511428 Α7 Β7 五、發明説明（1) 〔技術領域〕 本發明，係關於將晶片狀電子零件安裝在印刷電路板 等的裝置器，把晶片狀電子零件供給的紙製載具帶之製造 方法。 〔習知技藝〕 自已往，在將晶片狀電子零件供給安裝在印刷電路板 等的裝置器之載具帶，已知有塑膠製和紙製。 圖5 A，圖5 B係顯示在特開平1 — 3 1 4 1 5 0所 揭示的塑膠製載具帶之製造方法的圖。在圖5 A，圖5 B 所示之例，係首先如圖5 A所示地，在塑膠製載具帶基材 1 1 a，開孔比目的之晶片收容凹部3的口域窄之口域的 貫通孔2。接著如圖5 B所示，將穿孔器放在貫通孔2上 ，在貫通孔上以冲床加工成形所希望深度T 1的晶片收容 凹部3，而被製造塑膠製載具帶1 1。 經濟部智慧財產局員工消費合作社印製 此時，在成形晶片收容凹部3時貫通孔2的側壁之一 部份將被推壓，對應於該被推壓的塑膠容積之塑膠，將擠 出貫通孔2的晶片收容凹部3底部側之開口部而成爲底部 ，可是因塑膠係非壓縮性，如果將底部封閉將無法把凹部 形成至所希望的深度T 1，通常留下小孔1 4而決定所希 望之深度T 1。 並且，紙製載具帶將如圖6A，圖6B，圖6C所示 地被成形。 在圖6 A所示的例，係在紙製載具帶基材1 a之厚度 本紙張尺度適用中國國家標準（CNS ) A4規格（210Χ；297公釐） ~ <4 - 511428 A7 B7 五、發明説明（2) 方向開貫通孔2，在紙製載具帶基材1 a的底部貼上底帶 1 2，把貫通孔2之底部側的開口封閉而將凹部成形。接 著將該凹部做爲晶片收容凹部3把晶片狀電子零件收容而 以頂帶（未圖示）加蓋，被製造紙製載具帶1。 並且在圖6 B所示的例，係在紙製載具帶基材1 a以 冲床加工設置凹部，而被製造將該凹部做爲晶片收容凹部 3之紙製載具帶1。 並且在圖6 C所示的例，係在紙製載具帶基材1 a以 冲床加工設置凹部，將該凹部做爲晶片收容凹部3。同時 ’在晶片收容凹部3，因將晶片狀電子零件從晶片收容凹 部3的底部側向開口方向擠出，由於被設置使推出銷1 3 插通之推出銷用開孔1 4，而被製造紙製載具帶1。 可是，具有收容最近被促進微細化的晶片之晶片收容 凹部3的載具帶，將需要如下之條件。亦即， (i )晶片狀電子零件將在晶片收容凹部3內被固定 收容。 (i i )在晶片收容凹部3的底部存在有強度弱之部 份。 (i i i )在晶片收容凹部3的底部設有孔。 例如將晶片狀電子零件以載具帶搬送中，如果晶片狀 電子零件在晶片收容凹部3內未被固定收容而移動時，將 無法把被搬送的晶片收容凹部3內之晶片狀電子零件以裝 置器正確地捕捉。如果無法將晶片狀電子零件以裝置器正 確地捕捉，則無法將晶片狀電子零件以裝置器正確地安裝 本紙張尺度逍用中國國家標準（CNS ) A4規格（210X297公釐） (請先聞讀背面之注意事項再填寫本頁)511428 Α7 Β7 V. Description of the Invention (1) [Technical Field] The present invention relates to a method for manufacturing a paper carrier tape for mounting wafer-shaped electronic parts on a printed circuit board or the like and supplying wafer-shaped electronic parts. [Know-how] Conventionally, plastic carrier and paper carrier are known as carrier tapes for supplying wafer-shaped electronic parts to devices mounted on printed circuit boards and the like. 5A and 5B are diagrams showing a method for manufacturing a plastic carrier tape disclosed in Japanese Patent Laid-Open No. 1-3 1 4 1 50. FIG. In the example shown in FIG. 5A and FIG. 5B, first, as shown in FIG. 5A, in the plastic carrier tape substrate 1 1a, the opening is narrower than that of the target wafer receiving recess 3 Domain of through-holes 2. Next, as shown in FIG. 5B, a punch is placed on the through hole 2, and a wafer receiving recess 3 having a desired depth T1 is formed on the through hole by a punch, and a plastic carrier tape 11 is manufactured. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs At this time, when forming the wafer receiving recess 3, a part of the side wall of the through hole 2 will be pushed, and the plastic corresponding to the pushed plastic volume will be squeezed out The wafer accommodating recess 3 on the bottom side of the hole 2 becomes the bottom. However, due to the non-compressive nature of the plastic system, if the bottom is closed, the recess cannot be formed to the desired depth T 1, and the small hole 14 is usually left. Desired depth T 1. The paper carrier tape is formed as shown in Figs. 6A, 6B, and 6C. The example shown in Figure 6A is based on the thickness of the paper carrier tape substrate 1 a. The paper dimensions are applicable to China National Standard (CNS) A4 specifications (210 ×; 297 mm) ~ < 4-511428 A7 B7 5 2. Description of the invention (2) A through hole 2 is opened in the direction, a bottom tape 12 is attached to the bottom of the paper carrier tape base material 1a, and the opening on the bottom side of the through hole 2 is closed to form a recess. Then, the concave portion is used as a wafer accommodating concave portion 3 to receive a wafer-shaped electronic component and covered with a top tape (not shown), and a paper carrier tape 1 is manufactured. Further, in the example shown in FIG. 6B, a paper carrier tape 1 is provided by forming a recess on a paper carrier tape substrate 1a by punching, and the recess is used as a wafer receiving recess 3. In the example shown in FIG. 6C, a recessed portion is provided on the paper carrier tape substrate 1a by a punching process, and the recessed portion is used as the wafer receiving recessed portion 3. At the same time, wafer-shaped electronic parts are extruded from the bottom side of the wafer-receiving recess 3 toward the opening direction in the wafer-receiving recess 3, and are manufactured by being provided with push-out pins 1 3 through which the push-pin openings 14 are inserted. Paper carrier tape 1. However, a carrier tape having a wafer accommodating recess 3 for accommodating a wafer that has been recently miniaturized requires the following conditions. That is, (i) the wafer-like electronic component will be fixedly accommodated in the wafer accommodation recess 3. (i i) There is a weak portion at the bottom of the wafer receiving recess 3. (i i i) A hole is provided in the bottom of the wafer receiving recess 3. For example, during the transfer of wafer-shaped electronic parts on a carrier tape, if the wafer-shaped electronic parts are moved without being fixedly stored in the wafer-receiving recess 3, the wafer-shaped electronic parts in the wafer-receiving recess 3 cannot be transferred to the device. The device captures correctly. If the wafer-shaped electronic parts cannot be correctly captured by the device, then the wafer-shaped electronic parts cannot be correctly installed by the device. This paper is scaled to the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read first) (Notes on the back then fill out this page)
、1T 經濟部智慧財產局員工消費合作社印製 -5- 511428 A7 B7 五、發明説明（3) 在印刷電路板等。因此’在將被成形晶片收容凹部3的載 具帶、（i )之條件很重要。 並且，雖然裝置器將由真空吸附裝置等把晶片狀電子 零件吸附，可是通常因該吸附加很弱’在從晶片收容凹部 3.把晶片狀電子零件取出時，通常’將需要把晶片狀電子 零件從晶片收容凹部3的底部側以射銷1 3推出。此時如 果晶片收容凹部3之底部堅固’則射銷1 3將需要強的力 ，由射銷1 3之推出力過大時’有可能會損傷晶片狀電子 零件。並且，晶片收容凹部3的底部堅固時，由射銷1 3 之推出力將變大，比推出力小時，隨著推出晶片收容凹部 3的底部將會粉碎，其粉碎片將會飛散，將晶片狀電子零 件以安裝在裝置器之真空吸附裝置等取出時，有時會堵塞 真空吸附裝置等。因此，以小的力將晶片狀電子零件推出 爲理想。爲此，需要在晶片收容凹部3的底部設置強度弱 之部份，從強度弱的部份把射銷1 3推出。因此，在將被 成形晶片收容凹部3之載具帶，上述（i i )的條件將成 爲重要。 並且，如果在晶片收容凹部3之底部有孔存在時，可 能灰塵將從該孔侵入，該灰塵將附著在被收容在晶片收容 凹部3之晶片狀電子零件，而阻害晶片狀電子零件由裝置 器向印刷電路板等之安裝。因此，從防止灰塵對晶片狀電 子零件的附著對策之觀點，在將被成形晶片收容凹部3的 載具帶，（i i i )之條件係很重要。 特別係隨著晶片狀電子零件被微細化，上述（i )、 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) 訂 f 經濟部智慧財產局員工消費合作社印製 -6- 511428 A7 B7 五、發明説明（4) (i i ) 、（ i i i )之條件將更成爲重要。 (請先聞讀背面之注意事項再填寫本頁) 在已往的塑膠製載具帶1 1之製造方法，在例如圖5 A，圖5 B所示的塑膠製載具帶1 1之製造方法，由於能 夠將所希望的晶片收容凹部3以使用穿孔器之冲床加工精 確度良好地成形，故能滿足上述（i )的條件。並且，如 果爲了得到所希望深度T 1之晶片收容凹部3由冲床加工 被推壓的塑膠容積，和晶片收容凹部%3的底部側之貫通孔 2的開口容積相等時，將無晶片收容凹部3之底部的孔。 然而，如果考慮加工精確度及塑膠爲非壓縮性，由冲床加 工在貫通孔2的晶片收容凹部3之底部的孔將被縮小，而 孔消失時，將難以將具有所希望深度T 1之晶片收容凹部 3成形。因此，爲了得到具有所希望深度T 1的晶片收容 凹部3，在將晶片收容凹部3成形後，也必須在晶片收容 凹部3之底部有孔。此點將不會滿足上述（i i i )的條 件。並且，由成形晶片收容凹部3時之冲床加工，塑膠將 會熔著，晶片收容凹部3的底部，經全面將成爲堅固，難 以滿足上述（i i )之條件。 經濟部智慧財產局員工消費合作社印製 一方面，關於習知的紙製載具帶1，例如，在圖6 A 所示之紙製載具帶1，需要在貫通孔2的底部貼上底帶 1 2，在貫通孔2之蓋部貼上頂帶。因此，將需要新的底 帶材及頂帶材之新的材料，同時加工工程將會複雜化。 而且圖6 B所示之紙製載具帶1，即使晶片收容凹部 3的底部薄時，將由成形晶片收容凹部3之冲床加工，細 屑收容凹部3的底部係被壓縮，已成爲堅固者。因此，難 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -7- 511428 A7 ________ B7 五、發明説明（5) 以滿足上述（i i )之條件。再者，爲了將晶片收容凹部 3 ’在紙製載具帶基材1 a直接冲床加工而製造載具帶1 時’如圖7所示，晶片收容凹部3互相的間隔狹窄時，將 晶片收容凹部3以冲床加工開孔時，將會推壓先前開孔的 晶片收容凹部3之側壁，先前開孔的晶片收容凹部3之側 壁的形狀將會變形，難以滿足上述（i )之條件。 並且圖6 C所示的紙製載具帶1，係在晶片收容凹部 3之底部有孔，將不會滿足上述（i i i )的條件。 〔發明之揭示〕 本發明係考慮如此情況而被創作者，其目的係提供， 能夠不損傷晶片狀電子零件地，將晶片狀電子零件以射銷 推出，同時防止灰塵從貫通孔侵入之製造載具帶的紙製載 具帶之製造方法。 經濟部智慧財產局員工消費合作社印製 丨.---------—— (請先閱讀背面之注意事項再填寫本頁) f. 本發明，係一種紙製載具帶之製造方法，其特徵爲， 具備在紙製載具帶基材，將貫通孔在紙製載具帶基材的厚 度方向開孔之第1工程，和由於將穿孔器推到貫通孔上， 在紙製載具帶基材的貫通孔上成形晶片收容凹部，同時由 紙製載具帶基材之一部份封閉貫通孔而成形紙製載具帶之 第2工程的紙製載具帶之製造方法。 本發明之特徵，係在第1工程成形貫通孔時，同時在 紙製載具帶基材的厚度方向將載具帶移送用孔開孔，而在 第2工程，以載具帶移送用孔做爲基準把晶片收容凹部成 形的紙製載具帶之製造方法。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -8 - 511428 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（6) 本發明係一種紙製載具帶之製造方法，其特徵爲，在 第2工程所使用的穿孔器，係桿狀且在前端有對桿軸直角 之平面。 本發明，係一種紙製載具帶之製造方法，其特徵爲， 在第2工程’由以穿孔器被延伸的紙製載具帶基材，將貫 通孔完全封閉。 本發明，係一種紙製載具帶之製造方法，其特徵爲， 在第2工程被成形的晶片收容凹部，係從在晶片收容凹部 的平面形狀之重心至晶片收容凹部的平面形狀之各外周部 爲止的距離爲不一定。 本發明，係一種紙製載具帶之製造方法，其特徵爲， 在第2工程將被成形的晶片收容凹部之平面形狀，係非_ 形。 本發明，係一種紙製載具帶之製造方法，其特徵爲， 在第1工程將被成形的貫通孔之平面形狀，係爲四角形。 本發明，係一種紙製載具帶之製造方法，其特徵爲， 將在第2工程被成形的晶片收容凹部之紙製載具帶基材的 厚度方向之深度做爲T 1，在紙製載具帶基材的厚度中， 在第2工程未被成形晶片收容凹部部份之厚度做爲T 2， 在第2工程將被成形的晶片收容凹部之口域面積做爲S 1 ，在S 1中以第1工程被成形的貫通孔之口域面積以外的 面積做爲S2，將VI做爲V1=S2(T1+T2)， 將 V2 做爲 S2 = S1 ·Τ2，將 P 做爲 P=V1/V2 時，將成爲3<p<6 _ 5者。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 11! ^ I 11 V — I (請先閱讀背面之注意事項再填寫本頁) 訂 -9- 經濟部智慧財產局員工消費合作社印製 511428 A7 B7 五、發明説明（7) 根據本發明時，將在第1工程，在紙製載具帶基材， 開貫通孔。接著在第2工程’由將穿孔器推到貫通孔上， 在紙製載具帶基材的貫通孔上成形晶片收容凹部，同時以 紙製載具帶基材之一部份把貫通孔封閉。因此，能夠將晶 片收容凹部精確度良好地成形，同時，在晶片收容凹部的 底部形成強度弱之部份，並且從晶片收容凹部的底部使孔 消失。 〔圖面之簡單說明〕 圖1 A，圖1 B係顯示在根據本發明的紙製載具帶之 製造方法的實施形態之第1工程的圖。 圖2 A，圖2 B係顯示在根據本發明的紙製_具_ & 製造方法的實施形態之第2工程的圖。 圖3係顯示將在根據本發明的紙製載具帶之^ $ 的實施形態之晶片收容凹部之底部以射銷推出的彳育丨£ & g 0 圖4，係顯示在根據本發明的紙製載具帶之3 $ 的實施形態之穿孔器的圖。 圖5 A，圖5 B係顯示習知的塑膠製載具帶g 法的圖。 圖6 A，圖6 B，圖6 C係顯示習知的紙製戰具帶之 製造方法的圖。 圖7係顯示習知的紙製載具帶之圖。 本紙張ϋ適用中國國家標準（CNS ) A4規格（210X297公釐） 一 '、——— -10- (請先閲讀背面之注意事項再填寫本頁) ·Γ4Ι!^. 511428 A7 ___B7 五、發明説明（8) 主要元件對照表 1 紙 製載 具 帶 1 a 紙 製載 具 帶 基 材 2 貫 通孔 3 晶 片收 容 凹 部 4 載 具帶 移 送 用 孔 5 ，5 a ， 5 b 穿 孔 6 承台 1 1 塑 膠製 載 具 帶 1 2 底 帶 1 3 射 銷 1 4 小孔射 銷 用 開 孔 2 0 接 縫 W 晶 片狀 電 子 零 件 (請先閲讀背面之注意事項再填寫本頁) 〔發明之實施形態〕 以下，參照圖面說明本發明之實施形態。 經濟部智慧財產局員工消費合作社印製 圖1及圖2係顯示本發明的實施形態之圖。在此圖1 係顯示紙製載具帶的製造方法之第1工程的圖，圖2係顯 示其第2工程之圖。並且，圖1 A係將在第1工程的紙製 載具帶從上方觀察之圖’圖1 B係在圖1 A的A — A部份 之斷面圖。而且，圖2 A係將在第2工程的紙製載具帶從 上方觀察之圖，圖2B係在圖2A的B — B部份之斷面g 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -11 - 511428 A7 ___B7 五、發明説明（9) 首先如圖1 A，圖1 B所示，紙製載具帶基材1 a的 厚度，係已被規格化爲0 · 3 1mm、0 . 43mm、 (請先閱讀背面之注意事項再填寫本頁) Ο · 61mm、〇 · 75mm、〇 · 95mm等，將被準 備例如規格之一的厚度Ο · 6 1 m m之紙製載具帶基材1 a。該紙製載具帶基材1 a，將在第1工程，如圖1 a， 圖1 B所示地，在其厚度方向被開孔，而成形貫通孔2。 此時貫通孔2之平面形狀係成爲四角形狀。並且，將貫通 孔2成形時，同時，將在紙製載具帶基材1 a的所希望位 置，載具帶移送用孔4將被向紙製載具帶基材1 a之厚度 方向開孔。再者，雖然貫通孔2及載具帶移送用孔4，將 分別由穿孔器5 a，5 b的冲床加工被成形，但是也可以 由其他之加工方法被成形。 經濟部智慧財產局員工消費合作社印製 接著在第2工程，如圖2 A，圖2 B所示，將穿孔器 5推在貫通孔2上，由在與承台6之間對紙製載具帶基材 1 a實施冲床加工，而在紙製載具帶基材1 a的貫通孔2 上成形晶片收容凹部3 ’同時能夠由以穿孔器5被延伸之 紙製載具帶基材1 a的一部份將貫通孔2封閉。亦即，紙 製載具帶基材1 a係與如塑膠材料之非壓縮性材料不同， 因係由壓縮性材料而成，以承台6，和被推到貫通孔2上 的穿孔器5之間被冲床加工時將容易地被壓縮，同時將沿 貫通孔2的平面形狀，從貫通孔2之周邊向中心被延伸。 此時，因貫通孔2係成平面四角形狀，紙製載具帶基材1 a將從貫通孔2的4方向向中心被延伸而互相接上，一面 形成平面X字狀之接縫2 0，而封閉貫通孔2。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -12- 511428 A7 B7 五、發明説明（d (請先閎讀背面之注意事項再填寫本頁) 如此地能夠在晶片收容凹部3的底面’形成平面X字 狀之接縫2 0。該接縫2 0，係成爲如後述地能夠以小的 力容易地分開。 可是，晶片收容凹部3係以載具帶移送用孔4做爲基 準被成形。並且’如圖4所币’爲了將晶片收谷凹部3所 用的穿孔器5，係成桿狀且在前端有對桿軸成直角之平面 ，因具有如此的形狀，故能將紙製載具帶基材1 a精確地 加工。而且，晶片收容凹部3之平面形狀，係成爲配合晶 片的四方或長方形形狀。 更且，設晶片收容凹部3的紙製載具帶基材1 a之厚 度方向的深度爲T 1，紙製載具帶基材1 a之厚度中在第 2工程未被成形晶片收容凹部3的部份之厚度爲T 2，在 第2工程將被成形的晶片收容凹部3之口域面積（平面形 狀面積）爲S 1，S 1之中除去在第1工程被成形的貫通 孔2之口域面積爲S2，V1做爲V1 = S2 (T1 + T 2 )，將 V2 做爲 V2 = S1*T2，將 /〇 做爲 P = V1/V2時，將被加工成3<p<6 . 5。 經濟部智慧財產局員工消費合作社印製 如此地，能夠製造將晶片狀電子零件W收容而搬送用 之紙製載具帶1。 如圖1A，圖1B，圖2A，圖2B所示，在第1工 程將具有比晶片收容凹部3的口域狹窄的口域之貫通孔2 在紙製載具帶基材1 a開孔後’在第2工程將在貫通孔2 上有所希望形狀的開口之晶片收容凹部3由冲床加工成形 ，故能使晶片收容凹部3成形時的附隨冲床加工之對紙製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） «13- 511428 A7 _______B7 五、發明説明（彳） (請先閲讀背面之注意事項再填寫本頁) 載具帶1 a的推壓力，向貫通孔2側避開。因此，將晶片 收容凹部3以冲床加工開孔時，不會將先前開孔的晶片收 容凹部3之側壁，如在圖7說明地壓迫，也不會使先前開 孔的晶片收容凹部3之側壁的形狀變形。 可是貫通孔2的形狀，係根據是否會在晶片收容部凹 部3之底部造成接縫而被決定。例如，貫通孔2的平面形 狀爲圓形時，雖然能夠將晶片收容凹部3底部側之貫通孔 2的開口部，在晶片收容凹部3成形時之冲床加工時封閉 ’可是因無法造成接縫2 0故將容易成爲堅固，將難以用 射銷1 3突破晶片收容凹部3的底，故具有四角形等平面 多角形狀爲理想。 並且，在第1工程，和被成形貫通孔2的同時將被開 口載具帶移送用孔4，故能精確地決定貫通孔2和載具帶 移送用孔4之相對位置。因此，在第2工程，能夠以載具 帶移送用孔4 A做爲基準，在貫通孔2上成形晶片收容凹 部3，關於晶片收容凹部3和貫通孔2之相對位置，也能 夠精確地決定。 經濟部智慧財產局員工消費合作社印製 而且，如上述地在第2工程，由晶片收容凹部3的成 形時之冲床加工被推壓的紙製載具帶基材1 a之一部份， 將把貫通孔2的開口部完全封閉，晶片收容凹部3之底部 將設有孔。此時，晶片收容凹部3的底部全域，係在承台 6和穿孔器5之間由冲床加工被壓縮，故具有超過將晶片 狀電子零件W收容支持的強度。然而，因紙製載具帶基材 1 a之原料係成爲纖維，雖然由冲床加工被推壓’推壓部 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -14- 51T42B^ A7 ____B7 __ 五、發明説明（〇 也不會如塑膠製載具帶1 1地焙著。 (請先閲讀背面之注意事項再填寫本頁) 亦即，晶片收容凹部3的底部中，晶片收容凹部3成 形時紙製載具帶基材1 a由冲床加工被向貫通孔2方向延 伸而將貫通孔2封閉的部份，紙將被延伸而被成形，比其 他之晶片收容凹部3的底部其強度變弱，更且，封閉貫通 孔2之紙製載具帶基材1 a係形成X字狀的接縫2 0。 因此，如圖3所示，將晶片狀電子零件，從晶片收容 凹部3的底部側向開口方向，以射銷1 3推出時，能夠以 射銷1 3容易地將接縫2 0弄破，將晶片狀電子零件W以 不損傷程度的微弱之力（例如〇 . 1〜〇 · 2 N程度）推 出，同時晶片收容凹部3的底面也不會粉碎。 並且，載具帶基材1 a係具有壓縮性的紙製，將晶片 收容凹部3成形時，即使把晶片收容凹部3底部側之貫通 孔2完全封閉，也能夠將正確地具有所希望深度T 1之晶 片收容凹部3成形。 經濟部智慧財產局員工消費合作社印製 而且，在晶片收容凹部3的平面形狀爲圓形時，雖然 也有可能被收容之晶片狀電子零件W移動而不被固定收容 ，可是由將晶片狀收容凹部3如四角形狀等，使從在晶片 收容凹部3的平面形狀之重心至晶片收容凹部3的外周爲 止之距離成爲不一定，能夠使晶片狀電子零件W在晶片收 容凹部3內固定，並且在晶片收容凹部3底部做成一致面 〇Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of the 1T -5- 511428 A7 B7 V. Description of the invention (3) On printed circuit boards. Therefore, the conditions of the carrier tape (i) in which the recessed portion 3 is to be formed are important. In addition, although the device will suck the wafer-shaped electronic parts by a vacuum suction device or the like, the suction is usually weak because when the wafer-shaped electronic parts are taken out from the wafer accommodating recess 3. When the wafer-shaped electronic parts are usually taken out, It is pushed out from the bottom side of the wafer accommodating recess 3 with a shooting pin 13. At this time, if the bottom of the wafer accommodating recess 3 is strong, a strong force is required for the shooting pin 13 and when the pushing force of the shooting pin 13 is too large, the wafer-like electronic component may be damaged. In addition, when the bottom of the wafer accommodating recess 3 is firm, the pushing force of the shooting pin 1 3 will be larger than the pushing force. As the bottom of the wafer accommodating recess 3 is pushed out, the crushed pieces will fly away, dispersing the wafer. When the electronic components are taken out by a vacuum suction device or the like mounted on the device, the vacuum suction device or the like may be blocked. Therefore, it is desirable to push out the wafer-shaped electronic component with a small force. For this reason, a weak portion needs to be provided at the bottom of the wafer accommodating recess 3, and the shooting pin 13 is pushed out from the weak portion. Therefore, in the carrier tape in which the recessed portion 3 is to be formed in the wafer, the condition (i i) described above becomes important. In addition, if there is a hole at the bottom of the wafer accommodating recess 3, dust may intrude from the hole, and the dust will adhere to the wafer-shaped electronic parts accommodated in the wafer accommodating recess 3, preventing the wafer-shaped electronic parts from being passed through the device Mounting to printed circuit boards, etc. Therefore, from the viewpoint of preventing dust from adhering to the wafer-shaped electronic component, the conditions of the carrier tape (i i i) for accommodating the concave portion 3 of the formed wafer are important. In particular, with the miniaturization of wafer-like electronic parts, the above (i) and this paper size apply the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the precautions on the back before filling this page) Order f Economy Printed by the Consumer Cooperatives of the Ministry of Intellectual Property Bureau-6- 511428 A7 B7 V. Conditions of Invention (4) (ii) and (iii) will become even more important. (Please read the precautions on the back before filling out this page.) In the past, the manufacturing method of the plastic carrier tape 1 1 is shown in Fig. 5 A and Figure 5 B. Since the desired wafer accommodating recess 3 can be formed with good punching accuracy using a punch, the condition (i) described above can be satisfied. In addition, if the plastic volume pressed by the punch processing to obtain the wafer receiving recess 3 of the desired depth T 1 is equal to the opening volume of the through hole 2 on the bottom side of the wafer receiving recess% 3, the wafer-free receiving recess 3 is set. Hole at the bottom. However, if the accuracy of processing and the non-compressibility of plastic are considered, the hole at the bottom of the wafer accommodating recess 3 of the through hole 2 processed by the punch will be reduced, and when the hole disappears, it will be difficult to make a wafer with the desired depth T 1 The receiving recess 3 is formed. Therefore, in order to obtain the wafer accommodating recess 3 having a desired depth T1, after the wafer accommodating recess 3 is formed, it is necessary to have a hole in the bottom of the wafer accommodating recess 3 as well. This point will not satisfy the above conditions (i i i). In addition, the plastic will be melted by the punching process when the wafer accommodating recess 3 is formed, and the bottom of the wafer accommodating recess 3 will become solid after the whole surface, and it is difficult to satisfy the above condition (i i). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs On the one hand, the conventional paper carrier tape 1, for example, the paper carrier tape 1 shown in FIG. 6A, needs to be attached to the bottom of the through hole 2 The belt 12 is affixed with a top belt to a cover portion of the through hole 2. Therefore, new materials for the bottom and top strips will be required, and the processing process will be complicated. Moreover, even if the bottom of the wafer receiving recess 3 is thin, the paper carrier tape 1 shown in FIG. 6B is processed by a punch of the formed wafer receiving recess 3, and the bottom of the fine chip receiving recess 3 is compressed and has become strong. Therefore, it is difficult to apply the Chinese National Standard (CNS) A4 specification (210X297 mm) to this paper size. -7- 511428 A7 ________ B7 V. Description of the invention (5) To meet the above conditions (i i). In addition, when the carrier tape 1 is manufactured to directly punch the wafer receiving recesses 3 on the paper carrier tape substrate 1 a, as shown in FIG. 7, when the wafer receiving recesses 3 are narrowly spaced from each other, the wafers are accommodated. When the recessed portion 3 is punched with a punch, the side wall of the wafer receiving recessed portion 3 that was previously opened will be pressed, and the shape of the side wall of the previously received wafer receiving recessed portion 3 will be deformed, which is difficult to meet the condition (i) above. In addition, the paper carrier tape 1 shown in FIG. 6C has a hole in the bottom of the wafer accommodating recess 3 and will not satisfy the above condition (i i i). [Disclosure of the Invention] The present invention was created by the author in consideration of such a situation, and its purpose is to provide a manufacturing process capable of pushing out the wafer-shaped electronic parts by ejection pins without damaging the wafer-shaped electronic parts while preventing dust from entering through the holes. Manufacturing method of paper carrier tape. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 丨 .------------- (Please read the precautions on the back before filling out this page) f. The present invention is the manufacture of a paper carrier tape The method is characterized in that it comprises a first process of making a paper carrier tape base material, opening a through hole in the thickness direction of the paper carrier tape base material, and pushing a puncher onto the through hole, Manufacture of a paper carrier tape in the second process of forming a wafer receiving recess on a through hole of a carrier tape base material, and closing the through hole by a part of the base material of the paper carrier tape. method. The feature of the present invention is that when the through hole is formed in the first process, the carrier tape transfer hole is opened in the thickness direction of the paper carrier tape substrate, and in the second process, the carrier tape transfer hole is opened. As a reference, a method for manufacturing a paper carrier tape in which a wafer receiving recess is formed. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) -8-511428 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (6) The invention is a paper carrier tape The manufacturing method is characterized in that the punch used in the second process is tied in a rod shape and has a plane at a right angle to the rod axis at the front end. The present invention relates to a method for manufacturing a paper carrier tape, which is characterized in that, in the second process, a paper carrier tape base material extended by a puncher completely closes the through holes. The present invention is a method for manufacturing a paper carrier tape, characterized in that the wafer receiving recesses formed in the second process are from the center of gravity of the planar shape of the wafer receiving recesses to the outer periphery of the planar shape of the wafer receiving recesses. The distance to the end is not necessarily. The present invention is a method for manufacturing a paper carrier tape, characterized in that the planar shape of the wafer receiving recess to be formed in the second process is non-shaped. The present invention relates to a method for manufacturing a paper carrier tape, which is characterized in that the planar shape of the through hole to be formed in the first process is a quadrangle. The present invention relates to a method for manufacturing a paper carrier tape, which is characterized in that the depth of the paper carrier tape substrate in the thickness direction of the wafer receiving recess formed in the second process is T 1, In the thickness of the carrier tape substrate, in the second process, the thickness of the unreceived wafer receiving recess is T 2, and in the second process, the area of the opening area of the formed wafer receiving recess is S 1. In S1, the area other than the area of the through hole formed in the first process is S2, VI is V1 = S2 (T1 + T2), V2 is S2 = S1 · T2, and P is P When = V1 / V2, it will become 3 < p < 6 _ 5. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 11! ^ I 11 V — I (Please read the notes on the back before filling this page) Order-9- Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printing 511428 A7 B7 V. Description of the invention (7) According to the present invention, in the first process, a paper carrier is made with a base material and a through hole is opened. Next, in the second process, the puncher is pushed onto the through hole, and the wafer receiving recess is formed on the through hole of the paper carrier tape substrate, and the through hole is closed by a part of the paper carrier tape substrate. . Therefore, the wafer accommodating recess can be formed with good accuracy, and at the same time, a weak portion can be formed at the bottom of the wafer accommodating recess, and the hole can be eliminated from the bottom of the wafer accommodating recess. [Brief Description of Drawings] Figs. 1A and 1B are diagrams showing a first process of an embodiment of a method for manufacturing a paper carrier tape according to the present invention. FIG. 2A and FIG. 2B are diagrams showing a second process of an embodiment of a paper manufacturing method according to the present invention. Fig. 3 is a diagram showing the cultivation by pushing the bottom of the wafer receiving recess of the embodiment of the paper carrier tape according to the present invention with a shooting pin. Fig. 4 is a diagram showing the paper according to the present invention. The figure of the perforator of the 3 $ embodiment of the vehicle carrier tape. 5A and 5B are diagrams showing a conventional plastic carrier tape g method. 6A, 6B, and 6C are diagrams showing a conventional method for manufacturing a paper combat belt. Fig. 7 is a diagram showing a conventional paper carrier tape. This paper is compliant with Chinese National Standard (CNS) A4 specifications (210X297 mm) I ', ——— -10- (Please read the notes on the back before filling this page) · Γ4Ι! ^. 511428 A7 ___B7 V. Invention Explanation (8) Comparison table of main components 1 Paper carrier tape 1 a Paper carrier tape substrate 2 Through hole 3 Wafer receiving recess 4 Holes for carrier tape transfer 5, 5 a, 5 b Perforation 6 Cap 1 1 Plastic carrier tape 1 2 Bottom tape 1 3 Shooting pin 1 4 Small hole shooting pin opening 2 0 Seam W Wafer-shaped electronic parts (Please read the precautions on the back before filling out this page) [Implementation mode of the invention] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Figures 1 and 2 are diagrams showing the embodiment of the present invention. Here, FIG. 1 is a diagram showing a first process of a method for manufacturing a paper carrier tape, and FIG. 2 is a diagram showing a second process thereof. Further, Fig. 1A is a view in which the paper carrier tape of the first process is viewed from above 'Fig. 1B is a cross-sectional view of the A-A part in Fig. 1A. In addition, Fig. 2A is a diagram of the paper carrier belt in the second project viewed from above, and Fig. 2B is a cross-section of part B-B of Fig. 2A. G This paper size applies the Chinese National Standard (CNS) A4. Specifications (210X297 mm) -11-511428 A7 ___B7 V. Description of the invention (9) First, as shown in Figure 1 A and Figure 1 B, the thickness of the paper carrier tape substrate 1 a has been standardized to 0 · 3 1mm, 0.43mm, (please read the precautions on the back before filling in this page) 〇 · 61mm, 〇 75mm, 〇 95mm, etc., will be prepared as one of the specifications thickness 〇 · 6 1 mm paper Manufacturing carrier tape substrate 1 a. This paper carrier tape base material 1 a will be formed in the first process, as shown in FIG. 1 a and FIG. 1 B, in the thickness direction to form a through hole 2. At this time, the planar shape of the through hole 2 is a rectangular shape. When the through hole 2 is formed, at the same time, at the desired position of the paper carrier tape substrate 1 a, the carrier tape transfer hole 4 is opened in the thickness direction of the paper carrier tape substrate 1 a. hole. Furthermore, although the through hole 2 and the carrier tape transfer hole 4 are formed by punching of the punches 5a and 5b, respectively, they may be formed by other processing methods. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and then in the second project, as shown in Fig. 2A, Fig. 2B, the punch 5 is pushed on the through hole 2, and the paper is loaded between the base 6 and the base 6. The tape substrate 1 a is punched, and a wafer receiving recess 3 ′ is formed in the through hole 2 of the paper carrier tape substrate 1 a. At the same time, the paper carrier tape substrate 1 can be extended by the punch 5. A part of a closes the through hole 2. That is, the paper carrier tape substrate 1 a is different from a non-compressible material such as a plastic material because it is made of a compressible material, and is made of a base 6 and a punch 5 pushed onto the through hole 2. When it is processed by a punch, it will be easily compressed, and at the same time, it will be extended from the periphery of the through hole 2 to the center along the plane shape of the through hole 2. At this time, since the through-holes 2 are formed in a flat quadrangular shape, the paper carrier tape substrate 1 a is extended from the 4 directions of the through-holes 2 toward the center to be connected to each other, and a plane X-shaped seam 2 is formed on one side. While closing the through hole 2. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -12- 511428 A7 B7 V. Description of the invention (d (Please read the precautions on the back before filling out this page) so that the recessed part can be accommodated in the wafer The bottom surface of 3 forms a flat X-shaped seam 20. The seam 20 is easily separated with a small force as described later. However, the wafer receiving recess 3 is a carrier tape transfer hole 4 It is formed as a reference. In addition, as shown in FIG. 4, the punch 5 used to receive the recessed portion 3 of the wafer is rod-shaped and has a plane at a right angle to the rod axis at the front end. Because of this shape, The paper carrier tape substrate 1 a can be accurately processed. In addition, the planar shape of the wafer receiving recess 3 is a square or rectangular shape that matches the wafer. Furthermore, a paper carrier tape base having the wafer receiving recess 3 is provided. The depth in the thickness direction of the material 1 a is T 1, and the thickness of the part of the paper carrier tape substrate 1 a in the second process that is not formed with the wafer receiving recess 3 is T 2. In the second process, the thickness will be Area of the formed wafer receiving recess 3 (planar shape) Product) is S1, and the area of the area excluding the through hole 2 formed in the first process is S2, V1 is V1 = S2 (T1 + T 2), and V2 is V2 = S1 * T2 When / 〇 is taken as P = V1 / V2, it will be processed into 3 < p < 6.5. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs In this way, wafer-shaped electronic components W can be manufactured for storage and transportation Paper carrier tape 1. As shown in FIG. 1A, FIG. 1B, FIG. 2A, and FIG. 2B, in the first process, a through hole 2 having a narrower mouth area than the mouth area of the wafer receiving recess 3 is provided in the paper carrier. After the substrate 1 a is opened, in the second process, the wafer accommodating recess 3 having an opening of a desired shape in the through-hole 2 is processed by a punch. Therefore, the wafer accommodating recess 3 can be formed with the punching process. Applicable to China National Standard (CNS) A4 specification (210X297 mm) for paper size. Paper «13- 511428 A7 _______B7 V. Description of invention (彳) (Please read the precautions on the back before filling this page) Carrier tape 1 a The pressing force is avoided to the side of the through hole 2. Therefore, when the wafer receiving recess 3 is punched with a punch, The side walls of the front-receiving wafer receiving recess 3 will not deform the shape of the side walls of the previously-receiving wafer receiving recess 3 as described in Fig. 7. However, the shape of the through-hole 2 depends on whether or not it will be accommodated in the wafer. The bottom of the recessed portion 3 is determined by forming a seam. For example, when the planar shape of the through hole 2 is circular, the opening portion of the through hole 2 on the bottom side of the wafer receiving recess 3 can be formed when the wafer receiving recess 3 is formed. It is closed during the punching process. However, since it cannot cause the joints 20, it will easily become strong, and it will be difficult to break through the bottom of the wafer receiving recess 3 with the shooting pins 13, so it is desirable to have a flat polygonal shape such as a quadrangle. Further, in the first process, the opened carrier tape transfer hole 4 is formed at the same time as the through hole 2 is formed. Therefore, the relative position of the through hole 2 and the carrier tape transfer hole 4 can be accurately determined. Therefore, in the second process, the wafer receiving recess 3 can be formed on the through hole 2 based on the carrier tape transfer hole 4 A, and the relative position of the wafer receiving recess 3 and the through hole 2 can be accurately determined. . Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs and, as described above, in the second process, a part of the paper carrier tape substrate 1 a which is pressed by the press processing during the forming of the wafer receiving recess 3 is to be The opening of the through hole 2 is completely closed, and a hole is provided at the bottom of the wafer receiving recess 3. At this time, the entire area of the bottom portion of the wafer accommodating recess 3 is compressed by a punching process between the base 6 and the punch 5, and thus has a strength exceeding the support for accommodating the wafer-shaped electronic component W. However, because the raw material of the paper carrier tape substrate 1 a becomes fiber, although the press is pressed by the press processing, the paper size of the press applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) -14- 51T42B ^ A7 ____B7 __ 5. Description of the invention (0 will not be baked like a plastic carrier tape 1 1 (Please read the precautions on the back before filling this page) That is, in the bottom of the wafer receiving recess 3, the wafer When the receiving recess 3 is formed, the paper carrier tape substrate 1 a is extended by punching to the through-hole 2 to close the through-hole 2. The paper is extended and formed, which is more than the other wafer receiving recesses 3. The strength at the bottom becomes weaker, and the paper carrier tape substrate 1 a closing the through hole 2 forms X-shaped seams 20. Therefore, as shown in FIG. 3, the wafer-shaped electronic component is removed from the wafer. When the bottom of the accommodating recess 3 is opened in the direction of the opening and the ejection pin 13 is pushed out, the joint 20 can be easily broken with the ejection pin 13 and the wafer-shaped electronic component W can be broken with a slight force that does not damage (for example, 〇. 1 ~ 〇 · 2 N), while pushing out the bottom surface of the wafer receiving recess 3 The carrier tape substrate 1 a is made of compressive paper. When the wafer receiving recess 3 is formed, even if the through hole 2 on the bottom side of the wafer receiving recess 3 is completely closed, it can accurately have The wafer accommodating recess 3 having a desired depth T 1 is formed. It is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs and the planar shape of the wafer accommodating recess 3 is circular, although the wafer-like electronic component W may be moved and It is not fixedly stored, but the wafer-shaped receiving recess 3 such as a quadrangular shape can make the distance from the center of gravity of the planar shape of the wafer receiving recess 3 to the outer periphery of the wafer receiving recess 3 indefinite. W is fixed in the wafer receiving recess 3, and a uniform surface is formed at the bottom of the wafer receiving recess 3.
更且，考慮射銷1 3能將晶片收容凹部3的底部順利 地突破之晶片收容凹部3的底部之強度時，P係以3 < P 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -15- 511428 A7 B7 五、發明説明（d < 6 . 5爲理想。 (請先閱讀背面之注意事項再填寫本頁) 如以上所述，根據本實施形態時，將由在紙製載具帶 基材1 a開貫通孔2的第1工程，和將穿孔器5放在貫通 孔2上，將晶片收容凹部3成形，同時將底部由紙製載具 帶基材1 a之一部份封閉貫通孔2的第2工程，把紙製載 具帶1加工，故能將晶片狀電子零件W被固定收容之所希 望形狀的晶片收容凹部3精確地成形。並且，晶片收容凹 部3的底部側之貫通孔2的開口部，係由具有壓縮性之紙 製載具帶基材1 a的一部份，在晶片收容凹部3之底部成 形強度弱的部份，同時被完全地封閉，故能將晶片收容凹 部3之底部使孔消失。 經濟部智慧財產局員工消費合作社印製 如以上所說明，將由把貫通孔向紙製載具帶基材的厚 度方向開孔之第1工程，和將穿孔器放在貫通孔上，把晶 片收容凹部成形，同時由紙製載具帶基材的一部份封閉貫 通孔之第2工程把紙製載具帶加工。因此，能夠將被固定 收容晶片狀電子零件的所希望形狀之晶片收容凹部精確地 成形，晶片狀電子零件將由裝置器被正確地捕捉。而且， 通孔的晶片收容凹部之底部側的開口部，將由具有壓縮性 之紙製載具帶基材的一部份，被完全地封閉，在晶片收容 凹部之底部成形強度弱的部份，能夠不損傷晶片狀電子零 件，而由射銷將晶片狀電子零件推出。更且，因晶片收容 凹部之底部設有孔，能夠使晶片狀電子零件在搬送中不會 附著灰塵。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -16-In addition, when considering the strength of the bottom of the wafer receiving recess 3 that the shooting pin 1 3 can smoothly break through the bottom of the wafer receiving recess 3, P is based on 3 < P This paper size applies the Chinese National Standard (CNS) A4 specification ( 210X297 mm) -15- 511428 A7 B7 5. Description of the invention (d < 6.5 is ideal. (Please read the precautions on the back before filling out this page) As mentioned above, according to this embodiment, The first process of opening a through-hole 2 in a paper carrier tape substrate 1 a, and placing a punch 5 on the through-hole 2 to shape the wafer receiving recess 3, and the bottom of the paper carrier tape substrate 1 a As part of the second process of partially closing the through hole 2 and processing the paper carrier tape 1, the wafer-shaped electronic component W can be fixedly stored in a desired shape of the wafer receiving recess 3, and the wafer receiving can be accurately formed. The opening of the through hole 2 on the bottom side of the recess 3 is a part of the base material 1 a made of a paper carrier tape having compressibility, and a weak part is formed on the bottom of the wafer receiving recess 3 and completely finished. The ground is closed, so the bottom of the wafer receiving recess 3 can be made to disappear. Printed by the Consumer Cooperative of the Ministry of Economic Affairs and Intellectual Property of the Ministry of Justice, as described above, the first process is to open a hole in the thickness direction of the substrate of the paper carrier with a through hole, and place a punch on the through hole to house the wafer. In the second step of forming the recessed portion and closing the through hole in a part of the substrate of the paper carrier tape, the paper carrier tape is processed. Therefore, a desired shape of the wafer receiving recessed portion to which the wafer-shaped electronic component is fixedly stored can be stored. The wafer-shaped electronic component will be accurately captured by the device. The opening on the bottom side of the wafer-receiving recess of the through-hole will be completely formed by a part of the substrate with a compressive paper carrier tape. The ground is closed, and a weak part is formed at the bottom of the wafer receiving recess, so that the wafer-shaped electronic part can be pushed out by a shooting pin without damaging the wafer-shaped electronic part. Furthermore, because a hole is provided at the bottom of the wafer receiving recess, the Wafer-like electronic parts will not adhere to dust during transportation. The paper size applies to China National Standard (CNS) A4 (210X297 mm) -16-