KR20220094884A - Apparatus for treating a subatrate and method for treating a substrate - Google Patents

Abstract

The present invention relates to a substrate processing apparatus that includes: a processing container having an inner space; a support unit for supporting and rotating the substrate within the inner space; a liquid supply unit for discharging a processing liquid or a cleaning liquid onto the substrate placed on the support unit; a discharge pipe connected to the processing container and discharging the processing liquid or the cleaning liquid; a vibration generating device provided in the discharge pipe and vibrating the discharge pipe.

Description

Substrate processing apparatus and substrate processing method

The present invention relates to an apparatus for processing a substrate, and more particularly, to a substrate processing apparatus and a substrate processing method for processing a substrate by supplying a processing fluid to the substrate.

In order to manufacture a semiconductor device, various processes such as cleaning, deposition, photography, etching, and ion implantation are performed. Among these processes, the photo process includes a coating process of forming a film by applying a photoresist such as a photoresist to the surface of the substrate, an exposure process of transferring a circuit pattern to a film formed on the substrate, and a substrate selectively in the exposed region or vice versa and a developing process of removing the film formed thereon.

1 is a cross-sectional view schematically illustrating a substrate processing apparatus for applying a processing liquid to a substrate. Referring to FIG. 1 , a substrate processing apparatus 1 includes a processing vessel 2 having an inner space, a support unit 3 supporting a substrate W in the inner space, and a substrate placed on the support unit 3 and rotated. It has a nozzle 4 for supplying the processing liquid to the upper surface of the W, and a discharge pipe 5 connected to the processing container 2 and discharging the processing liquid splashing from the rotating substrate W.

In the substrate processing process, a processing liquid having various viscosities and/or properties is used according to the pattern of the surface of the substrate W. Treatment liquids having different viscosities and/or properties are discharged through the same discharge pipe 5 . In this case, a sedimentation phenomenon occurs in the discharge pipe 5 due to low solubility between treatment liquids having different viscosities and/or properties, and draining is not easy. In severe cases, the discharge pipe 5 is clogged. .

At this time, even when a cleaning solution is used for cleaning the discharge pipe 5 , it takes a lot of time until the sediment is dissolved in the cleaning solution and the cleaning of the discharge pipe 5 is completed, thereby causing a decrease in productivity.

An object of the present invention is to provide a substrate processing apparatus and a substrate processing method having increased solubility between deposits in a discharge pipe.

Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method in which cleaning efficiency of a discharge pipe is increased.

Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method in which a cleaning time of a discharge pipe is reduced.

The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

The present invention provides an apparatus for processing a substrate.

A substrate processing apparatus includes: a processing vessel having an interior space; a support unit for supporting and rotating the substrate in the inner space; a liquid supply unit for discharging a processing liquid or a cleaning liquid onto the substrate placed on the support unit; a discharge pipe connected to the processing container and discharging the processing liquid or the cleaning liquid; and a vibration generating device provided in the discharge pipe and vibrating the discharge pipe.

The vibration generating device may include: a vibrator provided on an outer surface of the discharge pipe; a driver providing power to the vibrator to vibrate the vibrator; a controller for controlling the actuator, wherein the controller controls the actuator so that the vibrator is not vibrated while the processing liquid is supplied from the liquid supply unit, and while the cleaning liquid is supplied from the liquid supply unit The actuator may be controlled so that the vibrator vibrates.

The treatment solution may include a photo resist (PR), and the cleaning solution may include a thinner.

The treatment solution may include high-viscosity photoresists (PRs) having different viscosities.

In the discharge pipe, a precipitate may be generated due to a difference in solubility of the high-viscosity photoresist having different viscosities, and the vibration generating device may increase the solubility between the precipitate and the cleaning solution.

The vibration generating device may be provided to surround the outer surface of the discharge pipe, and the vibration generating device may be provided at an end of the discharge pipe.

The present invention discloses a method of processing a substrate.

A substrate processing method includes: a substrate processing step of processing a substrate by supplying a processing liquid thereon; and a substrate cleaning step of cleaning the substrate by supplying a cleaning liquid to the substrate, wherein while the cleaning liquid is supplied, a discharge pipe for discharging the processing liquid and the cleaning liquid to the outside is vibrated.

The treatment solution may include a photoresist (PR), and the cleaning solution may include a thinner.

The photoresist may generate a precipitate while flowing through the discharge pipe, and the solubility between the precipitate and the cleaning solution may be increased by vibration of the discharge pipe.

Advantageous Effects of Invention According to the present invention, it is possible to provide a substrate processing apparatus and a substrate processing method having increased solubility between deposits in a discharge pipe.

Further, according to the present invention, it is possible to provide a substrate processing apparatus and a substrate processing method in which the cleaning efficiency of the discharge pipe is increased.

Further, according to the present invention, it is possible to provide a substrate processing apparatus and a substrate processing method in which the cleaning time of the discharge pipe is reduced.

Effects of the present invention are not limited to the above-described effects, and effects not mentioned will be clearly understood by those of ordinary skill in the art to which the present invention belongs from the present specification and accompanying drawings.

1 is a cross-sectional view showing a substrate processing apparatus having a general structure for processing a liquid while rotating a substrate.
2 is a perspective view schematically illustrating a substrate processing apparatus according to an embodiment of the present invention.
3 is a cross-sectional view of the substrate processing apparatus showing the application block or the developing block of FIG. 2 .
4 is a plan view of the substrate processing apparatus of FIG. 2 .
FIG. 5 is a plan view schematically illustrating the transport robot of FIG. 4 .
6 is a plan view schematically illustrating an example of the thermal treatment chamber of FIG. 4 .
7 is a front view of the thermal treatment chamber of FIG. 4 ;
8 is a cross-sectional view schematically illustrating a structure of a substrate processing apparatus for processing a substrate by supplying a liquid to a rotating substrate according to an embodiment of the present invention.
9 is a view showing a state in which the sediment is accumulated inside the discharge pipe according to the present invention.
10 is a diagram schematically illustrating a process of washing the sediment while the washing liquid flows through the discharge pipe of FIG. 9 .
11 is a diagram schematically illustrating a cleaning process by applying vibration to the discharge pipe of FIG. 9 .

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily implement them. However, the present invention may be implemented in several different forms and is not limited to the embodiments described herein. In addition, in describing a preferred embodiment of the present invention in detail, if it is determined that a detailed description of a related well-known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. In addition, the same reference numerals are used throughout the drawings for parts having similar functions and functions.

"Including" a certain component means that other components may be further included, rather than excluding other components, unless otherwise stated. Specifically, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification is present, and includes one or more other features or It should be understood that the existence or addition of numbers, steps, operations, components, parts, or combinations thereof does not preclude the possibility of addition.

The singular expression includes the plural expression unless the context clearly dictates otherwise. In addition, shapes and sizes of elements in the drawings may be exaggerated for clearer description.

The term “and/or” includes any one and all combinations of one or more of those listed items. In addition, in the present specification, “connected” means not only when member A and member B are directly connected, but also when member A and member B are indirectly connected by interposing member C between member A and member B. do.

Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more completely explain the present invention to those of ordinary skill in the art. Accordingly, the shapes of elements in the drawings are exaggerated to emphasize a clearer description.

A controller (not shown) may control overall operations of the substrate processing apparatus. The controller (not shown) may include a central processing unit (CPU), read only memory (ROM), and random access memory (RAM). The CPU executes desired processing, such as liquid processing and drying processing, which will be described later, according to various recipes stored in these storage areas. In the recipe, process time, process pressure, press temperature, various gas flow rates, etc., which are control information of the device for process conditions, are input. In addition, recipes indicating these programs and processing conditions may be stored in a hard disk or semiconductor memory. In addition, the recipe may be set at a predetermined position in the storage area while being accommodated in a portable computer-readable storage medium such as a CD-ROM or DVD.

The apparatus of this embodiment can be used to perform photo processing on a circular substrate. In particular, the apparatus of this embodiment may be connected to an exposure apparatus and used to perform a coating process and a developing process on a substrate. However, the technical spirit of the present invention is not limited thereto, and may be used in various types of processes for supplying a treatment solution to the substrate while rotating the substrate. Hereinafter, a case in which a wafer is used as a substrate will be described as an example.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 2 to 11 .

2 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention, FIG. 3 is a cross-sectional view of the substrate processing apparatus showing the application block or the developing block of FIG. 2 , and FIG. 4 is the substrate processing apparatus of FIG. 2 is a plan view of

2 to 4 , the substrate processing apparatus 10 according to an embodiment of the present invention includes an index module 100 , a processing module 300 , and an interface module 500 . ) is included. According to an embodiment, the index module 100 , the processing module 300 , and the interface module 500 are sequentially arranged in a line. Hereinafter, the direction in which the index module 100 , the processing module 300 , and the interface module 500 are arranged is referred to as a first direction 12 , and a direction perpendicular to the first direction 12 when viewed from the top A second direction 14 is referred to, and a direction perpendicular to both the first direction 12 and the second direction 14 is defined as the third direction 16 .

The index module 100 transfers the substrate W from the container F in which the substrate W is accommodated to the processing module 300 , and accommodates the processed substrate W in the container F. The longitudinal direction of the index module 100 is provided in the second direction 14 . The index module 100 has a load port 110 and an index frame 130 . With respect to the index frame 130 , the load port 110 is located on the opposite side of the processing module 300 . The container F in which the substrates W are accommodated is placed on the load port 110 . A plurality of load ports 110 may be provided, and the plurality of load ports 110 may be disposed along the second direction 14 .

As the container (F), a closed container (F) such as a Front Open Unified Pod (FOUP) may be used. The vessel F may be placed in the load port 110 by a transport means (not shown) or an operator, such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle. can

An index robot 132 is provided inside the index frame 130 . A guide rail 136 having a longitudinal direction in the second direction 14 is provided in the index frame 130 , and the index robot 132 may be provided to be movable on the guide rail 136 . The index robot 132 includes a hand on which the substrate W is placed, and the hand is provided movably in forward and backward movement, rotation about the third direction 16 , and movement along the third direction 16 . can

The processing module 300 may perform a coating process and a developing process on the substrate W. The processing module 300 may receive the substrate W accommodated in the container F and perform a substrate processing process. The processing module 300 has an application block 300a and a developing block 300b. The application block 300a performs a coating process on the substrate W, and the developing block 300b performs a development process on the substrate W. A plurality of application blocks 300a are provided, and they are provided to be stacked on each other. A plurality of developing blocks 300b are provided, and the developing blocks 300b are provided to be stacked on each other. According to the embodiment of FIG. 4 , two application blocks 300a are provided, and two development blocks 300b are provided. The application blocks 300a may be disposed below the developing blocks 300b. According to an example, the two application blocks 300a may perform the same process as each other, and may be provided in the same structure. In addition, the two developing blocks 300b may perform the same process as each other, and may be provided in the same structure.

Referring to FIG. 4 , the application block 300a includes a heat treatment chamber 320 , a transfer chamber 350 , a liquid treatment chamber 360 , and buffer chambers 312 and 316 . The heat treatment chamber 320 performs a heat treatment process on the substrate W. The heat treatment process may include a cooling process and a heating process. The liquid processing chamber 360 supplies a liquid on the substrate W to form a liquid film. The liquid film may be a photoresist film or an antireflection film. The transfer chamber 350 transfers the substrate W between the thermal processing chamber 320 and the liquid processing chamber 360 in the application block 300a.

The transfer chamber 350 is provided so that its longitudinal direction is parallel to the first direction 12 . The transfer chamber 350 is provided with a transfer robot 352 . The transfer robot 352 transfers substrates between the thermal processing chamber 320 , the liquid processing chamber 360 , and the buffer chambers 312 and 316 . According to an example, the transfer robot 352 has a hand on which the substrate W is placed, and the hand moves forward and backward, rotates about the third direction 16 , and moves along the third direction 16 . possible to be provided. A guide rail 356 having a longitudinal direction parallel to the first direction 12 is provided in the transfer chamber 350 , and the transfer robot 352 may be provided movably on the guide rail 356 . .

FIG. 5 is a plan view schematically illustrating the transport robot of FIG. 4 . Referring to FIG. 4 , the hand 352 has a base 352a and a support protrusion 352b. The base 352a may have an annular ring shape in which a portion of the circumference is bent. The base 352a has an inner diameter greater than the diameter of the substrate W. As shown in FIG. The support protrusion 352b extends inwardly from the base 352a. A plurality of support protrusions 352b are provided, and support an edge region of the substrate W. According to an example, four support protrusions 352b may be provided at equal intervals.

A plurality of heat treatment chambers 320 are provided. The heat treatment chambers 320 are arranged in a row along the first direction 12 . The heat treatment chambers 320 are located at one side of the transfer chamber 350 .

6 is a plan view schematically illustrating an example of the thermal processing chamber of FIG. 4 , and FIG. 7 is a front view of the thermal processing chamber of FIG. 4 .

6 and 7 , the heat treatment chamber 320 includes a housing 321 , a cooling unit 322 , a heating unit 323 , and a conveying plate 324 .

The housing 321 is provided in the shape of a substantially rectangular parallelepiped. An inlet (not shown) through which the substrate W enters and exits is formed on the sidewall of the housing 321 . The inlet may remain open. Optionally, a door (not shown) may be provided to open and close the inlet. A cooling unit 322 , a heating unit 323 , and a conveying plate 324 are provided in the housing 321 . The cooling unit 322 and the heating unit 323 are provided side by side along the second direction 14 . According to one example, the cooling unit 322 may be located closer to the transfer chamber 350 compared to the heating unit 323 .

The cooling unit 322 has a cooling plate 322a. The cooling plate 322a may have a generally circular shape when viewed from above. The cooling plate 322a is provided with a cooling member 322b. According to an example, the cooling member 322b is formed inside the cooling plate 322a, and may be provided as a flow path through which the cooling fluid flows.

The heating unit 323 has a heating plate 323a, a cover 323c, and a heater 323b. The heating plate 323a has a generally circular shape when viewed from above. The heating plate 323a has a larger diameter than the substrate W. A heater 323b is installed on the heating plate 323a. The heater 323b may be provided as a heating resistor to which current is applied. The heating plate 323a is provided with lift pins 323e drivable in the vertical direction along the third direction 16 . The lift pin 323e receives the substrate W from the transfer means outside the heating unit 323 and puts it down on the heating plate 323a or lifts the substrate W from the heating plate 323a to the heating unit 323 Handed over to an external transport means. According to an example, three lift pins 323e may be provided. The cover 323c has an open lower portion therein. The cover 323c is positioned above the heating plate 323a and is moved in the vertical direction by the actuator 323d. The cover 323c is moved so that the space formed by the cover 323c and the heating plate 323a is provided as a heating space for heating the substrate W. As shown in FIG.

The conveying plate 324 is provided in a substantially disk shape, and has a diameter corresponding to that of the substrate W. As shown in FIG. A notch 324b is formed at an edge of the conveying plate 324 . The notch 324b may have a shape corresponding to the protrusion 352b formed on the hand of the transport robot 352 described above. In addition, the notches 324b are provided in a number corresponding to the protrusions 352b formed on the hand, and are formed at positions corresponding to the protrusions 352b. When the upper and lower positions of the hand and the carrier plate 324 are changed from a position where the hand and the carrier plate 324 are vertically aligned, the substrate W is transferred between the hand 354 and the carrier plate 324 . The carrying plate 324 is mounted on the guide rail 324d and may be moved along the guide rail 324d by the driver 324c. A plurality of slit-shaped guide grooves 324a are provided in the carrying plate 324 . The guide groove 324a extends from the end of the carrying plate 324 to the inside of the carrying plate 324 . The length direction of the guide grooves 324a is provided along the second direction 14 , and the guide grooves 324a are spaced apart from each other along the first direction 12 . The guide groove 324a prevents the transfer plate 324 and the lift pins 323e from interfering with each other when the substrate W is transferred between the transfer plate 324 and the heating unit 323 .

The substrate W is cooled while the transport plate 324 on which the substrate W is placed is in contact with the cooling plate 322a. The transfer plate 324 is made of a material having high thermal conductivity so that heat transfer between the cooling plate 322a and the substrate W is well achieved. According to an example, the carrying plate 324 may be provided with a metal material.

A heating unit 323 provided in some of the heat treatment chambers 320 may supply a gas while heating the substrate W to improve the adhesion rate of the photoresist to the substrate W. According to an example, the gas may be a hexamethyldisilane (HMDS, hexamethyldisilane) gas.

A plurality of liquid processing chambers 360 are provided. Some of the liquid processing chambers 360 may be provided to be stacked on each other. The liquid processing chambers 360 are disposed at one side of the transfer chamber 350 . The liquid processing chambers 360 are arranged side by side along the first direction 12 . Some of the liquid processing chambers 360 are provided adjacent to the index module 100 . Hereinafter, these liquid treatment chambers 360 will be referred to as front liquid treating chambers 362 (front liquid treating chambers). Another part of the liquid processing chambers 360 is provided at a position adjacent to the interface module 500 . Hereinafter, these liquid processing chambers 360 are referred to as rear heat treating chambers 364 (rear heat treating chambers).

The front stage liquid processing chamber 362 applies the first liquid on the substrate W, and the rear stage liquid processing chamber 364 applies the second liquid on the substrate W. The first liquid and the second liquid may be different types of liquid. According to an embodiment, the first liquid is an anti-reflection film, and the second liquid is a photoresist. The photoresist may be applied on the substrate W on which the anti-reflection film is applied. Optionally, the first liquid may be a photoresist, and the second liquid may be an anti-reflection film. In this case, the anti-reflection film may be applied on the substrate W on which the photoresist is applied. Optionally, the first liquid and the second liquid are the same type of liquid, and they may both be photoresist.

Hereinafter, a structure of a substrate processing apparatus for processing a substrate by supplying a processing liquid onto a rotating substrate among the process chambers of the present invention will be described in detail. Hereinafter, a case in which the substrate processing apparatus is an apparatus for applying a photoresist will be described as an example. However, the substrate processing apparatus may be an apparatus for forming a film such as a protective film or an antireflection film on the rotating substrate W. In addition, optionally, the substrate processing apparatus may be an apparatus for supplying a processing liquid such as a developer to the substrate W.

8 is a cross-sectional view schematically illustrating a structure of a substrate processing apparatus for processing a substrate by supplying a liquid to a rotating substrate according to an embodiment of the present invention.

Referring to FIG. 8 , the substrate processing apparatus includes a housing 1100 , a processing container 1200 , a substrate support unit 1400 , and a liquid supply unit 1600 .

The housing 1100 is provided in a rectangular cylindrical shape having an internal space 1120 . An opening 1102 is formed at one side of the housing 1100 . The opening 1102 functions as a passage through which the substrate W is carried in and out. A door (not shown) is installed in the opening 1100 , and the door opens and closes the opening.

A processing container 1200 is provided in the inner space 1120 of the housing 1100 . The processing vessel 1200 has an interior space 1280 . The inner space 1280 is provided with an open top.

The support unit 1400 supports the substrate W in the inner space 1280 of the processing container 1200 . The support unit 1400 includes a support plate 1420 , a rotation shaft 1440 , and a driver 1460 . The support plate 1420 is provided with a circular upper surface. The support plate 1420 has a smaller diameter than the substrate W. The support plate 1420 is provided to support the substrate W by vacuum pressure. Optionally, the support plate 1420 may have a mechanical clamping structure for supporting the substrate W. A rotation shaft 1440 is coupled to the center of the bottom surface of the support plate 1420 , and a actuator 1460 providing rotational force to the rotation shaft 1440 is provided to the rotation shaft 1440 . The driver 1460 may be a motor.

The liquid supply unit 1600 supplies a processing liquid on the substrate W. The treatment liquid may be a coating liquid such as a photoresist. The treatment solution may be provided as a captive resist having various viscosities. For example, the treatment solution may be provided as a photoresist having a high viscosity. Alternatively, the treatment solution may be provided with a photoresist having a high viscosity and a photoresist having a medium viscosity. The liquid supply unit 1600 includes a nozzle 1620 , a nozzle moving member 1640 , and a liquid supply source (not shown). One or a plurality of nozzles 1620 are provided, and the processing liquid is discharged to the substrate (W). The nozzle 1620 is supported by the nozzle moving member 1640 . The nozzle moving member 1640 moves the nozzle 1620 between the process position and the standby position. In the process position, the nozzle 1620 supplies the processing liquid to the substrate W placed on the support plate 1420 , and the nozzle 1620 that has finished supplying the processing liquid waits in the standby position. In the standby position, the nozzle 1620 waits at a home port (not shown), and the home port is located outside the processing vessel 1200 in the housing 1100 .

A fan filter unit 1260 for supplying a descending airflow into the inner space is disposed on the upper wall of the housing 1100 . The fan filter unit 1260 includes a fan for introducing external air into the internal space and a filter for filtering external air.

From the housing 1100 to the outside of the processing container 1200 , an outer exhaust pipe 1140 for exhausting an airflow supplied to the space between the processing container 1200 and the housing 1100 and an internal space of the processing container 1200 are provided. An inner exhaust pipe 1160 for exhausting the supplied air flow is connected. A pressure adjusting member (not shown) is installed in the outer exhaust pipe 1140 and the inner exhaust pipe 1160 to forcibly suck in an airflow in the exhaust space. The pressure regulating member may be a pump.

The processing vessel 1200 has an outer cup 1220 and an inner cup 1240 .

The outer cup 1220 is provided to surround the support unit 1400 and the substrate W supported thereon. The outer cup 1220 has a bottom wall 1222 , a side wall 1224 , and a top wall 1226 . The inside of the outer cup 1220 is provided as the above-described inner space 1280 .

The bottom wall 1222 is provided in a circular shape and has an opening in the center. A side wall 1224 extends upwardly from an outer end of the bottom wall 1222 . The side wall 1224 is provided in a ring shape and is provided perpendicular to the bottom wall 1222 . According to an example, the sidewall 1224 extends to the same height as the upper surface of the support plate 1420 or to a height slightly lower than the upper surface of the support plate 1420 . The upper wall 1226 has a ring shape and has an opening in the center. The upper wall 1226 is provided inclined upward from the top of the side wall 1224 toward the central axis of the outer cup 1220 .

The inner cup 1240 is located inside the outer cup 1220 . The inner cup 1240 has an inner wall 1242 , an outer wall 1244 , and an upper wall 1246 . The inner wall 1242 has a through hole penetrating in the vertical direction. The inner wall 1242 is disposed to surround the actuator 1460 . The inner wall 1242 minimizes exposure of the actuator 1460 to airflow within the processing space. The rotation shaft 1440 and/or the actuator 1460 of the support unit 1400 extends in the vertical direction through the through hole. The lower end of the inner wall 1242 may be located on the bottom wall 1222 of the outer cup 1220 . The outer wall 1244 is disposed to be spaced apart from the inner wall 1242 and surround the inner wall 1242 . The outer wall 1244 is positioned spaced apart from the sidewall 1224 of the outer cup 1220 . The inner wall 1242 is disposed to be spaced upwardly from the bottom wall 1222 of the outer cup 1220 . The upper wall 1246 connects the upper end of the outer wall 1244 and the upper end of the inner wall 1242 . The upper wall 1246 has a ring shape and is disposed to surround the support plate 1420 . According to an example, the upper wall 1246 has an upward convex shape. The upper wall 1246 has an outer upper wall 1246a that slopes upwardly from the top of the outer wall 1244 toward the axis of rotation 1440 , and an inner upper wall 1246b that slopes downward from there to the top of the inner wall 1242 . The support plate 1420 may be located in a space surrounded by the inner upper wall 1246b. According to an example, the apex of the upper wall 1226 may be located outside the support plate 1420 , and located inside the end of the substrate W supported by the support unit 1400 .

A gas-liquid separation plate 1230 may be provided in the inner space 1280 of the processing vessel 1200 . The gas-liquid separation plate 1230 may be provided to extend upwardly from the bottom wall 1222 of the outer cup 1220 . The gas-liquid separator 1230 may be provided in a ring shape. The gas-liquid separator 1230 may be positioned between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240 when viewed from the top. Optionally, the gas-liquid separation plate 1230 may be positioned to overlap the outer wall 1244 of the inner cup 1240 when viewed from above, or may be positioned inside the outer wall 1244 of the inner cup 1240 . According to an example, the upper end of the gas-liquid separation plate 1230 may be located at a lower position than the lower end of the outer wall 1244 of the inner cup 1240 .

An inner exhaust pipe 1160 is connected to the bottom wall 1222 of the outer cup 1220 . The inner exhaust pipe 1160 exhausts the airflow flowing into the inner space 1280 of the processing container 1200 . The inner exhaust pipe 1160 is located closer to the inner cup 1240 than the outer cup 1220 . When viewed from above, the inner exhaust pipe 1160 is provided to overlap the inner cup 1240 .

A discharge pipe 1250 for discharging the treatment liquid is connected to the bottom wall 1222 of the outer cup 1220 . The discharge pipe 1250 discharges the processing liquid introduced between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240 to the outside of the processing container 1200 . According to an example, the space between the sidewall 1224 of the outer cup 1220 and the gas-liquid separation plate 1230 is provided as a discharge space for discharging the treatment liquid, and the discharge pipe 1250 is configured to discharge the treatment liquid from the discharge space. provided The airflow flowing into the space between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240 is the side wall 1224 and the bottom wall 1222 of the outer cup 1220, and the gas-liquid separator plate ( It is introduced into the space surrounded by the 1230 and is exhausted through the inner exhaust pipe 1160 . In this process, the processing liquid contained in the airflow is discharged to the outside of the processing vessel 1200 through the discharge pipe 1250 in the discharge space, and the airflow is exhausted by the exhaust unit 1900 of the processing vessel 1200 .

One or a plurality of discharge pipes 1250 may be provided. When a plurality of discharge pipes 1250 are provided, a plurality of discharge pipes 1250 may be provided along the circumferential direction of the inner cup 1240 . The discharge pipe 1250 has a discharge space 1252 through which a treatment liquid or a cleaning liquid 82 flows therein. The discharge space 1252 of the discharge pipe 1250 is formed surrounded by the inner surface of the discharge pipe 1250 . Treatment liquids having different viscosities flow in the inner space of the discharge pipe 1250 . For example, different high-viscosity photoresists may flow in the inner space of the discharge pipe 1250 , or high-viscosity photoresists and medium-viscosity photoresists may flow. At this time, a precipitate P is generated due to the low solubility between the photoresists having different viscosities. The sediment P is adhered to the inner surface of the discharge pipe 1250 or floats in the discharge space 1252 of the discharge pipe 1250 and prevents the discharge of the treatment liquid.

9 is a view showing a state in which the sediment is accumulated inside the discharge pipe according to the present invention, and FIG. It is a diagram schematically illustrating the cleaning process by applying vibration.

The discharge pipe 1250 is provided with a vibration generating device 1800 . The vibration generating device 1800 includes a vibrator 1820 installed in the discharge pipe 1250 . The vibrator 1820 is installed on the outer surface of the discharge pipe 1250 . The vibrator 1820 may be provided in a cylindrical shape. In this case, the vibrator 1820 may be provided to surround the inner surface of the discharge pipe 1250 . The vibrator 1820 may be provided at an end of the discharge pipe 1250 . This is because the photoresists of different viscosities flowing along the longitudinal direction of the discharge pipe 1250 generate more deposits as they move away from the processing vessel 1200 than at a position close to the processing vessel 1200 in the discharge pipe 1250. Because. The vibrator 1820 is installed in the discharge pipe 1250 to generate vibration. A driver 1840 for providing power is connected to the vibrator 1820 . The driver 1840 may include a motor. When the vibrator 1820 receives power from the actuator 1840 , it generates vibration and applies the vibration to the discharge pipe 1250 .

The controller 1860 controls the driver 1840 . The controller 1860 controls the vibrator 1820 to vibrate by operating the actuator 1840 when the discharge pipe 1250 is cleaned. For example, the controller 1860 operates the driver 1840 when the cleaning liquid 82 is supplied. The cleaning solution 82 may include thinner. That is, the controller 1860 controls the actuator 1840 so that the vibrator 1820 is not driven during the treatment process when the treatment liquid is supplied, and the vibrator 1820 is driven during the cleaning process when the cleaning liquid 82 is supplied. The driver 1840 is controlled.

9 to 11 , the cleaning solution 82 cleans the sediment P deposited on the inner surface of the discharge pipe 1250 and the discharge space 1252 . When the cleaning liquid 82 is supplied to clean the sediment P of the discharge pipe 1250, the controller 1860 operates the actuator 1840, and the vibrator 1820 receives power from the actuator 1840 and vibrates ( V) is applied to the discharge pipe 1250 . As the discharge pipe 1250 vibrates, the number of contact/collision between the washing liquid 82 flowing inside the discharge pipe 1250 and the sediment P increases. That is, the vibration energy according to the vibration of the vibrator 1820 increases the kinetic energy of the cleaning liquid 82 and the sediment P, and the number of contact/collision between the cleaning liquid 82 and the sediment P due to the activated movement is increased. is increased As a result, the solubility between the cleaning liquid 82 and the sediment P is increased, so that the cleaning efficiency of the discharge pipe 1250 is increased and the cleaning time is reduced.

On the other hand, in the embodiment of FIG. 8 , the vibrator 1820 is illustrated and described as being provided on the outer surface of the discharge pipe 1250 , but the present invention is not limited thereto and the vibrator 1820 is provided on the inner surface of the discharge pipe 1250 . can

The substrate processing apparatus 1000 includes a lifting unit 1700 . The lifting unit 1700 adjusts the relative height between the processing vessel 1200 and the support unit 1400 . The lifting unit 1700 moves the processing container 1200 in the vertical direction. Specifically, the lifting unit 1700 may adjust the relative height of the support plate 1420 and the outer cup 1220 . According to an example, the elevating unit 1700 may elevate the outer cup 1220 in the vertical direction. For example, when the substrate W is loaded on the support plate 1420 or the substrate W is unloaded from the support plate 1420 , the support plate to prevent the transfer member carrying the substrate W from interfering with the outer cup 1220 . 1420 is located at a height higher than the top of the outer cup 1220 . In addition, during the process, the support plate 1420 is positioned at a lower height than the upper end of the outer cup 1220 so that the substrate W is positioned in the processing space.

The lifting unit 1700 includes a bracket 1720 , a moving shaft 1740 , and a driver 1760 . The bracket 1720 connects the processing container 1200 and the moving shaft 1740 . The bracket 1720 is fixed to the outer cup 1220 of the processing vessel 1200 . The bracket 1720 is fixedly installed on the side wall 1224 of the outer cup 1220 . The moving shaft 1740 is provided so that its longitudinal direction is in the up-down direction. The upper end of the moving shaft 1740 is fixedly coupled to the bracket 1720 . The moving shaft 1740 may receive power from the actuator 1760 . The moving shaft 1740 is moved up and down from the actuator 1760 , and the processing container 1200 is moved up and down together with the moving shaft 1740 . The actuator 1760 provides power to the moving shaft 1740 . The actuator 1760 provides power so that the moving shaft 1740 reciprocates linearly or elevates. For example, the actuator 1760 may be a cylinder or a motor.

4 and 5 again, the front stage liquid processing chamber 362 applies the first liquid on the substrate W, and the rear stage liquid processing chamber 364 applies the second liquid on the substrate W. do. The first liquid and the second liquid may be different types of liquid. According to an embodiment, the first liquid is an anti-reflection film, and the second liquid is a photoresist. The photoresist may be applied on the substrate W on which the anti-reflection film is applied. Optionally, the first liquid may be a photoresist, and the second liquid may be an anti-reflection film. In this case, the anti-reflection film may be applied on the substrate W on which the photoresist is applied. Optionally, the first liquid and the second liquid are the same type of liquid, and they may both be photoresist.

The developing block 300b has the same structure as the application block 300a, and a liquid processing chamber provided in the developing block 300b supplies a developer on the substrate.

The interface module 500 connects the processing module 300 to the external exposure apparatus 700 . The interface module 500 includes an interface frame 510 , an additional process chamber 520 , an interface buffer 530 , and an interface robot 550 .

A fan filter unit for forming a descending airflow therein may be provided at an upper end of the interface frame 510 . The additional process chamber 520 , the interface buffer 530 , and the interface robot 550 are disposed inside the interface frame 510 . The additional process chamber 520 may perform a predetermined additional process before the substrate W, which has been processed in the application block 300a, is loaded into the exposure apparatus 700 . Optionally, the additional process chamber 520 may perform a predetermined additional process before the substrate W, which has been processed in the exposure apparatus 700 , is loaded into the developing block 300b. According to one example, the additional process is an edge exposure process of exposing the edge region of the substrate W, a top surface cleaning process of cleaning the upper surface of the substrate W, or a bottom surface cleaning process of cleaning the lower surface of the substrate W can A plurality of additional process chambers 520 may be provided, and they may be provided to be stacked on each other. All of the additional process chambers 520 may be provided to perform the same process. Optionally, some of the additional process chambers 520 may be provided to perform different processes.

The interface buffer 530 provides a space in which the substrate W transferred between the application block 300a, the additional process chamber 520, the exposure apparatus 700, and the developing block 300b temporarily stays during the transfer. A plurality of interface buffers 530 may be provided, and the plurality of interface buffers 530 may be provided to be stacked on each other.

According to an example, the additional process chamber 520 may be disposed on one side of the transfer chamber 350 in the longitudinal direction of the extension line, and the interface buffer 530 may be disposed on the other side thereof.

The interface robot 550 transfers the substrate W between the application block 300a , the additional process chamber 520 , the exposure apparatus 700 , and the developing block 300b . The interface robot 550 may have a transfer hand that transfers the substrate W. The interface robot 550 may be provided as one or a plurality of robots. According to an example, the interface robot 550 has a first robot 552 and a second robot 554 . The first robot 552 transfers the substrate W between the application block 300a, the additional processing chamber 520, and the interface buffer 530, and the second robot 554 transfers the interface buffer 530 and the exposure apparatus. A substrate W may be transferred between 700 , and a second robot 4604 may be provided to transfer the substrate W between the interface buffer 530 and the developing block 300b.

The first robot 552 and the second robot 554 each include a transfer hand on which the substrate W is placed, the hand moves forward and backward, rotates about an axis parallel to the third direction 16, and It may be provided to be movable along the third direction 16 .

The above detailed description is illustrative of the present invention. In addition, the above description shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed herein, the scope equivalent to the written disclosure, and/or within the scope of skill or knowledge in the art. The above-described embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in specific application fields and uses of the present invention are possible. Accordingly, the detailed description of the present invention is not intended to limit the present invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

1250: discharge pipe
1252: exhaust space
1800: vibration generator
1820: vibrator
1840: actuator
1860: controller

Claims (9)

An apparatus for processing a substrate, comprising:
a processing vessel having an interior space;
a support unit for supporting and rotating the substrate in the inner space;
a liquid supply unit for discharging a processing liquid or a cleaning liquid onto the substrate placed on the support unit;
a discharge pipe connected to the processing container and discharging the processing liquid or the cleaning liquid;
and a vibration generating device provided on the discharge pipe and vibrating the discharge pipe. According to claim 1,
The vibration generating device,
a vibrator provided on the outer surface of the discharge pipe;
a driver providing power to the vibrator to vibrate the vibrator;
a controller for controlling the actuator;
The controller is
and controlling the actuator so that the vibrator is not vibrated while the processing liquid is supplied from the liquid supply unit, and controlling the driver so that the vibrator is vibrated while the cleaning liquid is supplied from the liquid supply unit. 3. The method of claim 2,
The treatment solution includes a photo resist (PR),
The cleaning liquid is a substrate processing apparatus including a thinner (Thinner). 4. The method of claim 3,
The treatment solution is
A substrate processing apparatus including a high-viscosity photoresist (PR) having different viscosities. 5. The method of claim 4,
In the discharge pipe, a precipitate is generated due to the difference in solubility of the high-viscosity photoresist having the different viscosities,
and the vibration generating device increases solubility between the deposit and the cleaning solution. 6. The method of claim 1 to 5,
The vibration generating device is provided to surround the outer surface of the discharge pipe,
The vibration generating device is a substrate processing apparatus provided at an end of the discharge pipe. A method of processing a substrate, comprising:
a substrate processing step of processing the substrate by supplying a processing liquid onto the substrate;
A substrate cleaning step of cleaning the substrate by supplying a cleaning solution on the substrate,
A substrate processing method of vibrating a discharge pipe for discharging the processing liquid and the cleaning liquid to the outside while the cleaning liquid is supplied. 8. The method of claim 7,
The treatment solution includes a photo resist (Photo Resis, PR),
The cleaning solution is a substrate processing method including a thinner (Thinner). 9. The method of claim 8,
The photoresist creates a precipitate while flowing through the discharge pipe,
A method for treating a substrate in which solubility between the sediment and the cleaning solution is increased by vibration of the discharge pipe.

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