495861 A7 B7 五、發明説明彳). 發明領域及相關技術 本發明係關於一種曝光設 版印刷在一基底上。更特別地 中的一種基底固持系統和方法 樣被經由一投射系統投射和印 基底上。 備，用於將一個預定圖樣平 ，本發明是關於在曝光設備 ，其中行程在一原型上的圖 刷在一藉由基底台所固持的 請 先 閲· 背 習知地，在曝光設備中，基底是被放置並固定在一個 的方向上。 光設備中，特別地是掃描型的曝光設 寬度是由一個曝光狹縫寬度的長度所 域的縱向寬度是由掃描距離來決定。 寬度的長度是固定的。如此造成了 一 底安裝方向是固定在一方向上，使得 有很大的限制。 樣配置限制同樣的出現在非掃描型曝 發明槪述' 本發明之目的是要解決以上所述的問題。 根據本發明，以上所述的問題可以被任何以下的特色 所解決。 一種曝光設備，用於將一預定圖案印刷在一基底上， 其特徵爲基底固持機構是被配置以符合多個基底安裝方向 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） 項 基底台上，於一固定 另一方面，在曝 備，曝光區域的橫向 決定的，並且曝光區 而且，由於上述狹縫 項不便，就是因爲基 欲被曝光的圖樣配置 如此不良好的圖 光設備上。 經濟部智慧財產局員工消費合作社印製 -4 495861495861 A7 B7 V. Description of the Invention 彳). Field of the Invention and Related Technology The present invention relates to an exposure plate printed on a substrate. More particularly, a substrate holding system and method is projected and printed on a substrate via a projection system. The invention is used for flattening a predetermined pattern. The present invention relates to an exposure apparatus, in which a stroke on a prototype is held on a substrate, which is held by a substrate table. It is placed and fixed in one direction. In an optical device, particularly a scanning type exposure device, the width is determined by the length of an exposure slit width, and the vertical width is determined by the scanning distance. The length of the width is fixed. This caused the bottom mounting direction to be fixed in one direction, making it very restrictive. This kind of configuration limitation also appears in non-scanning exposures. Description of the invention The purpose of the present invention is to solve the problems described above. According to the present invention, the problems described above can be solved by any of the following features. An exposure device for printing a predetermined pattern on a substrate, characterized in that the substrate holding mechanism is configured to meet a plurality of substrate installation directions. This paper size applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm). On the base table, on the other hand, the exposure is determined laterally by the exposure area, and the exposure area is also inconvenient due to the above slit item, which is because the layout of the pattern to be exposed is so poor. on. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs -4 495861
經濟部智慧財產局員工消費合作社印製 A7 ________B7五、發明説明（2 ) 基底固持機構包含用於基底位置的檢測之感測器機構 ’及用於基底吸引之真空機構，這些是被分別設置在關於 多數基底安裝位置中。 基底固持機構包含真空機構，可以符合任何基底安裝 方向。 基底安裝方向是沿著一縱向和一橫向。 真空機構包含多數真空元件，當沿著任何方向安裝時 ’大致上是沿著基底的對角線而放置。 一種曝光設備，用於將一預定圖案印刷在一基底上， 其特徵爲區別機構特徵，用於區別基底所安裝的方向，及 基底固持機構，被配置以符合多數用於基底的安裝方向。 區別機構是反應於來自該設備外面的輸入。 經由該區別機構基底安裝方向的區別是自動執行的。 基底固持機構包含一真空感測器，被配置以符合基底 安裝方向。 此曝光設備是一掃描型曝光設備，其中具有一原型放 置於其上的罩台，和具有該基底安裝於其上的基底台是被 掃描地移動，藉此形成在原型上的圖案被掃描式地轉移至 基底上。 一種電子元件之製造方法，其特徵在於使用如第1項 中所敘述的曝光設備來製造電子元件。 以上述結構，能完成曝光過程不管基底的安裝方向。 本發明的這些及其他目的、特色及優點將變得更加淸 楚，在了解以下連同附圖所作的本發明較佳實施例之說明 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） (請先閱讀背面之注意事項再填寫本頁) -裝· 訂 線 -5- 4)95861 A7 B7 五、發明説明冬) 簡易圖不說明 圖1是根據本發明一實施例的基底固持系統之槪要圖 形； 圖2是根據本發明一實施例的曝光設備之槪要圖形； 圖3是根據本發明一實施例的流程圖； 圖4A及4 B是分別爲面板配置範例的槪要圖； 圖5是版導體裝置製造過程的流程圖； 圖6是一流程圖，用於說明晶圓處理的細節。 (請先閲讀背面之注意· 丨_^裝-- 事項再 本頁) 經濟部智慧財產局員工消費合作社印製 主 要 元件對照表 1 基底 1 0 1 外側輸 入 裝置 1 0 2 記億體 機 構 1 0 3 安裝方 向 指明電路 1 0 4 基底台 1 0 4 基底台 1 0 5 感測器 1 0 6 真空埠 1 0 7 感測器 1 0 8 真空埠 1 0 9 真空埠 1 1 0 真空感 測 器 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 訂 -6- 5861 A7 ____B7 五、發明説明4 ) 2 0 1 照明光 學系 統 2 0 3 原型 2 0 4 掩罩台 2 0 5 主要框架 2 0 6 投射光 學系 統 2 0 7 基底 2 0 8 基底台 2 0 9 測量單 元 2 1 0 測量單 元 2 1 1 馬達 2 1 2 馬達 2 1 3 控制電 路 2 1 4 處理系 統 4 0 3 曝射狹 縫 4 0 4 圖樣 較佳實施例之詳細說明 經濟部智慧財產局員工消費合作社印製 以下將參照附圖說明本發明的較佳實施例。 〔第一實施例〕 圖1是一槪要圖，用於說明根據本發明的基本結構。 在圖1中，一個外側輸入裝置101，提供一輸入訊號用 於指明欲被安裝在基底台（基底固持機構）1 0 4上的基 底1，應該沿著一縱向（垂直）一橫向（水平）而放置。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 11 6 A7 ___B7 五、發明説明$ ) 所提供的資料被儲存至在基底處理系統1 〇 〇內部中的一 記憶體機構1 0 2裡。所儲存的資料然後藉由一裝置指明 電路電路1 0 3而區別。依照區別的結果，在基底台 104上的感測器105和107和真空埠106、 1 0 8和1 0 9被控制。感測器1 0 5和1 0 7各作用以 測量參照一理想安裝位置之基底電流安裝位置的偏移量。 被這些感測器測量出的偏移量然後被修正在曝光操作中， 藉此基底1能被固持在理想位置中。 真空埠106，108和109是被設置以牢固地將 基底1放置在基底台1 0 4上。真空埠1 〇 6用以吸引基 底1，當同樣的基底被橫向放置在基底台1 0 5上時。它 們被配置在基底中或大致沿著基底的對角線。真空埠 1 0 8用以吸引基底1，當相同的基底被縱向放置時。它 們被放置在基底中或大致沿著基底的對角線。真空埠 1 0 9用以在橫向安裝和縱向安裝時吸引基底1。參考數 字1 1 0標示爲一真空感測器，用於偵測真空吸引的狀態 〇 經濟部智慧財產局員工消費合作社印製 當一個縱向安裝命令被自外側輸入單元1 0 1施加時 ，三個縱向安裝感測器1 0 7和兩個縱向安裝真空埠 1 0 8以及三個共用真空埠1 〇 9均被控制。另一方面， 當一橫向安裝命令被自外側輸入單兀1 0 1施加時’三個 橫向安裝感測器1 0 5和兩個橫向安裝真空埠1 0 6以及 三個共用真空埠109均被控制。 以下將更加詳細地描述此操作。 ‘紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -8- 495861 A7 B7 五、發明説明{). 當縱向安裝資訊被輸入到外側輸入裝置1 〇 1時’它 便被記億進儲存機構1 0 2中。所儲存的資訊被藉由安裝 方向指明電路1 0 3而區別。在此情形中，由於供應道外 側輸入裝置1 0 1的資訊會關係到縱向安裝基底，所以指 明電路1 0 3提供資訊道未顯示的基底輸送系統，用於縱 向地安裝基底1。如此，基底輸送系統輸送基底1以致基 底被安裝在其縱向位置在基底台1 0 4上，如藉圖形中的 實線所描繪的一樣。 另一方面，安裝方向指明電路1 0 3運轉以啓動此三 個縱向安裝感測器1 0 7道操作狀態，且亦啓動真空埠 1 0 8和1 0 9進入操作狀態。因此，已經放置圖中實線 位置上的基底1便被埠1 0 8和1 0 9吸引，藉此被固持 在安裝位置上。 假如因此所安裝的基底1並不在理想的位置上的話， 縱向安裝感測器1 0 7供應一偏移信號，相對於理想位置 ，道控制電路（未顯示）。因此，控制電路經由啓動器（ 未險使）控制基底台1 0 4。如此，基底1能被精確地放 置在理想的位置上。 以下將詳細說明當橫向安裝資訊被供應到外側輸入裝 置1 0 1時之操作。 當橫向安裝資訊被供應到外側輸入裝置1 0 1時，此 資訊便被儲存進記憶體機構1 0 2中。此儲存的資訊之後 被以安裝方向指明電路1 0 3區別。在此情況下，由於供 應到自外側輸入裝置1 0 1的資訊關係到橫向安裝基底， 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 請 先 閲- 讀 背 面 之· 注 意 裝 訂 經濟部智慧財產局員工消費合作社印製 -9- 495861 A7 ___B7_^_ 五、發明説明ΐ ). . 所以指明電路1 Ο 3供應資訊至未顯示的基底輸送系統， 用於橫向安裝基底1。因此，基底輸送系統輸送基底1， 以致基底被安裝在其橫向位置在基底台1 0 4上，如同在 圖形中的虛線所描繪的一樣。 另一方面，安裝方向指明電路1 0 3運轉以啓動三橫 向安裝感測器1 0 5進入操作狀態，且亦使真空埠1 0 6 和1 0 9啓動進入操作狀態。因此，已經放置在圖中破折 線位置上的基底1被埠1 0 6和1 0 9吸引，藉此固持在 安裝位置上。 假如因此所安裝的基底1並不在理想的位置上的話， 橫向安裝感測器1 0 5供應一偏移訊號，相對於理想位置 ，到控制電路（未顯示）。因此，控制電路藉由啓動器（ 未顯示）控制基底台1 0 4。如此，基底1便能被精確地 放置在理想的位置上。 圖2是一掃描型曝光設備的槪要圖。圖2中以2 0 3 所標示的是_原型（在下文中，稱“掩罩”）在其上形成 欲被轉移到基底2 0 7的圖樣，例如液晶面板圖素。數字 2 0 4標示一掩罩台，用於攜帶掩罩於其上且能在X，Υ 和0的方向上移動。它沿著Υ方向有掃描曝光功能。數字 2 0 7標示是一玻璃基底，例如，在其上一圖樣例如用於 製造液晶顯示器的電晶體，是製造根據一般的平板印刷過 程。數字.2 0 8標示一基底台，用於固持基底2 0. 7且可 在X，Υ和0的方向上移動。它沿著Υ方向有一掃描曝光 功能。 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） (請先閲讀背面之注意事 -- '項再本頁) 訂 經濟部智慧財產局員工消費合作社印製 -10- 495861 A7 B7 五、發明説明< ). 數字2 0 6標示一投射光學系統，包含一鏡射系統例 如有凹面鏡和凸面鏡。它用以投射形成在掩罩2 0 3上且 藉掩罩台2 0 4放置在一預定位置上之圖樣，到基底 2 0 7上。數字2 0 1標示是一照明光學系.統，用於照明 放置在以預定波長的光曝光位置上的掩罩2 0 3。它以平 版印刷術的方式轉移掩罩2 0 3的圖樣到形成在基底 2 0 7上的一感光層。數字2 0 5標示是一主要框架，其 中基底台2 0 8和掩罩台2 0 4是被裝配於其上。 數字2 1 1和2 1 2標示馬達，用以分別地移動台 2 0 4和2 0 8，在如圖中箭頭所指的水平方向（Y方向 )上。數字2 0 9和2 1 0標示爲測量單元，例如雷射干 擾儀，用於個別監視基底台2 0 4和2 0 8的位置。一控 制電路2 1 3用以在掃描曝光操作期間控制馬達2 1 1和 2 1 2的驅動量，根據供應自雷射干擾儀2 0 9和2 1 0 的台位置資訊，藉以彼此同步移動基底台2 0 4和2 0 8 。作爲實際控制方法的一範例_，馬達2 1 1可以一固定電 壓驅動以以一固定速度移動掩罩台2 〇 4。相應於藉雷射 干擾儀2 0 9和2 1 0測量的台2 0 4和2 0 8的位置之 驅動量，可以被供應至2 1 2以移動基底台2 0 8。 數字2 0 2標示一觀察光學系統，用於採集設置在掩 罩上放置在掩罩台上的對準記號及放置在基底台上的基底 之影像。數字2 1 4標示一處理系統，用於移動觀察光學 系統2 0 2到一指定位置上。 以下將詳細說明本發明第一實施例。 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再^*本頁) -裝. 訂 經濟部智慧財產局員工消費合作社印製 •11 - 495861 A7 B7 五、發明説明$ ), 圖3是根據此實施例的一流程圖。圖4A和4 B顯示 面板配置的範例。 在圖4A和4B中，數字4 0 3標示一曝光狹縫，在 掃描曝光操作期間曝射光是通過此曝光狹縫。此狹縫寬度 的長度是固定的。數字4 0 4標示是欲被影印在基底上的 圖樣，如液晶面板圖素。 在曝光過程欲以圖4 A所示面板配置實施之處，由於 曝光狹縫4 0 3的寬度是固定在3 3 Omm，用於放置基 底在一基底台上，所以只有基底的橫向放置能實施曝光。 另一方面，在曝光過程欲以圖4 B所示面板配置實施之處 ，由於相似理由的關係，只有基底的縱向放置才能實施曝 光。 經濟部智慧財產局員工消費合作社印製 在圖3的流程圖中，當考慮上述的情況時，欲被採用 的面板配置是被決定在（S301)，且然後一適當的基 底安裝位置被指明（S302)。所輸入的資訊被儲存進 入至記憶體機構（S 3 0 3 )-。接著，關於基底安裝位置 如儲存在記億體機構中的資訊被區別（S 3 0 4 )。假如 縱向放置被指明的話，此縱向安裝感測器和真空埠被控制 (S305)。假如橫向放置被指明的話，此橫向安裝感 測器和真空埠被控制（S 3 0 6 )。然後，便執行掃描曝 光操作。當所有曝光操作完成時（S307)，程序便完 成了。若沒有完成的話，順序會返回步驟S 3 0 4，且掃 描曝光過程會重複根據儲存在記憶體機構中的資訊。 雖然此實施例是參考一掃描型曝光設備而說明，但發 本紙張尺度適用中國國家標準（ CNS ) A4規格（210X297公釐）~ ' " -12- 495861 Α7 Β7 經濟部智慧財產局員工消費合作社印製 五、發明説明彳〇 ). 明並不僅限於此。它也能被應用到例如投射曝光設備或電 子光束圖樣描繪設備。在這樣的情形中，欲被印刷且轉移 的掩罩圖案的基底就是晶圓。 〔第二實施例〕 在第一實施例中，基底安裝位置被控制根據自設備外 面的資訊。現在將說明其中基底安裝位置會被自動區別的 例子。 在圖1中，當基底1被放置在曝光設備的基底台 1 0 4上時，橫向安裝真空埠1 0 6及縱向安裝真空埠 1 0 8被同時操作。從藉由真空感測器1 1 0所偵測的結 果來看，基底1的安裝方向能被自動地區別。藉由此區別 所獲得的資訊是被儲存進入記億體機構1 0 2中。之後， 當產生與儲存在記憶體機構中的基底1安裝位置時，若縱 向放置被指明的話，此縱向安裝感測器1 0 7和縱向安裝 真空埠1 0 8以及共用真空埠-1 0 9被操作，然而另一方 面，橫向安裝真空埠1 0 6則會停止。另一方面，若橫向 放置被指定的話，橫向安裝感測器1 0 5和橫向安裝真空 部份1 0 6以及共用真空埠1 0 9被操作，然而另一方面 ，縱向安裝真空部份則會停止。在基底1被如上述固持之 後，則執行掃描曝光操作，投射曝光操作或電子光束圖樣 描繪操作。 根據上述的本發明，欲被印刷在基底上的圖樣配置之 自由被擴大很多，也因此，能完成配置的最佳化。因此， (請先閲讀背面之注意事項再构寫本頁) fj: 裝· 、tr 1F$— 本紙張又度適用中國國家標準（CNS ) Α4規格（210X297公釐） •13- 495861 A7 B7 五、發明説明彳1 ). 可以增加例如液晶面板之半導體裝置的生產力，且降低生 產成本。 〔裝置製造的實施例〕 接下來，將說明使用上述版導體曝射設備的版導體裝 置製造方法之一實施例。 圖5是一用於製造例如半導體晶片（例如IC或 LS I s)，液晶面板，CCDs，薄膜磁頭或微型機器 等微裝置之過程的流程圖。 步驟1是一設計步驟，用於設計半導體裝置的電路， 步驟2是一步驟，用於製作掩罩根據電路圖樣的設計。步 驟3是一步驟，用於藉由如矽的材質而備製一晶圓。步驟 4是一晶圓處理（稱爲前處理），其中藉有準備好的掩罩 和晶圓，電路被經由平版印刷術實際地形成在晶圓上。在 此之後的步驟5是一組裝步驟（稱爲後處理），其中已經 被步驟4所處理過的晶圓形成在半導體晶片中。此步驟包 含一組裝（切割和接合）步驟和封裝（晶片蜜蜂）步驟。 步驟六是一檢查步驟，其中實施用於藉由步驟5所設置的 導體裝置之操作檢查，持久性檢查等等。藉由這些過程’ 半導體裝置被完成並被裝運（步驟7)。 圖6是一流程圖，顯示晶圓處理的細節。 步驟1 1是一氧化處理，用於氧化晶圓表面。步驟 1 2是一 CVD處理，用於形成一絕緣膜在晶圓表面上。 步驟1 3是一電極形成處理，用於藉由蒸鍍在晶圓上形成 本紙張尺度適用中國國家標準（CNS ) A4規格（210X29*7公釐） .裝-- (請先閲讀背面之注意事項再㈣寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 -14- 495861 :Ί. 五、發明説明（12 ) 電極。步驟1 4 °步驟1 5是光 晶圓上。步驟1 路圖樣經由上述 影處理，用於顯 ’用於移除除了 光阻分離處理， 圓上的光阻材質 形成在晶圓上。 藉這些過程 雖然本發明 不是僅限於所提 的或下列申請專 Α7 Β7 是一離子植入處理，用於植入離子到晶圓 阻處理，用於塗敷一光阻（感光材質）至 6是一曝光處理，藉曝光用於將掩罩的電 曝光設備印刷在晶圓上。步驟1 7是一顯 影被曝光的晶圓。步驟1 8是一蝕刻處理 所顯影的光阻影像之部份。步驟1 9是一 用於在受到蝕刻處理之後，分離殘留在晶 。藉由重複這些過程，電路圖樣被重疊地 ，可以製作高密度的微電子元件。 已經被參考文中所揭露的結構而說明，但 出的細節，並且本案打算涵蓋在以改良目 利範圍的範圍之內所作的修改或改變。 (請先閱讀背面之注意事項再填寫本頁) -裝_ 訂 -線· 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） 15-Printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs A7 ________ B7 V. Description of the invention (2) The substrate holding mechanism includes a sensor mechanism for detecting the position of the substrate 'and a vacuum mechanism for substrate suction. These are separately provided in About most substrate mounting positions. The substrate holding mechanism includes a vacuum mechanism, which can conform to any substrate mounting direction. The mounting direction of the substrate is along a longitudinal direction and a transverse direction. The vacuum mechanism contains most vacuum elements, and when mounted in any direction, it is placed substantially along the diagonal of the substrate. An exposure apparatus for printing a predetermined pattern on a substrate is characterized by a distinguishing mechanism feature for distinguishing a direction in which the substrate is mounted, and a substrate holding mechanism configured to conform to a mounting direction for most substrates. The distinguishing mechanism is responsive to input from outside the device. The difference in the mounting direction of the substrate through this difference mechanism is performed automatically. The substrate holding mechanism includes a vacuum sensor configured to conform to a substrate mounting direction. This exposure apparatus is a scanning type exposure apparatus having a cover table on which a prototype is placed, and a substrate table having the substrate mounted thereon to be scannedly moved, whereby a pattern formed on the prototype is scanned. Ground transfer to the substrate. An electronic component manufacturing method characterized in that an electronic component is manufactured using an exposure apparatus as described in the first item. With the above structure, the exposure process can be completed regardless of the mounting direction of the substrate. These and other objects, features, and advantages of the present invention will become even clearer. After understanding the following description of the preferred embodiment of the present invention made with the accompanying drawings, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 public) (%) (Please read the precautions on the back before filling in this page)-Binding · Binding -5- 4) 95861 A7 B7 V. Description of the invention Winter) Simple diagram does not explain Figure 1 is a substrate holding according to an embodiment of the present invention Essential figure of the system; Figure 2 is a essential figure of an exposure device according to an embodiment of the present invention; Figure 3 is a flowchart according to an embodiment of the present invention; Figures 4A and 4B are essentials of a panel configuration example respectively FIG. 5 is a flowchart of the manufacturing process of the plate conductor device. FIG. 6 is a flowchart for explaining the details of wafer processing. (Please read the note on the back first. 丨 _ ^ Installation-items on this page) The comparison table of the main components printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy 1 Base 1 0 1 External input device 1 0 2 Billion body organization 1 0 3 Mounting direction indicating circuit 1 0 4 Base table 1 0 4 Base table 1 0 5 Sensor 1 0 6 Vacuum port 1 0 7 Sensor 1 0 8 Vacuum port 1 0 9 Vacuum port 1 1 0 Vacuum sensor Paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) Order-6- 5861 A7 ____B7 V. Description of invention 4) 2 0 1 Illumination optical system 2 0 3 Prototype 2 0 4 Masking table 2 0 5 Main frame 2 0 6 Projection optical system 2 0 7 Base 2 0 8 Base table 2 0 9 Measuring unit 2 1 0 Measuring unit 2 1 1 Motor 2 1 2 Motor 2 1 3 Control circuit 2 1 4 Processing system 4 0 3 Exposure slit Detailed description of the preferred embodiment of the drawing 4 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The preferred embodiment of the present invention will be described below with reference to the drawings. [First Embodiment] Fig. 1 is a schematic diagram for explaining the basic structure according to the present invention. In FIG. 1, an external input device 101 provides an input signal for indicating that the substrate 1 to be mounted on the substrate table (substrate holding mechanism) 104 should be along a longitudinal (vertical) and a lateral (horizontal) While placed. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 11 6 A7 ___B7 V. Description of the invention $) The information provided is stored in a memory mechanism 1 inside the substrate processing system 100 2 miles. The stored data is then distinguished by a device designation circuit 103. According to the distinguished results, the sensors 105 and 107 and the vacuum ports 106, 108, and 10 9 on the substrate table 104 are controlled. The sensors 105 and 107 each act to measure the offset of the substrate current mounting position with reference to an ideal mounting position. The amount of offset measured by these sensors is then corrected in the exposure operation, whereby the substrate 1 can be held in a desired position. The vacuum ports 106, 108, and 109 are provided to firmly place the substrate 1 on the substrate table 104. The vacuum port 106 is used to attract the substrate 1 when the same substrate is placed laterally on the substrate table 105. They are arranged in the substrate or approximately along the diagonal of the substrate. The vacuum port 108 is used to attract the substrate 1 when the same substrate is placed longitudinally. They are placed in the substrate or approximately along the diagonal of the substrate. The vacuum port 1 0 9 is used to attract the substrate 1 in a horizontal installation and a vertical installation. The reference number 1 1 0 is marked as a vacuum sensor to detect the state of vacuum suction. 0 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. When a vertical installation command is applied from the external input unit 1 0 1 Both longitudinally mounted sensors 107 and two longitudinally mounted vacuum ports 108 and three common vacuum ports 109 are controlled. On the other hand, when a horizontal mounting command is applied from the outside input unit 101, three horizontal mounting sensors 105 and two horizontal mounting vacuum ports 106 and three common vacuum ports 109 are all applied. control. This operation will be described in more detail below. 'The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -8- 495861 A7 B7 V. Description of the invention {). When the vertical installation information is input to the external input device 1 0', it will be recorded in 100 million Into the storage mechanism 102. The stored information is distinguished by the installation direction designation circuit 103. In this case, since the information of the input device 1 0 1 on the outside of the supply track is related to the vertical mounting of the substrate, the circuit 1 0 3 is provided to provide a substrate conveying system (not shown) for the vertical mounting of the substrate 1. In this way, the substrate conveying system conveys the substrate 1 so that the substrate is mounted in its longitudinal position on the substrate table 104, as depicted by the solid line in the figure. On the other hand, the installation direction designation circuit 103 is operated to activate the 107 operating states of the three longitudinally mounted sensors, and the vacuum ports 108 and 109 are also activated to enter the operating state. Therefore, the substrate 1 which has been placed on the solid line position in the figure is attracted by the ports 108 and 109, thereby being held in the installation position. If the mounted substrate 1 is not in an ideal position, the longitudinally mounted sensor 107 supplies an offset signal, and a track control circuit (not shown) is provided relative to the ideal position. Therefore, the control circuit controls the substrate table 104 via a starter (not dangerous). Thus, the substrate 1 can be accurately placed at a desired position. The operation when the lateral installation information is supplied to the external input device 101 will be described in detail below. When the horizontal installation information is supplied to the external input device 101, this information is stored in the memory mechanism 102. This stored information is then distinguished by the circuit designating direction 103. In this case, since the information supplied to the external input device 1 0 1 is related to the horizontal mounting base, this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm). Please read first-read the back · note binding Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs-9- 495861 A7 ___ B7 _ ^ _ V. Description of the invention))... So specify the circuit 1 Ο 3 supply information to the substrate conveying system not shown for horizontal installation of substrate 1. Therefore, the substrate transport system transports the substrate 1 so that the substrate is mounted in its lateral position on the substrate table 104, as depicted by the dotted line in the figure. On the other hand, the installation direction designation circuit 103 is operated to start the three-horizontal installation sensor 105 and put into operation, and the vacuum ports 106 and 10 9 are also put into operation. Therefore, the substrate 1 which has been placed at the broken line position in the figure is attracted by the ports 106 and 109, thereby being held in the mounting position. If the mounted substrate 1 is not in the ideal position, the laterally mounted sensor 105 supplies an offset signal relative to the ideal position to the control circuit (not shown). Therefore, the control circuit controls the substrate table 104 by means of a starter (not shown). Thus, the substrate 1 can be accurately placed at a desired position. FIG. 2 is a schematic diagram of a scanning type exposure apparatus. In FIG. 2, indicated by 203 is a prototype (hereinafter, referred to as a "mask") on which a pattern to be transferred to the substrate 207, such as a liquid crystal panel pixel, is formed. The number 2 0 4 indicates a mask table for carrying a mask thereon and capable of moving in the directions of X, Υ and 0. It has a scanning exposure function along the Υ direction. The numeral 2 07 indicates a glass substrate, for example, a pattern thereon, such as a transistor used to manufacture a liquid crystal display, is manufactured according to a general lithographic process. The number .208 indicates a base table for holding the base 20.7 and is movable in the directions of X, X and 0. It has a scanning exposure function along the Υ direction. This paper size applies to China National Standard (CNS) A4 specification (210 × 297 mm) (Please read the note on the back-'item and then this page) Order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives-10-495861 A7 B7 V. Description of the invention <). The number 206 indicates a projection optical system, including a mirror system such as a concave mirror and a convex mirror. It is used to project a pattern formed on the mask 2 0 3 and placed on a predetermined position by the mask 2 0 4 onto the base 2 7. The number 2 0 1 designates an illumination optical system for illuminating a mask 2 3 placed at a light exposure position at a predetermined wavelength. It transfers the pattern of the mask 203 to a photosensitive layer formed on the substrate 207 in a lithographic manner. The number 205 indicates a main frame, in which the base table 208 and the mask table 204 are mounted on it. The numbers 2 1 1 and 2 1 2 indicate the motors, which are used to move the stations 2 0 4 and 2 8 respectively, in the horizontal direction (Y direction) as indicated by the arrows in the figure. The numbers 2 0 9 and 2 1 0 are marked as measuring units, such as laser interference meters, which are used to individually monitor the positions of the base tables 2 0 0 and 2 0 8. A control circuit 2 1 3 is used to control the driving amount of the motors 2 1 1 and 2 1 2 during the scanning exposure operation, and to move the substrates in synchronization with each other according to the position information of the tables supplied from the laser jammers 2 9 and 2 1 0. Desks 2 0 4 and 2 0 8. As an example of the actual control method, the motor 2 1 1 can be driven at a fixed voltage to move the mask table 204 at a fixed speed. The driving amount corresponding to the positions of the tables 204 and 208 measured by the laser jammers 209 and 2 10 can be supplied to 2 1 2 to move the base table 208. The number 2 0 2 indicates an observation optical system for collecting an alignment mark placed on the mask on the mask table and an image of the substrate placed on the substrate table. The number 2 1 4 indicates a processing system for moving the observation optical system 202 to a designated position. Hereinafter, a first embodiment of the present invention will be described in detail. This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before ^ * this page)-Packing. Order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives • 11-495861 A7 B7 V. Description of the invention $), FIG. 3 is a flowchart according to this embodiment. Figures 4A and 4B show examples of panel configurations. In Figs. 4A and 4B, the number 4 03 indicates an exposure slit through which the exposure light passes during the scanning exposure operation. The length of this slit width is fixed. The number 4 0 4 indicates the pattern to be photocopied on the substrate, such as the LCD panel pixel. Where the exposure process is intended to be implemented in the panel configuration shown in FIG. 4A, since the width of the exposure slit 403 is fixed at 3 3 Omm for placing the substrate on a substrate table, only the lateral placement of the substrate can be implemented exposure. On the other hand, where the exposure process is to be implemented in the panel configuration shown in FIG. 4B, for similar reasons, exposure can only be performed by placing the substrate in the longitudinal direction. Printed in the flowchart of Figure 3 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, when considering the above situation, the panel configuration to be adopted is determined at (S301), and then an appropriate base installation position is specified ( S302). The entered information is stored in the memory mechanism (S 3 0 3)-. Then, the information about the mounting position of the substrate, such as stored in the recorder body, is distinguished (S 3 0 4). If the vertical placement is specified, the vertical installation sensor and the vacuum port are controlled (S305). If lateral placement is specified, this laterally mounted sensor and vacuum port are controlled (S306). Then, the scanning exposure operation is performed. When all the exposure operations are completed (S307), the program is completed. If it is not completed, the sequence will return to step S304, and the scanning exposure process will be repeated based on the information stored in the memory mechanism. Although this embodiment is described with reference to a scanning exposure device, the paper size used in this paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm) ~ '" -12- 495861 Α7 Β7 Employees ’Consumption of Intellectual Property, Ministry of Economic Affairs Printed by the cooperative V. Description of invention 彳 〇). The description is not limited to this. It can also be applied to, for example, a projection exposure device or an electron beam pattern drawing device. In such a case, the substrate of the mask pattern to be printed and transferred is the wafer. [Second Embodiment] In the first embodiment, the substrate mounting position is controlled based on information from the outside of the device. An example in which the substrate mounting position is automatically distinguished will now be explained. In FIG. 1, when the substrate 1 is placed on the substrate table 104 of the exposure apparatus, the laterally mounted vacuum ports 106 and the longitudinally mounted vacuum ports 108 are operated simultaneously. From the results detected by the vacuum sensor 110, the mounting direction of the substrate 1 can be automatically distinguished. Based on this distinction, the information obtained is stored in the Billion Body Institute 102. After that, when the mounting position of the substrate 1 is generated and stored in the memory mechanism, if the vertical placement is specified, the vertical mounting sensor 1 07, the vertical mounting vacuum port 108, and the shared vacuum port-1 0 9 Is operated, but on the other hand, the lateral installation of vacuum port 106 is stopped. On the other hand, if the horizontal placement is specified, the horizontal installation of the sensor 105 and the horizontal installation of the vacuum section 106 and the shared vacuum port 109 are operated. However, on the other hand, the vertical installation of the vacuum section will operate. stop. After the substrate 1 is held as described above, a scanning exposure operation, a projection exposure operation, or an electron beam pattern drawing operation is performed. According to the present invention described above, the freedom of arrangement of patterns to be printed on a substrate is greatly expanded, and therefore, optimization of arrangement can be achieved. Therefore, (please read the precautions on the back before composing this page) fj: installed ·, tr 1F $ — this paper is again applicable to China National Standard (CNS) Α4 size (210X297 mm) • 13- 495861 A7 B7 5 Description of the invention 彳 1). It can increase the productivity of semiconductor devices such as liquid crystal panels and reduce production costs. [Embodiment of device manufacturing] Next, an embodiment of a method of manufacturing a plate conductor device using the above plate conductor exposure apparatus will be described. FIG. 5 is a flowchart of a process for manufacturing a micro device such as a semiconductor wafer (such as an IC or LS I s), a liquid crystal panel, a CCDs, a thin film magnetic head, or a micromachine. Step 1 is a design step for designing a circuit of a semiconductor device, and Step 2 is a step for making a mask design according to a circuit pattern. Step 3 is a step for preparing a wafer from a material such as silicon. Step 4 is a wafer process (called pre-processing), in which the circuit is actually formed on the wafer via lithography, with the prepared mask and wafer. Step 5 after this is an assembly step (referred to as post-processing), in which the wafer that has been processed in step 4 is formed in a semiconductor wafer. This step includes an assembly (cutting and bonding) step and a packaging (wafer bee) step. Step 6 is a check step in which an operation check, a durability check, and the like for the conductor device set by step 5 are performed. Through these processes, the semiconductor device is completed and shipped (step 7). FIG. 6 is a flowchart showing details of wafer processing. Step 11 is an oxidation treatment for oxidizing the surface of the wafer. Step 12 is a CVD process for forming an insulating film on the wafer surface. Step 13 is an electrode forming process, which is used to form the paper on the wafer by evaporation. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X29 * 7 mm). Installation-(Please read the note on the back first Matters are reprinted on this page) Order printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -14-495861: Ί. V. Description of the invention (12) Electrode. Step 1 4 ° Step 15 is light on the wafer. Step 1 The path pattern is processed by the above-mentioned shadowing process, and is used for display. In addition to the photoresist separation process, the photoresist material on the circle is formed on the wafer. By these processes, although the present invention is not limited to the proposed or the following applications, A7 B7 is an ion implantation process, used to implant ions into the wafer resist process, used to apply a photoresist (photosensitive material) to 6 is An exposure process by which the masked electrical exposure equipment is printed on a wafer by exposure. Step 17 is a wafer whose development is exposed. Step 18 is an etching process to develop a portion of the photoresist image. Step 19 is a step for separating residual crystals after being subjected to an etching treatment. By repeating these processes, the circuit patterns are overlapped, and high-density microelectronic components can be produced. It has been explained with reference to the structure disclosed in the text, but details are given, and this case is intended to cover modifications or changes made within the scope of the improvement objectives. (Please read the precautions on the back before filling out this page)-Binding-Ordering-Line · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy