TW503544B - Thermal joint and method of use - Google Patents
Thermal joint and method of use Download PDFInfo
- Publication number
- TW503544B TW503544B TW089126623A TW89126623A TW503544B TW 503544 B TW503544 B TW 503544B TW 089126623 A TW089126623 A TW 089126623A TW 89126623 A TW89126623 A TW 89126623A TW 503544 B TW503544 B TW 503544B
- Authority
- TW
- Taiwan
- Prior art keywords
- alloy
- temperature
- patent application
- thermal
- heat
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/006—Heat conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1419—Wax containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1452—Polymer derived only from ethylenically unsaturated monomer
Description
503544 A7. B7_ 五、發明說明(1 ) 發明領域 <請先閱讀背面之注意事項再填寫本頁) 本發明係有關一種熱接合物,用以將熱從一物體傳遞 到另一物體。本發明也有關一種在一產熱組件,例如半導 體裝置,與一移熱組件,例如熱壑,之間傳遞熱。 發明背景 有許多種裝置都需要有效率的熱傳遞。例如,高速電 腦和其他快速電子系統都需要許多積體電路晶片的組裝體 ’於其中每一晶片含有許多有源裝置且許多晶片都密切地 間隔在一起。於正常操作中,諸裝置會逸散出非常大的功 率密度,尤其是雙極電晶體裝置。裝置之恰當電子操作需 要相當冷的操作溫度,其轉而需要將功率密度充分地冷卻 。相反地,裝置與積體電路晶片的最大容許操作溫度配合 目前可得用的有限冷卻能力,限制了可容許的功率密度, 電路密度,和系統速度。 經濟部智慧財產局員工消費合作社印製 在需要經由傳導將熱從一物體傳遞或散逸到另一物體 之任何時候,在熱交換中的一種重要組件爲兩物體之間的 介面接合物。增強兩物體之間的熱交換之一種典型方法爲 將兩物體的介面機製成高度耐受性且將彼等緊密地固持在 一起使得相當高百分比的接合表面部位相接觸。不僅是這 種方法係昂貴者,而且接合物的熱效率係與表面整飾的光 滑度和跨該表面施加的壓力量都有相互關聯。即使表面不 規則性係微觀者且在兩接觸表面之間採用的壓力係大者, 也只能導致相當低的熱效率。這是因爲兩物體之間的介面 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -4 - 503544 A7 —…_ B7___ 五、發明說明(2 ) 區包括相當有限的由空氣間隙和空洞所包圍住之接觸區之 故。在介面區內空氣間隙和空洞的存在傾向於增加介面的 熱阻。 兩物體之間的介面所具電阻可經由提供可塡充接合介 面中的空氣間隙和空洞之介面材料而予以減低。有數種材 料,從熱脂至相轉變性化合物,已在某些情況中使用到, 典型地係用於電子裝置冷卻中作爲接觸材料。這些間隙材 料的主要功能爲減低空洞數目及增加接觸面積,其中可經 由施加接觸壓力下的黏稠流動或經由化學反應。不過,彼 等接觸材料大部份是以具有相當不良的熱傳導係數之組成 物爲基質,例如非晶態脂/油,矽酮脂,和石蠟。因此之 故,彼等接觸材料只提供熱性能上的有限增益。於遭遇高 熱通量或高操作溫度的操作環境中,這些材料作爲熱接合 物的性能會因爲揮發性組成分的逸失而迅速地變壞。爲了 解決彼等問題,有時候係將這類材料與熱傳導性粉混合或 與金屬框架組合。不過,彼等設計會導致複雜性且增加成 本。 也有考慮銅焊或錫焊作爲另一種減低兩物體之間的介 面所具熱阻之方式。雖然將兩物體間的金屬介面予以銅焊 可改良熱接觸,不過其應用只限於可與焊接材料反應之表 面。對於非反應性表面,例如鋁,陶瓷材料,和塑膠,於 錫焊或銅焊之前必須先施以黏合層(典型者爲貴金屬)之 沈積。不過,由於接合物體或沈積層之間的熱不配合,可 能發生銅焊材料的破折。某些因素,例如相當高的價格和 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) £ ^1 ϋ ϋ n n 一5、· ..a,, ...a. .Μ I i 經濟部智慧財產局員工消費合作社印製 503544 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(3 ) 修正的困難性,可能限制錫焊或銅焊在形成有效率熱接合 物中的應用。 , 基因前述理由,有需要一種可提供相當高熱傳導係數 的熱接合物。較佳者,該熱接合物的熱傳導係數係與典型 金屬或其合金可相比者。更合宜者爲該熱接合物包含最低 的複雜性使其可以容易地實現。 發明槪述 前述需求可由一或多項本發明部份予以滿足。於一部 份中,本發明係有關一種用以幫助熱傳遞的熱接合物。該 熱接合物包括一含有至少兩種組成分的合金;該合金具有 一操作溫度T P,一液體溫度τ L,和一固體溫度T s ;當 該操作溫度T P落於該液體溫度τ L與該固體溫度T S之間 時,該合金包括至少一液體相與至少一固體相。較佳者, 該液體相係與該固體相呈實質地平衡。該熱接合物的尺寸 係經調定成使其可配置於一產熱性組件與一 ·散熱性組件之· 間。 於另一部份中,本發明係有關一種裝置,其包括配置 於一產熱性裝置與一散熱性裝置之間的熱接合物。彼等裝 置可組裝到多種設備之中,包括但不限於,電腦、印表機 、行動電話、電視機、視頻匣式錄影機、功率擴大器、變 壓器、電源電路、高功率電晶體、二極體、和配電板。 於另一部份中’本發明係有關一種散熱方法。該方法 包括一或多道下列步驟:(a )提供一熱接合物,其包括 本紙張尺度適用争國國家標準(CNS)A4規格(210 X 297公釐) -6 J—--------®t--------訂-------—Aw (請先閱讀背面之注意事項再填寫本頁)
Claims (1)
- 503544 A8 B8 令年修正/更正/補充 C8 / D8 六、申請專利範圍 附件1 a: (請先閱讀背面之注意事項再填寫本頁) 第891 26623號專利申請案 中文申請專利範圍修正本 民國91年7月22日修正 1·一種用以幫助熱傳遞的熱接合物,其包括: .一含有至少兩種組成分的合金,該合金包括至少一液 體相與至少一固體相,該液體相係與該固體相呈實質地平 衡; - 其中該合金具有一操作溫度τ p,一液體溫度τ l,和 一固體溫度T S,且該操作溫度τ P係落於該液體溫度T L 與該固體溫度T S之間; 其中該熱接合物的尺寸係經調定成使其可配置於一產 熱性組件與一散熱性組件之間。 2 ·如申請專利範圍第1項之熱接合物,其中該合金 更包括一添加劑。 經濟部智慧財產局員工消費合作社印製 3 ·如申請專利範圍第1項之熱接合物,其中當該操 作溫度T p落於該液體溫度T L與該固體溫度τ s之間時, 該合金具有眾多固體相。 4 ·如申請專利範圍第1項之熱接合物,其中當該操 作溫度T p落於該液體溫度T ^與該固體溫度τ s之間時, 該合金具有眾多液體相。 5 ·如申請專利範圍第1項之熱接合物,其中該合^ 爲一兀合金° 503544 年 ^ 8 88 8 ABCD 月义 充 、申請專利範圍 6 ·如申請專利範圍第1項之熱接合物,其中該合金 爲三元合金。 7 ·如申請專利範圍第1項之熱接合物,其中該合金 爲四元合金。 8 ·如申請專利範圍第1項之熱接合物,其中該合金 包括五或更多種組成分。 9 ·如申請專利範圍第1項之熱接合物,其中該合金 包括一或多種下面所列者:β i ,pb,Sn,Cd, Sb,In,T1 ,Te ,Se ,Ga ,Hg ,和彼等的 組合。 1 〇 ·如申請專利範圍第1項之熱接合物,其中該合 金更包括一或多種下面所列者:Na,L i ,A 1 ,Mg ,Ag,Cu,Zn,As,K,Rb,Ca,Au, S i ,G e,和彼等的組合。 ‘ 1 1 ·如申請專利範圍第1項之熱接合物’其中該合 金更包括一或多種下面所列者·· C u,A g ’ A u ’ P t ,Pd,Si,Ge,Al,Mg,Zn’Cr ’Νι ’ B e,和彼等的組合。 1 2 ·如申請專利範圍第9項之熱接合物’其中該合 金更包括一或多種過渡金屬。 1 3 ·如申請專利範圍第1 0項之熱接合物,其中該 合金更包括一或多種過渡金屬。 1 4 ·如申請專利範圍第1 1項之熱接合物’其中该 合金更包括一或多種過渡金屬。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -2 - (請先閱讀背面之注意事項再填寫本頁) C· 經濟部智慧財產局員工消費合作社印製 503544/史i〜.4.處 τ、申請專利乾圍 1 5 ·如申請專利範圍第1項之熱接合物,其中該合 金爲銦,鉍和錫的三元合金。 (請先閲讀背面之注意事項再填寫本頁) 1 6 ·如申請專利範圍第1項之熱接合物,其中該合 金爲N a C 1和M g C 1的混合物。 1 7 .如申請專利範圍第1項之熱接合物,其中該合 金爲火石玻璃’ S i〇2/Ca C〇2,S i〇2/Pb〇 ,或 Si〇2/Ti〇2。 18·—種需要熱傳遞之裝置,其包括: 一產熱性組件; - 一散熱性組件;及 一熱接合物’其係配置於該產熱性組件與該散熱性組 件之間,該熱接合物包括一含有至少兩種組成分的合金, 該合金包括至少一液體相與至少一固體相,該液體相係與 該固體相呈實質地平衡; . 其中該合金具有一操作溫度Tp,一液體溫度Tl,和 一固體溫度T S,且該操作溫度T P係落於該液體溫度T L 與該固體溫度T S之間。 經濟部智擎〖財產局員工消費合作杜印 1 9 ·如申請專利範圍第1 8項之裝置,其中該熱接 合物的一表面係與該產熱性組件的一表面直接地接觸。 2 0 ·如申請專利範圍第1 8項之裝置,其中該熱接 合物的一表面係與該散熱性組件的一表面直接地接觸。 2 1 ·如申請專利範圍第1 8項之裝置,其中該裝# 係一半導體裝置。 2 2 .如申請專利範圍第1 8項之裝置,其中該裝胃 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -3 - 503544月^^日修正/更正/補充 六、申請專利範圍 係一熱交換器。 (請先聞讀背面之注意事項再填寫本頁) 2 3 ·如申請專利範圍第1 8項之裝置,係用於電腦 、印表機、行動電話、電視機、視頻匣式錄影機、功率擴 大器、變壓器、電源供應電路、高功率電晶體、二極體、 或配電板等設備。 2 4 · —種散熱方法,其包括: 提供一熱接合物於一產熱性組件與一散熱性組件之間 ,該熱接合物包括含有至少兩種組成分之合金,該合金具 有一液體溫度Tt和一固體溫度Ts;及 · 在一介於該液體溫度T l與該固體溫度T s之間的溫度 下操作該熱接合物; 其中該合金包括至少一液體相與至少一固體相,且該 液體相係與該固體相呈實質地平衡。 2 5 ·如申請·專利範圍第2 4項之方法,其中係在對· 該熱接合物施加一介於該液體溫度T ^與該固體溫度τ s之 間的溫度之後在低於該固體溫度T s之溫度下操作該熱接合 物。 經濟部智慧財產局員工消費合作社印製 2 6 ·如申請專利範圍第2 4項之方法,其中該產熱 性組件爲具有熱傳遞表面的半導體。 2 7 ·如申請專利範圍第2 4項之方法,其中該散熱 性組件爲具有熱傳遞表面的熱壑(heatsink)。 2 8 ·如申請專利範圍第2 6項之方法,其中該熱接 合物的一表面係與該半導體的熱傳遞表面直接地接觸。 2 9 ·如申請專利範圍第2 7項之方法,其中該熱接 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) -4 - 503544 1’年m 修正/更正/補充 C8 D8 六、申請專利範圍 合物的一表面係與該熱壑的熱傳遞表面直接地接觸。 3 0 · —種製造具有低熱阻的熱接合物之方法,其包 括: 提供一合金,其包括至少兩種組成分,該合金具有一 液體溫度與一固體溫度Ts ; 將該合金配置於一產熱性組件與一散熱性組件之間, 由是界定出至少一個具有介面空洞的介面;及 對該合金施加一高於該固體溫度T s的操作溫度以產生 一液體相來塡充該介面空洞;及 ' 將該操作溫度降低到低於該液體溫度T L。 3 1 ·如申請專利範圍第3 0項之方法,其中該操作 溫度係經降低到低於該固體溫度T S。 3 2 ·如申請專利範圍第3 0項之方法,其中係對該 合金施加一高於該液體溫度T ^的操作溫度。 (請先間讀背面之注意事項再填寫本頁) ·裝· 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) -5 - 503544 附件3a :第89126ό23號專利申請案中文圖式修正頁 民國91年7月22日修正 3 3 4 3 5 9 f /年? ϋ修正/更正/補充〇 CB—> 1〇0 聶1 503544 年/ 修正/吏止/補充503544 年7月)¾修止/更正/補患Tm(B)圖3 100 503544 f/年修正/更正/補充 接觸壓力ψψψψψψ^圖4
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/481,194 US6343647B2 (en) | 2000-01-11 | 2000-01-11 | Thermal joint and method of use |
Publications (1)
Publication Number | Publication Date |
---|---|
TW503544B true TW503544B (en) | 2002-09-21 |
Family
ID=23911006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW089126623A TW503544B (en) | 2000-01-11 | 2000-12-13 | Thermal joint and method of use |
Country Status (6)
Country | Link |
---|---|
US (1) | US6343647B2 (zh) |
JP (1) | JP2001257298A (zh) |
KR (1) | KR100459794B1 (zh) |
AU (1) | AU2001227751A1 (zh) |
TW (1) | TW503544B (zh) |
WO (1) | WO2001052323A2 (zh) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4459470B2 (ja) * | 2001-04-06 | 2010-04-28 | 信越化学工業株式会社 | 電子部品の放熱構造体及びそれに用いる放熱シート |
US7436058B2 (en) * | 2002-05-09 | 2008-10-14 | Intel Corporation | Reactive solder material |
US20030230403A1 (en) * | 2002-06-14 | 2003-12-18 | Webb Brent J. | Conductive thermal interface and compound |
CN1685069B (zh) * | 2002-10-07 | 2011-11-30 | 松下电器产业株式会社 | 热熔断器用元件、热熔断器及使用它的电池 |
US6665186B1 (en) | 2002-10-24 | 2003-12-16 | International Business Machines Corporation | Liquid metal thermal interface for an electronic module |
JP4014528B2 (ja) * | 2003-03-28 | 2007-11-28 | 日本碍子株式会社 | ヒートスプレッダモジュールの製造方法及びヒートスプレッダモジュール |
US7416922B2 (en) * | 2003-03-31 | 2008-08-26 | Intel Corporation | Heat sink with preattached thermal interface material and method of making same |
US7014093B2 (en) * | 2003-06-26 | 2006-03-21 | Intel Corporation | Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
US7527090B2 (en) * | 2003-06-30 | 2009-05-05 | Intel Corporation | Heat dissipating device with preselected designed interface for thermal interface materials |
US7004243B1 (en) * | 2003-07-22 | 2006-02-28 | Unisys Corporation | Method of extending the operational period of a heat-exchanger in a chip tester |
CN100370635C (zh) * | 2003-12-22 | 2008-02-20 | 中国电子科技集团公司第十八研究所 | 温差电元件与电极的压接方法 |
US20060120051A1 (en) * | 2004-12-03 | 2006-06-08 | Chris Macris | Liquid metal thermal interface material system |
JP4378334B2 (ja) * | 2005-09-09 | 2009-12-02 | 日本碍子株式会社 | ヒートスプレッダモジュール及びその製造方法 |
US9386327B2 (en) | 2006-05-24 | 2016-07-05 | Time Warner Cable Enterprises Llc | Secondary content insertion apparatus and methods |
US8280982B2 (en) | 2006-05-24 | 2012-10-02 | Time Warner Cable Inc. | Personal content server apparatus and methods |
US8024762B2 (en) | 2006-06-13 | 2011-09-20 | Time Warner Cable Inc. | Methods and apparatus for providing virtual content over a network |
US7825945B2 (en) * | 2006-09-18 | 2010-11-02 | Zink Imaging, Inc. | Thermal printer with auxiliary heat sink and methods for printing using same |
TWI344196B (en) * | 2006-11-15 | 2011-06-21 | Ind Tech Res Inst | Melting temperature adjustable metal thermal interface materials and use thereof |
US8016022B2 (en) * | 2006-11-27 | 2011-09-13 | Honeywell International Inc. | Systems and methods for passive thermal management using phase change material |
US8181206B2 (en) | 2007-02-28 | 2012-05-15 | Time Warner Cable Inc. | Personal content server apparatus and methods |
US8216418B2 (en) * | 2007-06-13 | 2012-07-10 | Lam Research Corporation | Electrode assembly and plasma processing chamber utilizing thermally conductive gasket and o-rings |
JP4345855B2 (ja) * | 2007-07-31 | 2009-10-14 | セイコーエプソン株式会社 | 半導体装置、放熱体、及び半導体装置の製造方法 |
US8152954B2 (en) | 2007-10-12 | 2012-04-10 | Lam Research Corporation | Showerhead electrode assemblies and plasma processing chambers incorporating the same |
US8187414B2 (en) | 2007-10-12 | 2012-05-29 | Lam Research Corporation | Anchoring inserts, electrode assemblies, and plasma processing chambers |
TWI354529B (en) * | 2007-11-23 | 2011-12-11 | Ind Tech Res Inst | Metal thermal interface material and thermal modul |
US9503691B2 (en) | 2008-02-19 | 2016-11-22 | Time Warner Cable Enterprises Llc | Methods and apparatus for enhanced advertising and promotional delivery in a network |
US8187413B2 (en) * | 2008-03-18 | 2012-05-29 | Lam Research Corporation | Electrode assembly and plasma processing chamber utilizing thermally conductive gasket |
US8679288B2 (en) | 2008-06-09 | 2014-03-25 | Lam Research Corporation | Showerhead electrode assemblies for plasma processing apparatuses |
US8449679B2 (en) | 2008-08-15 | 2013-05-28 | Lam Research Corporation | Temperature controlled hot edge ring assembly |
WO2011007224A2 (en) * | 2009-07-13 | 2011-01-20 | Clipper Windpower, Inc. | Low cost, high thermal conductivity heat flux transporter |
US20130224510A1 (en) * | 2012-02-29 | 2013-08-29 | General Electric Company | System including thermal interface material |
US20140111595A1 (en) | 2012-10-19 | 2014-04-24 | Zink Imaging, Inc. | Thermal printer with dual time-constant heat sink |
US20140282786A1 (en) | 2013-03-12 | 2014-09-18 | Time Warner Cable Enterprises Llc | Methods and apparatus for providing and uploading content to personalized network storage |
US9826662B2 (en) | 2013-12-12 | 2017-11-21 | General Electric Company | Reusable phase-change thermal interface structures |
KR20170108766A (ko) * | 2016-03-18 | 2017-09-27 | 헤베이 리신 테크놀로지 컴퍼니 리미티드 | 높은 연성을 가지는 무연 솔더 조성물 |
US20230054798A1 (en) * | 2020-03-27 | 2023-02-23 | Mitsubishi Electric Corporation | Metal jointed body, semiconductor device, wave guide tube, and method for joining members to be joined |
CN115808748A (zh) * | 2021-09-14 | 2023-03-17 | 戴尔产品有限公司 | 用于热电冷却光学端口的系统和方法 |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3678995A (en) * | 1970-06-22 | 1972-07-25 | Rca Corp | Support for electrical components and method of making the same |
US4092697A (en) | 1976-12-06 | 1978-05-30 | International Business Machines Corporation | Heat transfer mechanism for integrated circuit package |
JPS54132774A (en) * | 1978-04-05 | 1979-10-16 | Fujitsu Ltd | Method of joining radiation plate |
GB2090710B (en) * | 1980-12-26 | 1984-10-03 | Matsushita Electric Ind Co Ltd | Thermistor heating device |
US4384610A (en) * | 1981-10-19 | 1983-05-24 | Mcdonnell Douglas Corporation | Simple thermal joint |
US4654754A (en) * | 1982-11-02 | 1987-03-31 | Fairchild Weston Systems, Inc. | Thermal link |
US4842911A (en) | 1983-09-02 | 1989-06-27 | The Bergquist Company | Interfacing for heat sinks |
US4567505A (en) | 1983-10-27 | 1986-01-28 | The Board Of Trustees Of The Leland Stanford Junior University | Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like |
JPS60166163A (ja) * | 1984-02-09 | 1985-08-29 | Nec Kansai Ltd | ロウ付け方法 |
DE3587481T2 (de) * | 1984-02-27 | 1993-12-16 | Toshiba Kawasaki Kk | Schaltungssubstrat mit hoher Wärmeleitfähigkeit. |
US4685606A (en) * | 1986-05-09 | 1987-08-11 | International Business Machines Corporation | Oxide-free extruded thermal joint |
US4915167A (en) | 1988-08-05 | 1990-04-10 | Westinghouse Electric Corp. | Thermal coupling to enhance heat transfer |
US5224017A (en) * | 1989-05-17 | 1993-06-29 | The Charles Stark Draper Laboratory, Inc. | Composite heat transfer device |
US5198189A (en) * | 1989-08-03 | 1993-03-30 | International Business Machines Corporation | Liquid metal matrix thermal paste |
US5291371A (en) * | 1990-04-27 | 1994-03-01 | International Business Machines Corporation | Thermal joint |
JP3018554B2 (ja) * | 1991-04-25 | 2000-03-13 | 株式会社日立製作所 | 半導体モジュ−ル及びその製造方法 |
JPH0541563A (ja) * | 1991-05-28 | 1993-02-19 | Fuji Electric Co Ltd | 半導体レーザ装置の接合方法と半田層 |
US5141050A (en) * | 1991-07-31 | 1992-08-25 | Tra-Con, Inc. | Controlled highly densified diamond packing of thermally conductive electrically resistive conduit |
JP3067337B2 (ja) * | 1991-10-09 | 2000-07-17 | 東海ゴム工業株式会社 | 異方性熱伝導シートの製法 |
JP3201868B2 (ja) * | 1992-03-20 | 2001-08-27 | アジレント・テクノロジーズ・インク | 導電性熱インターフェース及びその方法 |
US5323292A (en) | 1992-10-06 | 1994-06-21 | Hewlett-Packard Company | Integrated multi-chip module having a conformal chip/heat exchanger interface |
US5323294A (en) * | 1993-03-31 | 1994-06-21 | Unisys Corporation | Liquid metal heat conducting member and integrated circuit package incorporating same |
US5344607A (en) | 1993-06-16 | 1994-09-06 | International Business Machines Corporation | Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium |
DE69328687D1 (de) * | 1993-07-06 | 2000-06-21 | Toshiba Kawasaki Kk | Wärmeleitende platte |
JP3348528B2 (ja) * | 1994-07-20 | 2002-11-20 | 富士通株式会社 | 半導体装置の製造方法と半導体装置及び電子回路装置の製造方法と電子回路装置 |
US5604978A (en) * | 1994-12-05 | 1997-02-25 | International Business Machines Corporation | Method for cooling of chips using a plurality of materials |
US5672297A (en) * | 1995-10-27 | 1997-09-30 | The Dow Chemical Company | Conductive composite articles based on expandable and contractible particulate matrices |
AU723258B2 (en) * | 1996-04-29 | 2000-08-24 | Parker-Hannifin Corporation | Conformal thermal interface material for electronic components |
US5930893A (en) * | 1996-05-29 | 1999-08-03 | Eaton; Manford L. | Thermally conductive material and method of using the same |
US5858537A (en) * | 1996-05-31 | 1999-01-12 | The United States Of America As Represented By The Secretary Of The Navy | Compliant attachment |
US5864176A (en) * | 1997-04-04 | 1999-01-26 | Unisys Corporation | Electro-mechnical subassembly having a greatly reduced thermal resistance between two mating faces by including a film of liquid, that evaporates without leaving any residue, between the faces |
US5944097A (en) * | 1997-05-06 | 1999-08-31 | Northrop Grumman Corporation | Composite substrate carrier for high power electronic devices |
JP3094094B2 (ja) * | 1998-02-02 | 2000-10-03 | 科学技術庁航空宇宙技術研究所長 | 接合媒体 |
JP2941801B1 (ja) * | 1998-09-17 | 1999-08-30 | 北川工業株式会社 | 熱伝導材 |
-
2000
- 2000-01-11 US US09/481,194 patent/US6343647B2/en not_active Expired - Fee Related
- 2000-11-01 KR KR10-2000-0064503A patent/KR100459794B1/ko not_active IP Right Cessation
- 2000-12-13 TW TW089126623A patent/TW503544B/zh not_active IP Right Cessation
-
2001
- 2001-01-09 AU AU2001227751A patent/AU2001227751A1/en not_active Abandoned
- 2001-01-09 JP JP2001001982A patent/JP2001257298A/ja not_active Withdrawn
- 2001-01-09 WO PCT/US2001/000622 patent/WO2001052323A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR100459794B1 (ko) | 2004-12-03 |
US6343647B2 (en) | 2002-02-05 |
US20010032719A1 (en) | 2001-10-25 |
WO2001052323A3 (en) | 2001-12-13 |
JP2001257298A (ja) | 2001-09-21 |
WO2001052323A2 (en) | 2001-07-19 |
KR20010070181A (ko) | 2001-07-25 |
AU2001227751A1 (en) | 2001-07-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW503544B (en) | Thermal joint and method of use | |
TWI344196B (en) | Melting temperature adjustable metal thermal interface materials and use thereof | |
US8679899B2 (en) | Multipath soldered thermal interface between a chip and its heat sink | |
US6365973B1 (en) | Filled solder | |
Gao et al. | Gallium-based thermal interface material with high compliance and wettability | |
US20070013054A1 (en) | Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages | |
TWI411691B (zh) | 金屬熱界面材料以及散熱裝置 | |
Wei | Challenges in cooling design of CPU packages for high-performance servers | |
US7846778B2 (en) | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly | |
US20030203181A1 (en) | Interstitial material with enhanced thermal conductance for semiconductor device packaging | |
US20030178720A1 (en) | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly | |
JPH04230057A (ja) | 熱放散装置およびその方法 | |
US7347354B2 (en) | Metallic solder thermal interface material layer and application of the same | |
US20020070445A1 (en) | Enveloped thermal interface with metal matrix components | |
US20090135567A1 (en) | Metal thermal interface material and thermal module and packaged microelectronic component containing the material | |
US20050245659A1 (en) | Thermal interface material and method for manufacturing same | |
WO2018233672A1 (zh) | 一种芯片封装结构 | |
TW202118988A (zh) | 分離式熱交換模組與複合式薄層導熱結構 | |
JPH03257953A (ja) | 半導体素子 | |
WO2021233241A1 (zh) | 一种功率变换装置 | |
TWI484604B (zh) | 金屬熱界面材料以及含該材料的構裝半導體 | |
JP2002093960A (ja) | マルチチップモジュールの冷却構造およびその製造方法 | |
Van Godbold et al. | Novel designs in power modules | |
Chau et al. | Feasibility study of using solid state refrigeration technologies for electronic cooling | |
US11943899B1 (en) | Composite thermal interface materials and associated devices, systems, and methods |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |