TW503544B - Thermal joint and method of use - Google Patents

Thermal joint and method of use Download PDF

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Publication number
TW503544B
TW503544B TW089126623A TW89126623A TW503544B TW 503544 B TW503544 B TW 503544B TW 089126623 A TW089126623 A TW 089126623A TW 89126623 A TW89126623 A TW 89126623A TW 503544 B TW503544 B TW 503544B
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Taiwan
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alloy
temperature
patent application
thermal
heat
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TW089126623A
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Seung-Mun You
Choong-Un Kim
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Thermax International L L C
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01Manufacture or treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3738Semiconductor materials
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005Thermal joints
    • F28F2013/006Heat conductive materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/14Layer or component removable to expose adhesive
    • Y10T428/1419Wax containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/14Layer or component removable to expose adhesive
    • Y10T428/1452Polymer derived only from ethylenically unsaturated monomer

Description

503544 A7. B7_ 五、發明說明(1 ) 發明領域 <請先閱讀背面之注意事項再填寫本頁) 本發明係有關一種熱接合物,用以將熱從一物體傳遞 到另一物體。本發明也有關一種在一產熱組件,例如半導 體裝置,與一移熱組件,例如熱壑,之間傳遞熱。 發明背景 有許多種裝置都需要有效率的熱傳遞。例如,高速電 腦和其他快速電子系統都需要許多積體電路晶片的組裝體 ’於其中每一晶片含有許多有源裝置且許多晶片都密切地 間隔在一起。於正常操作中,諸裝置會逸散出非常大的功 率密度,尤其是雙極電晶體裝置。裝置之恰當電子操作需 要相當冷的操作溫度,其轉而需要將功率密度充分地冷卻 。相反地,裝置與積體電路晶片的最大容許操作溫度配合 目前可得用的有限冷卻能力,限制了可容許的功率密度, 電路密度,和系統速度。 經濟部智慧財產局員工消費合作社印製 在需要經由傳導將熱從一物體傳遞或散逸到另一物體 之任何時候,在熱交換中的一種重要組件爲兩物體之間的 介面接合物。增強兩物體之間的熱交換之一種典型方法爲 將兩物體的介面機製成高度耐受性且將彼等緊密地固持在 一起使得相當高百分比的接合表面部位相接觸。不僅是這 種方法係昂貴者,而且接合物的熱效率係與表面整飾的光 滑度和跨該表面施加的壓力量都有相互關聯。即使表面不 規則性係微觀者且在兩接觸表面之間採用的壓力係大者, 也只能導致相當低的熱效率。這是因爲兩物體之間的介面 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -4 - 503544 A7 —…_ B7___ 五、發明說明(2 ) 區包括相當有限的由空氣間隙和空洞所包圍住之接觸區之 故。在介面區內空氣間隙和空洞的存在傾向於增加介面的 熱阻。 兩物體之間的介面所具電阻可經由提供可塡充接合介 面中的空氣間隙和空洞之介面材料而予以減低。有數種材 料,從熱脂至相轉變性化合物,已在某些情況中使用到, 典型地係用於電子裝置冷卻中作爲接觸材料。這些間隙材 料的主要功能爲減低空洞數目及增加接觸面積,其中可經 由施加接觸壓力下的黏稠流動或經由化學反應。不過,彼 等接觸材料大部份是以具有相當不良的熱傳導係數之組成 物爲基質,例如非晶態脂/油,矽酮脂,和石蠟。因此之 故,彼等接觸材料只提供熱性能上的有限增益。於遭遇高 熱通量或高操作溫度的操作環境中,這些材料作爲熱接合 物的性能會因爲揮發性組成分的逸失而迅速地變壞。爲了 解決彼等問題,有時候係將這類材料與熱傳導性粉混合或 與金屬框架組合。不過,彼等設計會導致複雜性且增加成 本。 也有考慮銅焊或錫焊作爲另一種減低兩物體之間的介 面所具熱阻之方式。雖然將兩物體間的金屬介面予以銅焊 可改良熱接觸,不過其應用只限於可與焊接材料反應之表 面。對於非反應性表面,例如鋁,陶瓷材料,和塑膠,於 錫焊或銅焊之前必須先施以黏合層(典型者爲貴金屬)之 沈積。不過,由於接合物體或沈積層之間的熱不配合,可 能發生銅焊材料的破折。某些因素,例如相當高的價格和 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) £ ^1 ϋ ϋ n n 一5、· ..a,, ...a. .Μ I i 經濟部智慧財產局員工消費合作社印製 503544 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(3 ) 修正的困難性,可能限制錫焊或銅焊在形成有效率熱接合 物中的應用。 , 基因前述理由,有需要一種可提供相當高熱傳導係數 的熱接合物。較佳者,該熱接合物的熱傳導係數係與典型 金屬或其合金可相比者。更合宜者爲該熱接合物包含最低 的複雜性使其可以容易地實現。 發明槪述 前述需求可由一或多項本發明部份予以滿足。於一部 份中,本發明係有關一種用以幫助熱傳遞的熱接合物。該 熱接合物包括一含有至少兩種組成分的合金;該合金具有 一操作溫度T P,一液體溫度τ L,和一固體溫度T s ;當 該操作溫度T P落於該液體溫度τ L與該固體溫度T S之間 時,該合金包括至少一液體相與至少一固體相。較佳者, 該液體相係與該固體相呈實質地平衡。該熱接合物的尺寸 係經調定成使其可配置於一產熱性組件與一 ·散熱性組件之· 間。 於另一部份中,本發明係有關一種裝置,其包括配置 於一產熱性裝置與一散熱性裝置之間的熱接合物。彼等裝 置可組裝到多種設備之中,包括但不限於,電腦、印表機 、行動電話、電視機、視頻匣式錄影機、功率擴大器、變 壓器、電源電路、高功率電晶體、二極體、和配電板。 於另一部份中’本發明係有關一種散熱方法。該方法 包括一或多道下列步驟:(a )提供一熱接合物,其包括 本紙張尺度適用争國國家標準(CNS)A4規格(210 X 297公釐) -6 J—--------®t--------訂-------—Aw (請先閱讀背面之注意事項再填寫本頁)

Claims (1)

  1. 503544 A8 B8 令年修正/更正/補充 C8 / D8 六、申請專利範圍 附件1 a: (請先閱讀背面之注意事項再填寫本頁) 第891 26623號專利申請案 中文申請專利範圍修正本 民國91年7月22日修正 1·一種用以幫助熱傳遞的熱接合物,其包括: .一含有至少兩種組成分的合金,該合金包括至少一液 體相與至少一固體相,該液體相係與該固體相呈實質地平 衡; - 其中該合金具有一操作溫度τ p,一液體溫度τ l,和 一固體溫度T S,且該操作溫度τ P係落於該液體溫度T L 與該固體溫度T S之間; 其中該熱接合物的尺寸係經調定成使其可配置於一產 熱性組件與一散熱性組件之間。 2 ·如申請專利範圍第1項之熱接合物,其中該合金 更包括一添加劑。 經濟部智慧財產局員工消費合作社印製 3 ·如申請專利範圍第1項之熱接合物,其中當該操 作溫度T p落於該液體溫度T L與該固體溫度τ s之間時, 該合金具有眾多固體相。 4 ·如申請專利範圍第1項之熱接合物,其中當該操 作溫度T p落於該液體溫度T ^與該固體溫度τ s之間時, 該合金具有眾多液體相。 5 ·如申請專利範圍第1項之熱接合物,其中該合^ 爲一兀合金° 503544 年 ^ 8 88 8 ABCD 月
    义 充 、申請專利範圍 6 ·如申請專利範圍第1項之熱接合物,其中該合金 爲三元合金。 7 ·如申請專利範圍第1項之熱接合物,其中該合金 爲四元合金。 8 ·如申請專利範圍第1項之熱接合物,其中該合金 包括五或更多種組成分。 9 ·如申請專利範圍第1項之熱接合物,其中該合金 包括一或多種下面所列者:β i ,pb,Sn,Cd, Sb,In,T1 ,Te ,Se ,Ga ,Hg ,和彼等的 組合。 1 〇 ·如申請專利範圍第1項之熱接合物,其中該合 金更包括一或多種下面所列者:Na,L i ,A 1 ,Mg ,Ag,Cu,Zn,As,K,Rb,Ca,Au, S i ,G e,和彼等的組合。 ‘ 1 1 ·如申請專利範圍第1項之熱接合物’其中該合 金更包括一或多種下面所列者·· C u,A g ’ A u ’ P t ,Pd,Si,Ge,Al,Mg,Zn’Cr ’Νι ’ B e,和彼等的組合。 1 2 ·如申請專利範圍第9項之熱接合物’其中該合 金更包括一或多種過渡金屬。 1 3 ·如申請專利範圍第1 0項之熱接合物,其中該 合金更包括一或多種過渡金屬。 1 4 ·如申請專利範圍第1 1項之熱接合物’其中该 合金更包括一或多種過渡金屬。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -2 - (請先閱讀背面之注意事項再填寫本頁) C· 經濟部智慧財產局員工消費合作社印製 503544
    /史i〜.4.處 τ、申請專利乾圍 1 5 ·如申請專利範圍第1項之熱接合物,其中該合 金爲銦,鉍和錫的三元合金。 (請先閲讀背面之注意事項再填寫本頁) 1 6 ·如申請專利範圍第1項之熱接合物,其中該合 金爲N a C 1和M g C 1的混合物。 1 7 .如申請專利範圍第1項之熱接合物,其中該合 金爲火石玻璃’ S i〇2/Ca C〇2,S i〇2/Pb〇 ,或 Si〇2/Ti〇2。 18·—種需要熱傳遞之裝置,其包括: 一產熱性組件; - 一散熱性組件;及 一熱接合物’其係配置於該產熱性組件與該散熱性組 件之間,該熱接合物包括一含有至少兩種組成分的合金, 該合金包括至少一液體相與至少一固體相,該液體相係與 該固體相呈實質地平衡; . 其中該合金具有一操作溫度Tp,一液體溫度Tl,和 一固體溫度T S,且該操作溫度T P係落於該液體溫度T L 與該固體溫度T S之間。 經濟部智擎〖財產局員工消費合作杜印 1 9 ·如申請專利範圍第1 8項之裝置,其中該熱接 合物的一表面係與該產熱性組件的一表面直接地接觸。 2 0 ·如申請專利範圍第1 8項之裝置,其中該熱接 合物的一表面係與該散熱性組件的一表面直接地接觸。 2 1 ·如申請專利範圍第1 8項之裝置,其中該裝# 係一半導體裝置。 2 2 .如申請專利範圍第1 8項之裝置,其中該裝胃 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -3 - 503544
    月^^日修正/更正/補充 六、申請專利範圍 係一熱交換器。 (請先聞讀背面之注意事項再填寫本頁) 2 3 ·如申請專利範圍第1 8項之裝置,係用於電腦 、印表機、行動電話、電視機、視頻匣式錄影機、功率擴 大器、變壓器、電源供應電路、高功率電晶體、二極體、 或配電板等設備。 2 4 · —種散熱方法,其包括: 提供一熱接合物於一產熱性組件與一散熱性組件之間 ,該熱接合物包括含有至少兩種組成分之合金,該合金具 有一液體溫度Tt和一固體溫度Ts;及 · 在一介於該液體溫度T l與該固體溫度T s之間的溫度 下操作該熱接合物; 其中該合金包括至少一液體相與至少一固體相,且該 液體相係與該固體相呈實質地平衡。 2 5 ·如申請·專利範圍第2 4項之方法,其中係在對· 該熱接合物施加一介於該液體溫度T ^與該固體溫度τ s之 間的溫度之後在低於該固體溫度T s之溫度下操作該熱接合 物。 經濟部智慧財產局員工消費合作社印製 2 6 ·如申請專利範圍第2 4項之方法,其中該產熱 性組件爲具有熱傳遞表面的半導體。 2 7 ·如申請專利範圍第2 4項之方法,其中該散熱 性組件爲具有熱傳遞表面的熱壑(heatsink)。 2 8 ·如申請專利範圍第2 6項之方法,其中該熱接 合物的一表面係與該半導體的熱傳遞表面直接地接觸。 2 9 ·如申請專利範圍第2 7項之方法,其中該熱接 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) -4 - 503544 1’年m 修正/更正/補充 C8 D8 六、申請專利範圍 合物的一表面係與該熱壑的熱傳遞表面直接地接觸。 3 0 · —種製造具有低熱阻的熱接合物之方法,其包 括: 提供一合金,其包括至少兩種組成分,該合金具有一 液體溫度與一固體溫度Ts ; 將該合金配置於一產熱性組件與一散熱性組件之間, 由是界定出至少一個具有介面空洞的介面;及 對該合金施加一高於該固體溫度T s的操作溫度以產生 一液體相來塡充該介面空洞;及 ' 將該操作溫度降低到低於該液體溫度T L。 3 1 ·如申請專利範圍第3 0項之方法,其中該操作 溫度係經降低到低於該固體溫度T S。 3 2 ·如申請專利範圍第3 0項之方法,其中係對該 合金施加一高於該液體溫度T ^的操作溫度。 (請先間讀背面之注意事項再填寫本頁) ·裝· 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) -5 - 503544 附件3a :第89126ό23號專利申請案中文圖式修正頁 民國91年7月22日修正 3 3 4 3 5 9 f /年? ϋ修正/更正/補充
    〇 CB—> 1〇0 聶1 503544 年/ 修正/吏止/補充
    503544 年7月)¾修止/更正/補患
    Tm(B)
    圖3 100 503544 f/年修正/更正/補充 接觸壓力
    ψψψψψψ^圖4
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