TW517386B - Solid-state image pickup device - Google Patents
Solid-state image pickup device Download PDFInfo
- Publication number
- TW517386B TW517386B TW090119935A TW90119935A TW517386B TW 517386 B TW517386 B TW 517386B TW 090119935 A TW090119935 A TW 090119935A TW 90119935 A TW90119935 A TW 90119935A TW 517386 B TW517386 B TW 517386B
- Authority
- TW
- Taiwan
- Prior art keywords
- overflow
- electrode
- ofcg
- control gate
- gate
- Prior art date
Links
- 238000012546 transfer Methods 0.000 claims abstract description 63
- 230000004888 barrier function Effects 0.000 description 28
- 239000012535 impurity Substances 0.000 description 9
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000011295 pitch Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007943 implant Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/186—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors having arrangements for blooming suppression
- H10F39/1865—Overflow drain structures
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000257463A JP4686830B2 (ja) | 2000-08-28 | 2000-08-28 | 固体撮像素子及びその駆動方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW517386B true TW517386B (en) | 2003-01-11 |
Family
ID=18745916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090119935A TW517386B (en) | 2000-08-28 | 2001-08-14 | Solid-state image pickup device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6512254B2 (enExample) |
| JP (1) | JP4686830B2 (enExample) |
| TW (1) | TW517386B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1341377B1 (en) * | 2002-02-27 | 2018-04-11 | Canon Kabushiki Kaisha | Signal processing device for image pickup apparatus |
| US7492404B2 (en) * | 2004-08-27 | 2009-02-17 | Eastman Kodak Company | Fast flush structure for solid-state image sensors |
| US20080195116A1 (en) * | 2007-02-09 | 2008-08-14 | Karim Mansour | Circumcision clamp and surgical kit |
| JP7765306B2 (ja) * | 2022-02-24 | 2025-11-06 | 浜松ホトニクス株式会社 | 固体撮像素子 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63296267A (ja) * | 1987-05-27 | 1988-12-02 | Mitsubishi Electric Corp | 電荷転送装置 |
| JP2666928B2 (ja) * | 1987-07-13 | 1997-10-22 | 株式会社東芝 | 電荷転送素子の出力検出器 |
| JPH084136B2 (ja) * | 1987-12-22 | 1996-01-17 | 日本電気株式会社 | 電荷転送装置 |
| JPH05251480A (ja) * | 1992-03-04 | 1993-09-28 | Sony Corp | 電荷電圧変換装置 |
| JPH06303527A (ja) * | 1993-04-09 | 1994-10-28 | Sony Corp | 電荷結合素子 |
| KR950002084A (ko) * | 1993-06-22 | 1995-01-04 | 오가 노리오 | 전하전송장치 |
-
2000
- 2000-08-28 JP JP2000257463A patent/JP4686830B2/ja not_active Expired - Fee Related
-
2001
- 2001-08-14 TW TW090119935A patent/TW517386B/zh not_active IP Right Cessation
- 2001-08-17 US US09/931,464 patent/US6512254B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6512254B2 (en) | 2003-01-28 |
| JP4686830B2 (ja) | 2011-05-25 |
| US20020060329A1 (en) | 2002-05-23 |
| JP2002076318A (ja) | 2002-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5243984B2 (ja) | 電子増倍機能内蔵型の固体撮像素子 | |
| JPS62237761A (ja) | 電荷結合装置 | |
| CN100433351C (zh) | 成像装置 | |
| TW517386B (en) | Solid-state image pickup device | |
| US6194242B1 (en) | Fabrication of solid-state imaging device having no transfer error of the signal charge from vertical horizontal charge-transfer section | |
| KR0128504B1 (ko) | 전하결합 장치 및 카메라 | |
| JP4049248B2 (ja) | 固体撮像装置 | |
| JP3301176B2 (ja) | 電荷転送装置 | |
| US7646042B2 (en) | Charge coupled device and solid-state imaging apparatus | |
| JP3384509B2 (ja) | 固体撮像素子 | |
| JP2936153B2 (ja) | 固体撮像素子の製造方法 | |
| JP3020537B2 (ja) | 電荷結合素子 | |
| EP0607874A1 (en) | Solid state image sensor | |
| JPS61184876A (ja) | 電荷転送装置 | |
| JP3578611B2 (ja) | 固体撮像装置 | |
| TW201034452A (en) | Solid-state image sensing device containing electron multiplication function | |
| JPH04367237A (ja) | Ccd固体撮像素子 | |
| CN100365823C (zh) | 电荷传输器件 | |
| JP2000022125A (ja) | 固体撮像素子 | |
| JPH03116841A (ja) | 電荷結合素子 | |
| JP2000114505A (ja) | Ccd固体撮像素子 | |
| JP3004764B2 (ja) | 電荷結合素子 | |
| JP2747328B2 (ja) | 電荷転送素子 | |
| JP2004253740A (ja) | 固体撮像素子 | |
| JPH0677461A (ja) | 固体撮像装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |