JP7357111B1 - Substrate processing equipment - Google Patents

Abstract

The present invention provides a substrate processing apparatus. To this end, in an example of the present invention, a substrate processing apparatus includes a processing container having an internal space, a support unit that supports and rotates a substrate within the internal space, and an exhaust duct that exhausts airflow within the internal space. and a guide member that is coupled to the processing container and guides the airflow in the internal space, and a plurality of guide members are arranged adjacently so as to be inclined with respect to the rotation direction of the substrate supported by the support unit. Can be done. [Selection diagram] Figure 12

Description

The present invention relates to an apparatus for processing a substrate, and more particularly to an apparatus for processing a rotating substrate by supplying a liquid to the substrate.

In order to manufacture semiconductor devices, various processes such as cleaning, deposition, photography, etching, and ion implantation are performed. Among these processes, the photographic process includes a coating process in which a photosensitive liquid such as photoresist is applied to the surface of the substrate to form a film, an exposure process in which a circuit pattern is transferred to the film formed on the substrate, and an exposure process. The method includes a development step that selectively removes the film formed on the substrate in the treated area or the opposite area.

FIG. 1 is a diagram schematically showing a substrate processing apparatus 1 that applies photoresist to a substrate. Referring to FIG. 1, the substrate processing apparatus 1 includes a processing container 10 having an internal space, a support unit 20 that supports a substrate (W) in the internal space, and a substrate (W) placed on the support unit 20 for processing. It has a nozzle 30 that supplies liquid 82. Processing vessel 10 has an outer cup 12 and an inner cup 14. Further, a fan filter unit (not shown) is disposed in the upper part of the processing container 10 to supply a downward airflow in the internal space, and a discharge pipe 60 for discharging the processing liquid is disposed in the lower part of the inner space. An exhaust pipe 70 for exhausting the atmosphere is connected.

When processing a substrate (W) while supplying a processing liquid 82 to a rotating substrate (W) in the substrate processing apparatus 1 having the structure as shown in FIG. It flows from the center of the substrate (W) toward the edge along the rotation direction of the substrate (W). Thereafter, as shown in FIG. 3, the upper airflow 84 flows downward after colliding with the outer cup 12 and is discharged from the inner space to the outside through the exhaust pipe 70. At this time, the airflow 84 is changed from the horizontal direction to the vertical direction, so that the airflow 84 collides with the outer cup 12, and a vortex is generated at its fulcrum. The airflow 84 is stagnated at the fulcrum where the vortex is generated, which prevents the internal space from being smoothly exhausted. These problems become more serious as the rotational speed of the substrate (W) increases.

As mentioned above, the generation of vortices and airflow congestion at the upper collision fulcrum impede the flow of airflow at the edge area of the substrate (W) when forming a film of the processing liquid 82 on the substrate (W), thereby This causes the thin film to be formed thicker in the edge region of the substrate (W) than in the central region. Furthermore, contaminants such as fumes flow back onto the substrate (W) due to the vortex flow at the upper collision fulcrum, causing contamination of the substrate (W).

Korean Patent Publication No. 10-2008-0071679

One object of the present invention is to provide a substrate processing apparatus that can improve substrate processing efficiency.

Another object of the present invention is to provide a substrate processing apparatus that can smoothly exhaust airflow within a processing space when processing a substrate by supplying a processing liquid to a rotating substrate in the processing space.

Another object of the present invention is to provide a substrate processing apparatus that can provide a uniform thickness of the liquid film over the entire area of the substrate when supplying a processing liquid to a rotating substrate to form a liquid film on the substrate. purpose.

Another object of the present invention is to provide a substrate processing apparatus that can prevent contaminants from being re-adsorbed onto a rotating substrate when the substrate is processed by supplying a processing liquid to the rotating substrate.

The objects of the present invention are not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the description below.

The present invention provides an apparatus for processing a substrate. In one example, the guide member may include a fixing part coupled to the processing container, and an extension part extending from the fixing part and having a predetermined angle in the length direction with respect to the rotation direction of the substrate. can.

In one example, the guide member may include a coupling part coupled to the processing container, and an extension part extending from the coupling part and provided at a predetermined angle in the length direction with respect to the rotation direction of the substrate. can.

In one example, a coupling portion can be provided to couple one end of the extension to the processing vessel.

In one example, the angle may be provided at 45 degrees.

In one example, the guide member further includes a hinge pin that connects the extension to the processing container at a central region in the longitudinal direction of the extension, and the extension has a fixing portion that is positioned above the hinge pin and is fixed to the processing container. The rotating part may further include a rotating part located below the hinge pin and rotatable about the hinge pin.

In one example, the rotating part may further include a stopper that limits the rotation angle of the rotating part so that the rotating part is rotated within a direction that is a tangent to the rotating direction of the substrate and the rotating direction of the substrate.

For example, the device may further include a fan unit that supplies a downward airflow to the internal space, and a nozzle that supplies a processing liquid to the substrate supported by the support unit.

For example, a plurality of guide members may be provided so as to be spaced apart from each other along a circumferential direction of the substrate supported by the support unit.

Further, the substrate processing apparatus, for example, includes a processing container having an internal space, a support unit that supports and rotates the substrate within the internal space, an exhaust duct that exhausts airflow within the internal space, and a processing container that is coupled to the processing container. A plurality of guide members are arranged adjacent to each other so as to be inclined with respect to the rotational direction of the substrate supported by the support unit, and the processing container has an open top. The apparatus may include an outer cup having an inner space, and an inner cup provided in the inner space and having a cup shape with an opening at the top and having a processing space formed therein.

In one example, a guide member can be provided between the outer cup and the inner cup.

In one example, the guide member may include a coupling part coupled to the inner cup, and an extension part extending from the coupling part and provided at a predetermined angle in the length direction with respect to the rotational direction of the substrate. can.

In one example, the lower end of the extension may be provided to be inclined downward in the direction toward which the inner cup is directed.

In one example, the outer surface of the extension adjacent to the outer cup may be provided with a groove for forming an airflow inclined with respect to the rotation direction of the substrate.

In one example, the inner cup defines an exhaust space within the interior space with an exhaust pipe coupled thereto, and airflow within the interior space may be provided to flow into the exhaust space and be exhausted from the post-treatment vessel.

In one example, the extension part may be provided at a position higher than the upper end of the exhaust duct provided in the exhaust space.

In one example, the guide member further includes a hinge pin that connects the extension to the processing container at a central region in the longitudinal direction of the extension, and the extension has a fixing portion that is positioned above the hinge pin and is fixed to the processing container. The rotating part may further include a rotating part located below the hinge pin and rotatable about the hinge pin.

In one example, the rotating part may further include a stopper that limits the rotation angle of the rotating part so that the rotating part is rotated within a direction that is a tangent to the rotating direction of the substrate and the rotating direction of the substrate.

For example, the device may further include a fan unit that supplies a downward airflow to the internal space, and a nozzle that supplies a processing liquid to the substrate supported by the support unit.

For example, a plurality of guide members may be provided so as to be spaced apart from each other along a circumferential direction of the substrate supported by the support unit.

In one example, the processing liquid may be a high viscosity photosensitive liquid.

According to the present invention, the processing liquid can be supplied to the substrate rotating within the internal space of the processing container, and the airflow within the internal space can be smoothly exhausted during processing of the substrate.

Further, according to an embodiment of the present invention, when a processing liquid is supplied to a rotating substrate to form a liquid film on the substrate, the thickness of the liquid film can be uniform over the entire area of the substrate.

Further, according to an embodiment of the present invention, when a processing liquid is supplied to a rotating substrate to process the substrate, it is possible to prevent contaminants from being re-attached to the substrate.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present invention pertains from this specification and the attached drawings. could be done.

1 is a cross-sectional view showing a substrate processing apparatus having a general structure in which a substrate is processed with a liquid while being rotated. FIG. 2 is a plan view showing the direction of airflow on a substrate surface in the substrate processing apparatus of FIG. 1; 2 is a cross-sectional view showing the flow of airflow in the substrate processing apparatus of FIG. 1. FIG. 1 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention; FIG. 5 is a cross-sectional view of the substrate processing apparatus showing the coating block or developing block of FIG. 4. FIG. 2 is a plan view of the substrate processing apparatus of FIG. 1. FIG. FIG. 7 is a plan view schematically showing the return robot of FIG. 6; FIG. 7 is a plan view schematically showing an example of the heat treatment chamber of FIG. 6; FIG. 7 is a front view of the heat treatment chamber of FIG. 6; 1 is a cross-sectional view schematically showing the structure of a substrate processing apparatus that processes a substrate by supplying a liquid to a rotating substrate according to a first embodiment of the present invention; FIG. 11 is a cutaway perspective view of the substrate processing apparatus of FIG. 10. FIG. 11 is a perspective view showing the guide member of FIG. 10 coupled to an inner cup; FIG. FIG. 11 is a perspective view of the guide member of FIG. 10; 11 is a cross-sectional view and a partially cutaway perspective view showing flow paths of airflow and processing liquid within the interior space of a processing container when a substrate is processed using the apparatus of FIG. 10; FIG. 11 is a diagram showing another example of the guide member of FIG. 10. FIG. 11 is a diagram showing another example of the guide member of FIG. 10. FIG.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments below. These Examples are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Accordingly, the shapes of elements in the drawings may be exaggerated or shortened for clarity.

The apparatus of this embodiment can be used to perform a photo process on a circular substrate. In particular, the apparatus of this embodiment can be connected to an exposure apparatus and used to perform a coating process and a developing process on a substrate. However, the technical idea of the present invention is not limited thereto, and may be used in various types of processes for supplying a processing liquid to a substrate while rotating the substrate. In the following, a case where a wafer is used as the substrate will be described as an example.

FIG. 4 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention, and FIG. 5 is a sectional view of the substrate processing apparatus showing the coating block or developing block of FIG. FIG. 6 is a plan view of the substrate processing apparatus of FIG. 4.

Referring to FIGS. 4 to 6, a substrate processing apparatus 10 according to an embodiment of the present invention includes an index module 100, a treating module 300, and an interface module 500. According to one embodiment, the index module 100, the processing module 300, and the interface module 500 are arranged sequentially in a line. Hereinafter, the direction in which the index module 100, the processing module 300, and the interface module 500 are arranged will be referred to as a first direction 12, and the direction perpendicular to the first direction 12 when viewed from above will be referred to as a second direction 14. A direction that is perpendicular to the first direction 12 and the second direction 14 is defined as a third direction 16 .

The index module 100 returns the substrate (W) from the container (F) containing the substrate (W) to the processing module 300, and stores the processed substrate (W) in the container (F). The length direction of the index module 100 is provided in the second direction 14 . Index module 100 has a load port 110 and an index frame 130. The load port 110 is located on the opposite side of the processing module 300 with respect to the index frame 130 . A container (F) containing substrates (W) and the like is placed at the load port 110. A plurality of load ports 110 may be provided, and the plurality of load ports 110 may be arranged along the second direction 14.

As the container (F), a closed container (F) such as a Front Open Unified Pod (FOUP) may be used. The container (F) may be placed in the load port 110 by a transport means (not shown), such as an Overhead Transfer, an Overhead Conveyor, or an Automatic Guided Vehicle, or by an operator. can.

An index robot 132 is provided inside the index frame 130 . A guide rail 136 having a longitudinal direction in the second direction 14 is provided within the index frame 130, and the indexing robot 132 may be provided movably on the guide rail 136. The indexing robot 132 includes a hand on which the substrate (W) is placed, and the hand can be provided to be able to move forward and backward, rotate about the third direction 16, and move along the third direction 16. .

The processing module 300 may perform a coating process and a developing process on the substrate (W). The processing module 300 can perform a substrate processing process upon receiving the substrate (W) housed in the container (F). The processing module 300 includes a coating block 300a and a developing block 300b. The coating block 300a performs a coating process on the substrate (W), and the developing block 300b performs a development process on the substrate (W). A plurality of application blocks 300a are provided, and these are provided so as to be stacked on each other. A plurality of developing blocks 300b are provided, and the developing blocks 300b are provided so as to be stacked on each other. According to the embodiment of FIG. 4, two coating blocks 300a and two developing blocks 300b are provided. The coating block 300a and the like may be arranged below the developing block 300b and the like. For example, the two application blocks 300a may perform the same process and have the same structure. Further, the two developing blocks 300b can perform the same process and have the same structure.

Referring to FIG. 6, the coating block 300a includes a heat treatment chamber 320, a return chamber 350, a liquid treatment chamber 360, and buffer chambers 312 and 316. The heat treatment chamber 320 performs a heat treatment process on the substrate (W). The heat treatment process can include a cooling process and a heating process. The liquid processing chamber 360 supplies a liquid onto the substrate (W) to form a liquid film. The liquid film may be a photoresist film or an antireflective film. The return chamber 350 returns the substrate (W) between the heat treatment chamber 320 and the liquid treatment chamber 360 within the coating block 300a.

The return chamber 350 is provided with its length parallel to the first direction 12 . A return robot 352 is provided in the return chamber 350 . The return robot 352 returns the substrate between the thermal processing chamber 320, the liquid processing chamber 360, and the buffer chambers 312 and 316. According to one example, the return robot 352 has a hand on which the substrate (W) is placed, and the hand can move forward and backward, rotate about the third direction 16, and move along the third direction 16. can be provided. A guide rail 356 whose length is parallel to the first direction 12 is provided in the return chamber 350, and the return robot 352 may be movable on the guide rail 356.

FIG. 7 is a diagram showing an example of the hand of the return robot. Referring to FIG. 7, the hand 352 has a base 352a and a support protrusion 352b. The base 352a may have an annular ring shape with a portion of the circumference bent. The base 352a has an inner diameter larger than the diameter of the substrate (W). The support protrusion 352b extends inwardly from the base 352a. A plurality of support protrusions 352b are provided to support the edge region of the substrate (W). For example, four support protrusions 352b may be provided at equal intervals. In one example, the hand 352 is coupled to the return robot 352 through a central shaft 352c and can be moved.

A plurality of heat treatment chambers 320 are provided. The heat treatment chambers 320 are arranged in a row along the first direction 12 . The heat treatment chamber 320 is located on one side of the return chamber 350.

8 is a plan view schematically showing an example of the heat treatment chamber of FIG. 6, and FIG. 9 is a front view of the heat treatment chamber of FIG. 8.

Referring to FIGS. 8 and 9, the heat treatment chamber 320 includes a housing 321, a cooling unit 322, a heating unit 323, and a return plate 324.

Housing 321 is generally provided in the shape of a rectangular parallelepiped. A loading port (not shown) is formed in the side wall of the housing 321, through which the substrate (W) is inserted and exited. The loading port can be maintained in an open state. A door (not shown) may be provided to selectively open and close the entrance. A cooling unit 322, a heating unit 323, and a return plate 324 are provided within the housing 321. The cooling unit 322 and the heating unit 323 are provided side by side along the second direction 14 . According to one example, the cooling unit 322 may be located closer to the return chamber 350 than the heating unit 323.

The cooling unit 322 has a cooling plate 322a. The cooling plate 322a may have a generally circular shape when viewed from above. A cooling member 322b is provided on the cooling plate 322a. According to an example, the cooling member 322b may be formed inside the cooling plate 322a, and may be provided with a channel through which cooling fluid flows.

The heating unit 323 includes a heating plate 323a, a cover 323c, and a heater 323b. The heating plate 323a has a generally circular shape when viewed from above. The heating plate 323a has a larger diameter than the substrate (W). A heater 323b is installed on the heating plate 323a. The heater 323b may be provided with a heat-generating low antibody to which a current is applied. The heating plate 323a is provided with lift pins 323e that can be driven in the vertical direction along the third direction 16. The lift pins 323e accept the substrate (W) from the return means outside the heating unit 323 and lower it onto the heating plate 323a, or lift the substrate (W) from the heating plate 323a and transfer it to the return means outside the heating unit 323. According to an example, three lift pins 323e may be provided. The cover 323c has a space inside with an open bottom. The cover 323c is positioned above the heating plate 323a and is moved up and down by a driver 323d. When the cover 323c is moved, the space formed by the cover 323c and the heating plate 323a is provided as a heating space for heating the substrate (W).

The return plate 324 is generally provided in a disc shape and has a diameter that corresponds to the substrate (W). A notch 324b is formed at the edge of the return plate 324. The notch 324b may have a shape corresponding to the protrusion 352b formed on the hand of the return robot 352 described above. Further, the number of notches 324b corresponds to the number of protrusions 352b formed on the hand, and the notches 324b are formed at positions corresponding to the protrusions 352b. If the vertical positions of the hand and the return plate 324 are changed at a position where the hand and the return plate 324 are vertically aligned, the substrate (W) is transferred between the hand 354 and the return plate 324. The return plate 324 is mounted on the guide rail 324d and can be moved along the guide rail 324d by a driver 324c. The return plate 324 is provided with a plurality of slit-shaped guide grooves 324a. The guide groove 324a extends to the inside of the return plate 324 at the end of the return plate 324. The guide grooves 324a have their lengths along the second direction 14, and the guide grooves 324a are spaced apart from each other along the first direction 12. The guide groove 324a prevents the return plate 324 and the lift pins 323e from interfering with each other when the substrate (W) is transferred between the return plate 324 and the heating unit 323.

The substrate (W) is cooled while the return plate 324 on which the substrate (W) is placed is in contact with the cooling plate 322a. The return plate 324 is made of a material with high thermal conductivity so that heat can be transferred well between the cooling plate 322a and the substrate (W). For example, the return plate 324 may be made of metal.

The heating units 323 provided in some of the heat treatment chambers 320 may supply gas while heating the substrate (W), thereby improving the rate at which photoresist adheres to the substrate (W). According to one example, the gas may be hexamethyldisilane (HMDS) gas.

A plurality of liquid processing chambers 360 are provided. Some of the liquid processing chambers 360 may be stacked on top of each other. The liquid processing chamber 360 is disposed on one side of the return chamber 350. The liquid processing chambers 360 are arranged side by side along the first direction 12 . Some of the liquid processing chambers 360 are provided adjacent to the index module 100. Hereinafter, these liquid treating chambers 360 will be referred to as front liquid treating chambers 362. Some of the liquid processing chambers 360 are provided adjacent to the interface module 500. Hereinafter, these liquid processing chambers 360 will be referred to as rear heat treating chambers 364.

The front liquid processing chamber 362 applies a first liquid onto the substrate (W), and the rear liquid processing chamber 364 applies a second liquid onto the substrate (W). The first liquid and the second liquid may be different types of liquids. According to one embodiment, the first liquid is an anti-reflective coating and the second liquid is a photoresist. A photoresist can be coated on a substrate (W) coated with an anti-reflection coating. Optionally, the first liquid may be a photoresist and the second liquid may be an anti-reflection coating. In this case, the anti-reflection film can be applied on the substrate (W) coated with photoresist. Optionally, the first liquid and the second liquid are of the same type and may all be photoresist.

Hereinafter, the structure of a substrate processing apparatus that processes a substrate by supplying a processing liquid onto a rotating substrate in a process chamber of the present invention will be described in detail. In the following, a case where the substrate processing apparatus is an apparatus for applying photoresist will be described as an example. However, the substrate processing apparatus may be an apparatus that forms a film such as a protective film or an antireflection film on a rotating substrate (W). Alternatively, the substrate processing apparatus may be a device that supplies a processing liquid 82 such as a developer to the substrate (W).

FIG. 10 is a cross-sectional view showing an embodiment of a substrate processing apparatus that processes a rotating substrate by supplying a processing liquid to the substrate. Referring to FIG. 10, the substrate processing apparatus includes a housing 1100, a processing container 1200, a substrate support unit 1400, a liquid supply unit 1600, an exhaust unit, and a guide member 1700.

The housing 1100 is provided in the shape of a rectangular tub having an internal space 1120. An opening 1102 is formed in one side of the housing 1100. The opening 1102 functions as a passageway through which the substrate (W) is carried out. A door (not shown) is installed in the opening 1100, and the door opens and closes the opening. A processing container 1200 is provided in an interior space 1120 of the housing 1100 . Processing container 1200 has an internal space 1280. The interior space 1280 is provided with an open top.

The support unit 1400 supports the substrate (W) within the internal space 1280 of the processing container 1200. The support unit 1400 includes a support plate 1420, a rotating shaft 1440, and a drive machine 1460. The support plate 1420 has a circular upper surface. The support plate 1420 has a smaller diameter than the substrate (W). The support plate 1420 is provided to support the substrate (W) using vacuum pressure. Alternatively, the support plate 1420 may have a mechanical clamping structure to support the substrate (W). A rotating shaft 1440 is coupled to the center of the bottom surface of the support plate 1420, and a driving device 1460 is provided to the rotating shaft 1440 to provide rotational force to the rotating shaft 1440. Drive 1460 can be a motor.

The liquid supply unit 1600 supplies a processing liquid onto the substrate (W). In one example, the processing liquid may be a photosensitive liquid, such as a photoresist. In one example, the processing liquid may be a highly viscous photoresist. The liquid supply unit 1600 includes a nozzle 1620, a nozzle moving member 1640, and a liquid supply source (not shown). One or more nozzles 1620 are provided and discharge a processing liquid onto the substrate (W). Nozzle 1620 is supported by nozzle moving member 1640. The nozzle moving member 1640 moves the nozzle 1620 between a process position and a standby position. At the process position, the nozzle 1620 supplies the processing liquid to the substrate (W) placed on the support plate 1420, and after completing the supply of the processing liquid, the nozzle 1620 waits at a standby position. In the standby position, the nozzle 1620 waits at a groove port (not shown), which is located outside the processing vessel 1200 within the housing 1100.

A fan filter unit 1260 is disposed on the upper wall of the housing 1100 to supply a downward airflow 84 to the internal space. The fan filter unit 1260 has a fan that takes in outside air into the internal space and a filter that filters outside air. An exhaust pipe 1140 is connected to the outside of the processing container 1200 of the housing 1100 to exhaust airflow supplied to the space between the processing container 1200 and the housing 1100.

Processing vessel 1200 has an outer cup 1220 and an inner cup 1240.

In one example, the outer cup 1220 is provided to surround the support unit 1400 and the substrate (W) supported by the support unit 1400. Outer cup 1220 has a bottom wall 1222, side walls 1224, and a top wall 1226. The interior of the outer cup 1220 is provided with the interior space 1280 described above. The interior space 1280 includes a portion of the upper processing space 1220 and a lower exhaust space 1248.

The bottom wall 1222 is provided in a circular shape and has an opening in the center. A side wall 1224 extends upwardly from the outer end of the bottom wall 1222. The side wall 1224 is provided in a ring shape and is provided perpendicularly to the bottom wall 1222. According to one example, the side wall 1224 may extend to the same height as the top surface of the support plate 1420, or may extend to a height slightly lower than the top surface of the support plate 1420. The top wall 1226 has a ring shape and has an opening in the center. The upper wall 1226 is provided to be inclined upward from the upper end of the side wall 1224 toward the central axis of the outer cup 1220.

Inner cup 1240 is located inside outer cup 1220. In one example, inner cup 1240 has an inner wall 1242, an outer wall 1244, and a top wall 1246. The inner wall 1242 has a through hole extending in the vertical direction. Inner wall 1242 is arranged to surround drive machine 1460. Inner wall 1242 minimizes exposure of driver 1460 to airflow 84 within the processing space. The rotation shaft 1440 and/or the driver 1460 of the support unit 1400 extend vertically through the through hole. A lower end of the inner wall 1242 may be located at the bottom wall 1222 of the outer cup 1220. The outer wall 1244 is spaced apart from the inner wall 1242 and is arranged to surround the inner wall 1242. The outer wall 1244 is spaced apart from the side wall 1224 of the outer cup 1220. The inner wall 1242 is spaced upwardly from the bottom wall 1222 of the outer cup 1220. Top wall 1246 connects the top of outer wall 1244 and the top of inner wall 1242. The upper wall 1246 has a ring shape and is arranged to surround the support plate 1420. According to one example, the top wall 1246 has an upwardly bulging shape. The upper wall 1246 has an outer upper wall 1246a that is inclined upward from the upper end of the outer wall 1244 toward the rotation axis 1440, and an inner upper wall 1246b that is inclined downward from the upper end of the inner wall 1242 to the upper end of the inner wall 1242. The support plate 1420 may be located in a space surrounded by the inner upper wall 1246b. According to an example, the highest point of the upper wall 1226 may be located outside the support plate 1420 and inside the end of the substrate (W) supported by the support unit 1400.

A space below the support plate 1420 in the processing space may be provided as an exhaust space 1248. According to one example, exhaust space 1248 can be defined by inner cup 1240. A space surrounded by and/or beneath the outer wall 1244, the upper wall 1246, and the inner wall 1242 of the inner cup 1240 may provide an exhaust space 1248.

A discharge pipe 1250 for discharging the processing liquid is connected to the bottom wall 1222 of the outer cup 1220 . The discharge pipe 1250 discharges the processing liquid flowing between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240 to the outside of the processing container 1200 . The airflow flowing in the space between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240 flows into the space surrounded by the side wall 1224 and the bottom wall 1222 of the outer cup 1220, and then flows into the exhaust space 1248. . During this process, the processing liquid contained in the airflow is discharged from the discharge space 1252 to the outside of the processing container 1200 through the discharge pipe 1250, and the airflow is introduced into the exhaust space 1248 of the processing container 1200. In one example, one or more discharge pipes 1250 may be provided. When a plurality of discharge pipes 1250 are provided, a plurality of discharge pipes 1250 may be provided along the circumferential direction of the inner cup 1240.

Although not shown, a lifting drive may be provided to adjust the relative heights of the support plate 1420 and the outer cup 1220. According to one example, the lifting drive may move the outer cup 1220 up and down in the up and down direction. For example, when loading the substrate (W) onto the support plate 1420 or unloading the substrate (W) from the support plate 1420, the return member for returning the substrate (W) may be prevented from interfering with the outer cup 1220. The support plate 1420 is located at a higher height than the upper end of the outer cup 1220. Additionally, the support plate 1420 is located at a lower height than the upper end of the outer cup 1220 so that the substrate (W) is located within the processing space during the process.

The exhaust unit has an exhaust pipe 1800. The exhaust pipe 1800 exhausts the air flowing into the exhaust space 1248 of the processing container 1200 to the outside of the processing container 1200. According to one example, the exhaust pipe 1800 is connected to the outer wall 1244 of the inner cup 1240. The exhaust pipe 1800 may extend to the space between the outer wall 1244 and the inner wall 1242 of the inner cup 1240. Optionally, the exhaust pipe 1800 can be coupled to the outer wall 1244 of the inner cup 1240 such that its inlet is provided on the outer wall 1244. According to an example, the exhaust pipe 1800 may be coupled to the processing chamber 1200 in a direction tangential to the rotational direction of the substrate (W). Alternatively, the exhaust pipe 1800 may be coupled to the processing chamber 1200 in a direction other than the tangential direction with respect to the rotational direction of the substrate (W). Optionally, the exhaust pipe 1800 can be coupled to the bottom wall 1222 of the outer cup 1220. A pressure regulating member (not shown) is installed in the exhaust pipe 1800 to forcibly inhale the airflow in the exhaust space 1248. The pressure regulating member may be a pump.

The guide member 1700 forms an airflow in the internal space 1252 and the exhaust space 1248.

In one example, the guide member 1700 guides the airflow at a height that is the same as or adjacent to the top surface of the substrate (W). When the substrate (W) is rotated, the downward air current provided to the upper region of the substrate (W) flows in a direction toward the center region of the substrate (W) and the edge region of the substrate (W) due to centrifugal force. The airflow flows toward the outside of the substrate (W) on the surface of the substrate (W) and in the area adjacent thereto while bending in the same direction as the rotation direction of the substrate (W). When these airflows leave the upper surface of the substrate (W), the direction of the airflow is generally tangential to the rotational direction of the substrate (W). However, the airflow formed in the tangential direction to the rotational direction of the substrate (W) is stagnated in the area adjacent to the substrate (W) when the rotational speed of the substrate (W) is provided at a high speed. Show the phenomenon. To prevent this, the guide member 1700 of the present invention allows the airflow formed in the internal space 1252 to have a direction inclined with respect to the rotation direction of the substrate (W).

The guide member 1700 is provided so that the airflow released from the upper surface of the substrate (W) flows in a diagonal direction with respect to the rotational direction of the substrate (W). According to one embodiment, the guide member 1700 is provided in a space between the outer cup 1220 and the inner cup 1240.

Hereinafter, the guide member 1700 of the present invention will be described in detail with reference to FIGS. 11 to 13. FIG. 11 is a cutaway perspective view of the substrate (W) processing apparatus of FIG. 10, FIG. 12 is a perspective view of the guide member 1700 of FIG. 10 coupled to the inner cup 1240, and FIG. 13 is a perspective view of the substrate (W) processing apparatus of FIG. FIG. 3 is a perspective view of a guide member 1700 of FIG.

Referring to FIGS. 11 and 12, a plurality of guide members 1700 may be provided so as to be spaced apart from each other along the circumferential direction of a substrate (W) supported by a support unit. In one example, a plurality of guide members 1700 may be arranged at equal intervals with respect to the center of the substrate (W) supported by the support unit so that the airflow formed in the internal space 1252 is uniform. can. For example, eight guide members 1700 may be provided. Optionally, more or fewer guide members 1700 may be provided.

Referring to FIG. 13, the guide member 1700 has a coupling part 1710 and an extension part 1720. The coupling part 1710 is coupled to the inner cup 1240. An inner surface 1712 of coupling portion 1710 is coupled to the top wall. Optionally, the coupling part 1710 may be provided to be coupled with the outer cup 1240. In one example, the coupling part 1710 has a hook shape to prevent the guide member 1700 from falling off from the inner cup 1240 due to the airflow formed in the inner space 1252.

Extension portion 1720 extends from coupling portion 1710. In one example, the extension part 1720 may be provided to have a length equal to the outer wall 1244. The coupling portion 1710 is provided to have a predetermined angle (α) in the length direction with respect to the rotation direction of the substrate (W). In one example, the angle may be provided at 45 degrees. Alternatively, the angle between the coupling part 1710 and the rotation direction of the substrate (W) may be 30 degrees to 60 degrees. Although the extension part 1720 is provided in a diagonal direction with respect to the rotational direction of the substrate (W), the airflow formed in the internal space 1252 has a diagonal direction along the extension part 1720.

In one example, the lower end 1734 of the extension portion 1720 is slanted downward in the direction toward which the inner cup 1240 is directed. In one example, the coupling part 1710 may be coupled to the inner cup 1240, and the lower end 1734 of the extension part 1720 may be provided to contact the outer cup 1240. The airflow formed in the internal space 1252 has a downwardly inclined direction toward the inner cup 1240 along the lower end 1734 of the extension part 1720.

In one example, the extension portion 1720 has outer surfaces 1722 and 1726 extending from a first surface 1714 that is an outer surface of the coupling portion 1710 and an inner surface 1736 extending from a second surface 1712 that is an inner surface of the coupling portion 1710. have That is, the outer surfaces 1722, 1726 are the surfaces that face the outer cup 1240, and the inner surface 1736 is the surface that faces the inner cup 1240. In one example, the inner surface 1736 can be provided in contact with the inner cup 1240. For example, inner surface 1736 can be attached to inner cup 1240. Alternatively, the inner surface 1736 may be spaced apart from the inner cup 1240.

In one example, grooves 1724 are provided on the outer surfaces 1722 and 1726 of the extension part 1720 adjacent to the outer cup 1240 to form an airflow inclined with respect to the rotation direction of the substrate (W). In one example, the outer surface of the extension part 1720 has an upper surface and a lower surface, and the groove part 1724 is provided between the upper surface and the lower surface. For example, the extension part 1720 may have a stepped shape with a groove part 1724. The airflow adjacent to the guide member 1700 passes through the groove 1724 due to the rotation of the substrate (W). The groove portion 1724 increases the velocity of the airflow and prevents the airflow from being blocked by the extension portion 1720.

In one example, the groove part 1724 of the extension part 1720 is provided at a higher position than the upper end of the exhaust duct 1225 provided in the exhaust space 1248. In addition, the airflow passing through the groove 1724 can be sucked into the exhaust duct 1225 by the descending airflow formed by the fan filter unit.

Hereinafter, with reference to FIG. 14, an air flow formed in the internal space 1252 when a substrate (W) is subjected to liquid processing using the apparatus of FIG. 10 will be described. FIG. 14 is a cross-sectional view showing the flow paths of airflow and processing liquid within the internal space 1252 of the processing containers 1200, 1200 when a substrate (W) is processed using the apparatus shown in FIG.

Referring to FIG. 14, during the coating process, the substrate (W) is supported by a support plate 1420 and rotated by the support plate 1420. The fan filter unit 1260 directs external air toward the substrate (W) to form a downward airflow. Further, a processing liquid 82 such as photoresist is supplied from the nozzle 1620 to the substrate (W). Due to the rotation of the substrate (W), the airflow 84 flows on the upper surface of the substrate (W) and in an area adjacent thereto while bending in the direction of rotation of the substrate (W) in a direction toward the outside of the substrate (W). When the airflow 84 flows to the outside of the substrate (W), the airflow 84 is directed downward due to the downward airflow formed by the fan filter unit 1260.

At this time, the guide member 1700 is provided so as to form the airflow 84 in a diagonal direction with respect to the rotational direction of the substrate (W), so that the airflow 84 flowing outside the substrate (W) is formed in a downwardly inclined direction. Ru. The airflow 84 formed by the guide member 1700 gradually flows downward from inside the interior space 1252. Thereafter, the airflow 84 is sucked into the exhaust duct 1225 due to the negative pressure created in the exhaust space 1248.

In the above example, the guide member 1700 has been described in which the coupling portion 1710 and the inner surface 1736 are coupled and fixed to the inner cup 1240. However, different from this, the guide member 1700 may be provided to be rotatable. For example, referring to FIG. 15, the guide member 1700 further includes a hinge pin 1740 that connects the extension part 1720 to the processing container 1200 at a longitudinally central region of the extension part 1720, and a stopper 1760. In one example, the extension part 1720 includes a fixed part 1722a located above the hinge pin 1740 and a rotation part 1732a located below the hinge pin 1740. In one example, the fixed part 1722a is fixed to the processing container 1200, and the rotating part 1732a is provided to be rotatable around the hinge pin 1740. Stopper 1760 limits the rotation angle of rotating portion 1732a. In one example, the rotation angle of the rotation part 1732a is limited so that the rotation part 1732a is rotated within a direction that is a tangent to the rotation direction of the substrate (W) and the rotation direction of the substrate (W).

As the rotational speed of the substrate (W) increases, the airflow formed in the internal space 1252 becomes stronger. In addition, as the rotation speed of the substrate (W) increases, the rotation angle of the rotating part 1732a increases. For example, if the airflow formed in the internal space 1252 becomes sufficiently large, the rotating part 1732a is rotated in a direction parallel to the rotational direction of the substrate (W), as shown in FIG.

In the example described above, the inner surface of the extension part 1720 is in contact with the inner cup 1240. However, different from this, the inner surface of the extension part 1720 may be spaced apart from the inner cup 1240 by a predetermined angle (β). Additionally, airflow can flow between the extension portion 1720 and the inner cup 1240 at a high speed. For example, the inner surface of the extension part 1720 may be provided such that the distance from the inner cup 1240 increases as it goes downward.

In the above example, the guide member 1700 is coupled to the inner cup 1240. However, different from this, the guide member 1700 may be provided as a structure independent of the outer cup 1240 or the inner cup 1240. For example, the guide member 1700 is located within the inner space 1252, but may be provided outside the outer cup 1240 or the inner cup 1240 and supported by a support member.

The foregoing detailed description is illustrative of the invention. Moreover, the foregoing description illustrates and describes preferred embodiments of the present invention, and the present invention can be used in a variety of different combinations, modifications, and environments. That is, changes or modifications can be made within the scope of the inventive concept disclosed in this specification, within the scope of equivalents to the content of the author's disclosure, and/or within the skill or knowledge in the art. The embodiments described above are intended to explain the best way to implement the technical idea of the present invention, and various changes may be made as required by the specific application field and use of the present invention. Therefore, the foregoing detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Additionally, the appended claims should be construed to include other implementations.

1240 Inner cup 1244 Outer wall 1252 Inner space 1700 Guide member 1710 Joint portion 1712 Inner surface 1720 Extension portion

Claims (16)

In a device that processes a substrate,
a processing container having an internal space;
a support unit that supports and rotates the substrate within the internal space;
an exhaust duct that exhausts airflow in the internal space;
a guide member coupled to the processing container to guide airflow within the internal space;
The guide member is
a plurality of them are arranged adjacent to each other so as to be inclined with respect to the rotation direction of the substrate supported by the support unit ,
The guide member is
a coupling part coupled to the processing container;
an extension part extending from the coupling part and provided at a predetermined angle in the length direction with respect to the rotation direction of the substrate;
further comprising a hinge pin coupling the extension to the processing vessel at a central longitudinal region of the extension;
The extension part is
a fixing part located above the hinge pin and fixed to the processing container;
The substrate processing apparatus may further include a rotating part located below the hinge pin and rotatable about the hinge pin . The coupling part is
The substrate processing apparatus of claim 1 , wherein one end of the extension part is coupled to the processing container. The substrate processing apparatus of claim 1 , wherein the angle is 45 degrees. 2. The apparatus of claim 1 , further comprising a stopper that limits a rotation angle of the rotating part so that the rotating part is rotated within a direction that is a tangent to the rotating direction of the substrate and the rotating direction of the substrate. substrate processing equipment. a fan unit that supplies downward airflow to the internal space;
5. The substrate processing apparatus according to claim 4 , further comprising a nozzle for supplying a processing liquid to the substrate supported by the support unit. Any one of claims 1 to 4, wherein a plurality of the guide members are provided so as to be spaced apart from each other along the circumferential direction of the substrate supported by the support unit. The substrate processing apparatus described in . In a device that processes a substrate,
a processing container having an internal space;
a support unit that supports and rotates the substrate within the internal space;
an exhaust duct that exhausts airflow in the internal space;
a guide member coupled to the processing container to guide airflow within the internal space;
The guide member is
a plurality of them are arranged adjacent to each other so as to be inclined with respect to the rotation direction of the substrate supported by the support unit,
The processing container is
an outer cup having an inner space with an open top;
an inner cup provided in the inner space and having a cup shape with an opening formed at the top and having a processing space formed therein;
The guide member is
a coupling part coupled to the inner cup;
an extension part extending from the coupling part and provided at a predetermined angle in the length direction with respect to the rotation direction of the substrate;
further comprising a hinge pin coupling the extension to the processing vessel at a central longitudinal region of the extension;
The extension part is
a fixing part located above the hinge pin and fixed to the processing container;
The substrate processing apparatus may further include a rotating part located below the hinge pin and rotatable about the hinge pin . The substrate processing apparatus of claim 7 , wherein the guide member is provided between the outer cup and the inner cup. 8. The substrate processing apparatus of claim 7 , wherein a lower end of the extension part is inclined downward in a direction toward which the inner cup is directed. 8. The apparatus of claim 7 , further comprising a stopper that limits a rotation angle of the rotating part so that the rotating part is rotated within a direction that is a tangent to the rotating direction of the substrate and the rotating direction of the substrate. substrate processing equipment. a fan unit that supplies downward airflow to the internal space;
11. The substrate processing apparatus according to claim 7 , further comprising a nozzle for supplying a processing liquid to the substrate supported by the support unit. Any one of claims 7 to 10 , wherein a plurality of the guide members are provided so as to be spaced apart from each other along the circumferential direction of the substrate supported by the support unit. The substrate processing apparatus described in . 12. The substrate processing apparatus according to claim 11 , wherein the processing liquid is a highly viscous photosensitive liquid. In a device that processes a substrate,
a processing container having an internal space;
a support unit that supports and rotates the substrate within the internal space;
an exhaust duct that exhausts airflow in the internal space;
a guide member coupled to the processing container to guide airflow within the internal space;
The guide member is
a plurality of them are arranged adjacent to each other so as to be inclined with respect to the rotation direction of the substrate supported by the support unit,
The processing container is
an outer cup having an inner space with an open top;
an inner cup provided in the inner space and having a cup shape with an opening formed at the top and having a processing space formed therein;
The guide member is
a coupling part coupled to the inner cup;
an extension part extending from the coupling part and provided at a predetermined angle in the length direction with respect to the rotation direction of the substrate;
an outer surface of the extension adjacent to the outer cup;
A substrate processing apparatus characterized in that a groove portion is provided for forming an airflow inclined with respect to the rotation direction of the substrate . the inner cup defines an exhaust space within the interior space to which an exhaust pipe is coupled;
15. The substrate processing apparatus of claim 14 , wherein the airflow in the internal space is provided so as to flow into the exhaust space and then be exhausted from the processing container. The extension part is
The substrate processing apparatus of claim 15 , wherein the groove is provided at a higher position than an upper end of the exhaust duct provided in the exhaust space.