TW501842U - Structure for incorporationg an inductively coupled plasma source in plasma processing chamber - Google Patents

Structure for incorporationg an inductively coupled plasma source in plasma processing chamber

Info

Publication number
TW501842U
TW501842U TW090212272U TW90212272U TW501842U TW 501842 U TW501842 U TW 501842U TW 090212272 U TW090212272 U TW 090212272U TW 90212272 U TW90212272 U TW 90212272U TW 501842 U TW501842 U TW 501842U
Authority
TW
Taiwan
Prior art keywords
incorporationg
processing chamber
inductively coupled
plasma processing
coupled plasma
Prior art date
Application number
TW090212272U
Other languages
English (en)
Inventor
Ajit Paranjpe
Cecil J Davis
Robert T Matthews
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of TW501842U publication Critical patent/TW501842U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
TW090212272U 1994-06-30 1995-12-27 Structure for incorporationg an inductively coupled plasma source in plasma processing chamber TW501842U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/269,414 US5580385A (en) 1994-06-30 1994-06-30 Structure and method for incorporating an inductively coupled plasma source in a plasma processing chamber

Publications (1)

Publication Number Publication Date
TW501842U true TW501842U (en) 2002-09-01

Family

ID=23027137

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090212272U TW501842U (en) 1994-06-30 1995-12-27 Structure for incorporationg an inductively coupled plasma source in plasma processing chamber

Country Status (6)

Country Link
US (2) US5580385A (zh)
EP (1) EP0690666B1 (zh)
JP (1) JPH08195297A (zh)
KR (1) KR100373815B1 (zh)
DE (1) DE69504254T2 (zh)
TW (1) TW501842U (zh)

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Also Published As

Publication number Publication date
US5591493A (en) 1997-01-07
KR960002631A (ko) 1996-01-26
US5580385A (en) 1996-12-03
DE69504254D1 (de) 1998-10-01
KR100373815B1 (ko) 2003-05-01
EP0690666B1 (en) 1998-08-26
JPH08195297A (ja) 1996-07-30
DE69504254T2 (de) 1999-04-08
EP0690666A1 (en) 1996-01-03

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