CN117153716A

CN117153716A - Apparatus for processing substrate

Info

Publication number: CN117153716A
Application number: CN202210575679.1A
Authority: CN
Inventors: 丁宣旭; 严基象; 崔晋镐; 崔炳斗; 安熙满
Original assignee: Semes Co Ltd
Current assignee: Semes Co Ltd
Priority date: 2022-05-24
Filing date: 2022-05-24
Publication date: 2023-12-01

Abstract

The present inventive concept provides a substrate processing apparatus. The substrate processing apparatus includes: a processing vessel having an interior space; a support unit configured to support and rotate a substrate within the internal space; an exhaust duct configured to exhaust the internal space; and at least one guide member combined with the process container and configured to guide an air flow within the inner space, and wherein the at least one guide member is arranged such that the air flow within the inner space flows obliquely with respect to a rotation direction of the substrate supported by the support unit when viewed from above.

Description

Apparatus for processing substrate

Technical Field

Embodiments of the inventive concept described herein relate to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for supplying liquid onto a rotating substrate.

Background

In order to manufacture a semiconductor device, various processes such as a cleaning process, a deposition process, a photolithography process, an etching process, and an ion implantation process are performed. Among these processes, the photolithography process includes a coating process of forming a film by applying a photosensitive liquid such as a photoresist on a surface of a substrate, an exposure process of exposing the photoresist film using a photomask defining a circuit pattern, and a development process of selectively removing an exposed or unexposed region of the photoresist film formed on the substrate.

Fig. 1 is a view schematically showing a substrate processing apparatus 1 for applying a photoresist to a substrate. Referring to fig. 1, a substrate processing apparatus 1 includes a processing container 10 having an inner space, a support unit 20 for supporting a substrate W in the inner space, and a nozzle 30 for supplying a processing liquid 82 onto the substrate W placed on the support unit 20. The processing vessel 10 has an outer cup 12 and an inner cup 14. In addition, a fan filter unit (not shown) for supplying a downward air flow to the inner space is provided above the process container 10, and a discharge pipe 60 for discharging the process liquid and a discharge pipe 70 for discharging the atmosphere in the process space are connected to the process container 10.

When the substrate W is processed while the processing liquid 82 is supplied to the substrate W in a rotating state at the substrate processing apparatus 1 having the structure shown in fig. 1, the air flow 84 flows from the center to the edge of the substrate W due to the centrifugal force at the surface of the substrate W in the rotating direction of the substrate W, as shown in fig. 2. Thereafter, as shown in fig. 3, the aforementioned air flow 84 collides with the outer cup 12 and then flows downward to be discharged from the inner space to the outside through the exhaust pipe 70. At this time, since the air flow 84 changes from the horizontal direction to the vertical direction, the air flow 84 collides with the outer cup 12 and a vortex is generated at that point. The air flow 84 stagnates at the point where the vortex is generated, and accordingly, the exhaust in the internal space cannot be smoothly performed. This problem is further exacerbated as the rotational speed of the substrate W increases.

As described above, when the film of the processing liquid 82 is formed on the substrate W, generation of vortex at the collision point and stagnation of the air flow may obstruct the flow of the air flow at the edge region of the substrate W, and thus the thickness of the thin film in the edge region of the substrate W is formed thicker than that at the center region of the substrate W. In addition, contaminants such as fumes flow back onto the substrate W due to the eddy current at the above-described collision point, thereby causing contamination on the substrate W.

Disclosure of Invention

Embodiments of the inventive concept provide a substrate processing apparatus to improve substrate processing efficiency.

Embodiments of the inventive concept provide a substrate processing apparatus to efficiently exhaust a gas flow in a processing space when a substrate is processed by supplying a processing liquid onto a rotating substrate at the processing space.

Embodiments of the inventive concept provide a substrate processing apparatus to uniformly provide a liquid film thickness over an entire area of a substrate when forming a liquid film by supplying a processing liquid to a rotating substrate.

Embodiments of the inventive concept provide a substrate processing apparatus to prevent contaminants from being re-adsorbed to a substrate when the substrate is processed by supplying a processing liquid to a rotating substrate.

Technical objects of the inventive concept are not limited to the above objects, and other technical objects not mentioned will become apparent to those skilled in the art from the following description.

In an embodiment, each of the at least one guide member comprises: a coupling portion configured to be combined with the processing container; and an extension portion extending from the coupling portion, the extension portion being disposed in a top-to-bottom direction such that a longitudinal direction of the extension portion has a predetermined angle with respect to a tangential direction of the substrate.

In an embodiment, one end of the coupling portion is coupled with the processing container.

In an embodiment, the angle is 45 degrees.

In an embodiment, each of the at least one guide member further comprises a hinge pin configured to join the extension portion with the processing container at a mid-point of the extension portion, and wherein the extension portion further comprises: a fixing portion provided above the hinge pin and configured to be fixed to the process container; and a rotating portion provided below the hinge pin and configured to rotate based on the hinge pin.

In an embodiment, the inner cup comprises a stop configured to limit the rotation angle of the rotating part, so that the rotating part rotates between a tangential direction of the base plate and a direction perpendicular to the base plate.

In an embodiment, the substrate processing apparatus further includes: a fan unit configured to supply a downward air flow into the interior space; and a nozzle configured to supply a processing liquid to the substrate supported by the support unit.

In an embodiment, the at least one guide member includes a plurality of guide members spaced apart along a circumferential direction of the substrate supported by the support unit.

The present inventive concept provides a substrate processing apparatus. The substrate processing apparatus includes: a processing vessel having an interior space; a support unit configured to support and rotate a substrate within the internal space; an exhaust duct configured to exhaust an airflow within the interior space; and a guide member combined with the process container and configured to guide the air flow within the inner space, and wherein a plurality of the guide members are provided adjacently to be inclined with respect to a tangential direction of the substrate supported by the support unit, and wherein the guide member is provided such that a longitudinal direction thereof is in a top-to-bottom direction, wherein the process container includes: an outer cup having an interior space with an open top; and an inner cup disposed within the inner space, the inner cup having a cup shape with an opening formed at a top, and a processing space formed within the inner cup.

In an embodiment, the guide member is disposed between the outer cup and the inner cup.

In an embodiment, the guide member comprises: a coupling portion configured to be combined with the inner cup; and an extension portion extending from the coupling portion, the extension portion being disposed in a top-to-bottom direction such that a longitudinal direction of the extension portion has a predetermined angle with respect to a tangential direction of the substrate.

In an embodiment, the bottom end of the extension is arranged to slope downwards in a direction facing the inner cup.

In an embodiment, at an outer surface of the extension portion adjacent to the outer cup, the groove portion is configured to form a sloped airflow based on the tangential direction of the substrate.

In an embodiment, the inner cup defines an exhaust space coupled to an exhaust pipe within the interior space, and the gas flow within the interior space is exhausted from the processing vessel after being introduced into the exhaust space.

In an embodiment, the extension portion is provided at a position higher than a top end of the exhaust duct provided at the exhaust space.

In an embodiment, the guide member further comprises a hinge pin configured to couple the extension portion to the processing container at a central region of the longitudinal direction of the extension portion, and wherein the extension portion further comprises: a fixing portion provided above the hinge pin and configured to be fixed to the process container; and a rotating portion provided below the hinge pin and configured to rotate based on the hinge pin.

In an embodiment, the inner cup further comprises a stop configured to limit the rotation angle of the rotating part, so that the rotating part rotates between a tangential direction of the base plate and a direction perpendicular to the base plate.

In an embodiment, the substrate processing apparatus includes: a fan unit configured to supply a downward air flow into the interior space; and a nozzle configured to supply a processing liquid to the substrate supported by the support unit.

In an embodiment, a plurality of the guide members are provided to be spaced apart along a circumferential direction of the substrate supported by the support unit.

In an embodiment, the processing fluid is a photoresist liquid having a high viscosity.

According to an embodiment of the inventive concept, the gas flow in the inner space when the substrate is processed may be effectively discharged by supplying the processing liquid onto the rotating substrate in the inner space of the processing container.

According to embodiments of the inventive concept, when a liquid film is formed by supplying a process liquid to a rotating substrate, a liquid film thickness at the entire area of the substrate may be uniformly formed.

According to embodiments of the inventive concept, it is possible to prevent contaminants from being re-adsorbed to a substrate when the substrate is processed by supplying a processing liquid to a rotating substrate.

The effects of the inventive concept are not limited to the above-described effects, and other effects not mentioned will become apparent to those skilled in the art from the following description.

Drawings

The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, in which like reference numerals refer to like parts throughout the various views unless otherwise specified, and in which:

fig. 1 is a cross-sectional view showing a substrate processing apparatus having a conventional structure that performs liquid processing while rotating a substrate.

Fig. 2 is a plan view showing the direction of air flow on the surface of a substrate at the substrate processing apparatus of fig. 1.

Fig. 3 is a cross-sectional view showing the flow of an air flow at the substrate processing apparatus of fig. 1.

Fig. 4 is a perspective view schematically illustrating a substrate processing apparatus according to an embodiment of the inventive concept.

Fig. 5 is a cross-sectional view illustrating a substrate processing apparatus of the coating block or the developing block of fig. 4.

Fig. 6 is a plan view of the substrate processing apparatus of fig. 1.

Fig. 7 is a plan view schematically illustrating the transfer robot of fig. 6.

Fig. 8 is a plan view schematically showing an embodiment of the heat treatment chamber of fig. 6.

Fig. 9 is a front view of the thermal processing chamber of fig. 6.

Fig. 10 is a cross-sectional view schematically showing the structure of a substrate processing apparatus for processing a substrate by supplying liquid to a rotating substrate according to a first embodiment of the inventive concept.

Fig. 11 is a cut-away perspective view of the substrate processing apparatus of fig. 10.

Fig. 12 is a perspective view illustrating a state in which the guide member of fig. 10 is coupled to the inner cup.

Fig. 13 is a perspective view of the guide member of fig. 10.

Fig. 14 is a cross-sectional view and a partially cut-away perspective view showing a flow path of a gas flow and a process liquid in an inner space of a process container when a substrate is liquid-processed using the apparatus of fig. 10.

Fig. 15 and 16 are diagrams schematically illustrating another embodiment of the guide member of fig. 10.

Detailed Description

The inventive concept is susceptible to various modifications and alternative forms and specific embodiments thereof are shown in the drawings and will be described in detail. However, embodiments according to the inventive concept are not intended to be limited to the specifically disclosed forms. The examples are provided to more fully explain the inventive concept to those skilled in the art. Accordingly, the form of the elements in the drawings may be exaggerated and/or omitted to emphasize a clearer description.

The apparatus of the present inventive concept may be used to perform a photolithography process on a circular substrate. In particular, the apparatus of the present inventive concept may be connected to an exposure apparatus and used to perform a coating process and a developing process on a substrate. However, the technical concept of the present inventive concept is not limited thereto, and may be used in various processes of supplying a processing liquid to a substrate while rotating the substrate. Hereinafter, a case of using a wafer as a substrate will be described as an example.

Fig. 4 is a perspective view schematically illustrating a substrate processing apparatus according to an embodiment of the inventive concept, fig. 5 is a cross-sectional view of the substrate processing apparatus illustrating a coating block or a developing block of fig. 4, and fig. 6 is a plan view of the substrate processing apparatus of fig. 4.

Referring to fig. 4 to 6, the substrate processing apparatus 10 according to an embodiment of the inventive concept includes an indexing module 100, a processing module 300, and an interface module 500. According to an embodiment, the indexing module 100, the processing module 300 and the interface module 500 are arranged sequentially in one direction. Hereinafter, the arrangement direction of the index module 100, the process module 300, and the interface module 500 is defined as a first direction 12, a direction perpendicular to the first direction 12 is defined as a second direction 14 when viewed from above, and a direction perpendicular to both the first direction 12 and the second direction 14 is defined as a third direction 16.

The indexing module 100 transfers the substrates W from the container F in which the substrates W are stored to the processing module 300, and stores the processed substrates W at the container F. The longitudinal direction of the indexing module 100 is disposed in the second direction 14. The indexing module 100 has a load port 110 and an indexing frame 130. The load port 110 and the process modules 300 are disposed on two opposite sides of the indexing frame 130 along the first direction 12. A container F storing substrates W is placed on the load port 110. A plurality of load ports 110 may be provided and a plurality of load ports 110 may be provided in the second direction 14.

As the container F, a sealed container F such as a Front Opening Unified Pod (FOUP) may be used. The containers F may be placed on the load port 110 by a conveyor (not shown), such as an overhead conveyor, or automated guided vehicle, or by an operator.

An indexing robot 132 is disposed within the indexing frame 130. A guide rail 136 disposed with its longitudinal direction in the second direction 14 may be disposed within the index frame 130, and the index robot 132 may be disposed to be movable along the guide rail 136. The index robot 132 includes a hand on which the substrate W is placed, and the hand may be movable forward and backward, movable with the third direction 16 as an axis, and movable along the third direction 16.

The process module 300 may perform a coating process and a developing process on the substrate W. The process module 300 may receive the substrates W stored in the container F to perform a substrate processing process. The process module 300 includes a coating block 300a and a developing block 300b. The coating block 300a performs a coating process on the substrate W, and the developing block 300b performs a developing process on the substrate W. A plurality of coating blocks 300a are provided and are disposed to be stacked on each other. A plurality of developing blocks 300b are provided, and the developing blocks 300b are disposed to be stacked on each other. According to the embodiment of fig. 4, two coating blocks 300a are provided and two developing blocks 300b are provided. The coating block 300a may be disposed under the developing block 300b. According to an embodiment, the two coating blocks 300a perform the same process and may have the same structure. In addition, the two developing blocks 300b perform the same process and may have the same structure.

Referring to fig. 6, the coating block 300a includes a heat treatment chamber 320, a transfer chamber 350, a liquid treatment chamber 360, and buffer chambers 312 and 316. The heat treatment chamber 320 may perform a heat treatment process on the substrate W. The heat treatment process may include a cooling process and a heating process. The liquid processing chamber 360 supplies liquid onto the substrate W to form a liquid film. The liquid film may be a photoresist film or an antireflection film. The transfer chamber 350 transfers the substrate W between the heat treatment chamber 320 and the liquid treatment chamber 360 within the coating block 300 a.

The transfer chamber 350 is arranged with its longitudinal direction parallel to the first direction 12. The transfer chamber 350 is provided with a transfer robot 352. The transfer robot 352 transfers substrates between the heat treatment chamber 320, the liquid treatment chamber 360, and the buffer chambers 312 and 316. According to the embodiment, the transfer robot 352 has a hand on which the substrate W is placed, and the hand may be provided to be movable forward and backward, rotatable with the third direction 16 as an axis, and movable along the third direction 16. A guide rail 356 having a longitudinal direction parallel to the first direction 12 may be provided in the transfer chamber 350, and the transfer robot 352 may be provided to be movable along the guide rail 356.

Fig. 7 shows an embodiment of a hand of a transfer robot. Referring to fig. 7, the hand 352 has a base 352a and a support protrusion 352b. Base 352a may have a circular ring shape with a portion of the circumference being a cutout. The base 352a has an inner diameter larger than the diameter of the substrate W. The support protrusion 352b extends from the base 352a to the inside thereof. The support protrusion 352b may be provided in plurality and may support an edge region of the substrate W. According to an embodiment, four support protrusions 352b may be disposed at equal intervals. In an embodiment, the hand 352 may be coupled to the transfer robot 352 via a central shaft 352c and move.

A plurality of heat treatment chambers 320 are provided. The heat treatment chambers 320 are arranged along the first direction 12. The heat treatment chamber 320 is disposed on one side of the transfer chamber 350.

Fig. 8 is a plan view schematically showing an embodiment of the heat treatment chamber of fig. 6, and fig. 9 is a front view of the heat treatment chamber of fig. 8.

Referring to fig. 8 and 9, the heat treatment chamber 320 includes a housing 321, a cooling unit 322, a heating unit 323, and a transfer plate 324.

The housing 321 is provided in a substantially rectangular parallelepiped shape. An inlet (not shown) through which the substrate W enters and exits is formed on a sidewall of the housing 321. The inlet may remain open. A door (not shown) may be provided to open and close the inlet. A cooling unit 322, a heating unit 323, and a transfer plate 324 are disposed within the housing 321. The cooling unit 322 and the heating unit 323 are arranged side by side along the second direction 14. According to an embodiment, the cooling unit 322 may be disposed closer to the transfer chamber 350 than the heating unit 323.

The cooling unit 322 has a cooling plate 322a. The cooling plate 322a may have a generally circular shape when viewed from above. The cooling member 322b is disposed at the cooling plate 322a. According to an embodiment, the cooling member 322b may be formed in the cooling plate 322a, and may be provided as a flow path through which the cooling fluid flows.

The heating unit 323 has a heating plate 323a, a cover 323c, and a heater 323b. The heating plate 323a has a substantially circular shape when viewed from above. The heating plate 323a has a diameter larger than that of the substrate W. The heater 323b is installed at the heating plate 323 a. The heater 323b may be provided as a heating resistor to which a current is applied. The heating plate 323a is provided with a lift pin 323e that can be driven in the up/down direction along the third direction 16. The lift pins 323e receive the substrate W from the transfer device outside the heating unit 323 and place the substrate W on the heating plate 323a, or lift the substrate W off the heating plate 323a to transfer the substrate to the transfer device outside the heating unit 323. According to an embodiment, three lift pins 323e may be provided. The cover 323c has a space with an open bottom portion therein. The cover 323c is disposed above the heating plate 323a and is moved in an up/down direction by a driver 323 d. The space formed by the cover 323c and the heating plate 323a by moving the cover 323c is provided as a heating space for heating the substrate W.

The transfer plate 324 has a substantially circular shape and has a diameter corresponding to the substrate W. A notch 324b is formed at the edge of the transfer plate 324. The recess 324b may have a shape corresponding to the protrusion 3543 formed on the hand 354 of the transfer robot 352. In addition, as many notches 324b as the protrusions 3543 formed on the hand 354 are formed at positions corresponding to the protrusions 3543. When the vertical alignment position of the hand 354 and the transfer plate 324 is changed in the vertical direction, the substrate W is transferred between the hand 354 and the transfer plate 324. The transfer plate 324 may be mounted on a guide rail 324d and movable along the guide rail 324d by a driver 324 c. A plurality of guide grooves 324a in a slit shape are provided in the transfer plate 324. The guide groove 324a extends inward from the edge of the transfer plate 324 to the inside of the transfer plate 324. The guide grooves 324a are provided such that the lengths thereof extend along the second direction 14, and the guide grooves 3242 are positioned apart from each other along the second direction 14. The guide groove 324a prevents the transfer plate 324 and the lift pins 323e from interfering with each other when the substrate W is handed over between the transfer plate 324 and the heating unit 323.

The cooling of the substrate W is performed in a state where the transfer plate 324 on which the substrate W is placed is in contact with the cooling plate 322 a. The transfer plate 324 is made of or includes a material having a high thermal conductivity so that heat transfer between the cooling plate 322a and the substrate W is well performed. According to an embodiment, the transfer plate 324 may be made of a metallic material.

The heating unit 323 provided to some of the heat treatment chambers 320 may improve an adhesion rate of the photoresist to the substrate W by supplying gas during heating of the substrate W. According to an embodiment, the gas may be Hexamethyldisilane (HMDS) gas.

A plurality of liquid treatment chambers 360 may be provided. Some of the liquid processing chambers 360 may be disposed stacked on one another. The liquid processing chamber 360 is disposed on one side of the transfer chamber 350. The liquid treatment chambers 360 are arranged side by side along the first direction 12. Some of the liquid processing chambers 360 are disposed adjacent to the indexing module 100. Hereinafter, these liquid processing chambers 360 are referred to as pre-liquid processing chambers 362. Other liquid treatment chambers 360 are disposed adjacent to the interface module 500. Hereinafter, these liquid processing chambers 360 are referred to as post-liquid processing chambers 364.

The front liquid processing chamber 362 coats the first liquid on the substrate W, and the rear liquid processing chamber 364 coats the second liquid on the substrate W. The first liquid and the second liquid may be different types of liquids. According to an embodiment, the first liquid is an anti-reflective coating and the second liquid is a photoresist liquid. The photoresist liquid may be applied to the substrate W coated with the anti-reflective coating. Alternatively, the first liquid may be a photoresist, and the second liquid may be an anti-reflective coating. In this case, the anti-reflective coating may be applied on the substrate W to which the photoresist liquid is applied. Alternatively, the first liquid and the second liquid are the same type of liquid, all of which may be photoresist liquids.

Hereinafter, a structure of a substrate processing apparatus for processing a substrate by supplying a processing liquid onto a rotating substrate between process chambers, which is the concept of the present invention, will be described in detail. Hereinafter, a case where the substrate processing apparatus is an apparatus for coating a photoresist liquid is described as an example. However, the substrate processing apparatus may be an apparatus for forming a film (such as a protective film or an antireflection film) on the rotating substrate W. In addition, the substrate processing apparatus may optionally be an apparatus for supplying a processing liquid 82 (such as a developer) to the substrate W.

Fig. 10 is a cross-sectional view showing an embodiment of a substrate processing apparatus for processing a substrate by supplying a processing liquid to a rotating substrate. Referring to fig. 10, the substrate processing apparatus includes a housing 1100, a processing vessel 1200, a substrate supporting unit 1400, a liquid supply unit 1600, an exhaust unit, and a guide member 1700.

The case 1100 may have a rectangular cylindrical shape with an inner space 1120. An opening 1102 is formed at one side of the case 1100. The opening 1102 functions as a passage through which the substrate W is put in and taken out. A door (not shown) is installed at the opening 1100, and the door opens and closes the opening. The process vessel 1200 is disposed at the inner space 1120 of the casing 1100. The process vessel 1200 has an interior space 1280. The inner space 1280 is provided such that a top portion thereof is opened.

The support unit 1400 supports the substrate W in the inner space 1280 of the process vessel 1200. The support unit 1400 includes a support plate 1420, a rotation shaft 1440, and a driver 1460. The top surface of the support plate 1420 has a circular shape. The support plate 1420 has a smaller diameter than that of the substrate W. The support plate 1420 is provided to support the substrate W by vacuum pressure. Alternatively, the support plate 1420 may have a mechanical clamping structure to support the substrate W. The rotation shaft 1440 is coupled to the center of the bottom surface of the support plate 1420, and the rotation shaft 1440 is provided with a driver 1460 that provides a rotation force to the rotation shaft 1440. The drive 1460 may be a motor.

The liquid supply unit 1600 supplies a process liquid onto the substrate W. In an embodiment, the processing liquid may be a photosensitive liquid, such as a photoresist liquid. In an embodiment, the processing liquid may be a photoresist liquid having a high viscosity. The liquid supply unit 1600 has a nozzle 1620, a nozzle moving member 1640, and a liquid supply source (not shown). A nozzle or nozzles 1620 are provided, and the processing liquid is discharged to the substrate W through the nozzle or nozzles 1620. The nozzle 1620 is supported by a nozzle moving member 1640. The nozzle moving member 1640 moves the nozzle 1620 between the process position and the standby position. In the process position, the nozzles 1620 supply the processing liquid onto the substrate W placed on the support plate 1420, and in the standby position, the nozzles 1620, which have completed supplying the processing liquid, stand by. In the standby position, the nozzles 1620 stand by at a main port (not shown), and the main port is provided outside the process vessel 1200 within the housing 1100.

A fan filter unit 1260 for supplying the downward air flow 84 to the inner space is provided on the top wall of the housing 1100. The fan filter unit 1260 has a fan for introducing external air into the internal space and a filter for filtering the external air. An exhaust pipe 1140 for exhausting an air flow supplied to a space between the process vessel 1200 and the housing 1100 is connected to the outside of the process vessel 1200 in the housing 1100.

The process vessel 1200 has an outer cup 1220 and an inner cup 1240.

In an embodiment, the outer cup 1220 is disposed to surround the support unit 1400 and the substrate W supported therein. The outer cup 1220 has a bottom wall 1222, side walls 1224, and a top wall 1226. The inside of the outer cup 1220 is provided as the above-described inner space 1280. The interior space 1280 includes a portion of the process space 1252 at the top and an exhaust space 1248 at the bottom.

The bottom wall 1222 may have a circular shape and an opening at the center. Side walls 1224 extend upwardly from the outer end of the bottom wall 1222. The side wall 1224 may have an annular shape and be disposed perpendicular to the bottom wall 1222. In embodiments, the side walls 1224 may extend to the same height as the top surface of the support plate 1420 or may extend to a height slightly below the top surface of the support plate 1420. The top wall 1226 has an annular shape and has an opening at the center. The top wall 1226 is provided to slope upwardly and inwardly from the top end of the side wall 1224 toward the central axis of the outer cup 1220.

The inner cup 1240 is positioned inside the outer cup 1220. The inner cup 1240 has an inner wall 1242, an outer wall 1244 and a top wall 1246. The inner wall 1242 has a through hole penetrating in the up/down direction. The inner wall 1242 is provided to enclose the driver 1460. The inner wall 1242 minimizes exposure of the driver 1460 to the gas flow 84 in the process space. The rotation shaft 1440 and/or the driver 1460 of the support unit 1400 extend through the through-hole in the up/down direction. The lower end of the inner wall 1242 may be located on the bottom wall 1222 of the outer cup 1220. The outer wall 1244 is provided spaced apart from the inner wall 1242 and surrounds the inner wall 1242. The outer wall 1244 is disposed spaced apart from the side wall 1224 of the outer cup 1220. The outer wall 1244 is disposed spaced apart from the boss 1228 of the outer cup 1220. An inner wall 1242 is provided spaced upwardly from the bottom wall 1222 of the outer cup 1220. A top wall 1246 connects the top end of the outer wall 1244 to the top end of the inner wall 1242. The top wall 1246 has an annular shape and is provided to surround the support plate 1420. According to an embodiment, the top wall 1246 has an upwardly convex shape. The top wall 1246 has an outer top wall 1246a inclined upwardly from the top end of the outer wall 1244 toward the rotational axis 1440 and an inner top wall 1246b inclined downwardly from the top wall 1246 to the end of the inner wall 1242. The support plate 1420 may be located in a space surrounded by the inner top wall 1246b. According to an embodiment, the highest point of the top wall 1226 may be disposed outside the support plate 1420 and further inward than the end of the substrate W supported by the support unit 1400.

The space below the support plate 1420 within the processing space may be provided as an exhaust space 1248. According to an embodiment, the exhaust space 1248 may be defined by the inner cup 1240. The space surrounded by the outer wall 1244, the top wall 1246 and the inner wall 1242 of the inner cup 1240 and/or the space below the inner cup may be provided as an exhaust space 1248.

A drain tube 1250 for draining the treatment liquid is connected to the bottom wall 1222 of the outer cup 1220. The drain 1250 drains the process liquid introduced between the sidewall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240 to the outside of the process vessel 1200. The airflow flowing into the space between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240 is introduced into the space surrounded by the side wall 1224 and the bottom wall 1222 of the outer cup 1220 and then into the exhaust space 1248. In this process, the process liquid contained in the gas flow is discharged from the discharge space 1252 to the outside of the process vessel 1200 through the discharge pipe 1250, and the gas flow is introduced into the discharge space 1248 of the process vessel 1200. In an embodiment, one or more exhaust pipes 1250 may be provided. When the plurality of exhaust pipes 1250 are provided, the plurality of exhaust pipes 1250 may be provided along the circumferential direction of the inner cup 1240.

Although not shown, a lifting/lowering driver for adjusting the relative heights of the support plate 1420 and the outer cup 1220 may be provided. According to an embodiment, the lift/lower driver may lift and lower the outer cup 1220 in the up/down direction. For example, when the substrate W is loaded on the support plate 1420 or the substrate W is unloaded from the support plate 1420, the support plate 1420 is disposed higher than the top end of the outer cup 1220 to prevent the transfer member for transferring the substrate W from interfering with the outer cup 1220. In addition, when the process is performed, the support plate 1420 is disposed at a lower height than the top end of the outer cup 1220 such that the substrate W is disposed in the processing space.

The exhaust unit has an exhaust conduit 1225. The exhaust conduit 1225 discharges the gas flow introduced into the exhaust space 1248 of the process volume 1200 to the outside of the process volume 1200. According to an embodiment, exhaust conduit 1225 is connected to an inner wall 1242 of inner cup 1240. The exhaust conduit 1225 may extend to a space between an outer wall 1244 and an inner wall 1242 of the inner cup 1240. Optionally, an exhaust conduit 1225 may be coupled to the outer wall 1244 of the inner cup 1240 such that the exhaust conduit inlet is disposed on the outer wall 1244. According to an embodiment, the exhaust conduit 1225 may be connected to the processing vessel 1200, so that the direction of introduction of the gas flow is different from that described above. Alternatively, the exhaust duct 1225 may be coupled to the process vessel 1200 in a direction different from the tangential direction with respect to the rotational direction of the substrate W. Optionally, an exhaust conduit 1225 may be coupled to the bottom wall 1222 of the outer cup 1220. A pressure regulating member (not shown) is installed at the exhaust pipe 1225 to forcibly suck the air flow in the exhaust space 1248. The pressure regulating member may be a pump.

The guide member 1700 creates an airflow in the interior space 1252 and the exhaust space 1248.

In an embodiment, the guide member 1700 guides the flow of the air flow at a height equal to or adjacent to the top surface of the substrate W. When the substrate W rotates, a downward air flow provided to the top region of the substrate W flows in a direction from the center region of the substrate W to the edge region of the substrate W by centrifugal force. On the surface of the substrate W and the region adjacent thereto, the air flow is curved in the same direction as the rotation direction of the substrate W and flows toward the outside of the substrate W. When this air flow deviates from the top surface of the substrate W, the air flow direction is substantially parallel to the tangent line of the substrate W. However, when the rotation speed of the substrate W is set to a high speed, the air flow formed parallel to the tangential line of the substrate W stagnates in the region adjacent to the substrate W. To prevent this, the guide member 1700 of the present inventive concept is arranged to allow the air flow in the internal space 1252 to have a direction that is not parallel (e.g., intersects) with the rotation direction of the substrate W when viewed from above. For example, the angle between the direction of the air flow in the interior space 1252 and the direction of rotation of the substrate may be about 30 degrees to 60 degrees.

The guide member 1700 is provided so that the air flow leaving the top surface of the substrate W does not flow along the rotation direction of the substrate W, for example, the air flow direction intersects the substrate rotation direction. According to an embodiment, the guide member 1700 is provided in the space between the outer cup 1220 and the inner cup 1240, and the air flow in the space between the outer cup 1220 and the inner cup 1240 flows obliquely assuming that the substrate rotation direction is horizontal.

Hereinafter, the guide member 1700 of the inventive concept will be described in detail with reference to fig. 11 to 13. Fig. 11 is a cross-sectional perspective view of the substrate W processing apparatus of fig. 10, fig. 12 is a perspective view showing a state in which the guide member 1700 of fig. 10 is coupled to the inner cup 1240, and fig. 13 is a perspective view of the guide member 1700 of fig. 10.

Referring to fig. 11 to 12, a plurality of guide members 1700 may be disposed to be spaced apart from each other on the outer surface of the inner cup 1240 along the circumferential direction of the substrate W supported by the support unit. In an embodiment, the guide members 1700 may be disposed at the same interval such that the air flow formed in the internal space 1252 is uniform. For example, eight guide members 1700 may be provided. Alternatively, more or fewer guide members 1700 may be provided.

Referring to fig. 13, the guide member 1700 has a coupling portion 1710 and an extension portion 1720. The coupling portion 1710 is coupled to the inner cup 1240. An inner surface 1712 of the coupling portion 1710 is coupled to the top wall. Optionally, a coupling portion 1710 may be provided that is coupled to the outer cup 1240. In an embodiment, the coupling portion 1710 has a hook shape to prevent the guide member 1700 from being separated from the inner cup 1240 by the air flow formed in the inner space 1252.

The extension portion 1720 extends from the coupling portion 1710. For example, extension 1720 may extend downward but obliquely toward the direction of substrate rotation. In an embodiment, extension 1720 may be provided to have the same length as outer wall 1244. The longitudinal direction length of the extension portion 1710 has a predetermined angle α with respect to the tangential direction of the substrate W. The angle may be 30 to 60 degrees. In an embodiment, the angle may be set to 45 degrees. Since the extension portion 1720 extends obliquely with respect to the tangential direction of the substrate W, the air flow in the internal space 1252 has an oblique direction with respect to the rotation direction of the substrate W by the extension portion 1720.

In the present inventive concept, the tangential direction of the substrate refers to a direction perpendicular to the radial direction of the substrate, and includes all directions parallel to the direction and a direction perpendicular to the radial direction at an end of the substrate.

In an embodiment, bottom end 1734 of extension 1720 slopes downward in a direction toward inner cup 1240. In an embodiment, the coupling portion 1710 can be coupled to a top wall 1246 of the inner cup 1240 and the extension portion 1720 can be disposed in contact with an outer wall 1244 of the inner cup 1240. The airflow created in interior space 1252 has a direction that slopes downward along bottom end 1734 of extension 1720 in a direction toward inner cup 1240.

In an embodiment, the extension portion 1720 has outer surfaces 1722 and 1726 extending from the first surface 1714, which is an outer surface of the coupling portion 1710, and an inner surface 1736 extending from the second surface 1712, which is an inner surface of the coupling portion 1710. That is, outer surfaces 1722 and 1726 are surfaces facing outward cup 1220 and inner surface 1736 is a surface facing inward cup 1240. In an embodiment, inner surface 1736 may be disposed in contact with inner cup 1240. For example, inner surface 1736 may be attached to inner cup 1240. Alternatively, inner surface 1736 may be disposed in spaced relation to inner cup 1240.

In an embodiment, the outer surfaces 1722 and 1726 of the extension portion 1720 adjacent to the outer cup 1220 are provided with a groove portion 1724 for forming an air flow inclined with respect to the rotation direction of the substrate W. In an embodiment, the outer surface of extension 1720 has a top surface and a bottom surface, and recessed portion 1724 is disposed between the top surface and the bottom surface. In an embodiment, the extension portion 1720 may be provided in a stepped shape by the groove portion 1724. The air flow adjacent to the guide member 1700 passes through the groove portion 1724 according to the rotation of the substrate W. The recessed portion 1724 increases the flow rate of such air flow and prevents the air flow from being blocked by the extended portion 1720.

In the embodiment, the groove portion 1724 is provided at a position higher than the tip end of the exhaust pipe 1225 provided in the exhaust space 1248. Accordingly, the air flow passing through the groove portion 1724 can be sucked into the exhaust duct 1225 by the downward air flow formed by the fan filter unit.

Hereinafter, a gas flow formed at the inner space 1252 when the substrate W is liquid-treated using the apparatus of fig. 10 will be described with reference to fig. 14. Fig. 14 is a cross-sectional view showing the flow paths of the gas flow and the process liquid in the internal space 1252 of the process vessel 1200 when the substrate is subjected to the liquid process using the apparatus of fig. 10.

Referring to fig. 14, during the execution of the coating process, a substrate W is supported by a support plate 1420 and rotated by the support plate 1420. The outside air forms a downward air flow toward the substrate W by the fan filter unit 1260. In addition, a processing liquid 82, such as a photoresist liquid, is supplied from a nozzle 1620 to the substrate W. By the rotation of the substrate W, the air flow 84 flows at the top surface of the substrate and the adjacent region in a direction facing the outside of the substrate W while being bent in the rotation direction of the substrate W. When the air flow 84 flows outside the substrate W, the downward air flow formed by the air flow 84 through the fan filter unit 1260 faces in a downward direction.

In this case, since the guide member 1700 is provided to form the air flow 84 in an oblique direction with respect to the rotation direction of the substrate W, the air flow 84 flowing to the outside of the substrate W is formed in a downward oblique direction. The air flow 84 formed by the guide member 1700 gradually flows downward in the internal space 1252. Thereafter, the air flow 84 is drawn into the exhaust conduit 1225 by the negative pressure created in the exhaust space 1248.

In the above example, guide member 1700 has been described as coupling and securing coupling portion 1710 and inner surface 1736 to inner cup 1240. However, unlike this, the guide member 1700 may be provided rotatably. For example, referring to fig. 15, the guide member 1700 further includes a hinge pin 1740 for coupling the extension 1720 to the processing vessel 1200 in a central region along a longitudinal direction of the extension 1720. In an embodiment, the extension 1720 has a fixed portion 1722a disposed above the hinge pin 1740 and a rotating portion 1732a disposed below the hinge pin 1740. In an embodiment, the fixed portion 1722a is fixed to the processing vessel 1200 and the rotating portion 1732a is provided to be rotatable on the hinge pin 1740. A stopper 1760 is provided at the inner cup 1240 and the stopper 1760 limits the rotation angle of the rotating portion 1732a. In an embodiment, the rotation angle of the rotation portion 1732a is limited such that the rotation portion 1732a rotates in a direction perpendicular to the tangential direction of the substrate W and a direction perpendicular to the substrate W.

As the rotation speed of the substrate W increases, the airflow formed in the internal space 1252 becomes stronger. Accordingly, as the rotation speed of the substrate W increases, the rotation angle of the rotation portion 1732a increases. For example, when the air flow formed in the internal space 1252 becomes sufficiently large, the rotating portion 1732a rotates to be in a direction parallel to the rotating direction of the substrate W, as shown in fig. 16.

In the above example, the inner surface of extension 1720 has been described as contacting inner cup 1240. However, unlike this, the inner surface of extension 1720 may be disposed spaced apart from inner cup 1240 at a predetermined angle β. Accordingly, the airflow may flow between extension 1720 and inner cup 1240 at a high velocity. In an embodiment, the inner surface of extension 1720 may be configured such that the distance from inner cup 1240 increases toward the bottom.

In the above example, the guide member 1700 has been described as being coupled to the inner cup 1240. However, unlike this, the guide member 1700 may be provided as a structure independent of the outer cup 1220 or the inner cup 1240. For example, the guide member 1700 is located within the interior space 1252, but may be supported by a support member disposed outside of the outer cup 1220 or the inner cup 1240.

The effects of the inventive concept are not limited to the above-described effects, and the effects not mentioned can be clearly understood by those skilled in the art to which the inventive concept pertains from the description and the drawings.

While preferred embodiments of the present inventive concept have been shown and described until now, the present inventive concept is not limited to the above-described specific embodiments, and it should be noted that the present inventive concept may be variously performed by those having ordinary skill in the art to which the present inventive concept relates without departing from the essence of the present inventive concept as claimed in the claims, and that modifications should not be construed separately from the technical spirit or prospect of the present inventive concept.

Claims

1. A substrate processing apparatus, comprising:

a processing vessel having an interior space;

a support unit configured to support and rotate a substrate within the internal space;

an exhaust duct configured to exhaust the internal space; and

at least one guide member in combination with the processing container and configured to guide an airflow within the interior space, and

wherein the at least one guide member is arranged such that the air flow within the inner space flows obliquely with respect to a rotation direction of the substrate supported by the support unit when viewed from above.

2. The substrate processing apparatus of claim 1, wherein each of the at least one guide member comprises:

a coupling portion configured to be combined with the processing container; and

an extension portion extending from the coupling portion, the extension portion being disposed in a top-to-bottom direction such that a longitudinal direction of the extension portion has a predetermined angle with respect to a tangential direction of the base plate.

3. The substrate processing apparatus of claim 2, wherein one end of the coupling portion is coupled with the processing container.

4. The substrate processing apparatus of claim 2, wherein the angle is 45 degrees.

5. The substrate processing apparatus of claim 2, wherein each of the at least one guide member further comprises a hinge pin configured to join the extension portion with the processing container at a mid-point of the extension portion, and

wherein the extension further comprises:

a fixing portion provided above the hinge pin and configured to be fixed to the process container; and

and a rotating portion provided below the hinge pin and configured to rotate based on the hinge pin.

6. The substrate processing apparatus of claim 5, wherein the inner cup comprises a stopper configured to limit a rotation angle of the rotating portion, so that the rotating portion rotates between a tangential direction of the substrate and a direction perpendicular to the substrate.

7. The substrate processing apparatus according to any one of claims 1 to 6, further comprising:

a fan unit configured to supply a downward air flow into the interior space; and

a nozzle configured to supply a processing liquid to a substrate supported by the support unit.

8. The substrate processing apparatus according to any one of claims 1 to 6, wherein the at least one guide member comprises a plurality of guide members spaced apart along a circumferential direction of the substrate supported by the support unit.

9. A substrate processing apparatus, comprising:

a processing vessel having an interior space;

an exhaust duct configured to exhaust an airflow within the interior space; and

a guide member in combination with the processing container and configured to guide the airflow within the interior space, an

Wherein the guide members provided with a plurality of are adjacently disposed to be inclined with respect to a tangential direction of the substrate supported by the support unit, and

wherein the guide member is arranged with its longitudinal direction in a top-to-bottom direction,

wherein the processing vessel comprises:

an outer cup having an interior space with an open top; and

an inner cup disposed within the inner space, the inner cup having a cup shape with an opening formed at a top, and a processing space formed within the inner cup.

10. The substrate processing apparatus of claim 9, wherein the guide member is disposed between the outer cup and the inner cup.

11. The substrate processing apparatus of claim 9, wherein the guide member comprises:

a coupling portion configured to be combined with the inner cup; and

12. The substrate processing apparatus of claim 11, wherein a bottom end of the extension portion is disposed to be inclined downward in a direction facing the inner cup.

13. The substrate processing apparatus of claim 11, wherein at an outer surface of the extension portion adjacent to the outer cup, a groove portion is configured to form a sloped airflow based on the tangential direction of the substrate.

14. The substrate processing apparatus of claim 13, wherein the inner cup defines an exhaust space coupled to an exhaust pipe within the interior space, and

the gas flow within the interior space is exhausted from the process vessel after being introduced into the exhaust space.

15. The substrate processing apparatus according to claim 14, wherein the extension portion is provided at a position higher than a top end of the exhaust duct provided at the exhaust space.

16. The substrate processing apparatus of claim 11, wherein the guide member further comprises a hinge pin configured to couple the extension portion to the processing container at a central region of a longitudinal direction of the extension portion, and

wherein the extension further comprises:

17. The substrate processing apparatus of claim 16, wherein the inner cup further comprises a stop configured to limit a rotation angle of the rotating portion so that the rotating portion rotates between the tangential direction of the substrate and a direction perpendicular to the substrate.

18. The substrate processing apparatus according to any one of claims 9 to 17, further comprising:

19. The substrate processing apparatus according to any one of claims 9 to 17, wherein a plurality of the guide members are provided spaced apart along a circumferential direction of the substrate supported by the support unit.

20. The substrate processing apparatus of claim 18, wherein the processing fluid is a photoresist liquid having a high viscosity.