TWM568494U - Workstation for transferring semiconductor substrates - Google Patents

Abstract

The workstation for transferring a semiconductor substrate of the present invention includes a warehouse management device, a substrate transfer device, and a transfer station. The warehouse management device allows input, output, and storage of a plurality of substrate transfer cassettes, and can carry the stored plurality of substrate transfer cassettes. The substrate transfer device is disposed in the storage management device and is configured to transport the plurality of substrates stored in the plurality of substrate transfer cassettes to the processing position and the transfer position. The machining position corresponds to the processing equipment. The transfer station is at the transfer position and receives the substrate conveyed by the substrate transfer device. The workstation for transferring a semiconductor substrate of the present invention can efficiently transport the substrate transfer cassette and the substrate to increase productivity and avoid contamination of the substrate.

Description

Workstation for transferring semiconductor substrates

This creation is related to semiconductor process equipment, and in particular to a workstation that transports a semiconductor substrate.

With the expansion of the semiconductor plant area or the adjustment of the product line, the original process configuration will need to be adapted to the current needs, but currently the semiconductor substrate transfer box is usually transported through the air transport system and the unmanned transport vehicle, and the two transport methods are usually It is for medium to long distance transmission, so it cannot meet the short distance transportation method.

Furthermore, after the substrate is taken out from the substrate transfer cassette, it is not suitable for long distance, cross-process transport or waiting for transport, because the longer the contact air time, the higher the probability of contamination of the substrate, so how to efficiently transport the transport demand efficiently Substrate transfer boxes and substrates have become an urgent problem to be solved in semiconductor manufacturing processes.

In view of the above-mentioned deficiencies, the workstation for transferring a semiconductor substrate of the present invention aims to provide a means for efficiently transferring the substrate transfer cassette and the substrate to shorten the waiting time of the processing (process) device.

In order to achieve the above object, the workstation for transferring a semiconductor substrate of the present invention includes a warehouse management device, a substrate transfer device, and a transfer station. The warehouse management device allows input, output, and storage of a plurality of substrate transfer cassettes, and can carry the stored plurality of substrate transfer cassettes. The substrate transfer device is disposed in the storage management device and is configured to transport the plurality of substrates stored in the plurality of substrate transfer cassettes to the processing position and the transfer position. The machining position corresponds to the processing equipment. The transfer station is at the transfer position and receives the substrate conveyed by the substrate transfer device.

In this way, the warehouse management apparatus can efficiently exchange and transport the substrate transfer cassette therein without waiting for the air transport system and the automated guided vehicle. The substrate transfer device can efficiently transfer the substrate to the processing device to shorten the waiting time of the processing device. Of course, the processing position can also correspond to two or more processing devices of the same or different processes. The transfer station can efficiently transport the substrate to the next process. Therefore, the workstation for transferring a semiconductor substrate of the present invention can efficiently transport the substrate transfer cassette and the substrate to increase productivity and avoid contamination of the substrate.

The detailed construction, features, assembly or use of the workstation for transporting the semiconductor substrate provided by this creation will be described in the detailed description of the subsequent embodiments. However, those of ordinary skill in the art should understand that the detailed description and specific embodiments of the present invention are merely used to illustrate the present invention and are not intended to limit the scope of the patent application.

Hereinafter, the components of the workstation for transferring the semiconductor substrate of the present invention and the achievement of the effect will be described with reference to the respective preferred embodiments. However, the components, dimensions, and appearance of the workstation in which the semiconductor substrate is transferred in each of the drawings are merely illustrative of the technical features of the present invention, and are not intended to limit the present invention.

1 to 3, FIG. 1 is a perspective view of a workstation for transporting a semiconductor substrate of the present invention, FIG. 2 is a front view of FIG. 1, and FIG. 3 is an illustration of the air transport system of FIG. A top view of the storage location and connection processing (semiconductor process) equipment.

The workstation 10 for transferring a semiconductor substrate of the present invention includes a warehouse management device 11, a substrate transport device 13, and a transfer station 15. The workstation 10 that transports the semiconductor substrate can be operated in conjunction with an airborne transport system (OHT) 30 and an automated carrier (AGV) 40, as will be described in detail later.

The storage management device 11 can define a range through its outer frame. In this embodiment, the outer frame adopts a closed structure, and allows input, output, and storage of a substrate transfer box (FOUP) 50, and can transport the substrate transfer case 50 in the storage management device 11 Internal movement.

The warehouse management device 11 has a plurality of storage locations 111 and a transport unit 113. The plurality of storage locations 111 are used to store a plurality of substrate transfer boxes 50, the number of which is at least one, and of course more than two or more. In this embodiment, the two layers have a total of ten storage locations 111. The transport unit 113 can transport the substrate transfer cassette 50 through a six-axis robot arm, an XYZ-axis mechanism or other multi-axis moving mechanism to exchange or carry the position of the substrate transfer cassette 50 in the storage management device.

The input and output substrate transfer cassette 50 can be transported by the air transport system 30 and the automated guided vehicle 40 to place the substrate transfer cassette 50 on the corresponding storage position 111 and carry the substrate transfer cassette 50 out of the storage management device 11. In this manner, the substrate transfer cassette 50 can be transported by the transport unit 113, the air transport system 30, and the automated transport vehicle 40 to improve the transport efficiency and shorten the process time. The process time includes waiting for the transport time and the equipment waiting for the processing time.

The substrate transfer device 13 is disposed in the storage management device 11 and is used to transport the substrate stored in the substrate transfer cassette 50, so that the substrate can be efficiently transported and prevented from being contaminated.

In the third embodiment of the present embodiment, the substrate transfer device 13 includes a machine main body 131, a plurality of load stages 133, and a substrate transfer unit 135. A plurality of loading platforms 133 are coupled to the machine body 131 and are configured to receive and open the substrate transfer cassette 50. The carrier 133 includes, in addition to the platform for receiving the substrate transfer cassette 50, a mechanism 1331 for opening and closing the substrate transfer cassette 50 to automatically open and close the substrate transfer cassette 50.

The substrate transport unit 135 is movably coupled to the machine body 131 and is capable of transporting the substrate. The transport includes exchanging the substrate from the substrate transfer cassette 50 and transporting the substrate to the processing position A or the transfer position B. The exchange of the substrate includes taking out the substrate from the substrate transfer cassette 50 and placing the substrate into the substrate transfer cassette 50.

The substrate transport unit 135 transports the substrate to the processing position A and the transfer position B. Wherein, the processing position A corresponds to the processing (semiconductor process) device 60, and therefore, the processing device can process, test, inspect, or perform other operations on the substrate. Wherein, the processing position A can correspond to one or more processing devices 60. Reprinted position after the description.

The substrate transport unit 135 includes a rail 1351 and a multi-axis moving jaw 1353, and the rail 1351 is fixedly coupled to the machine body 131. The multi-axis moving jaw 1353 is coupled to the rail 1351 and is movable along the rail 1351. The multi-axis moving jaw 1353 is horizontally movable at least to transport the substrate to a corresponding position. Horizontal movement includes horizontal rotation, horizontal elongation, and contraction. The dotted line in the figure indicates the position where the multi-axis moving jaw 1353 is moved after the movement, and these positions are only for convenience of understanding, and are not limited as positions. In other embodiments, the multi-axis moving jaw 1353 can also lift the substrate.

In other embodiments, the substrate transport unit 135 may also constitute a multi-axis substrate transport system through other mechanisms. Therefore, the composition of the substrate transport unit 135 is not limited to the embodiment.

The transfer table 15 is at the transfer position, and is used to receive the substrate conveyed by the substrate transfer device 13, and the transfer table 15 is exposed outside the storage management device 11. Exposed, the whole or part of the transfer station 15 is exposed outside the storage management device. The transfer station 15 can deliver the substrate and hand it over to the next process, such as the next workstation or another process device that transports the semiconductor substrate.

Wherein, the double-point chain line indicates the movement and direction change of the multi-axis moving jaw 1353, and the jaws of the multi-axis moving jaw 1353 stay at the processing position A and the transfer position B, in fact, the processing position A and the transfer position B There is no dotted jaw profile on it.

Since the substrate is transferred to the semiconductor processing apparatus 60 through the substrate transfer device 13 in the storage management device 11, the substrate transfer device 13 can reduce the waiting time of the semiconductor processing device 60 and efficiently increase the hourly throughput (UPH). Moreover, the process of the substrate can be completed in the warehouse management device 11, and the transmission pollution occurring across the different semiconductor process devices 60 can be effectively suppressed.

In addition, the substrate transfer cassette 50 can be transported not only by the transport unit 113 for short distances, but also by the air transport system (OHT) 30 or the unmanned transport vehicle (AGV) 40 (shown in FIG. 1) in the current semiconductor factory. The medium and long distance transportation is performed to increase the selection of the substrate transfer cassette 50, thereby improving the transportation efficiency and reducing the waiting time. The air transport system 30 can transport the substrate transport cassette directly from above the warehouse management device. The automated guided vehicle can take over the substrate transfer cassette transported by the transport unit 113.

Fig. 4 is a front elevational view showing a workstation in which two semiconductor substrates are collectively transferred, and Fig. 5 is a top plan view showing the air transport system and the storage position in Fig. 4, and the connection processing (semiconductor process) equipment.

As shown in FIGS. 4 and 5, in this embodiment, two workstations for transferring semiconductor substrates are connected in series, and thus, each workstation for transferring semiconductor substrates can be matched with processing (semiconductor process) devices of different or the same nature to be opposite to the substrate. The corresponding process is performed to further improve the transport efficiency of the substrate.

In other embodiments, the number of workstations that transmit the semiconductor substrate in series may be more, such as three or more. The operation of the semiconductor substrate will be referred to as a workstation 10a for transferring the semiconductor substrate and a workstation 10b for transferring the semiconductor substrate, respectively, for convenience of understanding.

The structure, composition, and operation of the storage management devices 11a and 11b, the substrate transfer devices 13a and 13b, and the transfer tables 15a and 15b of the first transfer semiconductor substrate workstation 10a and the second transfer semiconductor substrate workstation 10b are the same as those of the above embodiment. Therefore, the same part will not be described again. In the above embodiment, the transfer table can transfer the substrate and transfer it to the next process, which means that the transfer table 15a is used to carry the substrate for the second transfer semiconductor substrate workstation 10b to take another process operation. This is done at the workstation 10b that transports the semiconductor substrate, so that the substrate can be efficiently and quickly transferred to the next process to reduce latency and avoid contamination.

In addition, the first workstation 10a for transferring the semiconductor substrate and the second workstation 10b for transferring the semiconductor substrate can operate independently. For example, the substrate transfer units 135a and 135b can independently perform the operation of transporting the substrate, for example, the substrate transfer unit 135a takes the substrate. It is transported to the transfer stage 15a, and then the substrate transfer unit 135b transports the substrate into the workstation 10b of the second transfer semiconductor substrate. The substrate transport unit 135b may also transport the substrate to the transfer stage 15b and hand it to another process.

In this way, the workstation for transferring the semiconductor substrate of the present invention can efficiently transfer the substrate through the substrate transfer device for short distance transportation and processing (process), thereby reducing the waiting time of the device to increase the throughput.

Finally, it is emphasized that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention. The substitution or variation of other equivalent elements should also be the scope of the patent application of the present application. Covered.

10‧‧‧Workstation for transferring semiconductor substrates

11‧‧‧Warehouse management device

111‧‧‧ Storage location

113‧‧‧Transportation unit

13‧‧‧Substrate transport device

131‧‧‧ machine body

133‧‧‧bearing station

1331‧‧‧ institutions

135‧‧‧Substrate handling unit

1351‧‧‧ Track

1353‧‧‧Multi-axis moving jaws

15‧‧‧Transfer station

30‧‧‧Airborne transport system

40‧‧‧No-pass truck

50‧‧‧Substrate transfer box

60‧‧‧Processing equipment

A‧‧‧Working position

B‧‧‧Reproduced position

10a‧‧‧First workstation for transferring semiconductor substrates

10b‧‧‧Second workstation for transferring semiconductor substrates

11a, 11b‧‧‧Warehouse management device

13a, 13b‧‧‧ substrate transport device

135a, 135b‧‧‧Substrate handling unit

15a, 15b‧‧‧ transfer station

60a, 60b‧‧‧Processing equipment

Fig. 1 is a perspective view showing an embodiment of a workstation for transferring a semiconductor substrate. Fig. 2 is a front elevational view of Fig. 1. Fig. 3 is a top plan view showing the air transport system and the storage position in Fig. 1 omitted, and the connection processing (semiconductor process) equipment. Figure 4 is a front elevational view of a workstation in series with two original transfer semiconductor substrates. Fig. 5 is a top plan view showing the air transport system and the storage position in Fig. 4, and the connection processing (semiconductor process) equipment.

Claims (6)

A workstation for transporting a semiconductor substrate, comprising: a storage management device that allows input, output, and storage of a plurality of substrate transfer cassettes, and can carry the stored plurality of substrate transfer cassettes; a substrate transfer device disposed in the storage management device And for transporting the plurality of substrates stored in the plurality of substrate transfer boxes to a processing position and a transfer position, the processing position corresponding to a processing device; and a transfer station located at the transfer position and receiving the substrate transfer device The substrate that is transported. The workstation for transporting a semiconductor substrate according to claim 1, wherein the substrate transfer device comprises a machine body, a plurality of carriers, and a substrate handling unit, wherein the plurality of carriers are connected to the machine body, and The plurality of substrate transfer boxes that are transported by the storage management device, the substrate transfer unit is movably connected to the machine body, and is configured to transport the substrates stored in the plurality of substrate transfer boxes on the plurality of loading platforms, The substrate transfer unit transports the substrate to the transfer stage. The workstation for transporting a semiconductor substrate according to claim 2, wherein the substrate transfer unit transports the substrate to a processing device. The workstation for transporting a semiconductor substrate according to claim 2 or 3, wherein the substrate carrying unit comprises a track and a multi-axis moving jaw fixedly coupled to the machine body, the multi-axis moving jaw connecting the A track is movable along the track, and the multi-axis moving jaw is used to carry the substrate. The workstation for transferring a semiconductor substrate according to claim 2, wherein the plurality of carriers are used to receive and open the plurality of substrate transfer cassettes. The workstation for transferring a semiconductor substrate according to claim 2, wherein the storage management device includes a plurality of storage locations and a transport unit, the plurality of storage locations storing the plurality of substrate transport boxes, the transport unit transporting Storing the plurality of substrate transfer cassettes to the plurality of carriers.