CN118259553A - Substrate processing apparatus - Google Patents

Abstract

The present disclosure provides a substrate processing apparatus, including: a process unit including a process container having an inner space, and a support unit configured to support the substrate in the inner space and rotate the substrate in a first rotation direction; and an exhaust unit configured to exhaust gas from the internal space, wherein the exhaust unit includes an exhaust pipe providing an exhaust path for the gas exhausted from the internal space and one or more connectors connecting the process container to the exhaust pipe, and one end of the exhaust pipe is closed, and an open outlet is formed at the other end of the exhaust pipe to exhaust the gas.

Description

Substrate processing apparatus

Cross Reference to Related Applications

The present application is based on and claims priority from korean patent application No. 10-2022-0185009 filed on month 12 of 2022 to korean intellectual property office and korean patent application No. 10-2023-0015730 filed on month 2 of 2023 to korean intellectual property office, the disclosures of which are incorporated herein by reference in their entireties.

Technical Field

The technical spirit of the present disclosure relates to a substrate processing apparatus. In detail, the present invention relates to a substrate processing apparatus including an exhaust unit.

Background

To manufacture a semiconductor device, various processes such as cleaning, deposition, photolithography, etching, and ion implantation are performed. Among these processes, the photolithography process includes a coating process of coating a photosensitive liquid such as a photoresist on a surface of a substrate to form a film, an exposure process of transferring a circuit pattern to the film formed on the substrate, and a developing process of selectively removing the film formed on the substrate from an exposed area or an opposite area thereof.

A substrate processing apparatus for use in a coating process of forming a film by coating a photosensitive liquid such as a photoresist includes a cup-shaped processing container having a processing space, a supporting unit supporting and rotating a substrate in the processing space, and a nozzle supplying the photoresist onto the substrate placed on the supporting unit.

An exhaust unit is coupled to the bottom wall of the processing container to exhaust air from the atmosphere of the processing space. Generally, the exhaust unit includes an integrated pipe connecting the plurality of process containers to a plurality of exhaust pipes connected thereto, respectively, and the plurality of process spaces may be simultaneously exhausted through the integrated pipe.

Disclosure of Invention

An object of the technical spirit of the present disclosure is to provide a substrate processing apparatus in which a connection piece of an exhaust unit is inclined upward in the same direction as a rotation direction of a substrate.

Another object of the technical spirit of the present disclosure is to provide the substrate processing apparatus in which the exhaust pipe of the exhaust unit is bent in the same direction as the rotation direction of the substrate.

Additional aspects will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the embodiments presented herein.

In order to achieve the above object, a technical spirit of the present disclosure provides a substrate processing apparatus including: a process unit including a process container having an inner space, and a support unit configured to support the substrate in the inner space and rotate the substrate in a first rotation direction; and an exhaust unit configured to exhaust gas from the internal space, wherein the exhaust unit includes an exhaust pipe providing an exhaust path for the gas exhausted from the internal space and one or more connectors connecting the process container to the exhaust pipe, and one end of the exhaust pipe is closed and an open outlet is formed at the other end of the exhaust pipe to exhaust the gas.

The technical spirit of the present disclosure provides a substrate processing apparatus, including: a process unit including a process container having an inner space, and a support unit configured to support the substrate in the inner space and rotate the substrate in a first rotation direction; and an exhaust unit configured to exhaust gas from the inner space, wherein the exhaust unit includes an exhaust pipe providing an exhaust path for the gas exhausted from the inner space, one or more connectors connecting the process container to the exhaust pipe, and an outlet to exhaust the gas, and the connectors are respectively inclined upward at a preset angle in the same direction as the first rotation direction.

The technical spirit of the present disclosure provides a substrate processing apparatus, including: a housing providing a space in which a substrate is processed; a first process unit including a first process container having a first inner space in the housing, and a first support unit configured to support the substrate in the first inner space and rotate the substrate in one rotation direction of the clockwise direction and the counterclockwise direction; a second process unit including a second process container having a second inner space in the housing, and a second support unit configured to support the substrate in the second inner space and rotate the substrate in one rotation direction of the clockwise direction and the counterclockwise direction; a first exhaust unit and a second exhaust unit configured to exhaust gas from the first internal space and the second internal space, respectively; and an integrated duct connected to the first and second exhaust units and located at one side based on a unit arrangement direction in which the first and second exhaust units are arranged, wherein the first exhaust unit includes: a first exhaust pipe providing an exhaust path for gas exhausted from the first internal space and having one end closed and the other end formed with an open outlet; and one or more first connectors connecting the first process vessel to the first exhaust pipe, and the second exhaust unit includes: a second exhaust pipe providing an exhaust path for the gas exhausted from the second internal space and having one end closed and the other end formed with an open outlet; and one or more second connectors connecting the second processing vessel to the second exhaust pipe.

Drawings

The above and other aspects, features, and advantages of certain embodiments of the present disclosure will become more apparent from the following description when taken in conjunction with the accompanying drawings in which:

fig. 1 is a schematic perspective view of a substrate processing apparatus according to an embodiment;

fig. 2 is a cross-sectional view of a substrate processing apparatus showing a coating block or a developing block;

Fig. 3 is a plan view of the substrate processing apparatus of fig. 1;

FIG. 4 is a diagram of a hand of a transfer robot according to an embodiment;

FIG. 5 is a schematic plan view of the thermal processing chamber of FIG. 3, according to an embodiment;

FIG. 6 is a front view of the thermal processing chamber of FIG. 5;

Fig. 7 is a cross-sectional view of a liquid processing chamber in which a rotating substrate is liquid processed by supplying a processing liquid to the rotating substrate according to an embodiment;

Fig. 8 is a perspective view of an exhaust unit of the substrate processing apparatus according to the embodiment;

fig. 9 is a schematic plan view of an exhaust unit of the substrate processing apparatus according to the embodiment;

fig. 10 is a cross-sectional view taken in a long axis direction of a connection member of an exhaust unit according to an embodiment; and

Fig. 11 is a schematic plan view of an exhaust unit of a substrate processing apparatus according to another embodiment.

Detailed Description

Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. In this regard, the present embodiments may have different forms and should not be construed as limited to the descriptions set forth herein. Accordingly, the embodiments are described below only by referring to the drawings to illustrate aspects of the present specification. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. A phrase such as "at least one of … …" modifies the entire list of elements when it follows the list of elements and does not modify individual elements in the list.

Hereinafter, embodiments of the technical spirit will be described in detail with reference to the accompanying drawings. The same reference numerals are used for the same components in the drawings, and repeated descriptions thereof are omitted.

Fig. 1 is a schematic perspective view of a substrate processing apparatus 10 according to an embodiment.

Fig. 2 is a cross-sectional view showing the substrate processing apparatus 10 of the coating block or developing block of fig. 1.

Fig. 3 is a plan view of the substrate processing apparatus 10 of fig. 1.

Referring to fig. 1 to 3, a substrate processing apparatus 10 according to an embodiment may include an index module 100, a process module 300, and an interface module 500.

According to an embodiment, the indexing module 100, the processing module 300, and the interface module 500 may be sequentially arranged in a row. Hereinafter, the direction in which the index module 100, the processing module 300, and the interface module 500 are arranged is referred to as a first direction 12, the direction orthogonal to the first direction 12 when viewed from the top is referred to as a second direction 14, and the direction orthogonal to both the first direction 12 and the second direction 14 is defined as a third direction 16.

The index module 100 may transfer the substrates W from the container F in which the substrates W are received to the process module 300, and receive the processed substrates W in the container F. The length direction of the index module 100 may be set to the second direction 14. The index module 100 may include a load port 110 and an index framework 130. Based on the index frame 130, the load ports 110 may be located on opposite sides of the process modules 300. A container F in which the substrate W is accommodated may be placed in the load port 110. The load ports 110 may be provided in plurality, and the plurality of load ports 110 may be arranged in the second direction 14.

As the container F, a sealed container F such as a Front Opening Unified Pod (FOUP) may be used. Containers F may be placed in the load port 110 by a conveying element such as an overhead conveyor, overhead conveyor or automated guided vehicle, or by an operator.

An index robot 132 may be provided inside the index frame 130. A guide rail 136 whose length direction is set to the second direction 14 may be provided in the index frame 130. The index robot 132 may be movably disposed on the guide rail 136. The index robot 132 may include a hand on which the substrate W is placed, and the hand may be provided for forward and backward movement, rotation with the third direction 16 as an axis, and movement in the third direction 16.

The process module 300 may perform a coating process and a developing process on the substrate W. The process module 300 may receive the substrate W received in the container F and perform a substrate processing process on the substrate W. The process module 300 may include a coating block 300a and a developing block 300b. The coating block 300a may perform a coating process on the substrate W, and the developing block 300b may perform a developing process on the substrate W.

The coating blocks 300a may be provided in plurality, and the plurality of coating blocks 300a may be stacked on one another. The developing blocks 300b may be provided in plurality, and the plurality of developing blocks 300b may be stacked on one another. According to the embodiment of fig. 1, each of the coating block 300a and the developing block 300b may be provided in two. The coating block 300a may be disposed under the developing block 300 b. According to an embodiment, the two coating blocks 300a may perform the same process and may have the same structure. The two developing blocks 300b may perform the same process and may have the same structure.

Referring to fig. 3, the coating block 300a may include a heat treatment chamber 320, a transfer chamber 350, a liquid treatment chamber 360, and buffer chambers 312 and 316. The heat treatment chamber 320 may perform a heat treatment process on the substrate W. The heat treatment process may include a cooling process and a heating process. The liquid processing chamber 360 may supply liquid onto the substrate W to form a liquid film. The liquid film may be a photoresist film or an anti-reflective film. The transfer chamber 350 may transfer the substrate W between the heat treatment chamber 320 and the liquid treatment chamber 360 within the coating block 300 a.

The transfer chamber 350 may have a length direction parallel to the first direction 12. A transfer robot 352 may be disposed in the transfer chamber 350. The transfer robot 352 may transfer the substrate W between the heat treatment chamber 320, the liquid treatment chamber 360, and the buffer chambers 312 and 316. According to an embodiment, the transfer robot 352 may include a hand on which the substrate W is placed, and the hand may be provided for forward and backward movement, rotation with the third direction 16 as an axis, and movement in the third direction 16. Within the transfer chamber 350, a guide rail 356 having a length direction parallel to the first direction 12 may be provided, and the transfer robot 352 may be movably provided on the guide rail 356.

The heat treatment chamber 320 may be provided in plurality. The heat treatment chamber 320 may be arranged in the first direction 12. The heat treatment chamber 320 may be located at one side of the transfer chamber 350.

The liquid processing chamber 360 may be provided in a plurality. Some of the liquid processing chambers 360 may be stacked on top of each other. The liquid processing chamber 360 may be located on one side of the transfer chamber 350. The liquid treatment chambers 360 may be arranged side by side in the first direction 12. Some of the liquid processing chambers 360 may be disposed adjacent to the index module 100. Hereinafter, the liquid processing chamber 360 positioned adjacent to the index module 100 is referred to as a pre-liquid processing chamber 362. Other ones of the liquid processing chambers 360 may be disposed adjacent to the interface module 500. Hereinafter, the liquid processing chamber 360 positioned adjacent to the interface module 500 is referred to as a post-liquid processing chamber 364.

The pre-liquid treatment chamber 362 may apply a first liquid on the substrate W, and the post-liquid treatment chamber 364 may apply a second liquid on the substrate W. The first liquid and the second liquid may be different types of liquids. According to an embodiment, the first liquid may be an anti-reflective agent and the second liquid may be a photoresist. The photoresist may be coated on the substrate W having the anti-reflection film coated thereon. Alternatively, the first liquid may be a photoresist and the second liquid may be an anti-reflective agent. In this case, the anti-reflection film may be coated on the substrate W on which the photoresist is coated. Alternatively, the first liquid and the second liquid may be the same type of liquid, and may both be photoresists.

The developing block 300b may have the same structure as the coating block 300a, and a liquid processing chamber provided in the developing block 300b may supply a developing solution onto the substrate W.

The interface module 500 may connect the process module 300 to an external exposure apparatus 700. The interface module 500 may include an interface frame 510, an additional process chamber 520, an interface buffer 530, and an interface robot 550.

A fan filter unit in which a downward air flow is formed may be provided at an upper end of the interface frame 510. The additional process chambers 520, the interface buffer 530, and the interface robot 550 may be disposed inside the interface frame 510. The additional process chamber 520 may perform a preset additional process before the substrate W, on which the process in the coating block 300a is completely performed, may be brought into the exposure apparatus 700. Alternatively, the additional process chamber 520 may perform a preset additional process before the substrate W, on which the process in the exposure apparatus 700 is completely performed, may be brought into the developing block 300 b. According to an embodiment, the additional process may be an edge exposure process exposing an edge region of the substrate W, a top surface cleaning process cleaning a top surface of the substrate W, or a bottom surface cleaning process cleaning a bottom surface of the substrate W. The additional process chambers 520 may be provided in plurality, and the plurality of additional process chambers 520 may be stacked on each other. The additional process chambers 520 may all be configured to perform the same process. Alternatively, some of the additional process chambers 520 may be configured to perform different processes.

The interface buffer 530 may provide a space where the substrate W transferred between the coating block 300a, the additional process chamber 520, the exposure device 700, and the developing block 300b temporarily stays during transfer. The interface buffers 530 may be provided in plurality, and the plurality of interface buffers 530 may be stacked on one another.

According to an embodiment, the additional process chamber 520 may be placed on one side surface and the interface buffer 530 may be placed on the other side surface based on an extension line in the length direction of the transfer chamber 350.

The interface robot 550 may transfer the substrate W among the coating block 300a, the additional process chamber 520, the exposure device 700, and the developing block 300 b. The interface robot 550 may have a transfer hand to transfer the substrate W. The interface robot 550 may be provided as one or more robots. According to an embodiment, the interface robot 550 may include a first robot 552 and a second robot 554. The first robot 552 may transfer the substrate W between the coating block 300a, the additional process chamber 520, and the interface buffer 530, the second robot 554 may transfer the substrate W between the interface buffer 530 and the exposure apparatus 700, and the second robot 554 may be configured to transfer the substrate W between the interface buffer 530 and the developing block 300 b.

The first robot 552 and the second robot 554 may include transfer hands on which the substrates W are placed, respectively, and the hands may be provided for forward and backward movement, rotation with a direction parallel to the third direction 16 as an axis, and movement in the third direction 16.

Fig. 4 is a diagram of a hand 354 of the transfer robot according to an embodiment.

Referring to fig. 4, the hand 354 may include a base 354a and a support protrusion 354b. The base 354a may have an annular shape with a periphery thereof partially curved. The susceptor 354a may have an inner diameter larger than that of the substrate W. The support protrusion 354b may extend inwardly from the base 354 a. The supporting protrusions 354b may be provided in plurality, and the plurality of supporting protrusions 354b may support the edge region of the substrate W. According to the embodiment, the supporting protrusions 354b may be provided in four at equal intervals, but are not limited thereto.

Fig. 5 is a schematic plan view of the heat treatment chamber 320 of fig. 3 according to an embodiment.

Fig. 6 is a front view of the thermal processing chamber 320 of fig. 5.

Referring to fig. 5 and 6, the heat treatment chamber 320 may include a housing 321, a cooling unit 322, a heating unit 323, and a transfer plate 324. The case 321 may be provided in a substantially rectangular parallelepiped shape. An inlet through which the substrate W enters and exits may be formed in a sidewall of the housing 321. The inlet may remain open. A door may be provided to selectively open and close the access opening. The cooling unit 322, the heating unit 323, and the transfer plate 324 may be disposed within the housing 321. The cooling unit 322 and the heating unit 323 may be arranged in the second direction 14. According to an embodiment, the cooling unit 322 may be closer to the transfer chamber 350 than the heating unit 323.

The cooling unit 322 may include a cooling plate 322a. The cooling plate 322a may have a substantially circular shape when viewed from the top. The cooling plate 322a may be provided with a cooling member 322b. According to an embodiment, the cooling member 322b may be formed inside the cooling plate 322a, and may serve as a flow path through which the cooling fluid circulates.

The heating unit 323 may include a heating plate 323a, a cover 323c, and a heater 323b. The heating plate 323a may have a substantially circular shape when viewed from the top. The heating plate 323a may have a diameter larger than that of the substrate W. The heater 323b may be installed in the heating plate 323 a. The heater 323b may be provided as a heating resistor to which an electric current is applied. The heating plate 323a is provided with a lift pin 323e driven up and down in the third direction 16. The lift pins 323e may receive the substrate W from a transfer member outside the heating unit 323 and place the substrate W on the heating plate 323a, or may lift the substrate W from the heating plate 323a and transfer the substrate W to a transfer member outside the heating unit 323. According to an embodiment, the lift pins 323e may be provided in three. The cover 323c may have a space with an opened bottom.

The cover 323c may be disposed above the heating plate 323a, and may be moved up and down by a driver 323 d. A space formed by the cover 323c and the heating plate 323a by moving the cover 323c may be provided as a heating space for heating the substrate W.

The transfer plate 324 may have a substantially disc shape, and may have a diameter corresponding to the substrate W. A recess 324b may be formed on an edge of the transfer plate 324. The recess 324b may have a shape corresponding to the supporting protrusion 354b formed on the hand 354 of the transfer robot 352 described above. The recesses 324b may be provided in a number corresponding to the support protrusions 354b formed on the hand 354, and may be formed at positions corresponding to the support protrusions 354 b. When the vertical positions of the hand 354 and the transfer plate 324 are changed from the positions where the hand 354 and the transfer plate 324 are disposed in the vertical direction, the substrate W is transferred between the hand 354 and the transfer plate 324. The transfer plate 324 may be mounted on a guide rail 324d and may be moved along the guide rail 324d between the first region and the second region by a driver 324 c. The transfer plate 324 may be provided with a plurality of slit-shaped guide grooves 324a. The guide groove 324a may extend from one end of the transfer plate 324 to the inside of the transfer plate 324. The length direction of the guide grooves 324a may be set to the second direction 14, and the guide grooves 324a may be spaced apart from each other in the first direction 12. The guide groove 324a may prevent the transfer plate 324 and the lift pins 323e from interfering with each other when the substrate W is received and transferred between the transfer plate 324 and the heating unit 323.

The substrate W may be cooled while the transfer plate 324 on which the substrate W is placed is in contact with the cooling plate 322 a. In order to facilitate heat transfer between the cooling plate 322a and the substrate W, the transfer plate 324 may be made of a material having high thermal conductivity. According to an embodiment, the transfer plate 324 may be made of metal.

The heating unit 323 provided in some of the heat treatment chambers 320 may supply gas while heating the substrate W to improve the adhesion rate of the photoresist on the substrate W. According to an embodiment, the gas may be Hexamethyldisilane (HMDS) gas.

Hereinafter, the structure of the liquid processing chamber will be described in detail. Next, the liquid processing chamber provided in the coating block is explained as an example. The liquid processing chamber is illustrated as an example in which a photoresist is coated on the substrate W. However, the liquid processing chamber may be a chamber in which a film such as a protective film or an antireflection film is formed on the substrate W. The liquid processing chamber may be a chamber in which the substrate W is developed by supplying a developer to the substrate W.

Fig. 7 is a cross-sectional view of a liquid processing chamber 1000 in which a rotating substrate W is liquid-processed by supplying a processing liquid to the rotating substrate W according to an embodiment.

Referring to fig. 7, the liquid processing chamber 1000 may include a housing 1100, a processing unit 1201, a liquid supply unit, an exhaust unit 1600, and a controller. The case 1100 is provided in the shape of a rectangular cylinder having an inner space. An opening may be formed at one side of the case 1100. The opening may serve as a passage through which the substrate W is brought into and out of the housing 1100. A door may be installed in the opening, and the door may open and close the opening.

A fan filter unit 1130 supplying a downward air flow to the inner space may be disposed on an upper wall of the case 1100. The fan filter unit 1130 may include a fan to introduce external air into the inner space and a filter to filter the external air. A plurality of fan filter units 1130 may be disposed above the plurality of process containers 1220, respectively.

A plurality of processing units 1201 may be disposed in the inner space of the case 1100. The plurality of processing units 1201 may be arranged in one direction. Hereinafter, a direction in which the plurality of processing units 1201 are arranged is referred to as a unit arrangement direction.

The plurality of processing units 1201 may include a processing container 1220 and a supporting unit 1240, respectively. The processing vessel 1220 may have an interior space 1222. An upper portion of the interior space 1222 may be open.

The support unit 1240 may support the substrate W in the inner space 1222 of the process container 1220. The support unit 1240 may rotate the substrate W in the inner space 1222 of the process container 1220. The support unit 1240 may include a support plate 1242, a drive shaft 1244, and a driver 1246. The support plate 1242 may have a circular upper surface. The support plate 1242 may have a diameter smaller than that of the substrate W. The support plate 1242 is provided to support the substrate W by vacuum pressure. Alternatively, the support plate 1242 may have a mechanical clamping structure to support the substrate W. The drive shaft 1244 may be coupled to the center of the bottom surface of the support plate 1242, and the drive shaft 1244 may be coupled to a driver 1246 that provides a rotational force to the drive shaft 1244. The drive 1246 may be a motor.

The liquid supply unit may supply liquid onto the substrate W. The liquid supply unit includes a plurality of nozzles 1420 and a treatment liquid nozzle 1440. Each nozzle 1420 may supply liquid to the substrate W supplied to each supporting unit 1240. The plurality of nozzles 1420 may be arranged to supply the same type of liquid. According to an embodiment, the nozzle 1420 may supply a cleaning solution for cleaning the substrate W. For example, the cleaning solution may be water. According to another embodiment, the nozzle 1420 may supply a removing liquid for removing photoresist from an edge region of the substrate W. For example, the removal liquid may be a diluent. Each of the plurality of nozzles 1420 is rotatable about its axis of rotation between a process position and a standby position. The process position is a position where the liquid is discharged onto the substrate W, and the standby position is a position where the nozzle 1420 is standby without discharging the liquid onto the substrate W.

The processing liquid nozzle 1440 supplies the processing liquid to the substrate W provided in the support unit 1240. The processing liquid may be a photoresist. The treatment liquid nozzle 1440 is movable along the guide between a first process position, a second process position, a third process position, and a standby position. The first to third process positions may be positions at which the processing liquid is supplied to the substrates W supported on the plurality of support units 1240. The standby position may be a position where the processing liquid nozzle 1440 is standby at a standby port 1444 located between the processing units 1201 when the photoresist is not discharged from the processing liquid nozzle 1440.

A gas-liquid separation plate 1229 may be disposed in the interior space 1222 of the process vessel 1220. The gas-liquid separation plate 1229 may be disposed to extend upward from the bottom wall of the process vessel 1220. The gas-liquid separation plate 1229 may be provided in a ring shape.

According to an embodiment, the outer side of the gas-liquid separation plate 1229 may be provided as a discharge space for discharging liquid, and the inner side of the gas-liquid separation plate 1229 may be provided as a discharge space for discharging air. A drain 1228 that drains the processing liquid may be connected to the bottom wall of the processing container 1220. The discharge pipe 1228 may discharge the process liquid flowing between the sidewall of the process container 1220 and the gas-liquid separation plate 1229 to the outside of the process container 1220. The gas flow flowing in the space between the sidewall of the process vessel 1220 and the gas-liquid separation plate 1229 may flow into the inside of the gas-liquid separation plate 1229. In this process, the process liquid contained in the gas flow is discharged to the outside of the process container 1220 through the discharge pipe 1228 in the discharge space, and the gas flow flows into the discharge space of the process container 1220. Although not shown, a lift drive may be provided to adjust the relative heights of the support plate 1242 and the process vessel 1220.

A plurality of exhaust units 1640 may be connected to the plurality of processing units 1201, respectively. A plurality of connectors 1641 may connect the processing unit 1201 to the exhaust unit 1640, respectively. Although fig. 7 shows a case where four connectors 1641 connect one processing unit 1201 to one exhaust unit 1640, the number of connectors 1641 is not limited thereto, and may be designed in various ways as necessary.

The plurality of exhaust units 1640 may be arranged in a unit arrangement direction in which the plurality of processing units 1201 are arranged. A plurality of exhaust units 1640 may be connected to an integrated conduit 1680. The integrated duct 1680 may be placed at one side based on the cell arrangement direction. When the cell arrangement direction is the X-axis direction, the integrated duct 1680 may be positioned in the Y-axis direction based on the cell arrangement direction. The length direction of the integrated duct 1680 may be substantially parallel to the cell arrangement direction. The integrated conduit 1680 may be provided with a pressure relief member 1630 that provides a flow pressure to the exhaust. For example, the pressure reducing member 1630 may be a pump or a fan.

Fig. 8 is a perspective view of an exhaust unit of the substrate processing apparatus 10 according to the embodiment.

Fig. 9 is a schematic plan view of an exhaust unit 1640 of the substrate processing apparatus 10 according to the embodiment.

Referring to fig. 8 and 9, the exhaust unit 1640 of the substrate processing apparatus 10 according to the embodiment may include all or part of the connector 1641, the outlet 1642, and the exhaust pipe 1643.

The exhaust tube 1643 may provide an exhaust path for the gas exhausted from the interior space 1222. The exhaust pipe 1643 may be bent in the same direction as the rotation direction of the support unit 1240. The exhaust tube 1643 may be curved, but may be formed as one piece. In this case, the rotation direction of the support unit 1240 may be a direction in which the substrate W rotates, and may be a clockwise direction or a counterclockwise direction.

For example, as shown in fig. 9, when the support unit 1240 rotates the substrate W counterclockwise, the exhaust pipe 1643 may be bent counterclockwise. One end of the exhaust pipe 1643 may be closed, and an outlet 1642 may be formed at the other end of the exhaust pipe 1643. The exhaust pipe 1643 may be curved counterclockwise from one end to the other end, and may be formed as one body. Thus, the exhaust unit 1640 according to the present disclosure may direct the flow of the exhaust gas flow in one direction. That is, the flow of the exhaust gas flow may be guided only in the same direction as the rotation direction of the support unit 1240. In this case, the closed end of the exhaust pipe 1643 and the other end formed with the outlet 1642 may be formed at positions in the same clockwise direction or the counterclockwise direction as the rotation direction of the support unit 1240.

The connector 1641 may connect the processing container 1220 to the exhaust tube 1643. The exhaust unit 1640 according to the present disclosure may include one or more connectors 1641. Fig. 8 and 9 show four connectors 1641, but the connectors 1641 are not limited thereto, and may be designed in various ways as required. The plurality of connectors 1641 may be placed at equal intervals from one another. For example, when the exhaust unit 1640 includes four connectors 1641, each of the connectors 1641 may be positioned about 90 ° apart from an adjacent connector 1641. The plurality of connection members 1641 may be arranged at equal intervals from one end to the other end of the exhaust pipe 1643.

The connection member 1641 may be formed to be inclined in the same direction as the rotation direction of the supporting unit 1240. The connection member 1641 may be inclined upward at a predetermined angle in the same direction as the rotation direction of the supporting unit 1240. For example, as shown in fig. 8, the connector 1641 may be inclined upwardly in a counterclockwise direction. In this case, the preset angle may be about 0 ° to about 90 °. The preset angles of the plurality of connection members 1641 may be the same, but are not limited thereto, and the plurality of connection members 1641 may be inclined at different angles.

In the case of the Y-shaped exhaust unit according to the comparative example, there is a portion in which the direction of the air flow and the exhaust direction generated with the rotation of the support unit do not match each other. In at least a part of the exhaust unit, an air flow irregularity occurs, and for example, a vortex is generated in a part opposite to the direction of the exhaust air flow. Therefore, there is a limit in improving the exhaust performance.

The connector 1641 may include an upper end 1641b inserted into and coupled to the processing container 1220 and a lower end 1641c connecting the upper end 1641b to the exhaust pipe 1643. The cross-sectional area of the lower end 1641c may be greater than the cross-sectional area of the upper end 1641 b. However, not limited thereto, the cross-sectional area of the lower end portion 1641c and the cross-sectional area of the upper end portion 1641b may be the same, or the cross-sectional area of the lower end portion 1641c may be smaller than the cross-sectional area of the upper end portion 1641 b. An exhaust port 1641a through which gas flows is formed at one end of the upper end portion 1641b inserted into the case 1100.

The cross section of the exhaust port 1641a may have an elliptical shape. The cross section of the air outlet 1641a may have an elliptical shape having a major axis in the rotation direction of the support unit 1240. The exhaust port 1641a may be installed in the upper end portion 1641b, and the section of the exhaust port 1641a may have an elliptical shape having a long axis in a direction parallel to a virtual tangent of the exhaust pipe 1643.

The upper ends 1641b of the plurality of connectors 1641 may have different cross-sectional areas. However, not limited thereto, the upper ends 1641b of the plurality of connectors 1641 may be identical.

Fig. 10 is a cross-sectional view taken in the long axis direction of the connection member of the exhaust unit according to the embodiment.

Referring to fig. 10, at least a portion of the upper end portion 1641b of the connector 1641 may be inserted into and coupled to the processing container 1220. In this case, the upper end portion 1641b may be coupled to the process container 1220 to be higher than the bottom surface of the process container 1220 by a preset height t. The upper end portion 1641b may be coupled to the processing container 1220 to be higher than the bottom surface of the case 1100 by a preset height t, and thus the gas and the liquid may be separated from each other. For example, chemicals such as photoresist may be prevented from flowing into the exhaust unit 1640.

The connection member 1641 may be formed to be inclined in the same direction as the rotation direction of the supporting unit 1240. The connection member 1641 may be inclined upward at a predetermined angle a in the same direction as the rotation direction of the supporting unit 1240. In this case, the preset angle a may be about 0 ° to about 90 °.

In the exhaust unit 1640 according to the embodiment, the connection member 1641 may be inclined upward at the preset angle a in the same direction as the rotation direction of the support unit 1240, and thus the direction of the air flow and the direction of the exhaust may be uniform in all portions. Due to the angle of the connector 1641, stagnation of the rotating air flow can be suppressed. Therefore, the air flow irregularity can be solved, and the exhaust performance can be improved.

According to the present disclosure, the accumulation of smoke at the location where the vortex is generated can be reduced. Further, by improving the exhaust performance, the process performance can be improved, and for example, the product maintenance period can be increased and a constant thickness of the photoresist can be maintained.

Fig. 11 is a schematic plan view of an exhaust unit 1640 of a substrate processing apparatus according to another embodiment.

Referring to fig. 11, an exhaust unit 1640 according to another embodiment may include one or more connectors 1641. Two connectors 1641 may be positioned in the exhaust duct 1643. The plurality of connectors 1641 may be placed at equal intervals from one another. For example, when the exhaust unit 1640 includes two connectors 1641, each connector 1641 may be disposed at an interval of about 180 ° from an adjacent connector 1641. The plurality of connection members 1641 may be arranged at equal intervals from the closed end of the exhaust pipe 1643 to the other end where the outlet 1642 is formed.

As described above, the embodiments have been disclosed in the drawings and specification. In the present specification, the embodiments have been described using specific terms, but this is merely for illustrating the technical spirit of the present disclosure, and is not intended to limit the meaning or scope of the present disclosure described in the claims. Thus, those skilled in the art will appreciate that various modifications and other equivalent embodiments are possible. Therefore, the true technical scope of the present disclosure needs to be determined by the technical spirit of the appended claims.

It should be understood that the embodiments described herein should be considered in descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should generally be considered as available for other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the following claims.

Claims (20)

1. A substrate processing apparatus comprising:

A process unit including a process container having an inner space and a support unit configured to support a substrate in the inner space and rotate the substrate in a first rotation direction; and

An exhaust unit configured to exhaust gas from the internal space,

Wherein the exhaust unit includes:

an exhaust pipe providing an exhaust path for the gas exhausted from the internal space; and

One or more connectors connecting the process vessel to the exhaust pipe, and wherein one end of the exhaust pipe is closed and an open outlet is formed at the other end of the exhaust pipe to exhaust the gas.

2. The substrate processing apparatus of claim 1, wherein each of the connection members is inclined upward at a preset angle in the same direction as the first rotation direction.

3. The substrate processing apparatus of claim 1, wherein each of the connectors is configured to:

Comprises an upper end and a lower end, wherein the upper end is coupled to the processing container, and

Comprising an exhaust port through which the gas flows, the lower end connecting the upper end to the exhaust pipe.

4. The substrate processing apparatus according to claim 3, wherein the cross-sectional areas of the upper end portions are different from each other.

5. The substrate processing apparatus of claim 3, wherein the upper end portion is coupled to the processing container so as to be higher than a bottom surface of the processing container by a preset height.

6. The substrate processing apparatus according to claim 3, wherein a cross-sectional area of the lower end portion is larger than a cross-sectional area of the upper end portion.

7. The substrate processing apparatus according to claim 3, wherein a cross section of the exhaust port has an elliptical shape having a major axis in the first rotation direction.

8. The substrate processing apparatus according to claim 2, wherein the preset angle is 0 ° to 90 °.

9. The substrate processing apparatus of claim 1, wherein the one or more connectors are arranged at equal intervals.

10. The substrate processing apparatus of claim 1, wherein the exhaust pipe has an integrated shape that is curved in the same direction as the first rotation direction.

11. The substrate processing apparatus of claim 1, wherein the first rotational direction is one of a clockwise direction and a counter-clockwise direction.

12. A substrate processing apparatus comprising:

A process unit including a process container having an inner space and a support unit configured to support a substrate in the inner space and rotate the substrate in a first rotation direction; and

An exhaust unit configured to exhaust gas from the internal space,

Wherein the exhaust unit includes:

An exhaust pipe providing an exhaust path for the gas exhausted from the internal space;

one or more connectors connecting the process vessel to the exhaust pipe; and

An outlet for discharging the gas, and

Wherein each of the connection members is inclined upward at a preset angle in the same direction as the first rotation direction.

13. The substrate processing apparatus of claim 12, wherein the preset angle is 0 ° to 90 °.

14. The substrate processing apparatus of claim 12, wherein the one or more connectors are arranged at equal intervals.

15. The substrate processing apparatus of claim 12, wherein the exhaust pipe has an integrated shape that is curved in the same direction as the first rotation direction.

16. The substrate processing apparatus of claim 12, wherein the first rotational direction is one of a clockwise direction and a counter-clockwise direction.

17. The substrate processing apparatus of claim 12, wherein the exhaust pipe has one end closed and the other end formed with the outlet.

18. A substrate processing apparatus comprising:

A housing providing a space in which a substrate is processed;

a first process unit including a first process container having a first inner space in the housing, and a first supporting unit configured to support the substrate in the first inner space and rotate the substrate in one rotation direction of a clockwise direction and a counterclockwise direction;

A second process unit including a second process container having a second inner space in the housing, and a second supporting unit configured to support the substrate in the second inner space and rotate the substrate in one rotation direction of a clockwise direction and a counterclockwise direction;

A first exhaust unit and a second exhaust unit configured to exhaust gas from the first internal space and the second internal space, respectively; and

An integrated duct connected to the first and second exhaust units and located at one side based on a unit arrangement direction in which the first and second exhaust units are arranged,

Wherein the first exhaust unit includes:

a first exhaust pipe providing an exhaust path for gas exhausted from the first internal space and having one end closed and the other end formed with an open outlet; and

One or more first connectors connecting the first processing vessel to the first exhaust pipe, and

Wherein the second exhaust unit includes:

a second exhaust pipe providing an exhaust path for the gas exhausted from the second internal space and having one end closed and the other end formed with an open outlet; and

One or more second connectors connect the second processing vessel to the second exhaust pipe.

19. The substrate processing apparatus of claim 18, wherein each of the first and second connection members is inclined upward at a preset angle in the same direction as the rotation direction.

20. The substrate processing apparatus of claim 18, wherein the first exhaust pipe and the second exhaust pipe have an integrated shape that curves in the same direction as the rotation direction.