558545 i '發明說明（1) 發明領域： 本發明係有關於-種自動化物料傳輸系統及其 J =有關於-種利用起吊裝置之自動化物料傳輸系統及 發明說明： [習知技術說明] 料的i動傳r系、统（聰）被廣泛地應用在傳輪物 ί的各灯各業中。物料被放置在物料流程之自動化設 控制的輸送帶（conveyor)上，瘦由 夂 y ^上、！由輸送帶將物料運送至 f κ Λ aU〇n)上。拿半導體晶圓廠（wafer a )來说，放置晶圓之晶圓盒必^ ^ ^ ^ ^ ^ ^ ^ 傳送至各製程機器中以完成哕i#姻#由^輸达τ將晶®盒 晶圓盒被送回到輸送帶上並傳送^ 凡成該道製程後 另-道製程。 ，上謂送至另—製程機器上以完成 輪系: = 動製上及其他相_ ，導想晶圓廠中仍有= = ; = = 作之機械臂或其他類似的設備：員$將晶圓盒以手動操 該道製程之後再將晶圓盒以同：=程機器1 ’待完成 的動作則一直重複進行。 粟方式移回到推車上，這樣 另一種較為先進之系統為所謂之由 (Automated Guided Vehicle ， ΑΓν 、動導引車 動導引車，用來傳送晶圓盒 。該⑽是-種全自 裏程工作站上以完成相關 第4頁 〇503-7164TWF(N) ； TSMC200M109 ： nivek.ptd 558545 五、發明說明（2) 製程，但由於其行徑速度過於 業人員共用，使得晶圓廠更顯因其仃進路徑與從 代半是人力推車或AGV傳輸方式均無法滿足新 無人自動化傳輸系統的理想。 運到所明之 ’由於晶圓是一非常精緻且在後段 =品：積體電路元件從一製造到成品必須在晶：：二 積體雷ί以上的製程才能完成。更由於製程技術的提升^ 造成相當大的損失;尤其是在較多層次之金道屬製:製出 寸^』重要。因此在未來數年中，#準半導體晶圓的尺 ::將從W變成12叶且12对半導體晶圓廠即將成為主的流尺 a :，朝向具備全廠自動化之12吋半導體晶圓廠的目 疋當務之急。 ^ ^ 由於積體電路的製程日趨複雜、晶圓尺寸的增曰 人、價值亦實質地增加及較8吋晶圓盒重之1 2 4F〇Up晶圓 皿’使得作業人員更必須更加小心地搬運及處理F〇up晶圓 盒；尤其是在後段製程時。 a 、 請參照第1圖，第1圖係習知半導體晶圓廠之自動化物 料傳輸系統的上視圖，其中，晶圓盒（即物料）係藉由内 、外迴路而輸送至各工作站4〇進行相關製程作業，内迴路 為:輪送帶106，而外迴路為一高架式傳輸系統1〇7。第2A 圖係沿第1圖之線I I — U觀察而得的正視圖，第2B、2C及21) 圖係以第2 A圖的左半邊為例來說明習知傳送晶圓盒的流程558545 i 'Invention description (1) Field of the invention: The present invention relates to an automatic material transmission system and a description of the J = an automatic material transmission system and a description of the invention using a lifting device: [known technical description] iDynamics r system and system (Satoshi) are widely used in various industries of transmission wheel ί. The material is placed on a conveyor controlled by the automation device of the material flow. The weight is reduced by 夂 y ^ ,! The material is transported by a conveyor belt to f κ Λ aon. Take the semiconductor wafer factory (wafer a), the wafer box in which the wafer is placed must be transferred to each process machine to complete 哕 i #### ^^^ The wafer cassette is returned to the conveyor belt and transported ^ Fan Cheng after another process. The above mentioned is sent to another process machine to complete the gear train: = mechanical system and other phases _, I think there is still a robotic arm or other similar equipment in the wafer fab: staff $ will After the wafer cassette is manually operated in this process, the wafer cassette is processed in the same way: = process machine 1 'The actions to be completed are repeated all the time. The millet method is moved back to the cart, so another more advanced system is the so-called Automated Guided Vehicle (ΑΓν), which is used to transport the wafer box. This is a full-automatic Completion of relevant pages on the mileage workstation 〇503-7164TWF (N); TSMC200M109: nivek.ptd 558545 V. Description of the invention (2) Process, but because its travel speed is too common for industry personnel, making the fab more obvious The advancement path and the generation of semi-automatic carts or AGV transmission methods can not meet the ideals of the new unmanned automatic transmission system. Shipped to what is known 'Because the wafer is a very delicate and in the latter stage = product: integrated circuit components from The first production to the finished product must be completed in the process of crystal :: two integrated bodies and more. It also causes considerable losses due to the improvement of process technology ^ especially in the more advanced level of the gold industry system: manufacturing inch ^ 』 Important. Therefore, in the next few years, # quasi-semiconductor wafer ruler :: will change from W to 12 leaves and 12 pairs of semiconductor wafer fabs will soon become the main flow rule a: towards 12-inch semiconductor wafers with full factory automation The head of the round factory疋 Immediate priority. ^ ^ As the integrated circuit manufacturing process becomes more complex, the wafer size increases, the value also increases substantially, and it is heavier than the 8-inch wafer box, which is 1 2 4F〇Up wafer trays. Handle and handle F0up wafer cassettes more carefully; especially in the latter stage process. A. Please refer to Figure 1, which is a top view of the automated material transfer system of a conventional semiconductor wafer fab. The round box (that is, the material) is transported to the workstations 40 through internal and external circuits for related process operations. The internal circuit is a carousel 106 and the external circuit is an overhead transmission system 107. Figure 2A It is a front view taken along line II-U of Figure 1, 2B, 2C, and 21) The figure uses the left half of Figure 2A as an example to explain the process of transferring wafer cassettes.
558545 五、發明說明（3) :如第2B圖所示，高牟彳楠认 車101，首先利用高架式"傳於。，07具有—高架式傳輪 作站_上方，缺後將將晶圓盒103傳送至工 ^ …、傻將該晶圓盒i 0 3 r行作業’如第2C圖所示，待作業完畢後起作吊站;0 Y；®/103 ^ ^ ^ 06 ^ / 第2 D圖所不，利用輪谈撫彳Λ β 如 綜上所述，雖ίΐ: 6叶將曰晶门圓盒103輸送至下-站。 ^ (c c 、 12寸日日圓廠中所使用的輸送帶糸 ，（Conveyor System)已能夠在 中晶圓盒的流通量及生產量 Z二二士，7 s曰Η廠 太過龐大及佔空間（此習知技i 為Ϊ糸統本身的設計 予裝置（Hoist)因此較佔处門1) \送帶兩旁各設置一起 再多安裝-組或一組二二V置造成=^ 組輸：：系=吊裝置於已沒有多餘^的==。 5产及寬“入、η維、持12时半導體晶圓廠之3公尺 同度及寬度移入（Move In )路徑的要长。 [發明概要] ' 項缺：Πΐ?明之目的係針對於上述習知技術之各 =ϊϊ:Γί 動化物料傳輸系統（應），此 自=物料傳輸系統包括至少一高架式傳輸次系統（0ver558545 V. Description of the invention (3): As shown in Figure 2B, Gao Mounan recognized the car 101 and first transmitted it via the overhead type. ， 07 has—overhead transfer station _ above, after the absence of the wafer box 103 will be transferred to the work ^ ..., silly the wafer box i 0 3 r line operation 'as shown in Figure 2C, after the completion of the operation Starting crane station; 0 Y; ® / 103 ^ ^ ^ 06 ^ / Figure 2 D does not use round talk to touch 彳 Λ β As mentioned above, although ΐ: 6 leaves will be transferred to the crystal door round box 103 Go down-stop. ^ (cc, Conveyor System used in the 12-inch Japanese Yen plant, (Conveyor System) has been able to circulate and produce in the middle of the wafer box. Z 22, 7 s said the plant is too large and takes up space (This know-how i is the design of the system itself (Hoist), so it takes up a lot of space.) \ Set up each side of the belt and install more-a group or a group of two or two V sets = ^ Group input: : Department = Hanging device has no extra ^ ==. 5 production and width "in, η dimension, holding at 12 o'clock in the semiconductor wafer fab 3 meters with the same degree and width of the move (Move In) path is longer. [ Summary of the invention] 'Item defect: The purpose of the 系 is to address each of the above-mentioned conventional technologies = ϊϊ: Γί Dynamic material transmission system (should), this self-material transmission system includes at least one overhead transmission sub-system (0ver
Transportation，0HT)、至少一伸展機械臂 I Stretch Robot )、至少一升降姑班 ^ (TAG ID Reader) ^ ^ ^ ^ ^ ^ 爽鉗0其中高架式傳輸 係用來傳送、接收以及放置物料到伸展機械臂上， 固疋夾鉗係在伸展機械臂上用來夹住及固定物料，條碼讀Transportation (0HT), at least one stretching robot arm (I Stretch Robot), at least one lifting robot ^ (TAG ID Reader) ^ ^ ^ ^ ^ ^ Cooling tongs 0 where the overhead transmission system is used to transfer, receive and place materials to stretch On the robot arm, the solid clamp is attached to the extension robot arm to clamp and fix the material.
558545 五、發明說明（4) :器係用來讀取物料上之條碼藉以得知物 進度及相關資m，而升降裝置將物料運送到輸^上製転 藉由上述之本發明，高度較高的 鈐$ 實質地增加晶圓廠的空間、提高曰圓二，輸送帶糸統能 上所能儲存FOUP晶圓盒的數量、二持3公暫存式輸送帶 度的移入路徑及只需安裝一伸桿及_A向度及3公尺寬 ”成本花廣，因此使整個晶圓“生= = : = 地提高，，本發明亦適合安裝在 文顯者 中，因為高架式傳輸系統（0HT )防撞貞 曰曰囫廠空間 為15公分。 防禮偵測器之偵測範圍 實施例說明： 請參閱第3圖，第3圖係依據本發明之 輸系統的上視圖，纟中，晶圓盒（即物料:盒= 迴：而輸送至各工作站5。來進行相關製程作業：：路二 =送帶306，而外迴路為-高架式傳輸系統3()4。第4路圖為 係/口第3圖之線I V_ IV觀察而得的正視圖， (OHT) 304包括一疋數篁之傳輸車3〇1用來 放置FOUP晶圓盒30 3。伸展機械臂30 8可仲展搔收及 (請參閱第4圖的右半邊）以接收由傳輸_ 晶圓盒303 ’該伸展機械臂30 8具有—固定來 :來失住及固定住FOUP晶圓盒30 3。條碼讀取 讀取FOUP晶圓盒30 3上之條碼’藉以得知F〇Up晶圓各m 批號、製程進度以及相關資訊。纟本發明之自動化' 傳輸系統的中央設置有數個升降裂置3Q() ’而每—升降裝- 558545 五、發明說明（5) 置300包括一可旋轉的伸縮桿31〇、以及一起吊裝置3〇9連 結於该伸縮桿31 〇，因此每一升降裝置3 〇 〇可以同時處理左 右兩側的晶圓盒30 3，將完成該段製程之FOUP晶圓盒30 3從 工作站50移至暫存式輸送帶306上。暫存式輸送帶3 〇6係用 來傳送、接收及儲存FOUP晶圓盒303。 接下來詳細說明本發明之自動化晶圓盒傳輸系統之作 業流程：高架式傳輸系統（OHT ) 30 4之高架式傳輸車30 i 將一FOUP晶圓盒運送至工作站上方。該傳輸車3〇1接著降 下該FOUP晶圓盒303至工作站上。其中該工作站包括一伸 展機械臂308、一固定夾甜307及一條碼讀取器305。當傳 輸車301將FOUP晶圓盒303放置於上述伸展機械臂308時， 固定夾钳307夾住並固定在伸展機械臂308上的FOUP晶圓盒 3〇3。然後待FOUP晶圓盒303穩定地被夾住及固定後，條碼 讀取器30 5開始讀取FOUP晶圓盒3 03上之條碼藉以得知F〇up 晶圓盒303之批號、製程進度及相關資訊。在F0UP晶圓盒 303上之條碼被讀取後，承載著F〇up晶圓盒303的伸展機械 臂308向前伸展至一預定位置。 在伸展機械臂3 0 8向前伸展至一預定位置後，即鬆開 該FOUP晶圓盒303。接下來，升降裝置中之起吊裝置3〇9下 降至一預定位置並將FOUP晶圓盒303夾住並固定，使得起 吊裝置309得以穩定地吊起FOUP晶圓盒30 3。 接著’起吊裝置3 0 9以9 0度順時針或逆時針方向沿著 伸縮桿3 1 0旋轉，然後並上升至一預定高度。當該起吊装 置309抵達至一預定高度後再以90度逆時針或順時針方向558545 V. Description of the invention (4): The device is used to read the bar code on the material to know the progress of the material and related information, and the lifting device transports the material to the system. With the invention described above, the height is relatively high.钤 $ substantially increases the space of the fab, increases the number of rounds, the number of FOUP wafer boxes that can be stored on the conveyor belt system, the moving path of the second holding 3mm temporary storage belt, and only installation The cost of an extension rod and _A dimension and 3 meters width is wide, so that the whole wafer is improved. The invention is also suitable for installation in cultural displays, because the overhead transmission system (0HT The anti-collision Zhen said that the factory space was 15 cm. Example of the detection range of the anti-ceremony detector: Please refer to FIG. 3, which is a top view of the conveying system according to the present invention. In the middle, the wafer box (ie, material: box = back: and conveyed to Each work station 5. Comes to carry out the relevant process operations :: Road 2 = Belt Conveyor 306, and the external circuit is-Overhead Transmission System 3 () 4. The 4th road picture is the line I V_ IV observation of the line / port 3 In the front view, (OHT) 304 includes a number of transport vehicles 3101 for placing the FOUP wafer cassette 30 3. The extension robot arm 30 8 can be retracted (see the right half of Figure 4) To receive by the transfer_ wafer box 303 'The extension robot arm 30 8 has-fixed to: to lose and fix the FOUP wafer box 30 3. Bar code reading reads the barcode on the FOUP wafer box 30 3' Learn the lot number, process progress and related information of the F〇Up wafer. 自动化 The center of the automatic transmission system of the present invention is provided with several lifting and splitting 3Q () 's, and each-lifting equipment-558545 V. Description of the invention (5 ) Unit 300 includes a rotatable telescopic rod 31o, and a hoisting device 309 connected to the telescopic rod 31o, so each lift Set 300 can handle the left and right wafer cassettes 30 3 at the same time, and move the FOUP wafer cassettes 30 3 that have completed the process from the workstation 50 to the temporary storage belt 306. The temporary storage belt 3 006 It is used to transmit, receive and store FOUP wafer cassettes 303. Next, the operation flow of the automated wafer cassette transfer system of the present invention will be described in detail: the overhead transfer system (OHT) 30 4 and the overhead transfer vehicle 30 i will be a FOUP The wafer cassette is transported above the workstation. The transfer vehicle 301 then lowers the FOUP wafer cassette 303 onto the workstation. The workstation includes an extension robot 308, a clip 307, and a code reader 305. When When the transfer cart 301 places the FOUP wafer cassette 303 on the extension robotic arm 308, the fixing clamp 307 clamps and fixes the FOUP wafer cassette 303 on the extension robotic arm 308. Then, the FOUP wafer cassette 303 is stabilized. After being clamped and fixed, the barcode reader 30 5 starts to read the barcode on the FOUP wafer box 3 03 to learn the batch number, process progress and related information of the F0up wafer box 303. At the F0UP wafer box 303 After the above barcode is read, it carries the F0up wafer cassette 303 The extension robot arm 308 is extended forward to a predetermined position. After the extension robot arm 308 is extended forward to a predetermined position, the FOUP wafer cassette 303 is released. Next, the lifting device 309 in the lifting device is lifted. Lowered to a predetermined position and clamped and fixed the FOUP wafer cassette 303, so that the lifting device 309 can stably lift the FOUP wafer cassette 30 3. Then, the 'lifting device 309' is clockwise or counterclockwise at 90 degrees Rotate along the telescopic rod 3 1 0, and then rise to a predetermined height. After the hoisting device 309 reaches a predetermined height, it is rotated counterclockwise or clockwise at 90 degrees.
0503-7164TWF(N) ； TSMC200M109 ； nivek.ptd 第8頁 5585450503-7164TWF (N); TSMC200M109; nivek.ptd page 8 558545
沿著伸縮 帶306上 此外 所提及之 Seismic 抗地震振 以將其縮 到的高架 的動作、 制的。 桿3 10回轉並將趵肝晶圓盒303放置在暫存式輸送 u最後，起吊裝置3 09並回復到其原始位置。 ，為了防止FOUP晶圓盒303掉落的可能性，前面 起吊裝置309以及伸展機械臂3〇8必須能夠通過 Zone 4測試。所謂的Seismic z〇ne 4測試為一種 動檢測。前面所提及之伸縮桿3丨〇在必要時候可 :η寺晶圓廠3公尺的高度。以及，前面所提 ^傳輸糸統、暫存式輸送帶306及伸展機械臂1〇2 協調及溝通是經由一物料控制系統（Mcs)所控 本發明在左右兩側輸送帶之間僅設置一組升降 ::能減少佔據空fB1，使得本發明之晶圓廠空間是相當寬 ::’並不像一般習知技術的空間是較狹窄的，因此：用 J發明的半導體晶圓廠的工程師以及相關 當舒適的工作環境。 貝育b有相 種則開式晶圓盒（Front 其係為一種先進之12吋晶 本發明實施例之晶圓盒為一 Opening Unified Pod ? FOUP ) 圓廠專用晶圓盒。Along the telescopic belt 306, the above mentioned Seismic anti-seismic action to shrink it to the elevated movement is made. The lever 3 10 is rotated and the liver wafer cassette 303 is placed in the temporary storage mode. Finally, the device 3 09 is lifted and returned to its original position. In order to prevent the possibility of the FOUP wafer cassette 303 from falling, the front lifting device 309 and the extension robot 308 must pass the Zone 4 test. The so-called Seismic zone 4 test is a kind of dynamic detection. The telescopic pole 3 丨 〇 mentioned above can be 3 meters high in η Temple Wafer Factory when necessary. And, the aforementioned transmission system, temporary storage belt 306, and extension robotic arm 102 are coordinated and communicated through a material control system (Mcs). The present invention provides only one between the left and right conveyor belts. Group lift :: Can reduce the occupied space fB1, so that the fab space of the present invention is quite wide :: 'It is not as narrow as the conventional technology, so the engineer of the semiconductor fab invented by J And related when comfortable working environment. Beiyub has the following types of open-type wafer cassettes (Front is an advanced 12-inch crystal) The wafer cassettes of the embodiment of the present invention are an Opening Unified Pod (FOUP) wafer wafer cassettes.
藉由上述之本發明，可使整個晶圓廠的生 此顯著地提高。高度較習知技術高的暫存 實質地增加晶圓廠空間並提高晶圓廠在暫 能儲存F0UP晶圓盒的數量’維持晶圓廠移入路彳^帶八上j 尚度及寬度的需求’不像習知需使用一條輸及a 吊裝置’本發明只需安裝-組伸縮桿及起吊裝UWith the invention described above, the performance of the entire fab can be significantly improved. Temporary storage with a higher height than the conventional technology substantially increases the fab space and increases the number of F0UP wafer boxes that can be temporarily stored in the fab. 'Maintains the fab moving into the road. 'Unlike the conventional need to use a delivery and a lifting device' the present invention only needs to be installed-set of telescopic rods and lifting U
558545 五、發明說明（7)558545 V. Description of Invention (7)
FjUP晶圓盒傳送至暫存式輸送帶上並因此節省相當的成本 Γ ί二f ΐ ’本發明亦適合安裝在狹窄空間的晶圓廠中， 15公分。 糸統（0ΗΤ)其防撞偵測器之偵測範圍為 雖然本發明已以齡^去香 限定本發明，*何熟習此露：上：然其並非用以 神和範圍内，當可作更動與潤二 在不脫離本發明之精 當視後附之申請專利範圍^界去=此本發明之保護範圍 省'為準。 第10頁 0503-7164TWF(N) ； TSMC200M109 ； nivek.ptd 558545 圖式簡單說明 ^為讓本發明之上述目的、特徵、和優點能更明顯易 懂，下文特舉較佳實施例，並配合所附圖式，作詳細說明 如下： 第1圖係習知半導體晶圓廠之自動化物料傳輸 上視圖； J ^ 第2 A圖係沿第i圖之線f丨—丨j觀察而得的正視圖，· μ ¥第Μ 2〔及2 D圖係以第2 Α圖的左半邊為例來說明習知 傳送晶圓盒的流程； 視 圖；第3圖係依據本發明之自動化晶圓盒傳輸系統的上 第4圖係沿第3圖之線IV_IV觀察 符號說明： T岡止矾圃 40 、5 0〜工作站； 101 ' 30卜 ^高架式 傳 車； 103 〜晶圓 盒； 105 、309〜起吊裝 置 • 106 、30 6〜輸送帶 107 、304〜高架式 傳 輸 系統； 300 〜升降 裝置； 303 〜FOUP 晶圓盒； 305 〜條碼 讀取器； 307 〜固定 夾鉗； 308 〜伸展 機械臂； 310 〜伸縮 桿。 0503-7164TWF(N) ; TSMC2001-1109 ; nivek.ptd 第11頁The FjUP wafer cassette is transferred to a temporary storage belt and thus saves considerable costs. Γ ί 二 f ΐ ′ The present invention is also suitable for installation in a narrow space fab, 15 cm. The detection range of the system (0ΗΤ) of its anti-collision detector is that although the present invention has limited the present invention with age ^ deodorization, * how to familiarize yourself with this disclosure: top: but it is not used within the scope of God and can be used as Modifications and Runji will not deviate from the spirit of the present invention as the scope of the attached patent application = the scope of protection of the present invention shall prevail. Page 10503-7164TWF (N); TSMC200M109; nivek.ptd 558545 Schematic illustration ^ In order to make the above-mentioned objects, features, and advantages of the present invention more obvious and understandable, the following exemplifies preferred embodiments and cooperates with all The drawings are described in detail as follows: FIG. 1 is a top view of the automated material transfer of a conventional semiconductor wafer fab; J ^ FIG. 2 A is a front view observed along line i in FIG. I Figures μ μ 2 and 2 D use the left half of Figure 2 A as an example to explain the process of transferring wafer cassettes in a conventional manner; View; Figure 3 is an automated wafer cassette transfer system according to the present invention The above 4th figure is a description of the observation symbols along the line IV_IV of the 3rd figure: T Gangzhi alum garden 40, 50 ~ workstations; 101 '30b ^ overhead transfer car; 103 ~ wafer box; 105, 309 ~ lifting Device 106, 30 6 to conveyor belt 107, 304 to overhead conveyor system; 300 to lifting device; 303 to FOUP wafer box; 305 to bar code reader; 307 to fixed clamp; 308 to extend robot arm; 310 ~ Telescopic rod. 0503-7164TWF (N); TSMC2001-1109; nivek.ptd p. 11