理步驟予以說明。 合併保持於主搬送裝置17之搬送臂17a之基板G搬送時 間,如在第6⑷圖所示下降上杯6卜又,將頂件銷斗4上升 到預定位置’自搬送臂17a朝頂件銷44輸送基板G。接著如 在第2圖〜第4圖所示,將頂件銷44下降到預定位置,將 529102 A7 五、發明説明(15 ) 板G載置在形成於旋轉板41之支撐銷42上,藉止動銷43將 基板G定位,同時將上杯上升到預定位置。 基板G朝洗淨處理裝置21a之搬入完結之後,如在第8 圖所示,開始藉硬毛刷擦洗機構71之刷光洗淨。該刷光洗 淨係圓盤刷73在基板G之表面一邊以一定的壓力接觸,一 邊旋轉,且將基板G上由一端移動到另一端,由此,遍及 基板表面整體可除去粒子或樹脂成份等污髒。 當該刷光洗淨時即供給洗淨液至圓盤刷73。因此自圓 盤刷73或基板G四方地飛散洗淨液。飛散之洗淨液,鐾如 在第4圖所示,自形成於隔壁板51之窗部52朝排氣室”内掉 落由第2排出口 54排出,再者,傳至隔壁板51掉落到洗淨處 理裝置21a之底部,亦即下杯62之底板62b,由第2排出口 54 或第1排出口 58排出,而且,在衝突上杯61之内周壁6U或 緩衝室導向壁61b之後,傳給該等壁面朝下方掉落,自第2 排出口 54或第1排出口 58排出。 在刷光洗淨結束之後,施行鼓風洗淨機構72之吹風洗 淨。在該鼓風洗淨係喷嘴75將超音波振動之高壓洗淨液一 邊向著基板G喷射,一邊將基板G上水平方向地往復移動。 此時作動馬達47,將基板G與旋轉板41一同以預定的速度 旋轉。由此,吹風洗淨基板G之表面整體,先前藉刷光洗 淨無法除去之污髒等已洗掉。 豉風洗淨結束之後無須供給處理液,在擦洗洗淨機構 80朝上杯61外側疏散之狀態施行旋轉乾燥。在該旋轉乾燥 係將基板G以比鼓風洗淨時還大的旋轉速度旋轉一定時 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐)_, \ Swallow I V. Description of the invention (14) Stand by at a predetermined standby position such as the top of a box that is not shown in the upper cup 61. The structure of the bristle brush scrubbing mechanism 71 is not limited. For example, a brush rotation driving unit 74 that rotates and drives a plurality of disc brushes 73 while contacting the substrate surface with a certain pressure, and a rotary drive 4 74 is sent along the guide plate 91 to the brush feeding mechanism of the substrate ⑽ long side pattern not shown. In addition, a roller brush having a length substantially the same in the short side direction of the substrate G may also be used. A hard-bristle brush scrub that sweeps in the long direction of the plate G and rotates while rotating the roller brush The air cleaning mechanism 5 of the machine 7 2 includes, for example: a series of 75 blasts, which discharges the cleaning liquid from directly above the surface of the substrate G; the cleaning liquid supply unit (not shown) supplies the cleaning liquid to These nozzles 75; and the 'nozzle feed mechanism' (not shown) send the nozzles 75 along the guide plate 90 to the long side of the substrate G. In addition, when the blast cleaning mechanism 72 is used for blast cleaning, the timing circuit of the rotatable substrate G can usually be composed. Next, the cleaning processing steps of the cleaning processing device 21a will be described. The transfer time of the substrate G held by the transfer arm 17a of the main transfer device 17 is combined, and the upper cup 6 is lowered as shown in FIG. 6 (a), and the ejector pin bucket 4 is raised to a predetermined position. 'From the transfer arm 17a toward the ejector pin 44 feeding the substrate G. Next, as shown in FIG. 2 to FIG. 4, the top pin 44 is lowered to a predetermined position, and 529102 A7 V. Description of the Invention (15) The plate G is placed on the support pin 42 formed on the rotating plate 41. The stopper pin 43 positions the substrate G while raising the upper cup to a predetermined position. After the substrate G is moved into the cleaning processing device 21a, as shown in FIG. 8, the brush G is cleaned by the brush cleaning mechanism 71. This brush-cleaning disk brush 73 rotates while contacting the surface of the substrate G with a certain pressure, and moves the substrate G from one end to the other end, thereby removing particles or resin components throughout the entire substrate surface. Wait for dirt. When the brush is cleaned, the cleaning liquid is supplied to the disc brush 73. Therefore, the cleaning liquid is scattered from the disk brush 73 or the substrate G in all directions. As shown in FIG. 4, the scattered cleaning liquid is dropped from the window portion 52 formed in the partition plate 51 toward the exhaust chamber, and is discharged through the second discharge port 54, and is then transmitted to the partition plate 51 and dropped. It falls to the bottom of the washing treatment device 21a, that is, the bottom plate 62b of the lower cup 62, is discharged through the second discharge port 54 or the first discharge port 58, and the inner peripheral wall 6U or the buffer chamber guide wall 61b in the collision upper cup 61 After that, the wall surface is conveyed to fall downward and discharged from the second discharge port 54 or the first discharge port 58. After the brushing and washing is completed, the blower washing mechanism 72 is blown and washed. The cleaning nozzle 75 sprays the ultrasonic vibration high-pressure cleaning liquid toward the substrate G while reciprocating the substrate G horizontally. At this time, the motor 47 is operated to rotate the substrate G together with the rotating plate 41 at a predetermined speed. As a result, the entire surface of the substrate G was cleaned by air, and the dirt and the like that could not be removed by brushing was previously washed away. 豉 After the wind cleaning is completed, it is not necessary to supply a treatment liquid, and the scrub cleaning mechanism 80 faces the upper cup 61. Rotary drying is performed in the state of evacuation outside. G When rotating at a rotation speed greater than that during blast cleaning This paper size is in accordance with China National Standard (CNS) A4 (210X297 mm)

#… (請先閲讀背面之注意事項再填寫本頁) 訂| 18 529102 A7 B7 五、發明説明(16 ) 間。藉該高速旋轉附著於基板G之表面或裏面之洗淨液藉 離心力掙脫於周圍,在短時間基板G變成乾燥之狀態。 藉上述鼓風洗淨機構72之鼓風洗淨,為在基板〇供給 多量高壓洗淨液下旋轉乾燥基板G,自基板G有多量且強有 力之洗淨液朝四方飛散。而且,在鼓風洗淨時因基板G或 左旋轉板41之旋轉,發生如早先在第5圖箭頭si所示氣流 及/或霧氣。 再者’旋轉乾燥為增大基板G或旋轉板14之旋轉速 度,發生比洗淨強的氣流。此時也發生有霧氣,發生之霧 氣變成容易比吹風洗淨時所發生之霧氣還微細。而且,發 生之霧氣藉強烈的氣流一度衝撞上杯61之内周臂61 a之 後’再度變成微小的霧氣附著氣流,也認為產生朝處理杯 60外側飛散之事態。 然而,洗淨處理裝置21 a係在鼓風洗淨時自基板〇等飛 散之洗淨液一部份或藉基板G及旋轉板14旋轉所發生之氣 流及/或霧氣之一部份附著於該氣流,受到設置於隔壁板5 i 之翼片53之作用、自窗部52及開口部53a導入排氣室55,構 成自第2排出口 54排出。該排出路徑係在以前所示照第5圖 中之箭頭S2出示那樣,藉施行如此有效的排氣,可抑制飛 散之洗淨液一部份或發生之霧氣等朝基板G上飛揚。 再者,在鼓風洗淨時自基板G等飛散之洗淨液另一部 份或藉基板G或旋轉板41旋轉時發生之氣流及/或霧氣之另 一部份衝撞設置於内周壁61a之緩衝室導向壁61b朝下方流 掉之後,從第2排出口 54或第1排出口 58排出。 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 19 ------------------------___ (請先閲讀背面之注意事項再填寫本頁) .訂· 祖 529102 A7 r—— --———-__^2._ ____ 五、發明説明(17 ) "—' ~ 藉發生之氣流衝突内周壁61a或緩衝室導向壁61b,即 發生沿緩衝室導向壁61b之上升氣流。附著該上升氣流飛散 《洗淨液-部份或霧氣之—部份雖上升,但由於在上杯^ 設置有防護壁6U’如此的上升氣流或順著上升氣流上升之 務氣等,不會飛揚基板G上,通過通風口 68導入緩衝室63 内。此外,附著在防護壁61c之霧氣等係凝集傳到其壁面而 自然落下,從第2排出口 54或第1排出口 58排出。 導入緩衝室63之氣流在其内部變成亂流氣勢就衰 弱,又霧氣或霧氣彼此之間衝撞,等於衝撞壁面且增加質 量掉落至下方,自第1排出口 58排出。這樣做可防止導入緩 衝室63内飛散之洗淨液或藉基板G等旋轉發生之氣流及/或 I 務氣朝基板G上飛揚。 由於形成緩衝室63係利用洗淨處理裝置21&四隅使其 容積變大,並非增大洗淨處理裝置21&之覆蓋區。而且,由 於緩衝室63可大量地接收飛散之洗淨液或藉基板(}等旋轉 發生之氣流及/或霧氣,譬如,基板G周圍之氣流及/或霧氣 之流動變為順暢,可防止上升氣流等之發生,可防止霧氣 I 等飛揚基板G上。 此外,雖只要增大緩衝室63容積就可獲得如此大的效 果,但由於將緩衝室63大容積化也有招致洗淨處理裝置2U 大型化之情事。因此緩衝室63之大小係在可適當控制飛散 之洗淨液或藉基板G等旋轉發生的氣流及/或霧氣之範圍適 當的設定。 了疋,%風洗淨係一邊吐出洗淨液^ 邊進行,即使在 .................... -................. ___ 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐)#… (Please read the notes on the back before filling out this page) Order | 18 529102 A7 B7 V. Description of Invention (16). The cleaning liquid adhered to the surface or inside of the substrate G by the high-speed rotation is released from the surroundings by centrifugal force, and the substrate G becomes dry in a short time. By the blast cleaning by the above-mentioned blast cleaning mechanism 72, in order to spin dry the substrate G while supplying a large amount of high-pressure cleaning liquid to the substrate 0, a large amount of powerful cleaning liquid from the substrate G is scattered toward the four sides. Further, when the substrate G or the left rotating plate 41 is rotated during the blast cleaning, an air flow and / or a mist are generated as shown by the arrow si in FIG. 5 earlier. Furthermore, the spin-drying is to increase the rotation speed of the substrate G or the rotary plate 14, and generate a stronger airflow than cleaning. Fog also occurs at this time, and the generated mist becomes easier to produce than the mist generated during air washing. Furthermore, the generated mist once collided with the inner peripheral arm 61a of the cup 61 once by the strong airflow 'again became a small mist-adhered airflow, and it is also considered that a state of scattering toward the outside of the processing cup 60 occurred. However, the cleaning treatment device 21 a is a part of the cleaning liquid scattered from the substrate 0 or the like during the blast cleaning or a part of the airflow and / or mist generated by the rotation of the substrate G and the rotating plate 14 is attached to This air flow is subjected to the action of the fins 53 provided in the partition plate 5 i, is introduced into the exhaust chamber 55 from the window portion 52 and the opening portion 53 a, and is configured to be discharged from the second discharge port 54. This exhaust path is shown as shown by arrow S2 in Fig. 5. By performing such an effective exhaust, it is possible to suppress part of the scattered cleaning liquid or generated mist from flying toward the substrate G. In addition, another part of the cleaning liquid scattered from the substrate G or the like during the blast cleaning or another part of the airflow and / or mist generated when the substrate G or the rotating plate 41 rotates collides with the inner peripheral wall 61a. After the buffer chamber guide wall 61b flows downward, it is discharged from the second discharge port 54 or the first discharge port 58. This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) 19 ------------------------___ (Please read the note on the back first Please fill in this page again.) Order ancestor 529102 A7 r—— --————-__ ^ 2._ ____ V. Description of the invention (17) " — '~ By inner air wall 61a or buffer room where air conflict occurs The guide wall 61b, that is, an upward air flow along the guide wall 61b of the buffer chamber occurs. The upward flow is attached and the "washing liquid-part or mist-part rises, but because the upper wall ^ is equipped with a protective wall 6U ', such as an updraft or a rising air along the updraft, it will not The flying substrate G is introduced into the buffer chamber 63 through the vent 68. In addition, the mist or the like adhered to the protective wall 61c is condensed and transmitted to the wall surface, and naturally falls, and is discharged from the second discharge port 54 or the first discharge port 58. The air introduced into the buffer chamber 63 becomes turbulent and weakens inside, and the mist or mist collides with each other, which is equivalent to colliding with the wall surface and increasing the quality and falling to the bottom, and is discharged from the first discharge port 58. This can prevent the cleaning liquid introduced into the buffer chamber 63 or the airflow and / or airflow generated by the rotation of the substrate G from flying toward the substrate G. Since the buffer chamber 63 is formed by increasing the volume of the cleaning treatment device 21 & the size of the buffer chamber 63 is not to increase the coverage area of the cleaning treatment device 21 & Moreover, since the buffer chamber 63 can receive a large amount of scattered cleaning liquid or airflow and / or mist generated by rotation of the substrate (), for example, the airflow and / or mist flow around the substrate G becomes smooth, which can prevent rising The occurrence of airflow and the like can prevent mist I from flying on the substrate G. In addition, even if the buffer chamber 63 has a large volume, such a large effect can be obtained. However, the large volume of the buffer chamber 63 also causes a large 2U cleaning treatment device. Therefore, the size of the buffer chamber 63 is appropriately set in a range in which the scattered cleaning liquid or the airflow and / or mist generated by the rotation of the substrate G can be appropriately controlled. As a result, the% air cleaning system spit out and wash Cleansing ^ while proceeding, even when ................. ___ This paper size Applicable to China National Standard (CNS) A4 specification (210X297 mm)

# (請先閱讀背面之注意事項再填寫本頁) 訂丨 529102 A7 __B7_ 五、發明説明(18 ) 鼓風洗淨時發生的霧氣在基板G上飛揚而下降基板Q上,也 變成再度與洗淨液一同流出。另一方面,在自旋乾燥飛揚 之霧氣等附著於基板G上時,其霧氣變成微粒等污鱗之原 因。 因此,因基板G等旋轉而發生的氣流及/或霧氣,藉設 置緩衝室63防止導入缓衝室63之氣流及/或霧氣飛揚之效 果,及在隔壁板51設置有窗部52與翼片53,藉將氣流及/ 或霧氣導入排氣室55防止霧氣飛揚之效果在旋轉乾燥之步 驟下可特別顯著地獲得。 此外’在上述之鼓風洗淨中或在旋轉乾燥中係藉設置 於旋轉板41裏面之送風翼片49之整流作用,加強自旋轉板 41側撞上上杯61之内周壁61 a氣流的風壓,特別是在放射方 向或其法線方向。因該整流作用,變成伴隨旋轉板41及基 板G旋轉發生之氣流及/或霧氣容易導入排氣室55或緩衝室 63。但是,送風翼片49並不一定需要,即使有未設置送風 翼片49之情形,也可控制藉上述基板〇等之旋轉發生之氣 流及/或霧氣。 完成鼓風洗淨與接續·它的旋轉乾燥時,頂件銷44即上 升將基板G自旋轉板41舉起到預定高度,又上杯61則降低 到預定位置。這時候,主搬送裝置17之搬送臂na進入,自 頂件銷44接受基板G,基板G朝次一步驟之處理裝置搬送。 藉如此一系列步驟完成洗淨處理之基板G表面則施行 擦洗洗淨,且由於霧氣等幾乎未附著,具有清淨度很高之 表面,由此,即使在次一步驟之抗蝕劑塗布處理或顯像處 本紙張尺度適用中國國家標準(q^S) A4規格(210X297公釐) # (請先閱讀背面之注意事項再填寫本頁) 訂丨 ••禮, 21 529102 A7 ~ ----— B7 五、發明說明(19 ) "~' ~ 理’也可得污染或微粒很少之處理結果。進而可提高液晶 顯示器之製造合格率。 接著,说明有關洗淨處理裝置之另一實施形態。第9 圖表不洗淨處理裝置21c之概略構造平面圖與截面圖。洗淨 處理裳置21〇係代替洗淨處理裝置2u、21b可搭載於抗姓劑 塗布、顯像處理系統1〇〇。在洗淨處理裝置21c在内周壁61a 内側之緩衝室内壁61b下方,設置將藉基板G之旋轉產生之 氣μ導入下方之翼片69,在此點具有與前述洗淨處理裝置 21a不同的構造。 在洗淨處理裝置21a雖旋轉板41作成可將基板g全體 載置於上面之大小,但在洗淨處理裝置21c則旋轉板41的外 徑變小,基板G之邊緣部份自旋轉板41露出。如此旋轉板 41之大小係可保持基板〇限度内並沒有限制。 第10圖係更詳細表示翼片69安裝形態之說明圖。翼片 69係置於比略水平地保持之基板〇還低,沿内周壁61a之内 周’譬如’以等間隔設置32只(在第9圖之平面圖係圖示16 只)面對垂直方向預定角度0,譬如30度〜60度程度,理想 的是約45度傾斜。將基板g向第1〇圖中箭頭S3方向旋轉時 產生之氣流係如箭頭S4所示,藉翼片69面向處理杯60下方 整流,因此朝開口部53a及窗部52流入的氣流變多。 為藉翼片69朝開口部53a及窗部52之氣流容易流入,將 翼片69對應設置於翼片53或窗部52設置之位置較為理想。 再者’由於在未設置翼片53部份外侧之内周壁也設置有翼 片69,藉基板G之旋轉產生之氣流可更有效地導入處理杯 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公董) 22 (請先閲讀背面之注意事項再填寫本頁)# (Please read the precautions on the back before filling this page) Order 丨 529102 A7 __B7_ V. Description of the invention (18) The mist generated during the blast cleaning will fly on the substrate G and fall on the substrate Q, and it will become re-washed The neat liquid flows out together. On the other hand, when the spin-dry flying mist or the like adheres to the substrate G, the mist becomes a cause of dirt such as particles. Therefore, the airflow and / or mist generated by the rotation of the substrate G and the like prevents the airflow and / or mist from being introduced into the buffer chamber 63 by providing the buffer chamber 63, and the partition wall 51 is provided with a window portion 52 and a fin 53. The effect of preventing mist from flying by introducing airflow and / or mist into the exhaust chamber 55 can be particularly significantly obtained in the step of spin drying. In addition, in the above-mentioned blast cleaning or spin drying, the rectifying effect of the air supply wing 49 provided in the rotating plate 41 is used to strengthen the air flow from the rotating plate 41 side to the inner peripheral wall 61 a of the upper cup 61. Wind pressure, especially in the direction of radiation or its normal. Due to this rectifying effect, the airflow and / or mist generated by the rotation of the rotating plate 41 and the base plate G are easily introduced into the exhaust chamber 55 or the buffer chamber 63. However, the air supply fin 49 is not necessarily required, and even if the air supply fin 49 is not provided, the airflow and / or mist generated by the rotation of the substrate 0 or the like can be controlled. When the blast cleaning and connection are completed, the top pin 44 is raised to lift the substrate G from the rotating plate 41 to a predetermined height, and the upper cup 61 is lowered to a predetermined position. At this time, the transfer arm na of the main transfer device 17 enters, receives the substrate G from the ejector pin 44, and the substrate G is transferred to the processing device of the next step. The surface of the substrate G, which has been cleaned through such a series of steps, is scrubbed and cleaned, and because the fog or the like is hardly attached, it has a very clean surface. Therefore, even in the next step of the resist coating process or The paper size of the development area is in accordance with Chinese national standard (q ^ S) A4 specification (210X297 mm) # (Please read the precautions on the back before filling in this page) Order 丨 •• Li, 21 529102 A7 ~ ---- — B7 V. Description of the invention (19) " ~ '~ Management' can also obtain the treatment results with little pollution or fine particles. This can further improve the manufacturing yield of liquid crystal displays. Next, another embodiment of the cleaning processing apparatus will be described. The ninth diagram is a plan view and a cross-sectional view of a schematic structure of the non-washing treatment device 21c. The washing treatment clothes set 21 can replace the washing treatment devices 2u and 21b and can be mounted on an anti-name agent coating and development treatment system 100. Below the buffer chamber wall 61b inside the inner peripheral wall 61a of the cleaning treatment device 21, a fin 69 for introducing the gas μ generated by the rotation of the substrate G to the lower portion is provided. At this point, it has a structure different from that of the aforementioned cleaning treatment device 21a. . In the cleaning processing device 21a, although the rotating plate 41 is made to be able to place the entire substrate g on it, the cleaning processing device 21c reduces the outer diameter of the rotating plate 41, and the edge portion of the substrate G is rotated from the rotating plate 41. Exposed. In this way, the size of the rotating plate 41 can be kept within the limit of the substrate 0 and is not limited. Fig. 10 is an explanatory diagram showing the mounting form of the fin 69 in more detail. The fins 69 are placed lower than the substrate held slightly horizontally, and 32 pieces (for example, 16 pieces are arranged at regular intervals along the inner circumference of the inner peripheral wall 61a (16 pieces are shown in the plan view of FIG. 9)), facing the vertical direction. The predetermined angle 0 is, for example, about 30 degrees to 60 degrees, and is preferably inclined at about 45 degrees. The air flow generated when the substrate g is rotated in the direction of the arrow S3 in FIG. 10 is as shown by an arrow S4. The air flow inflows toward the opening 53a and the window 52 due to the fins 69 being rectified below the processing cup 60. In order to facilitate the inflow of the airflow toward the opening portion 53a and the window portion 52 by the fins 69, it is desirable to arrange the fins 69 at positions where the fins 53 or the window portions 52 are provided. Furthermore, 'the fins 69 are also provided on the inner peripheral wall of the outer side of the portion where the fins 53 are not provided, so that the airflow generated by the rotation of the substrate G can be more effectively introduced into the processing cup. The paper size applies the Chinese National Standard (CNS) A4 (210X297 public director) 22 (Please read the notes on the back before filling in this page)

、可I 529102May I 529102

五、發明説明(20 ) 6〇之下方,藉此可提高排氣效率。 如此藉在内周壁61a設置有翼片69,自内周壁61a近旁 向著處理杯60下方之氣流增多而從約排氣口 58或第2排氣 口 54排出,再者藉將朝開口部53a及窗部^流入之氣流增多 而自第2排氣口 54排出,可提高排氣效率。如此做,防止在 處理杯6G内4氣之滯留,可防止霧氣附著基板g。此外, 翼片69譬如由不銹鋼等構成,其表面作氟化樹脂塗布等抑 制霧氣附著也理想。 以上,雖就本發明之實施形態說明,但不用說當然本 ^明並不限定於上述形態。譬如,藉旋轉旋轉板41,藉設 置於旋轉板41裏面之送風翼片49發生之氣流及/或霧氣之 整流作用,因設置於上杯61之緩衝室導向壁61b而提高。不 過,即使作成未設置緩衝室導向壁61b之構造,也可獲得防 止務氣專朝基板G飛揚之效果。 再者,於上述之實施形態,雖處理杯6〇由可升降的上 杯61與固定之下杯62所構成,但在緩衝室〇形成之範圍 内,配置一個處理杯也可。為將氣流及/或霧氣排出外部而 没置於洗淨處理裝置2ia,21b之兩個手段,亦即,一般認 為在隔壁板51設置窗部52或翼片53之一手段與所謂在處理Fifth, the description of the invention (20) below 60, thereby improving the exhaust efficiency. In this way, the fins 69 are provided on the inner peripheral wall 61a, and the airflow from the vicinity of the inner peripheral wall 61a to the lower side of the processing cup 60 increases and is discharged from the exhaust port 58 or the second exhaust port 54. The airflow flowing into the window portion ^ is increased and discharged from the second exhaust port 54 to improve exhaust efficiency. By doing so, it is possible to prevent the retention of 4 gases in the processing cup 6G and prevent the mist from adhering to the substrate g. In addition, the fin 69 is made of, for example, stainless steel, and its surface is preferably coated with a fluorinated resin or the like to suppress the adhesion of mist. Although the embodiment of the present invention has been described above, it goes without saying that the present invention is not limited to the above embodiment. For example, by rotating the rotating plate 41, the rectifying effect of the air flow and / or mist generated by the air blowing fins 49 provided inside the rotating plate 41 is enhanced by the buffer chamber guide wall 61b provided in the upper cup 61. However, even if the structure is not provided with the buffer chamber guide wall 61b, it is possible to obtain the effect of preventing the flying of the service air toward the substrate G. Furthermore, in the above-mentioned embodiment, although the processing cup 60 is composed of an upper cup 61 that can be raised and lowered and a fixed lower cup 62, one processing cup may be arranged within the range formed by the buffer chamber 0. In order to discharge the air flow and / or mist to the outside, the two means are not placed in the washing treatment device 2ia, 21b, that is, it is generally considered that one of the means of providing the window portion 52 or the wing 53 in the partition wall 51

杯60設置緩衝室63之一手段,雖非併設兩方不可,但常設 緩衝室63較為理想。 X 作成可改變翼片53傾斜之構造也理想。該情形係將刷 光洗淨等之洗淨液,一邊吐出在基板G,一邊對基板g施行 預定之處理時,由於翼片53作成未突出隔壁板51,可抑制 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐)The cup 60 is provided with one of the buffer chambers 63. Although it is not necessary to provide both of them, a permanent buffer chamber 63 is preferable. It is also desirable that X is configured to change the inclination of the fins 53. In this case, when the cleaning liquid such as brushing and washing is discharged on the substrate G, and the substrate g is subjected to a predetermined treatment, since the flap 53 is made not to protrude from the partition plate 51, the paper standard can be suppressed from applying Chinese national standards. (CNS) A4 size (210X297 mm)

#… (請先閲讀背面之注意事項再填寫本頁) 、可| :禮- 23 529102 A7 B7 21 五、發明説明 洗淨液自翼片53彈回m在停止旋轉乾燥處理等 洗淨液之供給狀悲下施行處理時,如前述,作成翼片$ 3傾 斜預定角度狀態,施行氣流及/或霧氣之引進。此時,在旋 轉板41之旋轉數向時將翼片53之傾斜增大,在旋轉板41之 旋轉數低且小時將翼片53之傾斜相等的減小,配合因旋轉 板41之旋轉所發生之氣流等強度,也可控制朝排氣室$ $氣 流之收容量。 在方疋轉板41上保持基板G之手段係如在上述實施形 態,並不限定在使用止動銷43等機械的手段,譬如,也可 使用真空吸附式保持機構。旋轉板41之形狀,在設置有送 風翼片49時’為提高其效果雖以圓形較為理想,但其他形 狀,譬如矩形也可。該情形,由於從矩形旋轉板侧面會有 氣流的發生,如施行其控制,譬如將處理杯之内壁形狀設 計為適當者等的對策較為理想。 作成可改變形成於上杯61之緩衝室導向壁61b之傾斜 角度也理想。當旋轉基板G時由於配合自基板g掙脫之洗淨 液量或基板G之旋轉數大小,改變緩衝室導向壁61 b之傾斜 角度,一邊可將撞上緩衝室導向壁61之洗淨液更確實地向 下方掉落,一邊可將氣流及/或霧氣導入緩衝室63。 在上述實施形態雖舉例說明在抗蝕劑塗布,顯像處理 系統適用本發明液體處理裝置的情形,但本發明並非限定 於此,其他液體處理裝置也可適用。譬如,本發明之液體 處理裝置適用於抗蝕劑塗布,顯像處理系統之抗蝕劑處理 裝置22或顯像處理裝置24a〜24c時,基本上只要處理液之 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) ------------------------___ (請先閲讀背面之注意事項再填寫本頁) -、盯— :禮- 24 529102 A7 B7 五、發明説明(22 供給機構或洗淨機構替換預定之機構,其他部份則與、,、 洗淨處理裝置21a共同,可得與上述同樣的作用效果^ = 者,雖就作為基板之液晶顯示器說明,但關於半導體晶圓、 光碟基板等其他基板也可使用。 %胃' [發明之效果] 按照上述,依據本發明,藉在設置於旋轉板下方之隔 壁板設置有窗部或翼片,又在處理杯設置有緩衝室,當旋 轉基板施行預定之液體處理時所發生之氣流及/或霧氣可 順暢地朝液體處理裝置外部排出。再者,在圍繞基板那樣 設置之杯内壁旋轉基板時設置將產生之氣流導入下方之翼 片時可提高排氣效率。如此作可防止在液體處理裝置内之 上升氣流發生’由於可防止在基板上飛揚的霧氣發生與其 霧氣朝基板附著,變成可保持高品質基板,進而可獲得所 謂可提高製造合格率之顯著的效果。此外,只要利用液體 處理裝置之備用空間形成緩衝室,液體處理裝置之覆蓋區 無變大之情事,再者,交換或改造即存的液體處理裝置之 一部份則可容易地設置緩衝室。 圖式之簡單的說明 第1圖表示有關於本發明液體處理裝置具有洗淨處理 裝置之抗餘劑塗布、顯像處理系統之一實施形態平面圖。 第2圖表示有關於本發明之液體處理裝置之洗淨處理 裝置之一實施形態平面圖及截面圖。 第3圖表示有關於本發明之液體處理裝置之洗淨處理 裝置之一實施形態另一平面圖及截面圖。 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 25 (請先閱讀背面之注意事項再填寫本頁) -# 訂— 529102#… (Please read the precautions on the back before filling in this page), OK |: Li-23 529102 A7 B7 21 V. Description of the invention The cleaning solution springs back from the wing 53 to stop the spin drying process and other cleaning solutions. When the processing is performed under the condition of the supply, as described above, the fins $ 3 are tilted to a predetermined angle, and the introduction of airflow and / or mist is performed. At this time, the tilt of the fin 53 is increased when the number of rotations of the rotary plate 41 is oriented, and the tilt of the fins 53 is reduced equally when the number of rotations of the rotary plate 41 is low and small, in cooperation with the rotation of the rotary plate 41 The intensity of the generated airflow can also control the volume of airflow towards the exhaust chamber. The means for holding the substrate G on the square turn plate 41 is not limited to the mechanical means using the stopper pin 43 as in the above embodiment. For example, a vacuum suction type holding mechanism may be used. The shape of the rotary plate 41 when the air-sending fins 49 are provided is preferably a circular shape in order to improve the effect, but other shapes such as a rectangular shape may be used. In this case, since the air flow may occur from the side of the rectangular rotating plate, it is desirable to take measures such as designing the shape of the inner wall of the processing cup as appropriate if the control is performed. It is also desirable that the inclination angle of the buffer chamber guide wall 61b formed in the upper cup 61 can be changed. When the substrate G is rotated, the inclination angle of the buffer chamber guide wall 61 b can be changed due to the amount of the cleaning solution released from the substrate g or the number of rotations of the substrate G, and the cleaning solution that hits the buffer chamber guide wall 61 can be changed on the one side. While being surely dropped downward, airflow and / or mist can be introduced into the buffer chamber 63. Although the above embodiment has exemplified the case where the liquid processing apparatus of the present invention is applied to a resist coating and development processing system, the present invention is not limited to this, and other liquid processing apparatuses may be applied. For example, when the liquid processing device of the present invention is suitable for resist coating, and the resist processing device 22 or the developing processing devices 24a to 24c of the developing processing system, basically only the paper size of the processing solution is applicable to the Chinese national standard ( CNS) A4 specification (210X297mm) ------------------------___ (Please read the notes on the back before filling this page)-、 —: Li-24 529102 A7 B7 V. Description of the invention (22 The supply mechanism or cleaning mechanism replaces the predetermined mechanism, the other parts are common with the cleaning processing device 21a, and the same effect as above can be obtained ^ = Although the liquid crystal display used as the substrate is described, other substrates such as semiconductor wafers and optical disk substrates can also be used.% Stomach '[Effects of the Invention] As described above, according to the present invention, the partition wall provided below the rotating plate is used. The plate is provided with a window or a flap, and a processing chamber is provided with a buffer chamber, and the airflow and / or mist generated when the rotary substrate performs a predetermined liquid treatment can be smoothly discharged to the outside of the liquid treatment device. Furthermore, the surrounding The inner wall of the cup is set like a base plate. When the substrate is installed, the exhaust airflow can be improved by introducing the generated airflow into the lower wing. This can prevent the updraft from occurring in the liquid processing device. 'Because it can prevent the mist from flying on the substrate and its mist from adhering to the substrate, it becomes The high-quality substrate can be maintained, and the so-called significant effect of improving the manufacturing yield rate can be obtained. In addition, as long as the buffer space is formed by using the spare space of the liquid processing device, the coverage area of the liquid processing device does not become larger. The buffer chamber can be easily installed or modified as part of the existing liquid processing device. Simple illustration of the drawing Figure 1 shows that the liquid processing device of the present invention has the anti-resistance coating and development of the cleaning processing device. A plan view of an embodiment of a processing system. Fig. 2 shows a plan view and a sectional view of an embodiment of a cleaning treatment apparatus for a liquid processing apparatus of the present invention. Fig. 3 shows a cleaning process for a liquid processing apparatus of the present invention. One embodiment of the device, another plan view and cross-sectional view. This paper size applies to Chinese national standards (CNS) A4 size (210X297 mm) 25 (Please read the notes on the back of this page and then fill in) - Order # --529102

五、發明説明(23 ) 第4圖表示有關於本發明之液體處理裝置之洗淨處理 裝置之一實施形態又另一平面圖及截面圖。 第5圖將藉基板之旋轉產生之氣流及/或霧氣之排出路 經一個模式地表示之說明圖。 第6圖在第2圖記載之截面圖中,表示下降上杯之狀態 截面圖及表示上杯與下杯之密封構件周圍構造之截面圖。 第7圖表示朝第1排出口之除霧器安裝形態之一例說 明圖。 第8圖表示在第2圖記載之截面圖中,在基板上配置洗 淨機構之狀態截面圖。 第9圖表示有關於本發明之液體處理裝置之洗淨處理 裝置之另一實施形態之平面圖及戴面圖。 第10圖表示設置於第9圖記載之洗淨處理裝置之翼片 構造說明圖。 本紙張尺度適用中國國家標準(CNS) A4規格U10X297公釐) 26 # (請先閲讀背面之注意事項再填寫本頁) 、可— 529102 A7 B7 五、發明説明(24 ) 元件標號對照 1—^匣站 39…搬送臂 2···處理部 41…旋轉板 2a…前段部 42…支樓銷 2b,2c…後段部 43…止動銷 3…界面部 44…頂件銷 10…搬送機構 46…極轴 11…搬送臂 47…馬達 12,13,14···搬送路 48…收容容器 15,16…中繼部 49…送風翼片 17,18,19···主搬送裝置 51…隔壁板 21心211),21^洗淨處理裝置 51a…壁部 22…抗蝕劑塗布處理裝置 52…窗部 23…抗蝕劑除去裝置 53…翼片 24a,24b,24c…顯像處理裝置 53a…開口部 25,26,27,28,29,30"處理構體 54b…壁部 32,33…處理構體 54…第2排出口 34…藥液供給裝置 55…排氣室 35…維護空間 56…孔部 36…伸長部 57…感測器 37…緩衝台 57a…窗部 38…搬送機構 58…第1排出口 38a…搬送路 60…處理杯 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 27 529102 A7 B7 五、發明説明(25 ) 61a···内周壁 62c…第1突壁部 61b…内壁 63…緩衝室 61c···防護壁 66…密封構件 61d…錐形部 67…除霧器 61e…頂板 68…通風口 61f…外周壁 69…翼片 61g…第2突壁部 80…擦洗洗淨機構 62…下杯 100…抗1虫劑塗布、顯像處理系統 62a…外周壁 G…基板(LCD)(液晶顯示器) 62b…底板 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 28V. Description of the Invention (23) FIG. 4 shows another embodiment of the cleaning treatment device of the liquid treatment device of the present invention, and another plan view and sectional view. Fig. 5 is an explanatory diagram schematically showing a flow path of airflow and / or mist generated by rotation of the substrate. Fig. 6 is a cross-sectional view shown in Fig. 2 showing a state in which the upper cup is lowered, and a cross-sectional view showing a structure around the sealing member of the upper and lower cups. Fig. 7 is an explanatory diagram showing an example of a defogger mounting form toward the first discharge port. Fig. 8 is a cross-sectional view showing a state where the cleaning mechanism is arranged on the substrate in the cross-sectional view shown in Fig. 2. Fig. 9 shows a plan view and a wearing view of another embodiment of the cleaning processing apparatus of the liquid processing apparatus of the present invention. Fig. 10 is a diagram for explaining the structure of a fin installed in the cleaning treatment device shown in Fig. 9; This paper size applies to Chinese National Standard (CNS) A4 specification U10X297 mm) 26 # (Please read the precautions on the back before filling out this page), OK — 529102 A7 B7 V. Description of the invention (24) Component label comparison 1— ^ Box station 39 ... Transporting arm 2 ... Processing section 41 ... Rotating plate 2a ... Front section 42 ... Abutment pins 2b, 2c ... Rear section 43 ... Stop pin 3 ... Interface section 44 ... Top piece pin 10 ... Transport mechanism 46 ... Polar axis 11 ... Transport arm 47 ... Motor 12,13,14 ... Transport path 48 ... Receiving container 15,16 ... Relay section 49 ... Air supply flaps 17,18,19 ... Main transfer device 51 ... Partition plate 21 core 211), 21 ^ cleaning processing device 51a ... wall portion 22 ... resist coating processing device 52 ... window portion 23 ... resist removing device 53 ... fins 24a, 24b, 24c ... development processing device 53a ... Openings 25, 26, 27, 28, 29, 30 " processing structure 54b ... wall portion 32, 33 ... processing structure 54 ... second discharge port 34 ... medicinal liquid supply device 55 ... exhaust chamber 35 ... maintenance space 56 ... hole portion 36 ... extension portion 57 ... sensor 37 ... buffer table 57a ... window portion 38 ... carrying mechanism 58 ... first discharge port 38a ... Sending path 60 ... Processing cup (please read the precautions on the back before filling this page) This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) 27 529102 A7 B7 V. Description of the invention (25) 61a ·· · Inner peripheral wall 62c ... First protruding wall portion 61b ... Inner wall 63 ... Buffer chamber 61c ... · Protective wall 66 ... Sealing member 61d ... Tapered portion 67 ... Mist eliminator 61e ... Top plate 68 ... Vent 61f ... Outer peripheral wall 69 ... 61g of wings ... 2nd protruding wall portion 80 ... Scrubbing and washing mechanism 62 ... Lower cup 100 ... Anti-insecticide coating and development processing system 62a ... Peripheral wall G ... Substrate (LCD) (liquid crystal display) 62b ... Base plate (please (Please read the notes on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210X297 mm) 28

Claims (1)

六、申請專利範圍 h 一種液體處理裝置,係在基板施行預定之液體處理者, 其包含: , 保持機構,用以保持基板; 處理液供給機構,係用以供給預定之處理液至前述 基板; 旋轉機構,係使前述保持機構與前述基板一同面内 旋轉;及 緩衝室,係使由於前述基板之旋轉所產生之氣流及 /或硌氣滯留,且防止前述氣流及/或霧氣之捲揚與朝前 述基板之擴散。 2· —種液體處理裝置,係在基板施行預定之液體處理者, 其包含: 保持機構,用以保持基板; 處理液供給機構,係用以供給預定之處理液至前述 基板; 旋轉機構,係使前述保持機構與前述基板一同面内 旋轉; 處理杯,係由設置成圍繞前述基板周緣之可升降自 如的上杯及固定的下杯所構成;及 緩衝至係形成於刚述處理杯,使由於前述基板之 旋^而產生之氣流及/或霧氣滯留,且防止前述氣流及/ 或務氣之捲揚與朝前述基板之擴散。 3β如申請專利範圍第2項之液體處理裝置,其中: 前述緩衝室係由橫架於前述上杯之内周壁與外周 5291026. Patent application scope h A liquid processing device, which performs a predetermined liquid processing on a substrate, includes: a holding mechanism for holding a substrate; a processing liquid supply mechanism for supplying a predetermined processing liquid to the aforementioned substrate; The rotating mechanism rotates the holding mechanism and the substrate in-plane together; and the buffer chamber retains airflow and / or radon generated by the rotation of the substrate, and prevents the airflow and / or mist from being hoisted and Diffusion toward the aforementioned substrate. 2. A liquid processing device for performing a predetermined liquid processing on a substrate, including: a holding mechanism for holding the substrate; a processing liquid supply mechanism for supplying a predetermined processing liquid to the substrate; a rotation mechanism, the system The holding mechanism is rotated in-plane with the substrate; the processing cup is composed of an upper cup that can be raised and lowered and a fixed lower cup that is arranged around the periphery of the substrate; and the buffer is formed in the processing cup just described so that The airflow and / or mist generated due to the rotation of the substrate is retained, and the hoisting and diffusion of the airflow and / or service air to the substrate is prevented. 3β The liquid processing device according to item 2 of the scope of patent application, wherein: the buffer chamber is horizontally arranged on the inner peripheral wall and the outer periphery of the upper cup 529102 申清專利範圍 經濟部智慧財產局員工消費合作社印製 壁及前述内周壁與前述外周壁之頂板,及前述下杯之外 周壁與底壁所形成。 申明專利範圍第2項之液體處理裝置,其中·· 月述上杯在上升限度位置靜止時,前述上杯之外周 壁與前述下杯之外周壁之間是密封的, 而 $述上杯在比前述上升限度位置下方時,前述 杯之外周壁與前述下杯之外周壁之間產生間隙。 申明專利範圍第2,3或4項之液體處理裝置,其中: —於刖述上杯之内周壁設置有緩衝室導向構件,用C 將〜著則述上杯内周壁上升之氣流及/或霧氣導入前述 緩衝室。 6·如申請專利範圍第5項之液體處理裝置,其中·· 在蚋述緩衝至導向構件之上部設置有防護壁, 防止沿著前述緩衝室導向構件上升之氣流及/或霧氣 飛散。7. 如申請專利範圍第5項之液體處理裝置,其中: 、、在刖述上杯之内周壁形成有通風口,用以將沿著前 述緩衝室導向構件±升之氣流及/域氣導人前述緩衝 室。 8. 如申請專利範圍第!或2項之液體處理裝置,其中: 在別述緩衝至底面形成有排^ 口,用以將導入前述 緩衝室之氣流及/或霧氣排出外部。 9‘如申請專利範圍第2項之液體處理裝置,其中: 在前述上杯之内周壁設置有複數翼片,用以將藉前 以 用以 (請先閱讀背面之注意事項再填寫本頁)The scope of patent application is printed by the wall of the Intellectual Property Bureau of the Ministry of Economic Affairs, the consumer cooperative, and the top plate of the inner and outer peripheral walls, and the outer and bottom walls of the lower cup. The liquid treatment device of the second patent claim declares that, when the upper cup is stationary at the rising limit position, the outer peripheral wall of the upper cup and the outer peripheral wall of the lower cup are sealed, and the upper cup is in When it is lower than the rising limit position, a gap is generated between the outer peripheral wall of the cup and the outer peripheral wall of the lower cup. The liquid treatment device claiming the scope of the patent No. 2, 3 or 4, wherein:-a buffer chamber guide member is provided on the inner peripheral wall of the upper cup, and C is used to control the air flow rising from the inner peripheral wall of the upper cup and / or The mist is introduced into the buffer chamber. 6. The liquid processing device according to item 5 of the scope of patent application, wherein: a protective wall is provided on the upper part of the buffer member to the guide member to prevent the airflow and / or mist rising along the guide member of the buffer chamber from scattering. 7. The liquid processing device according to item 5 of the scope of the patent application, wherein: a vent is formed on the inner peripheral wall of the upper cup, which is used to direct the airflow and / domain air conduction of ± liters along the guide member of the buffer chamber. The aforementioned buffer room. 8. If the scope of patent application is the first! Or the liquid processing device according to item 2, wherein: a drain port is formed on the buffer to the bottom surface to discharge the airflow and / or mist introduced into the buffer chamber to the outside. 9‘If the liquid treatment device of the second item of the scope of patent application, wherein: a plurality of fins are provided on the inner peripheral wall of the upper cup, which is used for borrowing (please read the precautions on the back before filling this page) 30 52910230 529102 述旋轉機構之驅動產生之氣流及/或霧氣導入前述處理 杯之下方。 10*如申請專利範圍第i或2項之液體處理裝置,更包含伞 狀的隔壁板,其係設置於前述保持機構之下方,且在前 述隔壁板形成複數之窗部,又, 在前述隔壁板上設置有翼片,使藉前述旋轉機構之 驅動產生之氣流及/或霧氣導入前述窗部。 1 ·種液體處理裝置,係在基板施行預定之液體處理者, 其包含: 保持機構,用以保持基板; 處理液供給機構,係用以供給預定之處理液至前述 基板; 旋轉機構,係使前述保持機構與前述基板一同面内 旋轉傘狀之隔壁板,係設置於前述保持機構之下方,且 形成複數之窗部;及 翼片,係設置於前述隔壁板上,用以將藉前述旋轉 機構之驅動產生之氣流及/或霧氣導入前述窗部。 1厶一種液體處理裝置,係在基板施行預定之液體處理者, 其包含: 保持機構,用以保持基板; 處理液供給機構,係用以供給預定之處理液至前述 基板; 旋轉機構,係使前述保持機構與前述基板一同面内 旋轉; 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閲讀背面之注意事項再填寫本頁) •0 訂 線! 經濟部智慧財產局員工消費合作社印製 31 529102The airflow and / or mist generated by the driving of the rotating mechanism is introduced below the processing cup. 10 * If the liquid processing device in the scope of application for item i or 2 includes an umbrella-shaped partition wall, it is arranged below the holding mechanism, and a plurality of window portions are formed on the partition wall. A wing is provided on the board, so that the airflow and / or mist generated by the driving of the rotating mechanism is introduced into the window portion. 1. A liquid processing apparatus for performing a predetermined liquid processing on a substrate, comprising: a holding mechanism for holding the substrate; a processing liquid supply mechanism for supplying a predetermined processing liquid to the substrate; a rotation mechanism for The retaining mechanism and the substrate rotate the umbrella-shaped partition wall together in the plane, which is arranged below the holding mechanism and forms a plurality of window portions; and the fins are arranged on the partition wall plate, and are used for rotating the The airflow and / or mist generated by the driving of the mechanism is introduced into the aforementioned window portion. 1) A liquid processing device for performing a predetermined liquid processing on a substrate, comprising: a holding mechanism for holding the substrate; a processing liquid supply mechanism for supplying a predetermined processing liquid to the substrate; a rotation mechanism for The aforesaid holding mechanism rotates in-plane with the aforesaid substrate; this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) • 0 Order! Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 31 529102 六、申請專利範圍 經濟部智慧財產局員工消費合作社印製 傘狀的隔壁板,係設置於前述保持機構之下方,且 形成有複數之窗部; 第1翼片’係没置於前述隔壁板上’使由於前述旋 轉機構之驅動產生之氣流及/或霧氣導入前述窗部; 處理杯’係由設置成圍繞前述基板周緣之可升降自 如的上杯及固定之下杯所構成;及 複數第2翼片,係設置於前述上杯之内周壁,使由 於前述旋轉機構之驅動產生之氣流及/或霧氣導入前述 處理杯之下方。 13·如申請專利範圍第12項之液體處理裝置,其中·· 在對應於形成有前述窗部之位置設置有前述第2 翼片。 14·如申請專利範圍第12項之液體處理裝置,其中: 前述第2翼片以一定間隔設置有比前述窗部之形 成數還多之數目。 15·如申請專利範圍第12,13或14項之液體處理裝置,其 中: 在前述窗部之下方底面形成有排出口,用以排出通 過前述窗部而導入下方之氣流及/或霧氣。 如申明專利範圍第12,13或14項之液體處理裝置,其 中: Λ 在前述隔壁板設置有感測器,用以檢查在前述保持 機構中之前述基板之保持狀態。 C請先閲讀背面之注意事項再填寫本頁)6. Scope of patent application Umbrella-shaped partition wall printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is arranged below the aforementioned holding mechanism and forms a plurality of window portions; the first wing piece is not placed on the aforementioned partition wall The upper part causes the airflow and / or mist generated by the driving of the rotating mechanism to be introduced into the window portion; the processing cup is composed of a movable upper cup and a fixed lower cup arranged around the periphery of the substrate; The 2 wings are arranged on the inner peripheral wall of the upper cup, so that the airflow and / or mist generated by the driving of the rotating mechanism is introduced below the processing cup. 13. The liquid processing device according to item 12 of the scope of patent application, wherein the second fin is provided at a position corresponding to a position where the window is formed. 14. The liquid processing device according to item 12 of the patent application scope, wherein: the second wing is provided at a certain interval with a number greater than the number of formations of the window portion. 15. The liquid processing device according to claim 12, 13, or 14, wherein: a discharge port is formed on the bottom surface below the aforementioned window portion for discharging the airflow and / or mist passing through the aforementioned window portion. For example, the liquid handling device of claim 12, 13, or 14, in which: Λ is provided with a sensor on the aforementioned partition wall to check the holding state of the aforementioned substrate in the aforementioned holding mechanism. (Please read the notes on the back before filling this page) I II I
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