504737 A7 _B7 _____---- 五、發明說明（）504737 A7 _B7 _____---- 5. Description of the invention ()
經濟部智慧財產局員工消費合作社印製 本發明關係於用以製造半導體元件及平面顯示器之 設備，更明確地說’關係於用以在小規模，小容量之生產 群中，製造半導體元件及平面顯示器之設備。 發明背 近來，半導體元件及平面顯示器已經佔據了工業界之 大部份，因此，對半導體元件及平面顯示器之興趣愈來愈 大。因此，用以大量生產此等產品之大規模工廠對新設備 的投資已經快速地增加。 然而，因為這些大規模廠需要大規模場地及大規模生 產線，因此，實體分佈處理需要投資，製造者不能跟上消 費者有關小容量產品群之各種需求。為此，近年來，用於 小容量，小規模產品群之各種類型設備已經提出。 傳統製造半導體元件與平面顯示器之生產線的特性 是處理需要被執行在以功能為主之典型水平管理中，其中 以產品流動為主之設備群係被控制。 作為此一水平管理的代表，一薄膜液晶顯示裝置將例 示下。 第1圖為一方塊圖，顯示薄膜液晶顯示裝置之傳統製 造設備中之陣列處理。如於第1圖所示，薄膜LCD之製 造以清洗-沉積·清洗-光微影_蝕刻-剝離之順序進行，及工 嚴線係被建構，使得此等處理係被重覆地循環。 上述乏工廠生產線的大約結構將參考第2圖加以解 (請先閱讀背面之注意事項為填寫本頁) -裝 第4頁Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This invention relates to equipment used to manufacture semiconductor elements and flat-panel displays, and more specifically, 'is used to manufacture semiconductor elements and planes in a small-scale, small-capacity production group. Display equipment. BACKGROUND OF THE INVENTION Recently, semiconductor devices and flat-panel displays have occupied a large part of the industry. Therefore, interest in semiconductor devices and flat-panel displays has been increasing. As a result, the investment in new equipment by large-scale factories for mass production of these products has rapidly increased. However, because these large-scale plants require large-scale sites and large-scale production lines, physical distribution processing requires investment, and manufacturers cannot keep up with consumers' various needs for small-capacity product groups. For this reason, in recent years, various types of equipment for small-capacity, small-scale product groups have been proposed. The characteristic of traditional production lines for manufacturing semiconductor components and flat-panel displays is that processing needs to be performed in a typical level of function-oriented management, in which the product clusters are mainly controlled. As a representative of this level of management, a thin film liquid crystal display device will be exemplified. FIG. 1 is a block diagram showing an array process in a conventional manufacturing apparatus of a thin film liquid crystal display device. As shown in Fig. 1, the manufacturing of the thin film LCD is performed in the order of cleaning-deposition · cleaning-light lithography_etching-peeling, and the stringent lines are constructed so that these processes are repeatedly cycled. The approximate structure of the above production line of the factory will be explained with reference to Figure 2. (Please read the precautions on the back to complete this page)-Installation Page 4
504737 A7 五、發明說明（ 釋。首先，準製於產品架台車(未示出)上…ι(玻璃或 晶圓）係被傳送經中心承載路徑丨〇並被收納於第一生產線 的自動倉儲20a。被收納於自動倉儲2〇之產品係被傳送經 由一部件承載路徑30a並被傳送至第一製造，例如，藉由 第-生產線之裝載/卸載器40a之清洗處理。於第一處理完 成後，被處理於第一製程中之產品係藉由裝載/卸載器4〇a 所由第一生產線釋放，並經由部件承載路徑3“及中心承 載路徑而被收納於第二生產線的自動倉儲咖。處理於 第一製程中並被收納於自動倉儲2〇b的產品，在第二製程 之輸入產品處理完成後，係被傳送經一部件承載路徑3仉 並被第二生產線的裝載/卸載器4〇b所輸入至第二處理 中。隨後，產品係移動並處理於相關自動倉儲2k， 20d，…，部件承載路徑30c，30d，，及裝載/卸載器, 40d，…在連續生產線上，這係類似於第一生產線及第二 生產線者，這些處理係被重覆與循環。 然而，傳統以功能為主之水平線結構有以下問題，即 於處理間需要較多之準備時間，因此，製造時間較長。 同時，除了改良加值之處理室外，功能上，仍存在有 不必要的間接要件’例如裝載/卸載，承載，定位等。因此， 投資成本及工廠面積被增加及生產成本的增加。 同時，如上所述，傳統工廠線係有利於大量生產，但 並不適用於小規模小容量產品群。 第5頁 (請先閱讀背面之注意事項為填寫本頁) »!裝 kaj· 經濟部智慧財產局員工消費合作社印製 504737 A7 B7 五、發明說明（ 發明目的及概述： 本發明係、解決上述問題，及因此，本㈣之目的係提 供，又備it用以小規模，小容量產品群，來製造半導體 元件及平面顯示器。 本發明之一目的係改良工 ^ ^ 糈由排除於製造半 導體元件及平面顯示器設備中之不必要的間接元件。 為了完成上述目的，依據本發明之去灰設備組合/連 接用以形成半導體及平面顯示器之處理功能之模組於同 一類型之實體分佈設備中，即例如清洗-沉積·擴散_離子摻 雜-再耦合-研磨-光微影-蝕刻·去灰-剝離-檢视·回火之處 理功能，藉以防止由於實體分佈之重製造成之生產上之損 失。 上述设備係建構以能批次處理，來自一或多層之輸入 之處理流程，以藉由於一系統中，以最小層單元，完成該 製程，以最小化於相關處理及自動倉儲間移動所需之承載 單元。 本發明之諸實施例將參考附圖加以解釋。 圖式簡單說明： 第1圖為傳統薄膜液晶顯示裝置之製造設備中之陣列處理 的方塊圖， 第2圖為傳統大規模半導體裝置及平面顯示器之製造設備 結構圖；及 第3圖為依據本發明之半導體裝置及平面顯示器之製造設 第6頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ，丨 11»!裝 (請先閱讀背面之注意事項 寫本頁) 訂· 經濟部智慧財產局員工消費合作社印製 504737 A7 B7 五、發明說明（） 備的結構圖。 圖號對照說明： 10 中央承載路徑 30a-d 部件承載路徑 100a-d 裝載/卸載器 120 機械手臂 140a-c 機械手臂 160a-b 暫存站 20a-d 自動倉错 40a-d 裝載/卸1 110 產品 130 承載路徑 150 承載路徑 (請先閱讀背面之注意事項身填寫本頁> :裝 經濟部智慧財產局員工消費合作社印製 發明詳細說明： 本發明之一較佳實施例將參考附圖作詳細解釋。 罘3圖大致顯示依據本發明之半導體元件及平面顯示 器之製造設備的結構。 如於第3圖所示，用以製造半導體裝置及平面顯示器 之設備包含多數裝載/卸載器1〇〇a，…1〇〇d，一第一機械 手臂120 ,用以由多數裝載/卸載器1〇〇a，…1〇〇d收納已 備製之產品1 10，例如一玻璃基材或一晶圓，以傳送該產 品，一第一承載路徑130,其係為一區域，該第一機械手 臂移動於其上，多數第二機械手臂14〇a，14〇b，14〇e，用 以由第一機械手臂120取產品lio，並將諸產品傳送至諸 處理，例如清洗，沉積，擴散，離子摻雜，再耦合，研磨， 光微影，蝕刻，去灰，剝離，檢視，回火等，一第二承載 路徑150 ,其係為一區域，該多數第二機械手臂移動於其 ir. 504737 A7 B7 五、發明說明（ 經濟部智慧財產局員工消費合作社印製 上，及暫存站160a，160b安排於相關第二機械手臂間， 用以防止於機械手臂間之干擾。 具有上述結構之依據本發明的製造半導體元件及平 面顯示器之設備的操作將明確地說明。例如破璃基材或晶 圓之已備製產品11 〇係被一裝載/卸載器丨〇〇a所傳送至第 一機械手臂120。第一機械手臂12〇隨後移動於第一承載 路徑130上，以將產品11〇傳送至第二機械手臂M〇a，及 第二機械手臂140a輸入產品110至第一製程的清洗處 理。於執行此一程序時，第一機械手臂12〇自裝載/卸載器 100b接收另一產品i 1〇a ,並傳送i 1〇a至第二機械手臂 140a。同時，被處理完成之被輸入至清洗處理之產品ιι〇 係被一第二機械手臂140b所輸入至下一處理，其係不相 關於由第一機械手臂12〇取產品丨1〇a。 隨後，產品110，UOa，uob，11〇c係被第一機械手 臂120所傳送在第一承載路徑13〇上，傳送至第二機械手 臂140a，藉由第二機械手臂14〇b, 14〇c所移動於第二承 載路徑150上，並被輸入至每一處理及循環地處理於每一 處理中。此生產線係藉由規劃以降低每一處理所需之不必 要時間之諸機械手臂的連續操作，加以執行。 依據本發明之製造半導體元件及平面顯示器之設備 的最大特性是沒有出現產品的情況可以被檢出，以及，產 口口的遞送，產品芡輸入至每一處理及產品的處理可以重覆 地循環，藉以連續產出已完成之產品。 於上述循環中，受到所有處理的產品不能如傳統技藝 第8頁 本紙張尺度適巾S ®家標準(CNS)A4規格（21〇 X 297公碎)" (請先閱讀背面之注意事項,填寫本頁) 裝 Ί^τ· ，線· 504737 A7 B7_ 五、發明說明（） 般地一次產出大數量。然而，當一單元處理被停止時， 傳統技藝中所有處理必須停止的缺點及必須被解決的問 題可以被避免。 依據本發明之製造半導體元件及平面顯示器之設 備，實體分佈的重覆可以藉由輸入一或多層之批次處理加 以降低，以完成相同實體分佈系統，及生產之改良及投資 成本的降低可以由於此實體分佈的降低而取得。 同時，由於實體分佈的降低之工作空間的降低，所以 可以取得整個工廠面積的降低。 -----------裝--- (請先閱讀背面之注意事項寫本頁) -線· 經濟部智慧財產局員工消費合作社印製 第9頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）504737 A7 V. Description of the invention (Interpretation. First of all, it is approved on the product rack trolley (not shown) ... ι (glass or wafer) is transferred through the central load path and is stored in the automatic storage of the first production line. 20a. The products stored in the automatic storage 20 are transferred through a component carrying path 30a and transferred to the first manufacturing, for example, by the cleaning process of the loader / unloader 40a of the first production line. The first processing is completed After that, the products processed in the first process are released from the first production line by the loader / unloader 40a, and are stored in the automatic storage container of the second production line through the component load path 3 "and the central load path. The products processed in the first process and stored in the automatic storage 20b, after the input products of the second process are processed, they are transferred through a component carrying path 3 仉 and loaded by the loader / unloader of the second production line. 4〇b is input to the second process. Then, the products are moved and processed in the relevant automatic storage 2k, 20d, ..., the component carrying path 30c, 30d, and the loader / unloader, 40d, ... on the continuous production line This is similar to those of the first production line and the second production line, these processes are repeated and recycled. However, the traditional function-oriented horizontal line structure has the following problems, that is, it requires more preparation time in the processing room, so, The manufacturing time is longer. At the same time, in addition to improving the value-added processing room, there are still unnecessary indirect elements such as loading / unloading, loading, positioning, etc. Therefore, investment costs and plant area are increased and production costs At the same time, as mentioned above, the traditional factory line is conducive to mass production, but it is not suitable for small-scale and small-capacity product groups. Page 5 (Please read the precautions on the back to fill out this page) »! Install kaj · Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 504737 A7 B7 V. Description of the invention (Objective and summary of the invention: This invention is to solve the above problems, and therefore, the purpose of this article is to provide, and it is used for small-scale, small Capacity product group to manufacture semiconductor elements and flat displays. One of the objects of the present invention is to improve the process ^ ^ 排除 excluded from manufacturing semiconductor elements and Unnecessary indirect components in a flat display device. In order to accomplish the above purpose, the ash removal device according to the present invention combines / connects modules for forming semiconductor and flat display processing functions in the same type of physical distribution device, such as, for example, Cleaning-deposition · diffusion_ion doping-recoupling-grinding-light lithography-etching · ash removal-peeling-inspection · tempering processing functions to prevent production loss due to remanufacturing due to physical distribution. The above equipment is constructed to enable batch processing, input processing from one or more layers, to complete the process with the smallest unit in a system, in order to minimize the need for related processing and automatic storage room movement The load bearing unit. The embodiments of the present invention will be explained with reference to the drawings. Brief description of the drawings: FIG. 1 is a block diagram of an array process in a manufacturing device of a conventional thin film liquid crystal display device, and FIG. 2 is a conventional large-scale semiconductor Device and flat display manufacturing equipment structure diagram; and Figure 3 is a semiconductor device and flat display manufacturing equipment according to the present invention. Page 6 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm), 11 11 !! (Please read the precautions on the back to write this page) Order · Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 504737 A7 B7 V. Description of the invention () Structure of the device. Comparative description of drawing numbers: 10 Central load path 30a-d Component load path 100a-d Loader / unloader 120 Robot arm 140a-c Robot arm 160a-b Temporary storage station 20a-d Automatic storage error 40a-d Load / unload 1 110 Product 130 load path 150 load path (please read the notes on the back first and fill out this page >: Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Detailed description of the invention: A preferred embodiment of the present invention will be described with reference to the accompanying drawings. Detailed explanation. 罘 3 shows roughly the structure of a manufacturing device for a semiconductor element and a flat display according to the present invention. As shown in FIG. 3, the device for manufacturing a semiconductor device and a flat display includes a plurality of loaders / unloaders 100. a, ... 100d, a first robotic arm 120, which is used by most loaders / unloaders 100a, ... 100d to store prepared products 1 10, such as a glass substrate or a crystal To convey the product, a first load-bearing path 130, which is an area, on which the first robot arm moves, and most of the second robot arms 14a, 14b, and 14e are used for The first robotic arm 120 Product lio, and transfer products to processes such as cleaning, deposition, diffusion, ion doping, recoupling, grinding, photolithography, etching, deashing, peeling, inspection, tempering, etc., a second load path 150, which is an area where the majority of the second robotic arm is moved by its ir. 504737 A7 B7 V. Description of the invention (printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and the temporary storage stations 160a, 160b are arranged in relevant sections The two robot arms are used to prevent interference between the robot arms. The operation of the device for manufacturing semiconductor elements and flat displays according to the present invention having the above-mentioned structure will be clearly explained. For example, glass substrates or wafers have been prepared The product 11 is transferred to the first robot arm 120 by a loader / unloader. The first robot arm 120 is then moved on the first load path 130 to transfer the product 11 to the second robot arm. M〇a, and the second robot arm 140a input the cleaning process of the product 110 to the first process. When this procedure is executed, the first robot arm 120 receives another product i 1 from the loader / unloader 100b. 〇a, and transmit i 1〇a to the second robot arm 140a. At the same time, the processed product is input to the cleaning process, which is input to the next process by a second robot arm 140b, which is not related The product is picked up by the first robotic arm 120. Then, the products 110, UOa, uob, and 11c are transferred by the first robotic arm 120 on the first load path 13 and transferred to the second robot. The arm 140a is moved on the second load path 150 by the second robotic arms 14b, 14c, and is input to each process and cyclically processed in each process. This production line is implemented by the continuous operation of the robotic arms planned to reduce the unnecessary time required for each process. The biggest feature of the device for manufacturing semiconductor elements and flat panel displays according to the present invention is that no product can be detected, and the delivery of the mouth, the input of the product to each process and the process of the product can be repeatedly cycled. To continuously produce completed products. In the above cycle, the products subjected to all treatments cannot conform to the traditional technology. Page 8 This paper is suitable for standard S (China Household Standard) (CNS) A4 size (21 × X 297 pieces) " (Please read the precautions on the back first, (Fill in this page) Decoration ^ τ ·, line · 504737 A7 B7_ V. Description of the invention () Generally produce a large amount at a time. However, when one unit of processing is stopped, the disadvantages and problems that must be solved of all processes in conventional techniques can be avoided. According to the device for manufacturing a semiconductor element and a flat display according to the present invention, the repetition of physical distribution can be reduced by inputting one or more layers of batch processing to complete the same physical distribution system, and the improvement of production and reduction of investment costs can be caused by This entity is obtained by reducing the distribution. At the same time, due to the reduction of the physical distribution and the reduction of the working space, a reduction in the entire plant area can be achieved. ----------- Install --- (Please read the notes on the back to write this page first) -Line · Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, page 9 This paper applies Chinese national standards (CNS) A4 size (210 X 297 mm)