499688 A7 Β7 五、發明說明（ί ) [技術領域] 本發明係關於可變電阻器等電子元件之製造方法。 現有的殼體密封結構型的可變電阻器，係於殼體上裝 入轉子、滑動體及電阻基板等，在殼體的底部開口部塡充 環氧樹脂等密封樹脂以進行密封。該裝配作業及密封作業 係以殻體爲基準來進行，但是由於殼體是單體的樹脂成形 品，所以係呈分散狀態。 特別是對於不能適用於自動插裝機品種的作業，係由 手工加以進行，加工狀態雜處於分散的狀態下操作效率差 ，生產性低。 [發明欲解決之課題] 爲了解決這樣的問題，現有的技術中在進行裝配作業 與密封作業期間，係使用將殼體排列保持於一定位置的排 列用治具。 若係以密封樹脂來密封殼體內部之結構的電子元件時 ’將樹脂塡充於殼體的底部開口部後，加熱使樹脂固化的 話’殻體的內壓會上升將內部的空氣排出，而有在密封樹 脂中產生小孔’使該孔部分之外觀不良的情形。爲此，一 般係在密封後進行室溫固化，但是室溫固化由於需要放置 數小時’因此需要相當數量的排列用治具，投資額將影響 製造成本。 另外’排列用治具的重量也大，密封作業效率低，且 保管及搬運中亦需要採取相應的措施。 4 本紙張尺度適用中國國家標準（CNS)A4規格⑽χ 297公爱） ------------裝 (請先閱讀背面之注意事項再填寫本頁) τ —i n §mmma Mammw J ^ I n n fl— §_1 ·1 n «_1 I * 言 經濟部智慧財產局員工消費合作社印製 499688 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（〆） 因此，本發明的目的，在提供一種電子元件之製造方 法，以排除或減少排列用治具，實現降低製造成本及提高 作業效率。 [用以解決課題之方法] 爲達上述目的，本案申請專利範圍第1項之發明，係 一種電子元件之製造方法，該電子元件係於殻體的開口部 嵌合具有端子的基板所構成，其特徵在於，包括： 在與引線框架相連轉之狀態的端子上安裝基板的步驟 f 將上述引線框架安裝在組裝模具上，且以開口部對向 於基板之方式將殼體安裝在組裝模具上的步驟； 使組裝模具動作以切斷引線框架與端子的連結部，且 將基板嵌合在殼體的開口部的步驟； 將殼體向與切斷方向相反的方向壓擠，以引線框架的 一部分暫時保持殼體的外側面的步驟； 將暫時保持殼體的引線框架從組裝模具上取出的步驟 :以及 將殼體從引線框架分離的步驟。 首先，在一部分與引線框架相連結狀態的端子上安裝 基板。作爲安裝方法，可在端子上設置保持基板的部分， 亦可使端子在基板上嵌入成形。其次，將引線框架安裝在 組裝模具上，以和引線框架對向之方式安裝殼體。然而， 使組裝模具從殼體相反方向動作，以切斷引線框架與端子 5 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -----------裝--------訂----- ——聲. (請先閱讀背面之注意事項再填寫本頁) 499688 A7 ______Β7_______ 五、發明說明（々） 間的連結部，且將基板嵌合在殼體的開口部上。 接著，將殼體向與切斷方向相反之方向壓擠，以引線 框架的一部分暫時保持殼體的外側面。爲了穩定暫時保持 殼體，最好是預先形成能壓接保持殼體外側面的彈簧片及 卡止爪等。此外，亦可將引線框架與端子的連結部切斷之 後，利用該切斷部暫時保持殼體的外側面。 在將殼體暫時保持於引線框架上的狀態下，從組裝模 具上取出引線框架，搬送到下一個步驟。結束既定步驟後 ，只要將殼體從引線框架上分離，即可獲得目的之電子元 件。 一 如上述般，在組裝步驟後的搬送及操作步驟間，由於 係以引線框架兼作殻體的定位夾具，因此可排除或減少排 列用治具。而且，由於係在從引線框架上分離端子，將基 板嵌合在殼體的步驟後接著以引線框架暫時保持殼體，因 此能將殼體相對引線框架自動且準確地加以定位。而且， 由於負數個殼體（單一元件)係以連結狀態保持於一片引線 框架上，因此可自動進行搬送及密封作業，與分散狀態相 較，作業效率明顯提高。再者，由於殼體只不過暫時保持 在引線框架上，所以可從引線框架上簡單取下殼體，可以 使殼體在引線框架上保持到最後階段。 如申請專利範圍第2項般，最好是能在自組裝模具取 出暫時保持殼體的引線框架的步驟，與將殼體從引線框架 分離的步驟間，在將殻體暫時保持在引線框架上的狀態下 ，於殼體的開口部與基板之間塡充密封樹脂以進行密封的 尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 請 先 閲 讀 背499688 A7 Β7 V. Description of the Invention (Technical Field) The present invention relates to a method for manufacturing electronic components such as variable resistors. A conventional case-sealed structure-type variable resistor is a case in which a rotor, a slider, and a resistance substrate are mounted on a case, and a sealing resin such as an epoxy resin is filled in a bottom opening of the case for sealing. The assembling work and the sealing work are performed on the basis of the casing, but the casing is a single resin molded product, so it is dispersed. Especially for the operations that are not applicable to the variety of automatic insertion machines, they are performed manually, and the processing state is poor, and the operation efficiency is poor, and the productivity is low. [Problems to be Solved by the Invention] In order to solve such a problem, in the prior art, an alignment jig for holding and arranging the housings at a fixed position is used during assembly work and sealing work. If the electronic components of the structure inside the casing are sealed with a sealing resin, 'the resin is filled in the bottom opening of the casing, and the resin is cured by heating,' the internal pressure of the casing will rise, and the internal air will be discharged. There are cases where a small hole is formed in the sealing resin, and the appearance of the hole portion may be poor. For this reason, room temperature curing is generally performed after sealing. However, room temperature curing requires a few hours', so a considerable number of alignment jigs are required, and the amount of investment will affect the manufacturing cost. In addition, the weight of the arranging jig is also large, the sealing operation efficiency is low, and corresponding measures need to be taken during storage and transportation. 4 This paper size applies to China National Standard (CNS) A4 specification ⑽χ 297 public love) ------------ installed (please read the precautions on the back before filling this page) τ —in §mmma Mammw J ^ I nn fl— §_1 · 1 n «_1 I * Identified by the Consumers’ Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by 499688 Employees ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by A7 B7 5. Invention Description (〆) Therefore, the present invention The purpose of the invention is to provide a method for manufacturing electronic components to eliminate or reduce the jigs for arranging, so as to reduce the manufacturing cost and improve the operation efficiency. [Method to solve the problem] In order to achieve the above-mentioned object, the invention in the scope of patent application No. 1 of the present application is a method for manufacturing an electronic component. It is characterized in that it includes: step f of mounting a substrate on a terminal connected to the lead frame, mounting the lead frame on an assembly mold, and mounting the housing on the assembly mold such that the opening faces the substrate. Steps of operating the assembly mold to cut the connection portion between the lead frame and the terminal, and fitting the substrate to the opening portion of the housing; pressing the housing in a direction opposite to the cutting direction, and A step of temporarily holding the outer side surface of the case; a step of removing the lead frame temporarily holding the case from the assembly mold; and a step of separating the case from the lead frame. First, a board is mounted on a part of the terminals connected to the lead frame. As a mounting method, a portion holding a substrate may be provided on the terminal, or the terminal may be insert-molded on the substrate. Next, the lead frame is mounted on an assembly mold, and the housing is mounted so as to face the lead frame. However, the assembly mold is moved from the opposite direction of the housing to cut off the lead frame and the terminals. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ----------- -------- Order ----- ——Sound. (Please read the precautions on the back before filling this page) 499688 A7 ______ Β7 _______ 5. The connection between the description of the invention (々), and the substrate It fits into the opening part of a casing. Next, the case is pressed in a direction opposite to the cutting direction, and the outer surface of the case is temporarily held by a part of the lead frame. In order to stably hold the case temporarily, it is preferable to form a spring piece, a locking claw, and the like which can press-contact the outer surface of the case. Alternatively, after the connection portion between the lead frame and the terminal is cut, the outer surface of the case may be temporarily held by the cut portion. With the case temporarily held on the lead frame, the lead frame is taken out from the assembly mold, and the next step is carried. After completing the predetermined steps, as long as the case is separated from the lead frame, the intended electronic component can be obtained. As described above, since the lead frame also serves as a positioning jig for the housing between the transportation and operation steps after the assembly step, the jigs for alignment can be eliminated or reduced. Furthermore, since the terminals are separated from the lead frame, the step of fitting the substrate to the housing, and then temporarily holding the housing with the lead frame, the housing can be automatically and accurately positioned relative to the lead frame. In addition, since the negative cases (single components) are held on a single lead frame in a connected state, they can be automatically transported and sealed. Compared with the dispersed state, the operating efficiency is significantly improved. Furthermore, since the case is only held on the lead frame temporarily, the case can be simply removed from the lead frame, and the case can be held on the lead frame to the final stage. As in item 2 of the scope of patent application, it is preferable to temporarily hold the case on the lead frame between the step of taking out the lead frame temporarily holding the case from the self-assembly mold and the step of separating the case from the lead frame. Under the condition, the sealing resin is filled between the opening of the housing and the substrate for sealing. The standard of China National Standard (CNS) A4 (210 X 297 mm) is applicable. Please read the back first.
I 填胃· ί裝 頁I w I I I I I I 訂 經濟部智慧財產局員工消費合作社印製 499688 .A7 B7 五、發明說明（k ) 步驟。在將結束基板之組裝的殼體搬送至密封步驟時、或 在塡充密封樹脂後’爲進行室溫固化而長時間放置時，現 有技術係使用用來將殼體排列保持的排列用治具，但本發 明中由於係以引線框架來擔負排列用治具的角色，因此不 需排列用治具。此外’亦不需將殼體排列於排列用治具上 的作業，而能縮短作業時間。 如申請專利範圍第3項般，最好是能預先在連結部上 形成切口（notch)等之容易切斷部，以便能容易的切斷引線 框架與端子的連結部。據此，即不需在組裝模具上形成切 斷引線框架的連結部的切刀，而能簡單地切齡連結部。 如申請專利範圍第3項般，若在引線框架上與殼體相 對的兩個外側面上形成用以彈性壓接的卡止爪，即能以卡 止爪穩定的挾住殼體的兩側面，防止在搬送引線框架期間 殼體錯位或脫落。 [圖式之簡單說明] : 圖1係本發明之電子元件一例的可變電阻器的剖視圖 〇 經濟部智慧財產局員工消費合作社印製 圖2係圖1之可變電阻器在封裝前的仰視圖。 圖3係圖1之A — A線剖視圖。 圖4係圖1之可變電阻器的側視圖。 圖5係電阻基板的立體圖。 圖6係引線框架的俯視圖。 圖7係已裝配電阻基板的引線框架的俯視圖。 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 499688 A7 B7 五、發明說明 圖8係說明在殼體上裝入電阻基板之動作的剖視圖。 圖9係在引線框架上保持殼體之狀態的俯視圖及側視 圖 圖10係本發明之電子元件的另一實施例的剖視圖。 圖11係圖10的電子元件在封裝前的仰視圖。 請 先 閱 讀 背 意I Fill the stomach and fill the page I w I I I I I I Order printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 499688 .A7 B7 V. Description of the invention (k) Step. When the housing that has assembled the substrate is transported to the sealing step, or when the housing is left for a long time to cure at room temperature after being filled with the sealing resin, the prior art uses an alignment jig for keeping the housings aligned. However, in the present invention, since the lead frame is used to play the role of the jig for arranging, the jig for arranging is not necessary. In addition, the operation of arranging the casings on the alignment jig is not required, and the operation time can be shortened. As in the third item of the scope of patent application, it is desirable that an easy-to-cut portion such as a notch can be formed in the connecting portion in advance so that the connecting portion of the lead frame and the terminal can be easily cut. This eliminates the need to form a cutter for cutting the connection portion of the lead frame on the assembly mold, and allows the connection portion to be easily cut. Like item 3 of the scope of patent application, if locking claws for elastic crimping are formed on the two outer surfaces of the lead frame opposite to the case, the two sides of the case can be stably held by the locking claws. To prevent the housing from being dislocated or falling off during the transportation of the lead frame. [Brief description of the drawings]: Figure 1 is a cross-sectional view of an example of a variable resistor of the electronic component of the present invention. 0 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 2 is a bottom view of the variable resistor of Figure 1 before packaging. Illustration. Fig. 3 is a sectional view taken along the line A-A in Fig. 1. FIG. 4 is a side view of the variable resistor of FIG. 1. FIG. FIG. 5 is a perspective view of a resistance substrate. Fig. 6 is a plan view of a lead frame. FIG. 7 is a plan view of a lead frame on which a resistance substrate is mounted. 7 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 499688 A7 B7 V. Description of the invention Fig. 8 is a cross-sectional view illustrating the operation of mounting a resistor substrate on the case. Fig. 9 is a plan view and a side view of a state where a case is held on a lead frame. Fig. 10 is a cross-sectional view of another embodiment of the electronic component of the present invention. FIG. 11 is a bottom view of the electronic component of FIG. 10 before packaging. Please read it first
[符號說明] 項 1 ! m 1 殼體. 2 電阻基板 填, 寫 本 裝 3 轉子 f 4 滑動體. 頁 i 1 5 軸 6 密封#脂 1 1 I 7 引線框架 8 組裝模具 I i 1 13 開口部 21 〜23 端子 訂 a 1 72 連結部 73 卡止爪 1 1 I # [實施例] 圖1〜圖5係顯示本發明之電子元件一例的可變電阻 器。 經濟部智慧財產局員工消費合作社印製 該可變電阻器係由殼體1、電阻基板2、轉子3、滑動 體4、外部操作用的軸5等所構成。 殼體1，爲了耐焊接的熱量，能在高溫環境穩定工作 ，係用耐熱性熱塑性樹脂及熱固性樹脂等，一體形成爲底 部開口的方箱形狀。在殻體1的側面上形成有圓形的插入 孔11 ’在該插入孔11中插入可自由轉動的軸5。在軸5上 ，形成有與插入孔11貼緊並兼作防止脫落與密封的楔形環 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 x 297公釐） 499688 A7 B7 五、發明說明（v) 51。殼體1頂部設置有向下方突出的軸部12，於該軸部12 以旋轉自如之方式嵌合有轉子3上部所設之孔31。轉子3 的外側面上形成有蝸輪32，該蝸輪32與軸5上所形成的 蝸桿52相嚙合。 於轉子3的下面固定有滑動體4。本實施例中，係在 轉子3的下面設置突起部33，將滑動體4嵌合於該突起部 33，將突起33以熱鉚接固定。 經濟部智慧財產局員工消費合作社印製 電阻基板2係由樹脂及陶瓷材料等絕緣性基板所構成 ，於其上面，如圖5所示，電阻體24形成爲周.弧狀，其中 心部形成有中心電極25。滑動體4係以跨择電阻體24與 中心電極25之方式相接觸，藉滑動體4的旋轉來改變電阻 値。於電阻基板2上，以包挾基板2的兩側部的方式，固 定有三個端子21〜23。在端子21上，形成有包挾電阻基 板2兩側部的夾持部21a、及從電阻基板2的另一側部中 心位置突出向下方折彎成U字形的外部連接部21b。另外 ，在端子22、23上，亦形成有包挾電阻基板2側部的夾持 部22a、23a、及從電阻基板2的另一側部的中心位置突出 、向下方折彎成U字形的外部連接部22b、23b。此外，分 別以熔接等方法分別將端子21的夾持部21a連接於與中心 電極25相連接的電極26上，將端子22、23的夾持部22a 、23a連接於電阻體24的兩端所連接的電極27、28上。 電阻基板2嵌合在殼體1的底部開口部13上，被定位 成接觸殼體1內部形成的台階面14。又，外部連接部21b 〜23b的一部分，從殻體1的底部開口部13向外側面露出 9 成張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐） ' 499688 A7 B7 五、發明說明（) 。此外，在殼體1的底部開口部13與電阻基板2所構成的 凹部’藉塡充、固化環氧樹脂等的密封樹脂6，將電阻基 板2固定在殼體1上，且將殼體1的底部開口部13完全密 封(參照圖1)。再者，同時將固定端子21〜23確實的固定 於電阻基板2。 在由上述結構構成的可變電阻器上，用螺絲起子轉動 軸5的話’轉子3隨著轉動，滑動體4與電阻基板2上的 電阻體24的接觸位置變化，即可改變電阻値。又，由於軸 5與轉子3係藉由蝸桿52與蝸輪32相嚙合的，因此只要 不轉動軸5 ’轉子3即不會空轉，電阻不會違動。由於在 該可變電阻器的底面，以平面方式配置有端子21〜23，且 殼體1的底部係以密封樹脂6密封，因此能將可變電阻器 安裝於印刷基板等之表面。 又，可變電阻器不僅限於表面安裝型，亦也藉由在端 子上形成向下方突出的引線部，作成引線端子型的可變電 阻器。 · 其次，參照圖6〜圖8說明上述可變電阻器的製造方 法。 首先，準備圖6所示的引線框架7。該引線框架7是 將薄金屬帶鋼材衝壓加工成既定形狀，形成爲兩側具有搬 送孔71a的帶狀載子部71，其間以連結狀態形成有多數個 端子21〜2 3的部份。特別是，端子21的部分’係透過窄 幅之連接條72與作爲暫時保持部的卡止爪73相連接。在 該實施例中，卡止爪73係以一 V字形尖的一對爪形成， 10 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ------------^裝 (請先閱讀背面之注杳？事項再填寫本頁} i_l n mmme emmmm JrJ· μμι I mmm I 種 t 言 經濟部智慧財產局員工消費合作社印製 499688 A7 __________ 五、發明說明（3 ) 該等卡止爪73以端子部21爲中間，朝相對方向突出設置 。連接條72，爲了能以後述之模具容易地加以切斷，形成 有切口 72a(參照圖8的(b))。又，此階段的引線框架7上 ，雖已成形加工出各端子部21〜23的夾持部21a〜23a， •但外部連接部21b〜23b仍係與載子部71爲連接狀態。 其次，以未圖示的衝壓模具如圖7所示將各端子部21 〜23從載子部71分離出來，同時成形加工外部連接部21b 〜23b。然後，自側面（圖7的上下方向)將電阻基板2插入 夾持部21a〜23a，將電阻基板2裝配在端子芳II 21〜23上 〇 在此階段，窄幅的連接條72仍維持連結狀態。 接著，如上所述將裝有電阻基板2的引線框架安裝在 圖8所示的組裝模具8上。 組裝模具8上預先設置有收納轉子3、滑動體4及軸5 的殼體1，其上安裝裝配有電阻基板2的引線框架7。組裝 模具8，如圖(a)所示，係由壓基板用的凸模 8a與壓端子用 的凸模8b及凹模8c所構成，壓基板用的凸模8a與壓端子 用的凸模8b可以相互獨立動作。凹模8c與壓端子用的凸 模8b相對設置，支撐除引線框架7的端子部21 — 23及其 周圍部以外的部分。在凹模8c的中間部，係以其底部開口 部13朝上之方式安裝有殼體1。 其次，如圖8(b)所示，使壓端子用的凸模8b下降，在 與凹模8c之間對引線框架進行壓接保持。接著，使壓基板 用凸模8a下降，將電阻基板2壓向下方。此時，由於壓基 11 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 請 先 閱 讀 背 意 事 項▲ 再I 填i 5裝 本· 頁I I I I I I 訂 經濟部智慧財產局員工消費合作社印製 499688 A7 B7 ___ 五、發明說明（I ) 板用凸模8a的邊緣部係自後方壓連接條72的切口 72a， 因此連接條72很容易斷掉。圖8(c)係顯示更進一步的降下 壓基板用凸模8a的狀態，電阻基板2與端子部21〜23 — 起被壓進殼體1的內部。此時，在切口 72a處斷開的連接 條72被壓基板用凸模8a壓向下方，而另一方面，連接條 72的下面係被殼體1的底部開口部13所支撐，因此連接 條72的前端稍向下方彎曲。 又，當將壓基板用凸模8a下降到既定位置時，電阻基 板2即碰到殻體1內部的台階面14而停止' . 其次，圖8(d)係顯示在將壓基板用凸模^及殼體1保 持於一定高度的狀態下，使凸模8b與凹模8c —起下降的 狀態。當使凸模8b與凹模8c下降時，殼體1即相對於引 線框架7成爲被頂起的形式，藉殼體1的底部開口部使連 接條72及卡止爪73向上方撓曲，藉由對彎曲的彈性回彈 力，其前端壓接在殼體1的外側面上。因此，殼體1可藉 連接條72與卡止爪73穩定的加以保持。‘ 經濟部智慧財產局員工消費合作社印製 又’圖8(d)中雖係將殼體1保持於一定高度，使凸模 8b與凹模8c —起下降，但亦可將8b與凹模8c保持於一 定高度，而使殼體1與壓基板用凸模8a—起上升。 圖9(a)、（b)係顯示將殼體1保持在引線框架7上的狀 態下’從組裝模具8上取出的狀態。 從圖中可知，由於將連接條72夾於中間的一對卡止爪 73係壓接於殼體1的外側面，且該等連接條72及卡止爪 73係壓接於殻體〗之對向的二個側面上，因此可以穩定的 12 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) 一 " 499688 A7 _____B7 ____ 五、發明說明（θ) 保持殼體1。 另外，如果將卡止爪73的前端作成尖的，由於卡止爪 73會卡入殼體1的外側面中，因此具有進一步增加保持力 的優點。 卡止爪73的間隔卜越寬越好，例如設殼體1的寬度 爲L2時，若L2$ l/2Li，則殼體1的保持更爲穩定。 如上所述，殼體1係在保持於引線框架7上的狀態下 ，向密封步驟搬送，以將殼體1的底部開口部13塡充密封 樹脂6。塡充密封樹脂後，爲了防止在密封樹脂6中形成 i 空氣排出孔，最好進行室溫固化。此時，雖—放置於室溫 中數小時，但由於殼體1係以端子加工用的引線框架7加 以排列保持於既定位置上，因此不需另外在排列用治具上 對殼體1進行排列。是以，既可降低設備成本，同時亦不 需花費排列的麻煩。 再者，由於引線框架7的載子部71上預先形成有搬送 孔71a，因此利用該搬送孔71a可以將引線框架7準確定 位在密封裝置及其他裝置上，進而能將殼體1準確的定位 在各種裝置上。因此，能以高精度進行密封等之後段步驟 經濟部智慧財產局員工消費合作社印製 當結束密封等一系列之後段步驟後，即將殼體1從引 線框架7上加以分離。此時，由於在殼體1的外側面上僅 有壓接引線框架7的連接條72及卡止爪73，因此不必切 斷引線框架7的一部分，只要將連接條72及卡止爪73折 彎’就能將殼體1從引線框架7上簡單地分離。 13 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 499688[Explanation of Symbols] Item 1! M 1 housing. 2 Resistor substrate filling, writing pad 3 rotor f 4 sliding body. Page i 1 5 shaft 6 seal # grease 1 1 I 7 lead frame 8 assembly mold I i 1 13 opening 21 to 23 Terminals a 1 72 Connecting portion 73 Locking claw 1 1 I # [Example] Figs. 1 to 5 are variable resistors showing an example of the electronic component of the present invention. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This variable resistor is composed of a case 1, a resistance substrate 2, a rotor 3, a sliding body 4, an external operation shaft 5, and the like. In order to withstand the heat of welding, the casing 1 can work stably in a high temperature environment, and is formed into a rectangular box shape with an open bottom by using a heat-resistant thermoplastic resin and a thermosetting resin. A circular insertion hole 11 'is formed in the side surface of the casing 1, and a freely rotatable shaft 5 is inserted into the insertion hole 11. On the shaft 5, a wedge-shaped ring is formed which is in close contact with the insertion hole 11 and also serves as a protection against falling off and sealing. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (21 × x297 mm) 499688 A7 B7 V. Description of the invention ( v) 51. A shaft portion 12 protruding downward is provided on the top of the housing 1, and a hole 31 provided in the upper portion of the rotor 3 is fitted into the shaft portion 12 in a rotatable manner. A worm gear 32 is formed on the outer surface of the rotor 3, and the worm gear 32 is engaged with a worm 52 formed on the shaft 5. A sliding body 4 is fixed to the lower surface of the rotor 3. In this embodiment, a protruding portion 33 is provided on the lower surface of the rotor 3. The slider 4 is fitted to the protruding portion 33, and the protruding portion 33 is fixed by thermal caulking. The printed circuit board 2 of the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is composed of insulating substrates such as resin and ceramic materials. On the upper surface, as shown in FIG. 5, the resistor body 24 is formed in a circle. There are center electrodes 25. The slider 4 is in contact with the resistor 24 and the center electrode 25, and the resistance 改变 is changed by the rotation of the slider 4. Three terminals 21 to 23 are fixed to the resistance substrate 2 so as to cover both sides of the substrate 2. The terminals 21 are formed with clamping portions 21a that cover both sides of the resistance substrate 2 and external connection portions 21b that protrude downward from the center of the other side of the resistance substrate 2 and are bent in a U shape. In addition, the terminals 22 and 23 are also formed with clamping portions 22a and 23a that enclose the side portions of the resistance substrate 2 and protruding from the center position of the other side portion of the resistance substrate 2 and bent downward in a U shape. External connection portions 22b, 23b. In addition, the clamping portions 21 a of the terminals 21 are connected to the electrodes 26 connected to the center electrode 25 by welding or the like, and the clamping portions 22 a and 23 a of the terminals 22 and 23 are connected to both ends of the resistor 24. Connected electrodes 27, 28. The resistance substrate 2 is fitted into the bottom opening 13 of the case 1 and is positioned so as to contact a stepped surface 14 formed inside the case 1. Part of the external connection portions 21b to 23b is exposed from the bottom opening portion 13 of the housing 1 to the outside surface. 9 The scale is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). 499688 A7 B7 V. Invention Description (). In addition, in the recessed portion formed by the bottom opening portion 13 of the case 1 and the resistance substrate 2, the resistance substrate 2 is fixed to the case 1 by filling and curing the sealing resin 6 such as epoxy resin, and the case 1 is fixed. The bottom opening 13 is completely sealed (see FIG. 1). In addition, the fixed terminals 21 to 23 are surely fixed to the resistance substrate 2 at the same time. In the variable resistor constructed as described above, when the shaft 5 is rotated with a screwdriver, the 'rotator 3 rotates, the contact position of the sliding body 4 and the resistor 24 on the resistance substrate 2 changes, and the resistance 改变 can be changed. In addition, since the shaft 5 and the rotor 3 are engaged with the worm wheel 32 through the worm 52, the rotor 3 will not run idly and the resistance will not be violated unless the shaft 5 'is rotated. Since the terminals 21 to 23 are arranged in a planar manner on the bottom surface of the variable resistor, and the bottom of the case 1 is sealed with a sealing resin 6, the variable resistor can be mounted on the surface of a printed circuit board or the like. In addition, the variable resistor is not limited to a surface mount type, and a lead terminal type variable resistor is also formed by forming a lead portion protruding downward on the terminal. · Next, a method for manufacturing the variable resistor will be described with reference to FIGS. 6 to 8. First, the lead frame 7 shown in FIG. 6 is prepared. The lead frame 7 is formed by punching a thin metal strip steel into a predetermined shape, and is formed into a belt-shaped carrier portion 71 having transfer holes 71a on both sides, and a plurality of terminals 21 to 23 are formed in a connected state therebetween. In particular, the portion 21 of the terminal 21 is connected to the locking claw 73 as a temporary holding portion through a narrow connection bar 72. In this embodiment, the locking claw 73 is formed by a pair of claws with a V-shaped tip. 10 paper sizes are applicable to China National Standard (CNS) A4 (210 X 297 mm) -------- ---- ^ Installation (please read the note on the back? Matters before filling out this page) i_l n mmme emmmm JrJ · μμι I mmm I Type t Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 499688 A7 __________ V. Invention Explanation (3) The locking claws 73 are provided in the opposite direction with the terminal portion 21 as the center. The connecting bar 72 is formed with a cutout 72a for easy cutting by a mold described later (see FIG. 8 (b) )). Although the lead frames 7 at this stage have been formed with clamping portions 21a to 23a of each of the terminal portions 21 to 23, the external connection portions 21b to 23b are still connected to the carrier portion 71. Next, the terminal portions 21 to 23 are separated from the carrier portion 71 by a stamping die (not shown), and the external connection portions 21b to 23b are simultaneously formed. Then, the side portions (the up-down direction in FIG. 7) are formed. ) Insert the resistance substrate 2 into the clamping portions 21a to 23a, and mount the resistance substrate 2 to the terminals Fang 21 to 23 〇 At this stage, the narrow connection bar 72 is still connected. Next, the lead frame on which the resistance substrate 2 is mounted is mounted on the assembly mold 8 shown in FIG. 8. The assembly mold 8 is provided with a storage space in advance. The housing 1 of the rotor 3, the sliding body 4 and the shaft 5 is mounted with a lead frame 7 on which a resistance substrate 2 is mounted. The assembly mold 8 is shown in FIG. It consists of a male die 8b and a female die 8c. The male die 8a for the substrate and the male die 8b for the terminal can operate independently of each other. The female die 8c and the male die 8b for the terminal are arranged opposite each other to support the lead The terminal portions 21-23 of the frame 7 and the surrounding portions are not included. At the middle portion of the die 8c, the housing 1 is mounted with its bottom opening portion 13 facing upward. Next, as shown in FIG. 8 (b) As shown, the male die 8b for the crimp terminal is lowered, and the lead frame is crimped and held between the female die 8c and the female die 8c. Next, the male die 8a for the pressure substrate is lowered to press the resistance substrate 2 downward. At this time, because Pressure base 11 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) Please read the notes first ▲ Then I fill in 5 5th edition · Page IIIIII Order printed by the Ministry of Economic Affairs Intellectual Property Bureau employee consumer cooperative 499688 A7 B7 ___ V. Description of the invention (I) The edge of the convex die 8a for the board is from the back The cutout 72a of the connection bar 72 is pressed, so the connection bar 72 is easily broken. Fig. 8 (c) shows a further state of lowering the punch 8a for the press substrate, and the resistance substrate 2 and the terminal portions 21 to 23 are pressed together. Into the housing 1. At this time, the connection bar 72 broken at the cutout 72 a is pressed downward by the substrate pressing die 8 a, while the lower surface of the connection bar 72 is supported by the bottom opening 13 of the housing 1, so the connection bar The front end of 72 is bent slightly downward. In addition, when the punch 8a for a press substrate is lowered to a predetermined position, the resistance substrate 2 stops at the step surface 14 inside the case 1 '. Next, FIG. 8 (d) shows the punch for a press substrate. When the housing 1 is maintained at a certain height, the male mold 8b and the female mold 8c are raised and lowered together. When the male mold 8b and the female mold 8c are lowered, the housing 1 is pushed up with respect to the lead frame 7, and the connection bar 72 and the locking claw 73 are flexed upward by the bottom opening of the housing 1, The front end of the case 1 is crimped to the outer surface of the casing 1 by the elastic resilience against bending. Therefore, the housing 1 can be stably held by the connecting bar 72 and the locking claw 73. 'Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs' Although the housing 1 is maintained at a certain height in FIG. 8 (d), the male mold 8b and the female mold 8c are raised and lowered, but the 8b and the female mold can also be used. 8c is maintained at a certain height, so that the housing 1 and the die 8a for a press board are raised together. 9 (a) and 9 (b) show a state in which the case 1 is held on the lead frame 7 'from the assembly mold 8. As shown in FIG. As can be seen from the figure, a pair of locking claws 73 sandwiching the connecting bar 72 in the middle are crimped to the outer side of the housing 1, and the connecting bars 72 and the locking claw 73 are crimped to the housing. On the two opposite sides, the 12 paper sizes that can be stable are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). One " 499688 A7 _____B7 ____ 5. Description of the invention (θ) Holding the case 1 . In addition, if the front end of the locking claw 73 is made sharp, the locking claw 73 will be caught in the outer side surface of the housing 1, and therefore there is an advantage of further increasing the holding force. The wider the interval between the locking claws 73 is, the better, for example, when the width of the housing 1 is L2, if L2 $ l / 2Li, the holding of the housing 1 is more stable. As described above, the case 1 is conveyed to the sealing step while being held on the lead frame 7, so that the bottom opening 13 of the case 1 is filled with the sealing resin 6. After filling the sealing resin, in order to prevent the formation of i air vent holes in the sealing resin 6, it is preferable to perform room temperature curing. At this time, although it is left at room temperature for several hours, since the housing 1 is arranged and held in a predetermined position by the lead frame 7 for terminal processing, there is no need to separately carry out the housing 1 on the alignment jig. arrangement. Therefore, the cost of equipment can be reduced without the trouble of arranging. Furthermore, since the carrier portion 71 of the lead frame 7 has a carrying hole 71a formed in advance, the lead frame 7 can be accurately positioned on the sealing device and other devices by using the carrying hole 71a, and the housing 1 can be accurately positioned. On various devices. Therefore, subsequent steps such as sealing can be performed with high accuracy. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. After completing a series of subsequent steps such as sealing, the housing 1 is separated from the lead frame 7. At this time, since only the connecting bar 72 and the locking claw 73 of the lead frame 7 are crimped on the outer surface of the housing 1, it is not necessary to cut a part of the lead frame 7, and only the folding of the connecting bar 72 and the locking claw 73 is necessary. By bending, the casing 1 can be simply separated from the lead frame 7. 13 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 499688
經濟部智慧財產局員工消費合作社印制取 五、發明說明（（丨） 上述實施例中，雖係以可變電阻器爲例進行了說明， 但作爲本画之__子元件則報於雜電阻器。 圖10、圖11係顯示本發明的電子元件的另〜例。 loo爲殼體、1 ίο爲基板，於基板1上肷入模鑄4根 端子nl〜U4。基板110的表面形成有電路，視需要裝配 無源元件。基板110係嵌合在殼體100的底部開^部101 上，由台階面102加以定位。此外，在由殼體1〇()的底部 開口部101與基板110所構成的凹部填充密封樹脂12〇 , 並加以固化。 . : 此種電子元件之情形時’亦能與圖8同樣的進行裝配 。亦即，在端子ill〜114以連接狀態形成的引線框架上插 入成形基板110，將該引線框架與殻體100安裝在圖8所 示般之組裝模具上。然後’將基板110嵌合在殼體100上 ，同時切斷引線框架的連接條’以連接條與卡止爪保持殼 體即可。 上述實施例中，爲了對殼體1的底部開口部13進行密 封，而在殼體1的底部開口部全面塡充了密封樹脂6來加 以密封，但不限於此，亦可在電阻基板2與殼體1之間形 成環形槽，在該槽中塡充密封樹脂6來加以密封。此時， 密封後電阻基板2的一部分亦露出於殻體1的底面上。 又，上述實施例中，係從殼體1的側部插入軸5，透 過蝸桿及蝸輪使該軸5與殻體1內部所設置的轉子3相嚙 合，但並不限於此，亦可在殼體1的上面設置開口部，從 該開口部露出轉子3的一部分，或與轉子3嵌合以突出— 14 ^紙張尺度適用中國國家標準（CNS)A4規格（210>< 297公釐) "'^ (請先閱讀背面之注意事項再填寫本頁) - 經濟部智慧財產局員工消費合作社印製 499688 A7 B7 五、發明說明（丨y) 體轉動的軸皆可。 上述實施例中，係將殼體暫時保持在引線框架上後， 設置在殼體的底部開口部塡充密封樹脂的密封步驟，之後 將殼體從引線框架上分離，但亦可設置密封步驟以外的各 種步驟。因，本發明的電子元件並不限於殼體底部的開口 部以密封樹脂加以密封者。 [發明效果] 由上述的說明可知：根據申請專利範圍第1項之發明 ，由於將基板從引線框架上分離，裝入殼體ΐ寺，係以引線 框架的一部分暫時保持殼體的外側面，因此分散狀態的殼 體可由引線框架來排列保持。是以，不需要排列用治具， 即使在裝入基板後有密封步驟般之需要長時間的步驟，亦 能減少排列用治具所需的設備成本，以降低製造成本。 此外，由於不需要一一將殻體排列於排列用治具，因 此具有可省去排列作業的特點。 · 再者，由於引線框架與現有的排列用治具相較重量大 幅度減少，因此可使作業更有效率。· 15 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention ((丨) In the above embodiment, although the variable resistor is used as an example, it is reported in the miscellaneous component of the picture. Resistors. Figs. 10 and 11 show another example of the electronic component of the present invention. Lo is a case, and 1 is a substrate. Four terminals n1 to U4 are molded on the substrate 1. The surface of the substrate 110 is formed. There are circuits, and passive components are assembled as needed. The substrate 110 is fitted on the bottom opening 101 of the housing 100 and positioned by the step surface 102. In addition, the bottom opening 101 and The recess formed by the substrate 110 is filled with a sealing resin 12 and cured.: In the case of such an electronic component, it can be assembled in the same manner as in FIG. 8. That is, the leads formed at the terminals ill to 114 in a connected state. The molded substrate 110 is inserted into the frame, and the lead frame and the case 100 are mounted on an assembly mold as shown in Fig. 8. Then, 'the substrate 110 is fitted on the case 100 and the lead frame connection bar is cut off' to The connecting bar and the locking claw can hold the housing. In the above embodiment, in order to seal the bottom opening portion 13 of the casing 1, the bottom opening portion of the casing 1 is completely filled with the sealing resin 6 for sealing, but it is not limited to this, and the resistance substrate 2 and An annular groove is formed between the housings 1, and a sealing resin 6 is filled in the grooves for sealing. At this time, a part of the resistance substrate 2 is also exposed on the bottom surface of the housing 1 after sealing. The shaft 5 is inserted from the side of the casing 1, and the shaft 5 is engaged with the rotor 3 provided inside the casing 1 through a worm and a worm wheel, but it is not limited to this, and an opening may be provided on the upper surface of the casing 1, A part of the rotor 3 is exposed through the opening, or it is fitted with the rotor 3 to protrude— 14 ^ Paper size applies the Chinese National Standard (CNS) A4 specification (210 > < 297 mm) " '^ (Please read the back first Please pay attention to this page and fill in this page)-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 499688 A7 B7 V. Description of the invention (丨 y) The axis of the body can be rotated. In the above embodiment, the housing is temporarily held on the lead After the frame, it is installed in the bottom opening of the casing Fill the sealing step with the sealing resin, and then separate the case from the lead frame, but various steps other than the sealing step may be provided. Therefore, the electronic component of the present invention is not limited to the opening at the bottom of the case and sealed with the sealing resin. [Effects of the Invention] According to the above description, according to the first invention of the scope of patent application, since the substrate is separated from the lead frame and installed in the case temple, the outer side of the case is temporarily held by a part of the lead frame. Therefore, the shells in the dispersed state can be arranged and held by the lead frame. Therefore, no jig for alignment is needed, and even if there is a long step like the sealing step after the substrate is installed, the number of jigs for alignment can be reduced Equipment costs to reduce manufacturing costs. In addition, since it is not necessary to arrange the casings one by one on the arranging jig, there is a feature that arranging work can be omitted. • Furthermore, since the lead frame is significantly lighter than the existing jigs for alignment, the work can be made more efficient. · 15 paper sizes are applicable to China National Standard (CNS) A4 (210 X 297 mm)