TW201833013A - Transport system and method - Google Patents

Abstract

A transport system includes a load port, a plurality of first rails, a horizontal movable device, a lift, at least one second rail, and a first buffer stage. The load port is disposed adjacent to a machine relating to semiconductor processes. A space between at least portions of the first rails is over the load port. The horizontal movable device is movably coupled to the first rails. The lift is disposed on the horizontal movable device. The second rail has successive first and second regions. The first region is under the space between the portions of the first rails, and the second region is not under the same space. The first buffer stage is movably couple to the second rail.

Description

 Transmission system and method  

Some embodiments of the present disclosure relate to a transmission system and method, and more particularly to a transmission system and method for a semiconductor factory.

As technology grows, integrated circuits are widely used in various fields, such as memory, central processing unit (CPU), liquid crystal display (LCD), light-emitting diode (LED), laser diode or The chipset, together with the promotion of the semiconductor industry boom. In the highly competitive semiconductor industry, semiconductor components must be designed and manufactured under the most efficient conditions. Traditionally, the handling of semiconductor components has been carried out manually. However, as the wafer size of semiconductor components increases and the complexity of the process increases, manual handling is gradually unable to meet the demand, and human operations are prone to errors, pollution, and speed. The situation. Therefore, the Automated Material Handling System (AMHS) has been widely used in semiconductor manufacturing plants.

In general, an automated material distribution system has an Overhead Hoist Transport System (OHTS) and multiple stockers (Stockers), or a workstation (Tool Station) to automatically receive, transfer, and place semiconductor components. Carrying device. Therefore, the automated material distribution system has the advantages of saving manpower, reducing pollution, increasing transmission speed, and the like.

According to some embodiments of the disclosure, the transmission system includes a load port, a plurality of first tracks, a horizontal moving device, an elevator, at least one second track, and a buffer stage. The load system is set on a machine associated with the semiconductor process. At least a portion of the space between the first tracks is located directly above the load. The horizontal moving device is movably coupled to the first track. The elevator is installed in a horizontal moving device. The second track has a continuous first section and a second section, the first section being directly below the space between the first rails, and the second section being positive of the space not located between the first rails Below. The first buffer stage is movably coupled to the second track.

According to some embodiments of the present disclosure, the transmission system includes a load port, a plurality of tracks, a horizontal moving device, an elevator, and a buffer stage. The load system is set on a machine associated with the semiconductor process. Each of the tracks has a continuous first section and a second section, the space between the first sections is directly above the load 埠, and the space between the second sections is not directly above the load 埠. The horizontal moving device is a mobile system coupled to the track. The elevator is installed in a horizontal moving device. The buffer stage is located directly below the space between the second sections.

According to some embodiments of the disclosure, the transmission method comprises the following steps. Determine if the load is occupied. When the load 埠 is judged to be occupied, a buffer stage is moved to a first position, and the first position is located directly above the load 埠. An object is transported to the buffer stage in the first position.

10‧‧‧Transmission system

20‧‧‧Automatic Material Transfer System

22‧‧‧Inter-machine transmission

100‧‧‧Load埠

110‧‧‧Loading Department

120‧‧‧Connecting Department

122‧‧‧Open door

130‧‧‧ Object Detection Device

200‧‧‧buffer stage

210‧‧‧Removable buffer stage

220‧‧‧Fixed buffer stage

230‧‧‧ Object Detection Device

300‧‧‧Transfer device

310‧‧‧Horizontal mobile device

320‧‧‧ Lifts

400‧‧‧ machine

410‧‧‧Connected end

412‧‧‧ access opening

510‧‧‧ 夹门

600‧‧‧ first track

700‧‧‧Bubble stage actuator

710‧‧‧First actuating unit

720‧‧‧Second actuating unit

800‧‧‧Transfer actuator

810‧‧‧First actuation module

820‧‧‧Second actuation module

830‧‧‧ Third Actuation Module

900‧‧‧second track

920‧‧‧Sliding parts

A, B, C‧‧‧ objects

D1‧‧‧ first direction

D2‧‧‧ second direction

D3‧‧‧ third direction

P1‧‧‧ first position

P2‧‧‧ second position

P3‧‧‧ third position

Read the following detailed description and the corresponding drawings to understand the various aspects of the disclosure. It should be noted that the various features in the schema do not draw actual scales based on standard practices in the industry. In fact, the dimensions of the features described can be arbitrarily increased or decreased to facilitate clarity of discussion.

1 is a perspective view of a transmission system in accordance with some embodiments of the present disclosure.

2 is a side elevational view of a transmission system in accordance with some embodiments of the present disclosure.

Figure 3 is a top plan view of a transmission system in accordance with some embodiments of the present disclosure.

4 is a flow chart of a transmission method in accordance with some embodiments of the present disclosure.

The spirit and scope of the present disclosure will be apparent from the following description of the embodiments of the present disclosure, which may be modified and modified by the teachings of the present disclosure. Depart from the spirit and scope of this disclosure. For example, the description "the first feature is formed above or above the second feature", in the embodiment, the first feature and the second feature are included in direct contact; and the first feature and the second feature are also included as indirect The contact has additional features formed between the first feature and the second feature. Moreover, the present disclosure will reuse component numbers and/or text in various examples. The purpose of the repetition is to simplify and clarify, and does not in itself determine the relationship between the various embodiments and/or the configurations in question.

The terminology used herein is for the purpose of describing the particular embodiment In the present disclosure, the singular forms "a" and "the" It is to be understood that the terms "comprises", "comprising" and "comprising" are used to mean the presence of the features, regions, integers, steps, operations, components and/or components, but do not exclude One or more of the features, regions, integers, steps, operations, components, components, and/or combinations thereof are added.

In addition, azimuth-relative vocabulary, such as "under", "below", "below", "above" or "upper" or similar words, is used herein to facilitate the description in the drawings. The relationship of one element or feature to another element or feature. Azimuthally relative terms are used to describe different orientations of the device in use or operation, except to describe the orientation of the device in the drawings. When the device is otherwise set (rotated 90 degrees or other oriented orientation), the orientation relative vocabulary used herein can also be interpreted accordingly.

In the fabrication of semiconductor components, semiconductor wafers often require tens or hundreds of processes to form the final semiconductor component. Generally, the semiconductor wafer can be stored in a wafer carrier unit, the wafer carrier unit can accommodate a plurality of semiconductor wafers, and then transmitted by an automated material handling system (AMHS), for example, for example: Automatic guided vehicle (AGV), Rail guided vehicle (RGV), Overhead Hoist Shuttle (OHS), and Overhead Hoist Transport (OHT), or Other suitable devices automatically transfer the wafer carrier unit between different process machines (devices) so that the process machine can process the semiconductor wafers in batches.

That is to say, the wafer carrier unit can be transferred between different process machines by the transmission device of the automated material distribution system. The process machine can have a corresponding workstation station that includes at least one load port that is coupled to the process machine and can be used to place or store the wafer carrier unit. However, the number of load ports on the workstation is fixed and limited, and cannot be adjusted or changed depending on the capacity or condition of the current process. Therefore, when the corresponding load ports of the process machine of the wafer carrier unit are occupied, the wafer carrier unit cannot be transferred to the process machine of the desired process and stays on the transmission device, resulting in the wafer. The load cell generates a phenomenon of "plugging", thereby increasing the residence time of the wafer carrier unit between different process machines and delaying the processing time of the semiconductor wafer in the wafer carrier unit. Here, the dwell time indicates the time taken for the semiconductor wafer to be transferred from the workstation corresponding to one process machine to the workstation corresponding to the other process machine during the manufacturing process.

In addition, the residence time of the wafer carrier unit between the processing machines also affects the production efficiency and capacity of the semiconductor fab, and when the residence time of the wafer carrier unit between the processing machines is too long, that is, When the process time of the semiconductor wafer in the wafer carrier unit is too delayed, gas impurities or particles located in the semiconductor wafer fab may contaminate the semiconductor wafer in the wafer carrier unit, especially at the end of the semiconductor wafer. Some processes become particularly susceptible to contamination.

In view of this, some embodiments of the present disclosure provide a transmission system and a method thereof, which can improve the phenomenon of traffic jam between objects (for example, a wafer carrier unit or a reticle carrier) transmitted between different process machines, and reduce The time the object is transported between different process machines.

Refer to Figure 1. 1 is a perspective view of a transmission system in accordance with some embodiments of the present disclosure. In some embodiments, the transmission system 10 includes a load cassette 100, a buffer stage 200, a transfer device 300, a plurality of first tracks 600, and at least one second track 900. The load 埠 100 is placed on the machine 400 associated with the semiconductor process. In more detail, the load port 100 is used to accommodate an object (for example, a wafer carrier unit or a mask carrier), and the load port 100 is connected to one of the terminals 410 of the machine 400 (see FIG. 2). The contents of the article are caused to be transferred to the machine 400 via the load port 100 and the connection end 410. The first rail 600 is adjacent to one side of the machine 400, and at least a portion of the space between the first rails 600 is located directly above the load cassette 100. In other words, each of the first tracks 600 has a continuous first section 602 and a second section 604 (also referred to as an extended section 604). For example, the first section 602 is coupled to the second section 604 and the two are integrally formed. The space between the first sections 602 of the first track 600 is located directly above the load cassette 100, and the space between the second sections 604 of the first track 600 is not directly above the load cassette 100. The second track 900 has a continuous first section 902 and a second section 904, and the first section 902 of the second track 900 is located directly below the space between the first sections 602 of the two first tracks 600. And the second section 904 is not directly below the space between the first sections 602 of the two first rails 600. The buffer stage 200 is for temporarily storing objects, and the buffer stage 200 can be classified into a movable buffer stage 210 and a fixed buffer stage 220. The movable buffer stage 210 is movably coupled to the second track 900. That is, the movable buffer stage 210 can be moved along the second track 900 to the space between the first sections 902 of the two second tracks 900, or to the second section 904 of the two second tracks 900. Space between. In other words, the movable buffer stage 210 can be moved to a position directly above the load cassette 100 or moved to a position not directly above the load cassette 100. The fixed buffer stage 220 is located directly below the space between the second sections 604 of the first track 600, that is, the fixed buffer stage 220 is not directly above the load cassette 100. The transfer device 300 is used to transfer the object between the position where the load cassette 100 is located and the position where the buffer stage 200 is located. Further, in some embodiments, the load cassette 100 and the buffer stage 200 can be collectively referred to as a workstation, and the workstation can store objects. That is, the article can be selectively placed on the load cassette 100 or the buffer stage 200 (the movable buffer stage 210, the fixed buffer stage 220, or both), thereby increasing the selectivity of the placement space of the object. Thus, the transport system 10 can help reduce the traffic jam between objects transported between different stations 400 and reduce the dwell time that objects travel between different stations 400.

In some embodiments, as shown in FIG. 1, the conveyor 300 can be used to transfer items between the load cassette 100 and the buffer stage 200. For example, in some embodiments, the transmitting device 300 may be in accordance with different conditions, such as the process status of the machine 400, the condition in which the load 埠 100 is occupied, the condition in which the buffer stage 200 is occupied, or the machine 400. Other related states, etc., move the object from the buffer stage 200 to the load cassette 100; or move the object from the load cassette 100 to the buffer stage 200, but the disclosure is not limited thereto. That is, the article can be placed on the load cassette 100 or the buffer stage 200 via the transfer device 300.

Refer to both Figure 1 and Figure 2. Figure 2 is a side elevational view of a transmission system in accordance with some embodiments of the present disclosure. In some embodiments, the transfer device 300 is located in the first track 600 and is movable along the first track 600. The transfer device 300 includes a horizontal moving device 310 and an elevator 320. The horizontal moving device 310 is movably coupled to the first track 600, and the elevator 320 is disposed at the horizontal moving device 310. The horizontal moving device 310 moves along the first direction D1, and the elevator 320 moves along the second direction D2, and the first direction D1 intersects the second direction D2. The first direction D1 is the longitudinal direction of the first track 600, that is, the arrangement direction of the plurality of loads 埠100. In some embodiments, the first direction D1 may be a horizontal direction, and the second direction D2 may be a vertical direction, that is, the first direction D1 and the second direction D2 are substantially perpendicular.

In some embodiments, as shown in FIGS. 1 and 2, the level at which the buffer stage 200 is located is different from the level at which the load 埠 100 is located, and the level at which the first track 600 is located is different from the buffer load. The level at which the station 200 is located. In more detail, the level at which the buffer stage 200 is located is higher than the level at which the load 埠 100 is located, and the level at which the first track 600 is located is higher than the level at which the buffer stage 200 is located. In this way, when the buffer stage 200 and the first rail 600 are installed, since the buffer stage 200 and the first rail 600 are disposed above the load cassette 100, the buffer stage 200 and the first rail 600 are mounted. It does not interfere with the operation of the load 埠100, and does not interfere with the operation of the machine 400 corresponding to the load 埠100.

For example, in some embodiments, the transmitting device 300 can be an Automatic guided vehicle (AGV), a Rail guided vehicle (RGV), and an Overhead Hoist Shuttle (OHS). , Overhead Hoist Transport (OHT), or other suitable device to automatically move objects, but the disclosure is not limited thereto.

In some embodiments, the machine 400 may have the functions of an etching process, a deposition process, a yellow process, a diffusion process, or other semiconductor processes, but the disclosure is not limited thereto. In other embodiments, the machine 400 can have a measurement or detection tool for performing semiconductor process related detection, but the disclosure is not limited thereto.

In some embodiments, the object may be a wafer carrying unit for accommodating a wafer of 300 mm (12 inch) or 450 mm (18 inch). For example, the object may be a front open wafer cassette (Front Open Unified Pods) ;FOUPs), wafer cassettes (PODs), wafer carriers, wafer carriers, or cassettes, but the disclosure is not limited thereto. In other embodiments, the object may be a reticle carrier, such as a reticle carrier, or a Reticle SMIF Pod (RSP), but the disclosure is not limited thereto.

In some embodiments, as shown in FIG. 2, the load cassette 100 has an adjacent carrier portion 110 and a connection portion 120. The carrier 110 can be used to carry the item C. The connecting portion 120 protrudes from the carrying portion 110 and communicates with the machine table 400, and can be used to transfer the contents stored in the object C to the machine 400 or receive the processed contents from the machine 400. Further, the connection portion 120 of the load port 100 is connected to one of the connection ends 410 of the machine 400. The connection end 410 includes an access port 412 that is covered by a port door 122 of the connection portion 120 of the load port 100. The opening door 122 of the connecting portion 120 includes opposite outer and inner surfaces, the outer surface is exposed to the environment of the semiconductor factory, the inner surface is connected to the access opening 412 of the connecting end 410 of the machine 400, and the inner surface is located at the machine The sealed environment of the station 400. In this way, when the content in the object C carried by the load cassette 100 is to enter the machine 400, the opening door 122 of the connecting portion 120 can be opened, so that the content in the object C can be accessed through the opening of the machine 400. 412 enters the machine 400.

For example, in some embodiments, as shown in FIG. 2, when the object C is a front open type wafer cassette, the object C may include a movable poddoor 510, the clamping door 510 and the load cassette 100. The opening door 122 is interlockable. For example, in some embodiments, the clip C of the object C has a plurality of holes above the opening door 122 of the load C, and an alignment pin corresponding to the hole is provided above the opening door 122 of the load port 100. The alignment plug of the load cassette 100 can tightly engage the hole of the clamp door 510 so that the object C and the load cassette 100 can be tightly coupled. When the content in the object C carried by the load cassette 100 is to enter the machine 400, the door 510 of the object C can be opened, and the opening door 122 of the load 埠 100 is also opened, so that the contents in the object C are The machine 400 can be accessed through the clamping door 510, the opening door 122 and the access opening 412 in sequence. For example, in some embodiments, the content in the object C may be a semiconductor wafer, or a reticle, but the disclosure is not limited thereto.

Also refer to Figures 1~3. Figure 3 is a top plan view of a transmission system in accordance with some embodiments of the present disclosure. In some embodiments, the movable buffer stage 210 can include a moving component, such as a pulley, a guide chain, a motor, or other suitable driving device, but the disclosure is not limited thereto. In some embodiments, the second rail 900 can include a slider 920 that is coupled to the movable buffer stage 210, and the slider 920 is movably coupled to the second rail 900 such that the movable buffer is loaded. The stage 210 moves along the length of the second track 900. In some embodiments, the length direction of the first track 600 intersects the length direction of the second track 900. For example, in some embodiments, the length direction of the first track 600 is substantially perpendicular to the length direction of the second track 900. Optionally, in some embodiments, the length direction of the first track 600 and the length direction of the second track 900 may be at an obtuse angle or an acute angle, but the disclosure is not limited thereto.

In some embodiments, the first track 600 is adjacent to the connection end 410 of the machine 400, and the first track 600 extends along the first direction D1 (ie, the arrangement direction of the plurality of load ports 100). In other words, the first section 602 and the second section 604 of the first track 600 are arranged along the first direction D1, and the length direction of the first section 602 of the first track 600 and the first track 600 are The lengthwise direction of the two sections 604 is substantially parallel. The second rail 900 is connected to the connecting end 410 of the machine 400, and the second rail 900 extends along a third direction D3 (that is, the direction in which the load 埠100 and the machine 400 are arranged). In other words, the first section 902 and the second section 904 of the second track 900 are aligned along the third direction D3, and the first direction D1 intersects the third direction D3. In this way, since the longitudinal direction of the first track 600 (the first direction D1) intersects with the longitudinal direction of the second track 900 (the third direction D3), the movable buffer stage 210 can be along the third direction D3 at the second Moving on the track 900, the conveying device 300 can move on the first track 600 along the first direction D1, so that the conveying device 300 and the movable buffer stage 210 can be located directly above the position of the load port 100, so that the conveying device 300 The pick-and-place operation of the object can be performed on the movable buffer stage 210.

In some embodiments, as shown in FIG. 3, the length of the first section 902 of the second track 900 is not less than the length of the movable buffer stage 210. For example, the length of the first section 902 can be greater than or equal to the length of the movable buffer stage 210 in the third direction D3. Accordingly, the movable buffer stage 210 can be completely located in the space between the first sections 902 of the second rail 900, and completely above the load cassette 100. In some embodiments, the length of the second section 904 of the second track 900 is not less than the length of the movable buffer stage 210. For example, the length of the second section 904 can be greater than or equal to the length of the movable buffer stage 210 in the third direction D3. Thus, the movable buffer stage 210 can be completely located in the space between the second sections 904 of the second track 900, completely away from the load cassette 100 directly above.

In some embodiments, the transmission system 10 further includes a buffer stage actuator 700 that is electrically connected or signaled to the movable buffer stage 210. The buffer stage actuator 700 is for controlling the movement of the movable buffer stage 210 between the first position P1 and the second position P2. The first position P1 is located directly above the load port 100, and the second position P2 is remote from the machine table 400 relative to the first position P1. In more detail, in some embodiments, the buffer stage actuator 700 includes a first actuation unit 710 that is used to actuate the movable buffer stage 210 to move such that the movable buffer stage 210 moves from the first position P1 to the second position P2. Alternatively, the buffer stage actuator 700 includes a second actuation unit 720 for actuating the movable buffer stage 210 to move such that the movable buffer stage 210 moves from the second position P2 to the first A position P1, but the disclosure is not limited thereto. In some embodiments, the first actuation unit 710 and the second actuation unit 720 can be software or firmware installed in the same actuator. In other embodiments, the first actuation unit 710 and the second actuation The moving unit 720 can also be two independent hardware devices.

In some embodiments, as shown in FIGS. 1 and 3, the transmission system 10 further includes a first actuation module 810 electrically coupled to the transmission device 300. The first actuation module 810 is configured to be used as a buffer. When the station 200 is moved to a position, the control conveyor 300 is moved to this position and stopped at this position, and this position is directly above the load cassette 100. In other words, the first actuation module 810 is configured to actuate the transfer device 300 to move and transfer the item. When the movable buffer stage 210 is to be moved from a second position P2 to the first position P1, the first actuation module 810 can assign a transmission path to the transmission device 300 and control the transmission device 300 to proceed along the transmission path. A position P1. The first position P1 is located directly above the load port 100, and the second position P2 is remote from the machine table 400 relative to the first position P1. For example, in some embodiments, when the movable buffer stage 210 is moved to the first position P1, the first actuation module 810 can control the horizontal moving device 310 of the transmitting device 300 (see FIG. 2). The first direction D1 moves to the first position P1 and stops at the first position P1. Subsequently, the first actuation module 810 can control the elevator 320 of the conveyor 300 (see FIG. 2) to move along the second direction D2, and grip and move the object located on the movable buffer stage 210, but Exposure is not limited to this.

In some embodiments, as shown in FIGS. 1 and 3, the transmission system 10 further includes a second actuation module 820 electrically coupled to the transmission device 300. The second actuation module 820 is configured to control the transfer device 300 from the first position P1 to the position where the load cassette 100 is located when the buffer stage 200 leaves the first position P1. In other words, the second actuation module 820 is configured to actuate the transfer device 300 to move and transfer the item. When the movable buffer stage 210 is moved from the first position P1 to the second position P2, the second actuation module 820 can assign a transfer path to the transfer device 300 and control the transfer device 300 along the transfer path from the first position. P1 proceeds to load 埠100. For example, in some embodiments, when the movable buffer stage 210 is to be moved from the first position P1 to the second position P2, the second actuation module 820 can control the elevator 320 of the transfer device 300 to grasp and move. When the buffer stage 210 is in the first position P1, this can move the object on the buffer stage 210. Subsequently, when the movable buffer stage 210 moves and stays to the second position P2, the second actuation module 820 can control the elevator 320 of the conveyor 300 to move along the second direction D2 such that the elevator 320 is from the first position P1. The object is moved downward to the load 埠100, thereby helping the object to move from the first position P1 of the movable buffer stage 210 and placed on the load 埠100, but the disclosure is not limited thereto.

In some embodiments, as shown in FIGS. 1 and 3, the buffer stage 200 is fixed to a third position P3, and the third position P3 is not located directly above the load cassette 100. That is, the fixed buffer stage 220 is located directly below the position where the first track 600 is located, and is not located directly above the position where the load port 100 is located. Therefore, the fixed buffer stage 220 can increase the selectivity of the space in which the object is placed without obstructing the transfer device 300 from transporting the object to the load cassette 100. In some embodiments, the transport system 10 further includes a third actuation module 830 for actuating the transport device 300 to move from the third position P3 where the fixed buffer stage 220 is located to the load 埠100. Or, the actuating and transmitting device 300 is moved from the load port 100 to the third position P3 where the fixed buffer stage 220 is located, but the disclosure is not limited thereto. In some embodiments, the movable buffer stage 210 and the fixed buffer stage 220 can coexist in the transmission system 10 to further increase the selectivity of the buffer placement space of the object.

In general, in some embodiments, the first actuation module 810, the second actuation module 820, and the third actuation module 830 can be collectively referred to as a delivery device actuator 800. The transfer device actuator 800 can be used to control the transfer device 300 to move between the buffer stage 200 (including the movable buffer stage 210 and the fixed buffer stage 220) and the load cassette 100, that is, the transfer device actuator 800 is available At least one of the horizontal moving device 310 and the elevator 320 is controlled to move. In some embodiments, the conveyor actuator 800 can be electrically connected or signaled to the conveyor 300. In some embodiments, the first actuator 710 and the second actuator 720 may be collectively referred to as a buffer stage actuator 700, and the buffer stage actuator 700 may be electrically connected or signal-connected to the slider. 920, for controlling the movement of the slider 920, so that the movable buffer stage 210 is moved to the first position P1 and the second position P2. In some embodiments, at least one of the buffer stage actuator 700 and the conveyor actuator 800 can be integrated into one or more of the computers. The processing device can be a central processor, a control element, a microprocessor, a server, or other hardware component of executable instructions. In other embodiments, at least one of the buffer stage actuator 700 and the conveyor actuator 800 can be implemented by a computer program of a computer and stored in the storage device. The storage device includes a non-transitory computer readable recording medium or other storage device. The computer program includes a plurality of program instructions, which can be executed by a central processing unit to perform the functions of the modules, but the disclosure is not limited thereto.

In some embodiments, the conveyor actuator 800 can be electrically connected or signaled to a material control system (MCS). The material control system can be connected to a plurality of host computers, and each host is connected to one or more machines 400. An instrument automation program (EAP) can be embedded in the host to transmit messages and issue commands between the material control system and the machine, thereby avoiding the possibility of collision of the transfer device 300 when transferring objects. Sex.

Refer to Figure 4. 4 is a flow chart of a transmission method in accordance with some embodiments of the present disclosure. In some embodiments, the transmission method includes the following steps. In step S10, it is judged whether or not the load port 100 is occupied. When the load 埠100 is judged to be occupied, step S20 is performed; when the load 埠100 is judged to be not occupied, step S12 is performed (to be described in more detail later). In step S20, when the load port 100 is judged to occupy, the buffer stage 200 is moved to a first position P1, and the first position P1 is located directly above the load port 100. In more detail, when the load cassette 100 does not have a space for storing articles, the movable buffer stage 210 is moved to the first position P1 to provide an object placement space. In step S30, an object is transported to the buffer stage 200 at the first position P1. In this way, when the load 埠100 is occupied, the object can be selectively placed on the buffer stage 200, thereby helping to reduce the traffic jam between the objects transmitted between the different machines 400, and reducing the transfer of objects to Residence time between different process machines.

In some embodiments, the transmission method further includes the following steps. In step S12, when the load port 100 is determined not to be occupied, the buffer stage 200 is moved to a second position P2, which is away from the load port 100 with respect to the first position P1. In step S14, the object is transferred to the load cassette 100. In this way, the object can be placed on the load cassette 100 or the buffer stage 200 according to the state of the current load 埠 100, thereby increasing the selection of the space in which the object is placed. For example, in some embodiments, the object may be a wafer carrier unit, such as: Front Open Unified Pods (FOUPs), wafer cassettes (PODs), wafer carriers, Wafer carriers, or cassettes, but the disclosure is not limited thereto. In other embodiments, the article may be a reticle carrier, such as a reticle carrier, or a Reticle SMIF Pod (RSP), but the disclosure is not limited thereto.

In some embodiments, the load port 100 further includes an object detecting device 130 for detecting whether the load port 100 is occupied by the object, and the object detecting device 130 can report the detected load state to the transmission system 10 . Similarly, the buffer stage 200 also includes an object detecting device 230 for detecting whether the buffer stage 200 is occupied by the object, and the object detecting device 230 can report the detected buffer stage status to the transmission system 10 . For example, in some embodiments, the object detecting devices 130 and 230 may include an infrared sensing device, a pressure sensing device, an optical detecting device, and a gravity sensing device, but the disclosure is not limited thereto.

In some embodiments, as shown in FIG. 1, transmission system 10 can be combined with an automated material handling system 20. The automated material transfer system 20 can include an inter-machine transfer device 22 for moving the item A from one machine to another, and the inter-machine transfer device 22 is located at the transfer device 300. Above.

For example, as shown in FIG. 1 , in some embodiments, when the inter-machine transmission device 22 moves the object A from one machine to another, if the load of the machine 400 is not 100 Occupied, the object detecting device 130 of the load port 100 transmits a load 埠 vacancy state S1 to the transport system 10 and the automated material transfer system 20. Subsequently, the inter-machine transfer device 22 moves the object A onto the load cassette 100 on the premise that the buffer stage 200 is not directly above the load cassette 100.

For example, in other embodiments, as shown in FIG. 2, when the inter-machine transfer device 22 moves the object B from one machine to the other, if the load of the machine 400 is 100, the object is The object detecting device 130 of the load 埠100, which is occupied by C, transmits a load 埠 occupation state S2 to the transmission system 10 and the automated material transfer system 20. Subsequently, the transport system 10 and the automated material transfer system 20 will ask if the buffer stage 200 is occupied. If the buffer stage 200 is not occupied, the object detecting device 230 of the buffer stage 200 transmits a buffer stage vacancy state S3 to the transmission system 10 and the automated material transfer system 20, driving the buffer stage 200 along The third direction D3 is moved to the first position P1 such that the inter-machine transfer device 22 can move the object B onto the buffer stage 200. Then, when the machine 400 is in an idle state, that is, when there is no object content (for example, a wafer) to perform a semiconductor process in the machine 400, the machine 400 returns an unloading completion message to the transmission system 10 and Automated material transfer system 20. Next, the transport device 300 of the transport system 10 can move the finished object C to the movable buffer stage 210, or the transport device 300 can move the finished object C to the fixed buffer stage 220, or automate material transfer. The inter-machine transfer device 22 of the system 20 can move the object C from the load cassette 100 to another machine, but the disclosure is not limited thereto. Therefore, the object C can exit from the load 埠100. When the load 埠 100 is not occupied by the object, the object detecting device 130 of the load 埠 100 transmits a load 埠 vacant state S1 to the transport system 10 and the automated material transfer system 20. Subsequently, the transport device 300 can move the object B located on the buffer stage 200 onto the load cassette 100. It should be noted that the method for transmitting the object when the transmission system 10 is combined with the automated material transfer system 20 is merely used herein, and the disclosure should not be limited. In practical applications, the transmission system 10 and the automated material transfer system 20 may be based on current conditions, such as the condition of the inter-machine transmission device 22, the process status of the machine 400, the condition occupied by the load 埠 100, and the buffer stage 200. The occupied condition, or other related state of the machine 400, etc., logically controls the transmission path of the transmission system 10 and the automated material transfer system 20, but the disclosure is not limited thereto.

In some embodiments, the transmission system 10 can include a Manufacturing Execution System (MES), which can have the function of planning the transmission path of the object, the function of the transmission path of the optimal material, or the record object. The function of the transmission path...etc. The buffer stage actuator 700 of the transmission system 10 controls the movable buffer stage 210 to move between the first position P1 and the second position P2 in accordance with an instruction issued by the manufacturing execution system. The conveyor actuator 800 of the transmission system 10 also controls the conveyor 300 to transfer items between the load cassette 100 and the buffer stage 200 in accordance with instructions issued by the manufacturing execution system.

In some embodiments, the transmission system 10 can include a Real-Time Dispatching System (RTD). When the machine 400 is in an idle state, that is, when the semiconductor process performed by the machine 400 is completed, the machine 400 reports an unloading completion message to the manufacturing execution system. The manufacturing execution system will ask the instant dispatch system which machine the object will next be transported to. When the instant dispatch system replies to the manufacturing execution system, the manufacturing execution system transmits a handling command to the conveyor actuator 800. Next, the conveyor actuator 800 controls the conveyor 300 to move the item away from the load port 100. Similarly, when the machine 400 reports a load completion message to the manufacturing execution system, that is, the contents of the object have entered the machine 400. The manufacturing execution system will ask which batch of objects to be transported to the machine 400 next, and then the immediate dispatching system will give the manufacturing execution system a process list containing a list of objects for the semiconductor process of the machine 400 to be performed. Subsequently, the manufacturing execution system transmits a handling command to the conveyor actuator 800, which can control the conveyor 300 to transfer another item to the load cassette 100.

In one or more of the above embodiments, the transmission system includes a load port, a plurality of first tracks, a horizontal moving device, an elevator, at least one second track, and a buffer stage. The load system is set on a machine associated with the semiconductor process. At least a portion of the space between the first tracks is located directly above the load. The horizontal moving device is movably coupled to the first track. The elevator is installed in a horizontal moving device. The second track has a continuous first section and a second section, the first section being directly below the space between the first rails, and the second section being positive of the space not located between the first rails Below. The first buffer stage is movably coupled to the second track. In this way, the buffer stage can be located not directly above the load raft, so that the object can be selectively placed on the load raft or the buffer stage, thereby increasing the selectivity of the space in which the object is placed. Therefore, the transport system can help reduce the traffic jam between objects transported between different machines and reduce the dwell time between items being transported between different machines.

The features of the several embodiments have been summarized above, and those skilled in the art will appreciate the aspects of the disclosure. Those skilled in the art will appreciate that the present disclosure can be readily utilized to design or refine other processes and structures to achieve the same objectives and/or the same advantages as the embodiments described herein. It is to be understood by those skilled in the art that the present invention is not limited to the spirit and scope of the disclosure, and various modifications, substitutions, and alterations may be made without departing from the spirit and scope of the disclosure.

Claims (10)

 A transmission system comprising: a load port disposed on a machine associated with a semiconductor process; a plurality of first tracks, at least a portion of the space between the first tracks being located directly above the load port; a horizontal moving device Momentally coupling the first tracks; an elevator disposed on the horizontal moving device; at least one second track having a continuous first segment and a second segment, the first segment being located Directly below the space between the first tracks, and the second section is not directly below the space between the first tracks; and a first buffer stage movably coupled to the first Two tracks.    The transmission system of claim 1, wherein a length direction of the first tracks intersects a length direction of the second track.    The transmission system of claim 1, wherein the lengthwise direction of the first tracks is substantially perpendicular to the length direction of the second track.    The transmission system of claim 1, wherein the length of the second section of the second track is not less than the length of the first buffer stage.    The transmission system of claim 1, wherein the length of the first section of the second track is not less than the length of the first buffer stage.    The transmission system of claim 1, wherein each of the first tracks has an extended section, the space between the extended sections is not directly above the load, and the transport system further comprises : a second buffer stage located directly below the space between the extension sections.    A transmission system comprising: a load port disposed on a machine associated with a semiconductor process; a plurality of tracks, each of the tracks having a continuous first segment and a second segment, the first The space between the segments is located directly above the load ,, the space between the second segments is not directly above the load ;; a horizontal moving device movably couples the tracks; a lift, Provided on the horizontal moving device; and a buffering station located directly below the space between the second sections.    The transmission system of claim 7, wherein the lengthwise direction of the first sections is substantially parallel to the lengthwise direction of the second sections.    A transmission method includes: determining whether a load 被 is occupied; when the load 埠 is judged to be occupied, moving a buffer stage to a first position, and the first position is directly above the load ;; An object is transported to the buffer stage at the first location.    The transmission method of claim 9, further comprising: moving the buffer stage to a second position when the load port is determined not to be occupied, and the second position is relative to the first position Moving away from the load; and transferring the object to the load.