CN1342998A - Equipment for producing semiconductor device and panel display - Google Patents
Equipment for producing semiconductor device and panel display Download PDFInfo
- Publication number
- CN1342998A CN1342998A CN 01124802 CN01124802A CN1342998A CN 1342998 A CN1342998 A CN 1342998A CN 01124802 CN01124802 CN 01124802 CN 01124802 A CN01124802 A CN 01124802A CN 1342998 A CN1342998 A CN 1342998A
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- CN
- China
- Prior art keywords
- product
- robot
- semiconductor device
- equipment
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
Abstract
The apparatus for manufacturing semiconductor device and flat panel display according to the present invention combines/connects the modules having process functions for forming semiconductor device and flat panel display in the same type of physical distribution apparatuses, that is, process functions such as cleaning-depositing-diffusing-ion doping-recoupling-polishing-photolithography-etching-ashing-stripping-inspecting-anealing, thereby to prevent loss in production due to duplication of physical distributions.
Description
Technical field
The present invention relates to produce the equipment of semiconductor device and flat-panel monitor, and be particularly related to small-scale and the semiconductor device of be pilot group and the equipment of flat-panel monitor made.
Background technology
Recently, semiconductor device and flat-panel monitor have occupied most industrial circle, and thus, people more and more pay close attention to such semiconductor device and flat-panel monitor.Therefore, in large-scale plant, the investment that is used to produce in batches the new equipment of such product increases fast.
Yet because large-scale plant needs large-scale place and large-scale production line, thus, the entity assigning process needs excess investment, and the manufacturer can not suitably satisfy the various needs of client about the be pilot group.For this reason, recently, various types of production equipments of small lot and small-scale product group have been proposed to be used for.
The characteristics of the conventional production lines of semiconductor device and flat-panel monitor are under typical horizontal management, by the function executing process, wherein the control of each equipment group to be flow through Cheng Jinhang along product.
Representative as such horizontal management will illustrate with thin-film transistor LCD device now.
Fig. 1 is a calcspar, has shown the array treating process in the conventional production equipment of thin-film transistor LCD device.As shown in Figure 1, the production of thin-film transistor LCD is carried out with the process of cleaning-deposition-cleaning-photoetching-etching-peel off, and constitutes production line, makes such process repetitive cycling.
Above-mentioned production line structure roughly will be explained with reference to figure 2.At first, product 1 (glass or wafer) to be processed on product railcar (not shown) is transmitted by central transportation route 10, and is received by the charging machine 20a of first step production line.The product that is received by charging machine 20 transmits by transported in parts path 30a, and is transferred to first step by the load/unload machine 40a of first step production line, for example cleaning.After first step was finished, the product of handling at first step discharged from the first step production line by load/unload machine 40a, and by transported in parts path 30a and central transportation route 10, by the charging machine 20b reception of the second step production line.The product of handling and being received by charging machine 20b at first step after the product of having imported in second step is finished processing, by transported in parts path 30b transmission, and is input to second step by the load/unload machine 40b of the second step production line.Then, the 20c of charging machine separately, 20d on the tinuous production ..., transported in parts path 30c, 30d ..., and load/unload machine 40c, 40d ... the motion of last product and processing, similar to those of the first step production line and the second step production line, these processes repeat also circulation.
Yet such problem is arranged,, between step, need the more time to prepare, cause the production time longer so promptly by the traditional water flat production line structure of function.
Equally, on function, except being used to improve the processing space of added value, there being unnecessary indirect element, as being used for element of load/unload, transportation, location or the like.Thus, cost of investment and factory's area increase, and cause product cost to increase like this.
Equally, as mentioned above, from the viewpoint of producing in batches, traditional production line is highly beneficial, but is unsuitable for the product group of small-scale and small lot.
Summary of the invention
The present invention is intended to solve top problem, the purpose of this invention is to provide a kind of equipment of producing semiconductor device and flat-panel monitor, is suitable on a small scale and the product group of small lot.
Another object of the present invention is to produce in the process of semiconductor device and flat-panel monitor with described production equipment, improving the efficient of its work by getting rid of unnecessary indirect element.
In order to realize top purpose, ash handling equipment combination/connection according to the present invention has the module of different processing functions, in entity distribution (physical distribution) equipment of same type, form semiconductor device and flat-panel monitor, be processing capacity as cleaning-deposition-diffusion-ion doping-coupling-polishing again-photoetching-etching-ash disposal-peel off-check-anneal, prevent the production loss that causes owing to repetition that entity distributes thus.
By making the layer unit in the system minimize formation equipment as above, can batch processing be input to the completing steps flow process, thereby reduce between each step and charging machine, to move required performance element from one layer or more.
Description of drawings
Embodiments of the invention will explain with reference to the accompanying drawings, wherein:
Fig. 1 is a calcspar, shows the array treating process of the conventional production equipment of tft liquid crystal display device;
Fig. 2 illustrates in general the conventional production equipment structure of large-scale semiconductive device and flat-panel monitor; And
Fig. 3 illustrates in general the structure according to the production equipment of semiconductor device of the present invention and flat-panel monitor.
Embodiment
Referring now to accompanying drawing specific explanations the preferred embodiments of the present invention.
Fig. 3 illustrates in general the structure according to the production equipment of semiconductor device of the present invention and flat-panel monitor.
As shown in Figure 3, the production equipment of production semiconductor device and flat-panel monitor comprises: a plurality of load/unload machine 100a ..., 100d; First robot 120, be used for from a plurality of load/unload machine 100a ..., 100d receives product 110 to be processed, as substrate of glass or wafer, comes transmission product; First transportation route 130, it is the zone that first robot moves; A plurality of second 140a of robot, 140b, 140c are used for getting product from first robot 120, and transmission product handles, as cleaning, deposition, diffusion, ion doping, be coupled, polishing, photoetching, etching, ash disposal, peel off, check, anneal or the like; Second transportation route 150, it is the zone that a plurality of second 140a of robot, 140b, 140c move; With buffer 160a, 160b, be arranged between the second corresponding robot, be used to prevent disturb between the described robot.
To explain the operation of the equipment of the production semiconductor device that has top structure according to the present invention and flat-panel monitor below especially.Product 110 to be processed is transferred to first robot 120 as substrate of glass or wafer by load/unload machine 100a.First robot 120 moves on first transportation route 130 continuously, and product 110 is transferred to second 140a of robot, and second 140a of robot is input to cleaning with product 110, and this is a first step.In the process of carrying out such program, first robot 120 receives another product 110a from load/unload machine 100b, and product 110a is transferred to second 140a of robot.At this moment, be input to the product 100 of cleaning, after this step is finished, be input to next step, and the 140b of this second robot is with irrelevant from the 120 reception product 110a of first robot by second 140b of robot.
Then, product 110,110a, 110b, 110c are transferred to second 140a of robot by first robot 120 on first transportation route 130, move by second 140b of robot and 140c on second transportation route 150, and be input to each step, and in each step circular treatment.By the robot continued operation of programming, carry out such production line, reduce the unnecessary time of every step.
According to the present invention, the maximum characteristics that are used to produce the equipment of semiconductor device and flat-panel monitor are, can detect lacking of product, and the transmission of product, product be input to the processing of each step and product can repetitive cycling, the product finished of output continuously thus.
In the superincumbent circulation, through product in steps can not export in large quantities as the prior art while.Yet, can avoid the shortcoming of transmission technology, promptly when a unit step stopped, all steps of must stopping solved problem.
According to the equipment of production semiconductor device of the present invention and flat-panel monitor,, can reduce the repetition that entity distributes by in identical entity compartment system, being input to the batch processing of finishing from one layer or more.And because the minimizing that this entity distributes, the productivity ratio that can be improved and reduction cost of investment.
Equally, because reduced required working space, so can reduce whole factory area owing to reduced the entity distribution.
Claims (2)
1. equipment that is used to produce semiconductor device and flat-panel monitor comprises:
A plurality of load/unload machines;
First robot is used for receiving product to be processed from described a plurality of load/unload machines, as substrate of glass or wafer, transmits described product;
First transportation route, described first robot move thereon;
A plurality of second robots are used for receiving described product from described first robot, and described product are transferred to corresponding treatment step;
Second transportation route, described a plurality of second robots move thereon; With
Buffer is arranged between described second robot, is used to prevent produce between the described robot disturb,
Wherein lacking of product, be read out, and the transmission of product, product are input to the processing repetitive cycling of each treatment step and product.
2. according to the equipment that is used to produce semiconductor device and flat-panel monitor of claim 1, it is characterized in that described treatment step is cleaning, deposition step, diffusing step, ion doping step, be coupled step, polishing step, lithography step, etching step, ash disposal step, strip step, inspection step, annealing steps again.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR36453/00 | 2000-06-29 | ||
| KR1020000036453A KR20010034990A (en) | 2000-06-29 | 2000-06-29 | Multifunctional integration manufacturing apparatus for semiconductor and flat panel displays |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1342998A true CN1342998A (en) | 2002-04-03 |
Family
ID=19674791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01124802 Pending CN1342998A (en) | 2000-06-29 | 2001-06-29 | Equipment for producing semiconductor device and panel display |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2002076088A (en) |
| KR (1) | KR20010034990A (en) |
| CN (1) | CN1342998A (en) |
| DE (1) | DE10130998A1 (en) |
| TW (1) | TW504737B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1306558C (en) * | 2003-03-31 | 2007-03-21 | 精工爱普生株式会社 | Device and method for transporting products |
| CN100380599C (en) * | 2002-04-15 | 2008-04-09 | 株式会社荏原制作所 | Polishing device and substrate processing device |
| CN100403145C (en) * | 2005-01-31 | 2008-07-16 | 中华映管股份有限公司 | Factory production working system and its operating method |
| CN102324397A (en) * | 2006-06-15 | 2012-01-18 | 东京毅力科创株式会社 | Lining treatment system and substrate conveyance method |
| CN101454733B (en) * | 2006-06-06 | 2012-08-08 | Abb研究有限公司 | Improved method and system for operating a cyclic production machine in coordination with a loader or unloader machine |
| CN102642162A (en) * | 2012-05-08 | 2012-08-22 | 广东新海岸机械有限公司 | Glass double-edge grinding and polishing equipment |
| CN107357137A (en) * | 2011-08-30 | 2017-11-17 | 株式会社尼康 | Exposure method, manufacture method and substrate processing method using same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011018731A (en) * | 2009-07-08 | 2011-01-27 | Rayresearch Corp | Wafer-branching and carrying device |
| KR101439168B1 (en) * | 2012-09-19 | 2014-09-12 | 우범제 | A wafer treat equipment have the wafer purging cassette removal remain fume on the wafer |
| KR101458626B1 (en) * | 2012-11-01 | 2014-11-11 | 우범제 | The wafer purging cassette |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980075658A (en) * | 1997-03-31 | 1998-11-16 | 윤종용 | Wafer transfer system and wafer transfer method of photolithography process equipment |
| JP3884170B2 (en) * | 1998-06-18 | 2007-02-21 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP3576831B2 (en) * | 1998-09-18 | 2004-10-13 | 東京エレクトロン株式会社 | Processing equipment |
| JP2000138276A (en) * | 1998-10-30 | 2000-05-16 | Tokyo Electron Ltd | Substrate processing device |
-
2000
- 2000-06-29 KR KR1020000036453A patent/KR20010034990A/en not_active Application Discontinuation
-
2001
- 2001-06-27 DE DE2001130998 patent/DE10130998A1/en not_active Withdrawn
- 2001-06-28 TW TW90115850A patent/TW504737B/en not_active IP Right Cessation
- 2001-06-28 JP JP2001195958A patent/JP2002076088A/en active Pending
- 2001-06-29 CN CN 01124802 patent/CN1342998A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100380599C (en) * | 2002-04-15 | 2008-04-09 | 株式会社荏原制作所 | Polishing device and substrate processing device |
| US7850817B2 (en) | 2002-04-15 | 2010-12-14 | Ebara Corporation | Polishing device and substrate processing device |
| CN1306558C (en) * | 2003-03-31 | 2007-03-21 | 精工爱普生株式会社 | Device and method for transporting products |
| CN100403145C (en) * | 2005-01-31 | 2008-07-16 | 中华映管股份有限公司 | Factory production working system and its operating method |
| CN101454733B (en) * | 2006-06-06 | 2012-08-08 | Abb研究有限公司 | Improved method and system for operating a cyclic production machine in coordination with a loader or unloader machine |
| CN102324397A (en) * | 2006-06-15 | 2012-01-18 | 东京毅力科创株式会社 | Lining treatment system and substrate conveyance method |
| US8702370B2 (en) | 2006-06-15 | 2014-04-22 | Tokyo Electron Limited | Substrate transfer method for performing processes including photolithography sequence |
| CN102324397B (en) * | 2006-06-15 | 2015-01-07 | 东京毅力科创株式会社 | Substrate processing system and substrate transfer method |
| CN107357137A (en) * | 2011-08-30 | 2017-11-17 | 株式会社尼康 | Exposure method, manufacture method and substrate processing method using same |
| CN102642162A (en) * | 2012-05-08 | 2012-08-22 | 广东新海岸机械有限公司 | Glass double-edge grinding and polishing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20010034990A (en) | 2001-05-07 |
| TW504737B (en) | 2002-10-01 |
| DE10130998A1 (en) | 2002-03-14 |
| JP2002076088A (en) | 2002-03-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |