TW472320B - Plasma etching equipment and LCD module fabricated using the same - Google Patents

Plasma etching equipment and LCD module fabricated using the same Download PDF

Info

Publication number
TW472320B
TW472320B TW088114171A TW88114171A TW472320B TW 472320 B TW472320 B TW 472320B TW 088114171 A TW088114171 A TW 088114171A TW 88114171 A TW88114171 A TW 88114171A TW 472320 B TW472320 B TW 472320B
Authority
TW
Taiwan
Prior art keywords
cathode electrode
glass substrate
cathode
plasma
lcd glass
Prior art date
Application number
TW088114171A
Other languages
English (en)
Chinese (zh)
Inventor
Chang-Hoon Park
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW472320B publication Critical patent/TW472320B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32559—Protection means, e.g. coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW088114171A 1998-08-26 1999-08-19 Plasma etching equipment and LCD module fabricated using the same TW472320B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019980034587A KR100275671B1 (ko) 1998-08-26 1998-08-26 플라즈마 식각 설비

Publications (1)

Publication Number Publication Date
TW472320B true TW472320B (en) 2002-01-11

Family

ID=19548300

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088114171A TW472320B (en) 1998-08-26 1999-08-19 Plasma etching equipment and LCD module fabricated using the same

Country Status (4)

Country Link
JP (1) JP4487026B2 (https=)
KR (1) KR100275671B1 (https=)
CN (1) CN1157758C (https=)
TW (1) TW472320B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127041A (ja) * 1999-10-26 2001-05-11 Matsushita Electric Ind Co Ltd 基板のプラズマ処理装置およびプラズマ処理方法
EP1352415A2 (en) * 2000-10-23 2003-10-15 Applied Materials, Inc. Monitoring substrate processing using reflected radiation
CN102969361B (zh) * 2011-09-01 2015-09-23 中国科学院微电子研究所 光照稳定性非晶态金属氧化物tft器件以及显示器件
KR101384980B1 (ko) * 2012-06-25 2014-04-14 주식회사 테스 플라즈마 발생장치 및 이를 포함하는 박막증착장치
CN105225989B (zh) * 2015-10-13 2018-12-28 京东方科技集团股份有限公司 等离子刻蚀机
CN108711546B (zh) * 2018-04-28 2019-07-23 武汉华星光电技术有限公司 下电极及干蚀刻机
CN111970838B (zh) * 2020-08-24 2021-09-21 泉州市创智工业设计服务有限公司 一种用于生产电路板的蚀刻机

Also Published As

Publication number Publication date
KR20000014935A (ko) 2000-03-15
KR100275671B1 (ko) 2001-02-01
JP2000091328A (ja) 2000-03-31
JP4487026B2 (ja) 2010-06-23
CN1246724A (zh) 2000-03-08
CN1157758C (zh) 2004-07-14

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees