TW514972B - Vacuum processing apparatus - Google Patents

Vacuum processing apparatus Download PDF

Info

Publication number
TW514972B
TW514972B TW090129185A TW90129185A TW514972B TW 514972 B TW514972 B TW 514972B TW 090129185 A TW090129185 A TW 090129185A TW 90129185 A TW90129185 A TW 90129185A TW 514972 B TW514972 B TW 514972B
Authority
TW
Taiwan
Prior art keywords
chamber
substrate
vacuum
processed
inert gas
Prior art date
Application number
TW090129185A
Other languages
English (en)
Chinese (zh)
Inventor
Tsutomu Hiroki
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TW514972B publication Critical patent/TW514972B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
TW090129185A 2000-11-27 2001-11-26 Vacuum processing apparatus TW514972B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000360272A JP4841035B2 (ja) 2000-11-27 2000-11-27 真空処理装置

Publications (1)

Publication Number Publication Date
TW514972B true TW514972B (en) 2002-12-21

Family

ID=18831898

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090129185A TW514972B (en) 2000-11-27 2001-11-26 Vacuum processing apparatus

Country Status (3)

Country Link
JP (1) JP4841035B2 (ko)
KR (3) KR20020041294A (ko)
TW (1) TW514972B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI560796B (en) * 2014-09-05 2016-12-01 Tae Wha Kim Fume removing apparatus for semiconductor fabrication chamber

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005211865A (ja) * 2004-02-02 2005-08-11 Masato Toshima プラズマ処理装置
KR100613265B1 (ko) 2004-09-06 2006-08-21 (주)아이씨디 진공처리 시스템 및 이를 이용한 대상물 이송방법
JP5078243B2 (ja) * 2005-09-02 2012-11-21 東京エレクトロン株式会社 真空処理装置および真空予備室の排気方法
JP4642610B2 (ja) * 2005-09-05 2011-03-02 東京エレクトロン株式会社 基板位置合わせ装置および基板収容ユニット
KR101036188B1 (ko) * 2006-03-22 2011-05-23 엘아이지에이디피 주식회사 평판표시소자 제조장치
JP4985031B2 (ja) * 2007-03-29 2012-07-25 東京エレクトロン株式会社 真空処理装置、真空処理装置の運転方法及び記憶媒体
KR100972965B1 (ko) * 2009-10-28 2010-07-29 씨에이코리아(주) 풍력발전기 타워 지지 장치
KR101085241B1 (ko) 2010-04-23 2011-11-21 주식회사 뉴파워 프라즈마 게이트밸브어셈블리와 이를 포함하는 기판처리시스템
JP6240695B2 (ja) * 2016-03-02 2017-11-29 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及びプログラム
JP7209318B2 (ja) * 2017-11-22 2023-01-20 日新イオン機器株式会社 フラットパネルディスプレイ製造装置
JP6559813B2 (ja) * 2018-01-19 2019-08-14 東京エレクトロン株式会社 基板処理装置及び基板処理装置の基板載置部の雰囲気制御方法
DE102019208704A1 (de) * 2019-06-14 2020-12-17 Siltronic Ag Einrichtung und Verfahren zum Polieren von Halbleiterscheiben
WO2021044622A1 (ja) * 2019-09-06 2021-03-11 キヤノンアネルバ株式会社 ロードロック装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63147811A (ja) * 1986-12-11 1988-06-20 Kawasaki Steel Corp ＳｉＣ微粉末の製造方法
JP3350234B2 (ja) * 1994-06-06 2002-11-25 東京エレクトロン株式会社 被処理体のバッファ装置、これを用いた処理装置及びその搬送方法
JPH0817899A (ja) * 1994-06-29 1996-01-19 Hitachi Ltd 基板処理装置
JPH08340037A (ja) * 1995-06-13 1996-12-24 Kokusai Electric Co Ltd 半導体製造装置
JP3650495B2 (ja) * 1995-12-12 2005-05-18 東京エレクトロン株式会社 半導体処理装置、その基板交換機構及び基板交換方法
JP4502411B2 (ja) * 1996-12-05 2010-07-14 大日本スクリーン製造株式会社 基板処理装置
JPH10321610A (ja) * 1997-03-19 1998-12-04 Fujitsu Ltd 半導体装置の製造方法
JPH11200035A (ja) * 1998-01-19 1999-07-27 Anelva Corp スパッタ化学蒸着複合装置
KR19990068950A (ko) * 1998-02-03 1999-09-06 윤종용 잔류가스 배기 시스템
JPH11260742A (ja) * 1998-03-12 1999-09-24 Kokusai Electric Co Ltd 熱処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI560796B (en) * 2014-09-05 2016-12-01 Tae Wha Kim Fume removing apparatus for semiconductor fabrication chamber

Also Published As

Publication number Publication date
KR20090042883A (ko) 2009-05-04
JP2001291758A (ja) 2001-10-19
KR20020041294A (ko) 2002-06-01
KR20080080269A (ko) 2008-09-03
KR100900870B1 (ko) 2009-06-04
JP4841035B2 (ja) 2011-12-21
KR100937073B1 (ko) 2010-01-15

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