JP2013207265A - Substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To separate multiple types of process liquids supplied to a substrate by type using one cup and reduce the contamination of the substrate.SOLUTION: A substrate processing apparatus includes: a spin chuck 4 horizontally holding a substrate W and rotating the substrate W around a rotation axis A1; a nozzle 5 supplying multiple types of process liquids to the substrate W; a cylindrical cup 6 that includes a cylindrical inner peripheral surface 6a enclosing the substrate W and multiple discharge ports 21 opening on the inner peripheral surface 6a; an airflow formation device that forms rotation airflow flowing in the same direction as a rotation direction D1 of the substrate W between the substrate W and the inner peripheral surface 6a of the cup 6; a cup cleaning nozzle 24 supplying pure water to the inner peripheral surface 6a of the cup 6; and a separation device 27 separating the multiple types of process liquids discharged to the multiple discharge ports 21 by type.

Description

  The present invention relates to a substrate processing apparatus for processing a substrate. Examples of substrates to be processed include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, and photomasks. Substrate, ceramic substrate, solar cell substrate and the like.

In the manufacturing process of a semiconductor device or a liquid crystal display device, a substrate processing apparatus for processing a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device is used.
A single-wafer type substrate processing apparatus described in Patent Document 1 includes a spin chuck that holds and rotates a substrate horizontally, a chemical nozzle that discharges a chemical toward the substrate, and a rinse that discharges a rinsing liquid toward the substrate. A liquid nozzle. The substrate processing apparatus further includes a plurality of cups surrounding the spin chuck, a lifting mechanism that lifts and lowers the plurality of cups independently, a blade member that forms a descending airflow in the cup, and an atmosphere in the cup. And an exhaust pipe exhausted from the bottom.

JP 2009-231710 A

  In the substrate processing apparatus described in Patent Document 1, in order to separate a plurality of types of processing liquids for each type, the cup facing the substrate is changed for each type of processing liquid supplied to the substrate. Therefore, a plurality of cups and a mechanism for moving the cup and the spin chuck relative to each other are required, and the cost of the substrate processing apparatus increases. A method of receiving a plurality of types of processing liquids with one cup is conceivable. However, in this method, different types of chemicals are mixed with each other unless the cups are sufficiently washed before the type of processing liquid supplied to the substrate is changed. Or particles may be generated. Further, in the configuration in which the processing liquid discharged around the substrate is received by the cup, a droplet of the processing liquid that has bounced back to the substrate side due to the collision with the cup may adhere to the substrate and be contaminated.

  Therefore, an object of the present invention is to provide a substrate processing apparatus that can separate a plurality of types of processing liquids supplied to a substrate for each type with a single cup and reduce contamination of the substrate.

  In order to achieve the above-mentioned object, the invention according to claim 1 is characterized in that the substrate holding means (4) for horizontally holding the substrate (W) and the substrate holding means around the vertical rotation axis (A1) passing through the substrate. A substrate rotating means (10) for rotating the substrate being processed, a processing liquid supply means (5) for supplying a plurality of types of processing liquids to the substrate held by the substrate holding means, and a substrate holding means. A cylindrical inner peripheral surface (6a) that surrounds the substrate, and a plurality of discharge ports (21) that open on the inner peripheral surface, and a plurality of types of processing liquids discharged around the substrate A cylindrical cup (6) that is received by the peripheral surface and discharges a plurality of types of processing liquid discharged around the substrate to the plurality of discharge ports, and the substrate and the cup held by the substrate holding means Direction of rotation of the substrate (D ) And a cup cleaning unit (5d) for supplying pure water to the inner peripheral surface of the cup. 24) and separation means (27, 227) for separating the plurality of types of processing liquids discharged to the plurality of discharge ports for each type of substrate processing apparatus (1).

  According to this configuration, the substrate rotating unit rotates the substrate held horizontally by the substrate holding unit around a vertical rotation axis passing through the substrate. The processing liquid supply means supplies a plurality of types of processing liquids to the rotating substrate. The plurality of types of processing liquids discharged around the substrate are received by the inner peripheral surface of the cup surrounding the substrate. Since the rotating airflow that flows in the same direction as the rotation direction of the substrate between the substrate and the inner peripheral surface of the cup is formed by the airflow forming means, the treatment liquid adhering to the inner peripheral surface of the cup And flows in the same direction as the rotation direction of the substrate (the circumferential direction of the cup) along the inner peripheral surface of the cup. Therefore, the processing liquid received by the cup spreads over a wide area on the inner peripheral surface of the cup. And the process liquid which moves to the circumferential direction of a cup is discharged | emitted by the several discharge port opened on the internal peripheral surface of a cup. The plurality of types of treatment liquids discharged to the plurality of discharge ports are separated for each type by the separation means.

  Similar to the treatment liquid, the pure water supplied from the cup cleaning means to the inner peripheral surface of the cup is pushed by the rotating airflow and moves in the cup circumferential direction along the inner peripheral surface of the cup. Therefore, the pure water supplied to the inner peripheral surface of the cup spreads over a wide area on the inner peripheral surface of the cup. And the pure water which moves to the circumferential direction of a cup is discharged | emitted by several discharge port. In this way, the pure water supplied from the cup cleaning means to the inner peripheral surface of the cup spreads over a wide area on the inner peripheral surface of the cup, so that the treatment liquid and particles adhering to the inner peripheral surface of the cup are removed by pure water. It can be washed away reliably. Therefore, the residual amount of the processing liquid in the cup can be extremely reduced. Therefore, even when a plurality of types of processing liquids are received by a common cup, mixing of different types of processing liquids (for example, chemical liquids) can be suppressed or prevented. Furthermore, since the traveling direction of the processing liquid scattered toward the inner peripheral surface of the cup is bent by the rotating airflow, the impact when the processing liquid droplet collides with the cup is weakened. Therefore, the amount of mist generated in the processing liquid can be reduced, and contamination of the substrate due to mist adhesion can be reduced. Thereby, the cleanliness of the substrate can be increased.

The invention according to claim 2 is the substrate processing apparatus according to claim 1, further comprising exhaust means (32) for exhausting the atmosphere in the cup from the plurality of exhaust ports.
According to this configuration, the atmosphere in the cup is guided to the plurality of outlets by the rotating airflow, and is discharged to the plurality of outlets by the suction force from the exhaust means. Therefore, the atmosphere in the cup is uniformly discharged in the circumferential direction of the cup, and the residual amount of mist and steam in the processing liquid in the cup is reduced. Therefore, contamination of the substrate due to adhesion of mist and vapor can be reduced. Thereby, the cleanliness of the substrate can be increased.

The invention according to claim 3 is the substrate processing apparatus according to claim 1 or 2, wherein the separating means includes a plurality of opening / closing means (28) capable of independently opening and closing the plurality of discharge ports. .
According to this configuration, the plurality of outlets are independently opened and closed by the plurality of opening and closing means. Therefore, the separating means can separate a plurality of types of processing liquids for each type by changing the open discharge port for each type of processing liquid supplied to the substrate. As a result, the plurality of types of processing liquids supplied to the substrate are separated for each type in the cup.

  According to a fourth aspect of the present invention, the separation means includes a plurality of input ports (256a) connected to the plurality of discharge ports, and a plurality of processing liquids discharged from the plurality of discharge ports to the input ports. 4. A drainage switching valve (256) having an output port (256 b) and capable of switching an output port connected to the input port among the plurality of output ports. 5. The substrate processing apparatus according to the item.

  According to this configuration, the plurality of discharge ports opened on the inner peripheral surface of the cup are connected to the input port of the drain switching valve, and the processing liquid supplied to the input port from the plurality of discharge ports is drained. It is discharged from one of the plurality of output ports of the switching valve. The output port connected to the input port is switched to one of a plurality of output ports. Therefore, the separation means can separate a plurality of types of treatment liquids for each type by switching the drainage switching valve. Thereby, the multiple types of processing liquids supplied to the substrate are separated for each type on the downstream side of the cup.

The invention according to claim 5 is any one of claims 1 to 4, wherein the cup cleaning means includes a pure water nozzle (5d) for discharging pure water toward the substrate held by the substrate holding means. The substrate processing apparatus according to one item.
According to this configuration, pure water discharged from the pure water nozzle is supplied to the substrate. Thereby, the processing liquid and particles adhering to the substrate are washed away. And the pure water discharged | emitted by the circumference | surroundings of a board | substrate is supplied to the internal peripheral surface of a cup. Thereby, the process liquid and particles adhering to the inner peripheral surface of the cup are washed away.

The invention described in claim 6 is the cup cleaning means according to any one of claims 1 to 5, wherein the cup cleaning means includes a cup cleaning nozzle (24) for discharging pure water toward the inner peripheral surface of the cup. This is a substrate processing apparatus.
According to this configuration, pure water is discharged from the cup cleaning nozzle toward the inner peripheral surface of the cup. Therefore, pure water is reliably supplied to the inner peripheral surface of the cup. Thereby, the process liquid and particles adhering to the inner peripheral surface of the cup are washed away.

The invention according to claim 7 is characterized in that the airflow forming means includes a blade (39) disposed inside the cup, a rotating body (38) rotatable together with the blade around a vertical axis, and the rotating body. The substrate processing apparatus according to claim 1, further comprising blade rotating means (10, 41 </ b> D, 41 </ b> E).
According to this configuration, when the blade rotating means rotates the rotating body around the vertical axis, the blade disposed inside the cup rotates together with the rotating body, and the rotation direction of the substrate is determined between the substrate and the cup. A rotating airflow flowing in the same direction is formed. Thereby, a process liquid and a pure water can be diffused in the wide range of the internal peripheral surface of a cup.

The invention according to claim 8 is the substrate processing apparatus according to claim 7, wherein the blade has a vertically symmetrical cross section.
According to this configuration, since the cross section of the blade (the cross section orthogonal to the rotational radius direction) is vertically symmetric, the generation of the updraft and the downdraft is suppressed or prevented. Therefore, a stronger rotating airflow is formed than when the blades have a vertically asymmetric cross section. Thereby, a process liquid and a pure water can be diffused in the wide range of the internal peripheral surface of a cup.

The invention according to claim 9 is the substrate processing apparatus according to claim 7 or 8, wherein the blade rotating means is the substrate rotating means.
According to this configuration, since the drive source that rotates the substrate and the drive source that rotates the blades are common, an increase in the number of components can be suppressed.
The invention according to claim 10 is the substrate processing apparatus according to claim 7 or 8, wherein the blade rotating means is independent of the substrate rotating means.

According to this configuration, the blade is rotationally driven by a drive source (blade rotation unit) different from the drive source (substrate rotation unit) that rotates the substrate. Therefore, the blade rotating means can form a rotating airflow independently of the rotation of the substrate.
The invention according to claim 11 is characterized in that the airflow forming means includes gas discharge means (36) for discharging gas in the tangential direction of the inner peripheral surface of the cup toward the downstream side in the rotation direction of the substrate. Item 11. The substrate processing apparatus according to any one of Items 1 to 10.

  According to this configuration, the gas discharge means discharges gas in the tangential direction of the inner peripheral surface of the cup toward the downstream side in the rotation direction of the substrate. Therefore, the gas discharged from the gas discharge means is guided in the circumferential direction of the cup by the inner peripheral surface of the cup, and flows in the same direction as the rotation direction of the substrate along the inner peripheral surface of the cup. Thereby, a rotating airflow that flows in the same direction as the rotation direction of the substrate is formed between the substrate and the cup.

According to a twelfth aspect of the present invention, the airflow forming means is a tangential direction of the inner peripheral surface of the cup from a suction port (49) opening on the inner peripheral surface of the cup toward the downstream side in the rotation direction of the substrate. It is a substrate processing apparatus as described in any one of Claims 1-11 containing the gas suction means (37) which attracts | sucks gas to.
According to this structure, the gas in a cup is attracted | sucked by the suction opening opened on the internal peripheral surface of a cup. The suction port sucks gas in the tangential direction of the inner peripheral surface of the cup. Therefore, the gas in the cup flows in the circumferential direction of the cup along the inner circumferential surface of the cup while being guided in the circumferential direction of the cup by the inner circumferential surface of the cup. Further, the suction port sucks gas in a direction extending along a tangent line of the inner peripheral surface of the cup toward the downstream side in the rotation direction of the substrate. Thereby, a rotating airflow that flows in the same direction as the rotation direction of the substrate is formed between the substrate and the cup.

  In this section, alphanumeric characters in parentheses represent reference numerals of corresponding components in the embodiments described later, but the scope of the claims is not limited by these reference numerals.

It is the schematic diagram which looked at the inside of the processing unit with which the substrate processing apparatus concerning a 1st embodiment of the present invention was equipped from the horizontal direction. It is a typical top view of a spin chuck and a cup. It is the schematic diagram which looked at the cup from the horizontal direction. It is a typical sectional view of a guide. It is a typical sectional view of a guide. It is a schematic diagram for demonstrating the discharge path | route of the process liquid discharged | emitted from the board | substrate. It is a schematic diagram of an airflow formation apparatus. It is a schematic diagram of an airflow formation apparatus. It is a schematic diagram of an airflow formation apparatus. It is a schematic diagram of an airflow formation apparatus. It is a schematic diagram of an airflow formation apparatus. It is a schematic diagram of an airflow formation apparatus. It is a schematic diagram of an airflow formation apparatus. It is a typical top view for demonstrating the structure of a blade | wing. It is a typical longitudinal cross-sectional view for demonstrating the structure of a blade | wing. It is a typical top view for demonstrating the structure of a blade | wing. It is a figure for demonstrating an example of the process of the board | substrate performed by the process unit. It is a schematic diagram for demonstrating the discharge path | route of the process liquid which concerns on 2nd Embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic view of the inside of a processing unit 2 provided in the substrate processing apparatus 1 according to the first embodiment of the present invention as seen from the horizontal direction. FIG. 2 is a schematic plan view of the spin chuck 4 and the cup 6. FIG. 3 is a schematic view of the cup 6 viewed from the horizontal direction. 4A and 4B are schematic cross-sectional views of the guide 23. FIG. In FIG. 2, a cross section of the cup 6 is shown. The thick arrows in FIG. 2 indicate the direction of airflow.

As shown in FIG. 1, the substrate processing apparatus 1 is a single-wafer type apparatus that processes a disk-shaped substrate W such as a semiconductor wafer one by one. The substrate processing apparatus 1 includes a plurality of processing units 2 and a control device 3 that controls the operation of the apparatus provided in the substrate processing apparatus 1 and the opening / closing of a valve.
As shown in FIG. 1, the processing unit 2 includes a spin chuck 4 that holds a substrate W horizontally and rotates it around a vertical rotation axis A <b> 1 that passes through the center of the substrate W, and a substrate W that is held by the spin chuck 4. A plurality of nozzles 5 for discharging the processing liquid toward the upper surface of the substrate, and a cylindrical cup 6 surrounding the spin chuck 4.

  As shown in FIG. 1, the spin chuck 4 includes a disc-shaped spin base 7 that is held in a horizontal posture, a plurality of chuck pins 8 that protrude upward from the peripheral edge of the upper surface of the spin base 7, and the spin base 7. A rotation shaft 9 extending downward from the center portion and a spin motor 10 that rotates the spin base 7, the chuck pin 8, and the rotation shaft 9 integrally around a vertical axis (rotation axis A 1) passing through the center of the spin base 7 are included. . The spin base 7 has a larger diameter than the substrate W. The plurality of chuck pins 8 are arranged at intervals in the circumferential direction.

  As shown in FIG. 1, the spin chuck 4 brings the plurality of chuck pins 8 into contact with the peripheral end surface of the substrate W, thereby holding the substrate W at the holding position above the spin base 7 (the position of the substrate W shown in FIG. 1). Is held (clamped) in a horizontal position. The spin chuck 4 is not limited to the clamping chuck, and may be a vacuum chuck that holds the substrate W by adsorbing the lower surface (back surface) of the substrate W. The spin chuck 4 rotates the spin base 7 by the spin motor 10 while holding the substrate W. As a result, the substrate W rotates around the rotation axis A1. The control device 3 controls the spin motor 10 to rotate the substrate W in a constant rotation direction D1 (see FIG. 2).

  As shown in FIG. 1, the plurality of nozzles 5 are disposed above the spin chuck 4. The plurality of nozzles 5 include a first chemical liquid nozzle 5a, a second chemical liquid nozzle 5b, and a third chemical liquid nozzle 5c that discharge the chemical liquid downward, and a rinse liquid nozzle 5d that discharges the rinse liquid downward. The first chemical liquid nozzle 5a is connected to the first chemical liquid pipe 12 in which the first chemical liquid valve 11 is interposed, and the second chemical liquid nozzle 5b is in the second chemical liquid pipe 14 in which the second chemical liquid valve 13 is interposed. It is connected to the. The third chemical liquid nozzle 5c is connected to a third chemical liquid pipe 16 in which a third chemical liquid valve 15 is interposed. The rinse liquid nozzle 5d is connected to a rinse liquid pipe 18 in which a rinse liquid valve 17 is interposed. Each nozzle 5 may be a fixed nozzle that discharges the processing liquid in a stationary state toward the central portion of the upper surface of the substrate W, and the position where the processing liquid is deposited on the upper surface of the substrate W is between the central portion and the peripheral portion. It may be a scan nozzle that discharges the processing liquid while moving so as to move between them.

When the processing liquid discharged from each nozzle 5 is supplied to the upper surface of the rotating substrate W, the processing liquid spreads outward on the substrate W by centrifugal force. Then, the processing liquid that has reached the peripheral edge of the upper surface of the substrate W is shaken off around the substrate W and received by the cup 6. As a result, the processing liquid is supplied to the entire upper surface of the substrate W. The chemical liquid supplied to the first chemical liquid nozzle 5a is hydrofluoric acid (hydrofluoric acid), and the chemical liquid supplied to the second chemical liquid nozzle 5b is a mixed liquid containing SC1 (NH ₄ OH and H ₂ O _2). The chemical liquid supplied to the third chemical liquid nozzle 5c is SC2 (mixed liquid containing HCl and H ₂ O ₂ ). The rinse liquid supplied to the rinse liquid is pure water (deionized water).

  The chemical liquid supplied to the first chemical liquid nozzle 5a is not limited to hydrofluoric acid, but sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, aqueous ammonia, hydrogen peroxide, organic acids (such as citric acid and oxalic acid), and organic alkalis. (For example, TMAH: Tetramethylammonium hydroxide, etc.), a liquid containing at least one of a surfactant and a corrosion inhibitor may be used. The same applies to the chemical liquid supplied to the second chemical liquid nozzle 5b and the third chemical liquid nozzle 5c. The rinse liquid supplied to the rinse liquid nozzle 5d is not limited to pure water, but any of carbonated water, electrolytic ion water, hydrogen water, ozone water, and hydrochloric acid water having a diluted concentration (for example, about 10 to 100 ppm). There may be.

  As shown in FIG. 2, the cup 6 includes a cylindrical inner peripheral surface 6 a surrounding the substrate W and the spin base 7. A cross section of the inner peripheral surface 6 a (a cross section when the cup 6 is cut in a horizontal plane) is a cylindrical shape coaxial with the substrate W and the spin base 7. As shown in FIG. 1, the longitudinal section of the inner peripheral surface 6a (the section when the cup 6 is cut by a vertical surface) is a C-shape that opens inward. The peripheral end surface of the substrate W faces the inner peripheral surface 6a of the cup 6 with a gap in the radial direction. The upper end of the cup 6 is disposed above the substrate W, and the lower end of the cup 6 is disposed below the substrate W. The cup 6 is connected to an elevating device 19 that moves the cup 6 up and down between an upper position where the cup 6 is positioned around the substrate W and a lower position where the cup 6 is positioned below the substrate W. It may be.

  As shown in FIG. 2, the processing unit 2 includes a plurality of (four in FIG. 2) ducts 20 connected to the cup 6. The plurality of ducts 20 are arranged at intervals in the circumferential direction of the cup 6. The upstream end of the duct 20 is disposed around the cup 6. The upstream end portion of the duct 20 extends in the tangential direction of the inner peripheral surface 6a of the cup 6 from the cup 6 toward the downstream side in the rotation direction D1 of the substrate W in plan view. The upstream end of the duct 20 is connected to a discharge port 21 that opens at the inner peripheral surface 6 a of the cup 6. The plurality of discharge ports 21 are arranged at equal heights at equal intervals in the circumferential direction of the cup 6. The inside of the duct 20 communicates with the discharge port 21. The processing liquid discharged around the substrate W and the atmosphere containing the processing liquid vapor and mist are discharged into the duct 20 through the discharge port 21.

  As shown in FIG. 3, the discharge port 21 extends upward from the bottom of the cup 6. The bottom of the cup 6 includes a plurality of inclined portions 22 that respectively correspond to the plurality of discharge ports 21. The inclined portion 22 extends in the circumferential direction of the cup 6 from the upstream side in the rotation direction D1 toward the corresponding discharge port 21 and is inclined obliquely downward toward the corresponding discharge port 21. The downstream end portion of the inclined portion 22 is connected to the corresponding discharge port 21. The downstream end portion of the inclined portion 22 is inclined at the same inclination angle as the upstream end portion of the duct 20. The cup 6 includes a guide 23 that extends in the circumferential direction of the cup 6 along the inner peripheral surface 6 a of the cup 6. The guide 23 extends spirally so as to surround the rotation axis A1. The guide 23 may be a groove recessed from the inner peripheral surface 6a of the cup 6 as shown in FIG. 4A, or a protrusion protruding inward from the inner peripheral surface 6a of the cup 6 as shown in FIG. 4B. There may be.

  As shown in FIG. 2, the processing unit 2 includes a cup cleaning nozzle 24 that discharges pure water, which is an example of a cleaning liquid, toward the inner peripheral surface 6 a of the cup 6, and pure water piping in which a pure water valve 25 is interposed. 26. The pure water pipe 26 is connected to the cup cleaning nozzle 24. The outlet of the cup cleaning nozzle 24 is disposed in the cup 6. When the pure water valve 25 is opened, pure water is discharged from the cup cleaning nozzle 24. The cup cleaning nozzle 24 discharges pure water from the discharge port in the tangential direction of the inner peripheral surface 6a of the cup 6 toward the downstream side in the rotation direction D1 of the substrate W. Therefore, the pure water discharged from the cup cleaning nozzle 24 flows in the circumferential direction along the inner peripheral surface 6 a of the cup 6. Thereby, foreign matters (droplets and particles) adhering to the inner peripheral surface 6a of the cup 6 are washed away. The pure water flowing in the circumferential direction of the cup 6 is discharged to one of the discharge ports 21. Thereby, the foreign matter is removed from the cup 6.

FIG. 5 is a schematic diagram for explaining a discharge path of the processing liquid discharged from the substrate W. In the following, reference is made to FIG. 2 and FIG.
As shown in FIG. 5, the processing unit 2 includes a separation device 27 that separates a plurality of types of processing liquids supplied to the substrate W for each type. The separation device 27 includes a plurality of opening / closing devices 28 that respectively open and close the plurality of discharge ports 21. As shown in FIG. 2, the opening / closing device 28 includes a lid 29 that opens and closes the discharge port 21 and an opening / closing actuator 30 (for example, a cylinder or a motor) that moves the lid 29 so that the discharge port 21 is opened or closed. . The plurality of switchgears 28 include a first switchgear 28a, a second switchgear 28b, a third switchgear 28c, and a fourth switchgear 28d. The plurality of outlets 21 include a first outlet 21a, a second outlet 21b, a third outlet 21c, and a fourth outlet 21d. The first discharge port 21a is opened / closed by the first opening / closing device 28a, and the second discharge port 21b is opened / closed by the second opening / closing device 28b. Similarly, the third outlet 21c is opened and closed by a third opening / closing device 28c, and the fourth outlet 21d is opened and closed by a fourth opening / closing device 28d. Accordingly, the plurality of outlets 21 are opened and closed independently by the plurality of opening and closing devices 28.

  As shown in FIG. 5, the processing unit 2 includes a plurality of gas-liquid separation devices 31 connected to the plurality of discharge ports 21 and an exhaust gas connected to the plurality of discharge ports 21 via the plurality of gas-liquid separation devices 31. The apparatus 32 and the collection | recovery / drainage apparatus 33 connected to the several discharge port 21 via the some gas-liquid separation apparatus 31 are included. The first discharge port 21a is connected to the first gas-liquid separator 31a via the duct 20. The first gas-liquid separator 31a is connected to the first recovery device 33a and the first exhaust device 32a. Similarly, the 2nd discharge port 21b is connected to the 2nd gas-liquid separator 31b via the duct 20. As shown in FIG. The second gas-liquid separation device 31b is connected to the second drainage device 33b and the second exhaust device 32b. The third discharge port 21c is connected to the third gas-liquid separator 31c through the duct 20. The third gas-liquid separator 31c is connected to the third drain device 33c and the third exhaust device 32c. The fourth outlet 21d is connected to the fourth gas-liquid separator 31d via the duct 20. The fourth gas-liquid separation device 31d is connected to the fourth recovery device 33d and the fourth exhaust device 32d.

  The drainage discharged to the first discharge port 21a is separated from the exhaust gas by the first gas-liquid separation device 31a and then guided to the first recovery device 33a. The exhaust gas separated from the waste liquid by the first gas-liquid separation device 31a is guided to the first exhaust device 32a. Similarly, the drainage and exhaust discharged to the second discharge port 21b are led to the second drainage device 33b and the second exhaust device 32b, respectively, and the drainage and exhaust discharged to the third discharge port 21c are respectively Are respectively guided to the third drainage device 33c and the third exhaust device 32c. Further, the drainage and exhaust discharged to the fourth discharge port 21d are guided to the fourth recovery device 33d and the fourth exhaust device 32d, respectively. The drainage recovered by the first recovery unit 33a and the fourth recovery unit 33d is reused for the processing of the substrate W, and the drainage recovered by the second drainage unit 33b and the third drainage unit 33c is discarded. The

  6A to 6G are schematic views of the airflow forming device 34. FIG. 7A is a schematic plan view for explaining the configuration of the blade 39. FIG. 7B is a schematic longitudinal sectional view (a section cut along a vertical plane) for explaining the configuration of the blade 39. FIG. 7C is a schematic plan view for explaining the configuration of the blade 39. The thick line arrow in FIG. 6F indicates the gas discharge direction, and the thick line arrow in FIG. 6G indicates the gas suction direction.

  The processing unit 2 includes an airflow forming device 34 that forms a rotating airflow that flows between the substrate W and the cup 6 in the same direction as the rotation direction D1 of the substrate W. The air flow forming device 34 may be the blower 35A to the blower 35E shown in FIGS. 6A to 6E, the gas discharge device 36 shown in FIG. 6F, or the gas suction device 37 shown in FIG. 6G. May be. The airflow forming device 34 may include two or more of the blowers 35 </ b> A to 35 </ b> E, the gas discharge device 36, and the gas suction device 37.

  A blower 35A shown in FIG. 6A includes a spin base 7 as a rotating body 38 and a plurality of blades 39A extending outward from the outer peripheral surface of the spin base 7. The plurality of blades 39A are disposed below the substrate W. The plurality of blades 39A are arranged at intervals in the circumferential direction. The phases of the plurality of blades 39 </ b> A may be the same as or different from the phases of the plurality of chuck pins 8. The plurality of blades 39 </ b> A are disposed in the cup 6. The plurality of blades 39 </ b> A are connected to the spin base 7. The plurality of blades 39A rotate around the rotation axis A1 together with the spin base 7. Accordingly, the plurality of blades 39A rotate around the rotation axis A1 together with the substrate W.

  The blower 35B shown in FIG. 6B includes a plurality of chuck pins 8 as the rotating body 38 and a plurality of blades 39B extending outward from the plurality of chuck pins 8. The plurality of blades 39B are arranged at the same height as the substrate W. The plurality of blades 39 </ b> B are connected to the plurality of chuck pins 8, respectively. Therefore, the plurality of blades 39 </ b> B are arranged at the same phase as the plurality of chuck pins 8 and spaced in the circumferential direction. The plurality of blades 39 </ b> B are disposed in the cup 6. The plurality of blades 39 </ b> B rotate around the rotation axis A <b> 1 together with the plurality of chuck pins 8. Therefore, the plurality of blades 39B rotate around the rotation axis A1 together with the substrate W.

  A blower 35 </ b> C illustrated in FIG. 6C includes a rotating shaft 9 as the rotating body 38 and a plurality of blades 39 </ b> C extending outward from the outer peripheral surface of the rotating shaft 9. The plurality of blades 39 </ b> C are disposed below the substrate W. The plurality of blades 39C are arranged at intervals in the circumferential direction. The phases of the plurality of blades 39C may coincide with the phases of the plurality of chuck pins 8 or may be different. The plurality of blades 39 </ b> C are disposed in the cup 6. The tip of the blade 39 </ b> C may be disposed below the peripheral edge of the substrate W or may be disposed outward from the peripheral edge of the substrate W. The plurality of blades 39 </ b> C are connected to the rotation shaft 9. The plurality of blades 39 </ b> C rotate around the rotation axis A <b> 1 together with the rotation shaft 9. Accordingly, the plurality of blades 39C rotate around the rotation axis A1 together with the substrate W.

  A blower 35D shown in FIG. 6D includes an annular body 40 as a rotating body 38 surrounding the rotary shaft 9, a plurality of blades 39D extending outward from the outer peripheral surface of the annular body 40, and the annular body 40 and the blades 39D with the rotation axis A1. And a blade rotating device 41D that rotates integrally therewith. The annular body 40 is disposed below the spin base 7. The annular body 40 can rotate independently of the spin chuck 4. The plurality of blades 39 </ b> D are connected to the annular body 40. The plurality of blades 39 </ b> D are disposed below the substrate W. Several blade | wing 39D is arrange | positioned at intervals in the circumferential direction. The plurality of blades 39 </ b> D are arranged in the cup 6. The tip of the blade 39D may be disposed below the peripheral edge of the substrate W, or may be disposed outward from the peripheral edge of the substrate W. The annular body 40 and the blade 39D are rotationally driven independently of the substrate W by the blade rotating device 41D.

  A fan 35E shown in FIG. 6E includes a cup 6 as a rotating body 38, a plurality of blades 39E extending inward from the inner peripheral surface 6a of the cup 6, and blades that integrally rotate the cup 6 and the blades 39E around the rotation axis A1. Rotation device 41E. The plurality of blades 39E may be disposed at the same height as the substrate W, or may be disposed above or below the substrate W. The plurality of blades 39E are arranged at intervals in the circumferential direction. The tip of the blade 39E is disposed outside the substrate W and the spin base 7. The plurality of blades 39E are connected to the cup 6. The cup 6 and the blade 39E are rotationally driven independently of the substrate W by the blade rotating device 41E.

  As shown in FIG. 7A, the blade 39 (the blade 39A to the blade 39E) may be a flat plate held in a vertical posture. In this case, the blades 39 may extend in the radial direction or may be inclined with respect to the radial direction. Further, as shown in FIG. 7B, the blade 39 may have a C-shape that is open on the upstream side in the rotation direction D1. Further, as shown in FIG. 7C, the blade 39 may include a sphere 42 and a rod-like support 43 that connects the sphere 42 and the rotating body 38. The orthogonal cross section of the blade 39 cut by a plane orthogonal to the rotational radius direction may be uniform from the root to the tip of the blade 39 or may vary. In any case, the orthogonal cross section of the blade 39 is vertically symmetric. Therefore, when the plurality of blades 39 rotate around the rotation axis A <b> 1, generation of ascending airflow and descending airflow is suppressed or prevented, and the substrate along the inner peripheral surface 6 a of the cup 6 is interposed between the substrate W and the cup 6. A rotating airflow that flows in the same direction as the rotation direction D1 of W is generated. The strength of the rotating airflow is adjusted by the control device 3 controlling the rotational speed of the blade 39.

  Further, as shown in FIG. 7A, the processing unit 2 may include a plurality of angle changing devices 44 respectively connected to the plurality of blades 39. The angle changing device 44 includes a folding position (a position indicated by a two-dot chain line) where the blade 39 is disposed along the rotating body 38, and a deployed position (a position indicated by a solid line) where the tip of the blade 39 is separated from the rotating body 38. ) To move the corresponding blade 39. The plurality of blades 39 are independently driven by the plurality of angle changing devices 44. Accordingly, the control device 3 controls only the plurality of angle changing devices 44 to arrange only some of the blades 39 in the folding position or arrange all the blades 39 in the folding position or the unfolding position. be able to. Furthermore, the angle changing device 44 can hold the blade 39 at an arbitrary position between the folding position and the deployed position. Therefore, the angle changing device 44 can adjust the angle of the blade 39. The strength of the rotating airflow is adjusted by the rotation speed of the blade 39 and the angle of the blade 39.

  A gas discharge device 36 shown in FIG. 6F includes a plurality of gas pipes in which a plurality of gas discharge nozzles 45 that discharge gas toward the inner peripheral surface 6a of the cup 6, and a gas valve 46 and a discharge flow rate adjustment valve 47 are interposed. 48. The plurality of gas pipes 48 are connected to the plurality of gas discharge nozzles 45, respectively. The discharge ports of the plurality of gas discharge nozzles 45 are arranged in the cup 6 at intervals in the circumferential direction with a phase different from that of the plurality of discharge ports 21. When the gas valve 46 is opened, gas is discharged from the gas discharge nozzle 45 at a flow rate corresponding to the opening of the discharge flow rate adjustment valve 47. The gas may be an inert gas such as nitrogen gas, may be dry air, or may be clean air. The gas discharge nozzle 45 discharges gas from the discharge port in the tangential direction of the inner peripheral surface 6a of the cup 6 toward the downstream side in the rotation direction D1 of the substrate W. Therefore, the gas discharged from the gas discharge nozzle 45 flows in the circumferential direction along the inner peripheral surface 6 a of the cup 6. Thereby, the generation of the updraft and the downdraft is suppressed or prevented, and the rotating airflow that flows in the same direction as the rotation direction D1 of the substrate W along the inner peripheral surface 6a of the cup 6 between the substrate W and the cup 6. Occurs. The strength of the rotating airflow is adjusted by the gas discharge flow rate from the gas discharge nozzle 45, that is, the opening degree of the discharge flow rate adjustment valve 47.

  The gas suction device 37 shown in FIG. 6G includes a plurality of suction ports 49 that open on the inner peripheral surface 6a of the cup 6, and a plurality of suction pipes 52 in which a suction valve 50 and a suction flow rate adjustment valve 51 are interposed. The plurality of suction pipes 52 are respectively connected to the plurality of suction ports 49. The plurality of suction ports 49 are arranged at intervals in the circumferential direction at a phase different from that of the plurality of discharge ports 21. When the suction valve 50 is opened, the gas in the cup 6 is sucked into the suction port 49 at a flow rate corresponding to the opening degree of the suction flow rate adjustment valve 51. The suction port 49 sucks gas in a direction extending in the tangential direction of the inner peripheral surface 6a of the cup 6 from the suction port 49 toward the downstream side in the rotation direction D1 of the substrate W. Therefore, when at least one of the plurality of suction ports 49 sucks the gas, generation of ascending airflow and descending airflow is suppressed or prevented, and between the substrate W and the cup 6, along the inner peripheral surface 6 a of the cup 6. A rotating airflow that flows in the same direction as the rotation direction D1 of the substrate W is generated. The strength of the rotating airflow is adjusted by the suction flow rate of the gas to the suction port 49, that is, the opening degree of the suction flow rate adjustment valve 51.

  In a state where at least one of the plurality of discharge ports 21 opened on the inner peripheral surface 6 a of the cup 6 is opened, the atmosphere inside the cup 6 and the atmosphere outside the cup 6 are brought into contact with the cup by the suction force from the exhaust device 32. 6 is attracted to the inner peripheral surface 6a. Therefore, the contaminated atmosphere containing the treatment liquid vapor and mist is attracted to the inner peripheral surface 6 a of the cup 6. In a state where at least one of the plurality of discharge ports 21 is open and a rotating airflow that flows in the same direction as the rotation direction D1 of the substrate W along the inner peripheral surface 6a of the cup 6 is formed in the cup 6. The contaminated atmosphere rides on the rotating airflow and flows in the same direction as the rotation direction D1 of the substrate W along the inner peripheral surface 6a of the cup 6. Similarly, the droplets of the processing liquid discharged around the substrate W ride on the rotating airflow and flow along the inner peripheral surface 6a of the cup 6 in the same direction as the rotation direction D1 of the substrate W. Therefore, the treatment liquid droplets and the contaminated atmosphere are guided to the discharge port 21 by the rotating airflow and discharged from the cup 6.

  In this way, the rotating air current captures the droplets and the contaminated atmosphere, so the droplets and the contaminated atmosphere are unlikely to return to the substrate W side. Therefore, contamination of the substrate W due to reattachment of droplets and a contaminated atmosphere can be reduced. Furthermore, since generation | occurrence | production of an updraft and a downdraft is suppressed or prevented, the leakage of the contaminated atmosphere from the inside of the cup 6 can be suppressed or prevented. Moreover, since the traveling direction of the liquid droplets scattered outward toward the inner peripheral surface 6a of the cup 6 is bent by the rotating airflow, the impact when the liquid droplets collide with the cup 6 is weakened. Therefore, the amount of mist generated in the processing liquid can be reduced. Furthermore, since the liquid droplets flowing along the inner peripheral surface 6a of the cup 6 are smoothly guided to the discharge port 21 by the inclined portion 22 and the guide 23 (see FIG. 3) of the cup 6, the treatment liquid in the cup 6 Residual amount can be reduced. Furthermore, when pure water is discharged from the cup cleaning nozzle 24 (see FIG. 2) in a state where a rotating airflow is formed, the pure water spreads in the circumferential direction farther on the rotating airflow. Therefore, the inner peripheral surface 6a of the cup 6 can be efficiently cleaned, and the remaining amount of the processing liquid in the cup 6 can be further reduced.

FIG. 8 is a schematic diagram for explaining an example of the processing of the substrate W performed by the processing unit 2.
As shown in the leftmost column of FIG. 8, the control device 3 has a high concentration hydrofluoric acid, pure water, low concentration SC1, pure water, and low concentration in a state where a rotating airflow is formed in the cup 6. SC2 and pure water are supplied to the substrate W in this order. Specifically, the control device 3 supplies hydrofluoric acid from the first chemical liquid nozzle 5a to the entire upper surface of the rotating substrate W (first chemical liquid supply step), and then supplies pure water from the rinse liquid nozzle 5d. Supply to the entire upper surface of the substrate W in a rotating state (first rinsing liquid supply step). Subsequently, the control device 3 supplies SC1 from the second chemical solution nozzle 5b to the entire upper surface of the rotating substrate W (second chemical solution supply step), and then the pure water from the rinse solution nozzle 5d is rotated. It is made to supply to the whole upper surface of the board | substrate W (2nd rinse liquid supply process). Subsequently, the control device 3 supplies SC2 from the third chemical solution nozzle 5c to the entire upper surface of the rotating substrate W (third chemical solution supply step), and then the pure water from the rinse solution nozzle 5d is rotated. Supplying to the whole upper surface of the board | substrate W (3rd rinse liquid supply process). Subsequently, the control device 3 dries the substrate W by rotating the substrate W at a high speed by the spin chuck 4 (drying process).

  The control device 3 opens the first discharge port 21a by the first opening / closing device 28a while discharging hydrofluoric acid from the first chemical liquid nozzle 5a. Therefore, as shown in the rightmost column of FIG. 8, hydrofluoric acid droplets and contaminated atmosphere generated by the supply of hydrofluoric acid to the substrate W are guided to the first discharge port 21a by the rotating airflow, and the first discharge port It is discharged to 21a. As shown in the leftmost column and the middle column in FIG. 8, the control device 3 stops the discharge of hydrofluoric acid from the first chemical liquid nozzle 5a, and then removes pure water from the rinse liquid nozzle 5d and the cup cleaning nozzle 24. Are simultaneously started. Then, as shown in the rightmost column of FIG. 8, the control device 3 performs the first opening / closing operation after the start of the discharge of pure water until the discharged pure water reaches the first discharge port 21a. The first outlet 21a is closed by the device 28a. Thereafter, the control device 3 opens the second discharge port 21b by the second opening / closing device 28b. Therefore, the pure water discharged from the rinse liquid nozzle 5d and the cup cleaning nozzle 24 is discharged to the second discharge port 21b.

  As shown in the leftmost column of FIG. 8, the control device 3 stops the discharge of pure water from the rinse liquid nozzle 5d and the cup cleaning nozzle 24, and then starts the discharge of SC1 from the second chemical liquid nozzle 5b. . As shown in the rightmost column of FIG. 8, the control device 3 starts the first discharge of SC1 until the discharged SC1 reaches the second discharge port 21b via the substrate W. The second discharge port 21b is closed by the two opening / closing device 28b. Thereafter, the control device 3 opens the third discharge port 21c by the third opening / closing device 28c. Therefore, SC1 discharged from the second chemical liquid nozzle 5b is discharged to the third discharge port 21c. As shown in the leftmost column and the middle column in FIG. 8, the control device 3 stops the discharge of SC1 from the second chemical liquid nozzle 5b, and then the pure water from the rinse liquid nozzle 5d and the cup cleaning nozzle 24. Are simultaneously started. Then, as shown in the rightmost column of FIG. 8, the control device 3 is configured so that the third opening / closing device 28c causes the third discharge port to flow out after almost all the SC1 adhering to the inner peripheral surface 6a of the cup 6 has been washed away. 21c is closed. Thereafter, the control device 3 opens the fourth discharge port 21d by the fourth opening / closing device 28d. As shown in the middle row in FIG. 8, the control device 3 stops the discharge of pure water from the cup cleaning nozzle 24 after opening the fourth discharge port 21 d.

  As shown in the leftmost column of FIG. 8, the control device 3 stops the discharge of pure water from the rinse liquid nozzle 5d and then starts the discharge of SC2 from the third chemical liquid nozzle 5c. As shown in the rightmost column of FIG. 8, the control device 3 starts the second discharge from the start of the discharge of SC2 until the discharged SC2 reaches the fourth discharge port 21d via the substrate W. The fourth outlet 21d is closed by the four opening / closing device 28d. Thereafter, the control device 3 opens the second discharge port 21b by the second opening / closing device 28b. Therefore, SC2 discharged from the third chemical liquid nozzle 5c is discharged to the second discharge port 21b. As shown in the leftmost column and the middle column in FIG. 8, the control device 3 stops the discharge of SC2 from the third chemical solution nozzle 5c, and then the pure water from the rinse solution nozzle 5d and the cup cleaning nozzle 24. Start dispensing at the same time. Then, as shown in the rightmost column of FIG. 8, after almost all the SC2 adhering to the inner peripheral surface 6a of the cup 6 has been washed away, the control device 3 uses the second opening / closing device 28b to remove the second discharge port. 21b is closed. Thereafter, the control device 3 opens the fourth discharge port 21d by the fourth opening / closing device 28d. As shown in the middle row in FIG. 8, the control device 3 stops the discharge of pure water from the cup cleaning nozzle 24 after opening the fourth discharge port 21 d. Thereafter, the control device 3 stops the discharge of pure water from the rinse liquid nozzle 5d and dries the substrate W.

  As described above, in the first embodiment, the airflow forming device 34 forms a rotating airflow that flows in the same direction as the rotation direction D1 of the substrate W between the substrate W and the inner peripheral surface 6a of the cup 6. Therefore, the atmosphere in the cup 6 rides on the rotating airflow and flows in the same direction as the rotation direction D1 of the substrate W along the inner peripheral surface 6a of the cup 6. Therefore, the atmosphere in the cup 6 is guided by the rotating airflow to the plurality of outlets 21 opened on the inner peripheral surface 6 a of the cup 6, and is discharged to the plurality of outlets 21 by the suction force from the exhaust device 32. Therefore, the atmosphere in the cup 6 is uniformly discharged in the circumferential direction of the cup 6, and the residual amount of mist and steam in the processing liquid in the cup 6 is reduced. Therefore, the contamination of the substrate W due to the mist of the processing liquid and the adhesion of vapor can be reduced. Thereby, the cleanliness of the substrate W can be increased. Thus, since the rotating airflow is formed between the substrate W and the cup 6, the atmosphere in the cup 6 swirls along the inner peripheral surface 6 a of the cup 6 even if the suction force of the exhaust device 32 is weak. to continue. Therefore, the exhaust flow rate of the exhaust device 32 can be reduced while reducing the amount of atmosphere leakage from the cup 6.

  Furthermore, in 1st Embodiment, the pure water adhering to the internal peripheral surface 6a of the cup 6 is pushed by the rotation airflow, and flows in the circumferential direction of the cup 6 along the internal peripheral surface 6a of the cup 6. Therefore, the pure water supplied to the cup 6 reaches a wide area on the inner peripheral surface 6 a of the cup 6. Then, the pure water moving in the circumferential direction of the cup 6 is discharged to the plurality of discharge ports 21. Thus, since the pure water supplied to the inner peripheral surface 6a of the cup 6 spreads over a wide area of the inner peripheral surface 6a of the cup 6, the treatment liquid and particles adhering to the inner peripheral surface 6a of the cup 6 are purified. Can be washed away with water. Therefore, the residual amount of the processing liquid in the cup 6 can be extremely reduced. Therefore, even if a plurality of types of treatment liquids are received by one cup 6, it is possible to suppress or prevent mixing of different types of chemical liquids. Furthermore, since the traveling direction of the processing liquid scattered toward the inner peripheral surface 6 a of the cup 6 is bent by the rotating airflow, the impact when the processing liquid droplet collides with the cup 6 is weakened. Therefore, the amount of mist generated in the processing liquid can be reduced, and contamination of the substrate W due to mist adhesion can be reduced. Thereby, the cleanliness of the substrate W can be further increased.

FIG. 9 is a schematic diagram for explaining the discharge path of the processing liquid according to the second embodiment.
9, the same components as those shown in FIGS. 1 to 8 described above are denoted by the same reference numerals as those in FIG. 1 and the description thereof is omitted.
The main difference between the second embodiment and the first embodiment is that a plurality of types of treatment liquids are not separated in the cup 6 but separated on the downstream side of the cup 6.

  In addition to the configuration of the processing unit 2 according to the first embodiment, the processing unit 202 according to the second embodiment includes a separation device 227 that separates a plurality of types of processing liquids supplied to the substrate W for each type. The separation device 227 includes a plurality of exhaust pipes 253 connected to the plurality of gas-liquid separation devices 31, and an exhaust gas switching valve 254 connected to the plurality of gas-liquid separation devices 31 via the plurality of exhaust tubes 253. The separator 227 further includes a plurality of drain pipes 255 connected to the plurality of gas-liquid separators 31 and a drain switch valve connected to the plurality of gas-liquid separators 31 via the plurality of drain pipes 255. 256.

  The exhaust switching valve 254 includes an input port 254a connected to the plurality of exhaust ports 21 via the duct 20, the gas-liquid separator 31 and the exhaust pipe 253, and a plurality of output ports connected to the plurality of exhaust devices 32, respectively. 254b. The input port 254a is connected to any one of the plurality of output ports 254b. The exhaust gas switching valve 254 can switch the output port 254b connected to the input port 254a among the plurality of output ports 254b. Exhaust gas in the plurality of exhaust pipes 253 is guided to one of the plurality of exhaust devices 32 by switching the exhaust gas switching valve 254.

  Similarly, the drainage switching valve 256 includes an input port 256a connected to the plurality of outlets 21 through the duct 20, the gas-liquid separator 31 and the drainage pipe 255, the first recovery device 33a, and the second drainage device. And a plurality of output ports 256b respectively connected to the liquid device 33b, the third drain device 33c, and the fourth recovery device 33d. The input port 256a is connected to one of the plurality of output ports 256b. The drainage switching valve 256 can switch the output port 256b connected to the input port 256a among the plurality of output ports 256b. The drainage in the plurality of drainage pipes 255 is guided to one of the first recovery device 33a, the second drainage device 33b, the third drainage device 33c, and the fourth recovery device by switching the drainage switching valve 256. Is done.

The control device 3 (see FIG. 1) can separate the plurality of types of processing liquids received by the cup 6 for each type by controlling the exhaust switching valve 254 and the drain switching valve 256. Therefore, the control device 3 can separate a plurality of types of processing liquids for each type as described with reference to FIG. 8 without opening and closing the plurality of discharge ports 21 for each type of processing liquid.
Although the description of the first and second embodiments of the present invention has been described above, the present invention is not limited to the contents of the first and second embodiments, and various modifications can be made within the scope of the claims. Is possible.

For example, in the first and second embodiments, the case where the number of the cups 6 arranged around the spin chuck 4 is one has been described. However, a plurality of cups 6 are arranged around the spin chuck 4. The cup 6 facing the peripheral end surface of the substrate W may be changed by the lifting device 19.
In the first and second embodiments, the case where the processing unit 2 includes the cup cleaning nozzle 24 that discharges pure water toward the inner peripheral surface 6a of the cup 6 has been described. The processing unit 2 may not be provided.

In the first and second embodiments, the case where a plurality of types of processing liquids are supplied to the substrate W from different nozzles has been described. However, a plurality of types of processing liquids are supplied to the substrate W from a common nozzle. May be. For example, all types of processing liquids may be supplied to the substrate W from a common nozzle, or only some types of processing liquids may be supplied to the substrate W from a common nozzle.
In the first and second embodiments, the case where the substrate processing apparatus 1 is an apparatus that processes a disk-shaped substrate W has been described. However, the substrate processing apparatus 1 is a polygon such as a substrate for a liquid crystal display device. An apparatus for processing the substrate W may be used.

  In addition, various design changes can be made within the scope of matters described in the claims.

1: Substrate processing apparatus 4: Spin chuck (substrate holding means)
5: Nozzle (treatment liquid supply means)
5d: rinse liquid nozzle (treatment liquid supply means, cup cleaning means, pure water nozzle)
6: Cup 6a: Inner peripheral surface 10: Spin motor (substrate rotating means)
20: Duct 21: Discharge port 24: Cup cleaning nozzle (cup cleaning means)
27: Separation device (separation means)
28: Opening / closing device (opening / closing means)
32: Exhaust device (exhaust means)
34: Airflow forming device (airflow forming means, blade rotating means)
35A: Blower (airflow forming means)
35B: Blower (airflow forming means)
35C: Blower (airflow forming means)
35D: Blower (air flow forming means)
35E: Blower (air flow forming means)
36: Gas discharge device (air flow forming means, gas discharge means)
37: Gas suction device (air flow forming means, gas suction means)
38: Rotating body 39: Blade 41D: Blade rotating device (blade rotating means)
41E: blade rotation device (blade rotation means)
49: Suction port 227: Separation device (separation means)
256: Drain switch valve 256a: Input port 256b: Output port A1: Rotation axis D1: Rotation direction W of substrate: Substrate

Claims (12)

Substrate holding means for holding the substrate horizontally;
Substrate rotating means for rotating the substrate held by the substrate holding means around a vertical rotation axis passing through the substrate;
Treatment liquid supply means for supplying a plurality of types of treatment liquids to the substrate held by the substrate holding means;
A cylindrical inner peripheral surface surrounding the substrate held by the substrate holding means; and a plurality of discharge ports opened on the inner peripheral surface, and a plurality of types of treatment liquids discharged around the substrate A cylindrical cup that receives the inner peripheral surface and discharges a plurality of types of processing liquid discharged around the substrate to the plurality of discharge ports;
An airflow forming means for forming a rotating airflow flowing in the same direction as the rotation direction of the substrate between the substrate held by the substrate holding means and the inner peripheral surface of the cup;
Cup cleaning means for supplying pure water to the inner peripheral surface of the cup;
A substrate processing apparatus comprising: a separation unit configured to separate the plurality of types of processing liquids discharged to the plurality of discharge ports by type.   The substrate processing apparatus according to claim 1, further comprising an exhaust unit that exhausts the atmosphere in the cup from the plurality of exhaust ports.   3. The substrate processing apparatus according to claim 1, wherein the separation unit includes a plurality of opening / closing units capable of independently opening and closing the plurality of discharge ports.   The separation means includes an input port connected to the plurality of discharge ports, and a plurality of output ports for discharging the processing liquid supplied from the plurality of discharge ports to the input port, and is connected to the input ports. The substrate processing apparatus as described in any one of Claims 1-3 containing the drainage switching valve which can switch the output port to be switched among these output ports.   The substrate processing apparatus according to claim 1, wherein the cup cleaning unit includes a pure water nozzle that discharges pure water toward the substrate held by the substrate holding unit.   The substrate processing apparatus according to claim 1, wherein the cup cleaning unit includes a cup cleaning nozzle that discharges pure water toward an inner peripheral surface of the cup.   The airflow forming means includes a blade disposed inside the cup, a rotating body that can rotate around a vertical axis together with the blade, and a blade rotating means that rotates the rotating body. The substrate processing apparatus as described in any one of these.   The substrate processing apparatus according to claim 7, wherein the blade has a vertically symmetric cross section.   The substrate processing apparatus according to claim 7, wherein the blade rotating unit is the substrate rotating unit.   The substrate processing apparatus according to claim 7, wherein the blade rotating unit is independent of the substrate rotating unit.   The said airflow formation means contains the gas discharge means which discharges gas to the tangential direction of the internal peripheral surface of the said cup toward the downstream of the rotation direction of the said board | substrate. Substrate processing equipment.   The air flow forming means includes gas suction means for sucking gas in a tangential direction of the inner peripheral surface of the cup from a suction port opened on the inner peripheral surface of the cup toward a downstream side in the rotation direction of the substrate. Item 12. The substrate processing apparatus according to any one of Items 1 to 11.

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