KR100275671B1 - 플라즈마 식각 설비 - Google Patents
플라즈마 식각 설비 Download PDFInfo
- Publication number
- KR100275671B1 KR100275671B1 KR1019980034587A KR19980034587A KR100275671B1 KR 100275671 B1 KR100275671 B1 KR 100275671B1 KR 1019980034587 A KR1019980034587 A KR 1019980034587A KR 19980034587 A KR19980034587 A KR 19980034587A KR 100275671 B1 KR100275671 B1 KR 100275671B1
- Authority
- KR
- South Korea
- Prior art keywords
- cathode electrode
- cathode
- lcd glass
- mother substrate
- glass mother
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32559—Protection means, e.g. coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0418—Apparatus for fluid treatment for etching
- H10P72/0421—Apparatus for fluid treatment for etching for drying etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980034587A KR100275671B1 (ko) | 1998-08-26 | 1998-08-26 | 플라즈마 식각 설비 |
| TW088114171A TW472320B (en) | 1998-08-26 | 1999-08-19 | Plasma etching equipment and LCD module fabricated using the same |
| JP23852699A JP4487026B2 (ja) | 1998-08-26 | 1999-08-25 | プラズマエッチング装置 |
| CNB991180909A CN1157758C (zh) | 1998-08-26 | 1999-08-25 | 等离子体蚀刻设备 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980034587A KR100275671B1 (ko) | 1998-08-26 | 1998-08-26 | 플라즈마 식각 설비 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20000014935A KR20000014935A (ko) | 2000-03-15 |
| KR100275671B1 true KR100275671B1 (ko) | 2001-02-01 |
Family
ID=19548300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980034587A Expired - Fee Related KR100275671B1 (ko) | 1998-08-26 | 1998-08-26 | 플라즈마 식각 설비 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4487026B2 (https=) |
| KR (1) | KR100275671B1 (https=) |
| CN (1) | CN1157758C (https=) |
| TW (1) | TW472320B (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101384980B1 (ko) * | 2012-06-25 | 2014-04-14 | 주식회사 테스 | 플라즈마 발생장치 및 이를 포함하는 박막증착장치 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001127041A (ja) * | 1999-10-26 | 2001-05-11 | Matsushita Electric Ind Co Ltd | 基板のプラズマ処理装置およびプラズマ処理方法 |
| EP1352415A2 (en) * | 2000-10-23 | 2003-10-15 | Applied Materials, Inc. | Monitoring substrate processing using reflected radiation |
| CN102969361B (zh) * | 2011-09-01 | 2015-09-23 | 中国科学院微电子研究所 | 光照稳定性非晶态金属氧化物tft器件以及显示器件 |
| CN105225989B (zh) * | 2015-10-13 | 2018-12-28 | 京东方科技集团股份有限公司 | 等离子刻蚀机 |
| CN108711546B (zh) * | 2018-04-28 | 2019-07-23 | 武汉华星光电技术有限公司 | 下电极及干蚀刻机 |
| CN111970838B (zh) * | 2020-08-24 | 2021-09-21 | 泉州市创智工业设计服务有限公司 | 一种用于生产电路板的蚀刻机 |
-
1998
- 1998-08-26 KR KR1019980034587A patent/KR100275671B1/ko not_active Expired - Fee Related
-
1999
- 1999-08-19 TW TW088114171A patent/TW472320B/zh not_active IP Right Cessation
- 1999-08-25 CN CNB991180909A patent/CN1157758C/zh not_active Expired - Fee Related
- 1999-08-25 JP JP23852699A patent/JP4487026B2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101384980B1 (ko) * | 2012-06-25 | 2014-04-14 | 주식회사 테스 | 플라즈마 발생장치 및 이를 포함하는 박막증착장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20000014935A (ko) | 2000-03-15 |
| JP2000091328A (ja) | 2000-03-31 |
| JP4487026B2 (ja) | 2010-06-23 |
| CN1246724A (zh) | 2000-03-08 |
| CN1157758C (zh) | 2004-07-14 |
| TW472320B (en) | 2002-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8845810B2 (en) | Substrate damage prevention system and method | |
| KR100252075B1 (ko) | 기판처리장치 및 기판처리장치에서 기판을 반출하기 위한 방법 | |
| US6676761B2 (en) | Method and apparatus for dechucking a substrate | |
| JP5219377B2 (ja) | 基板載置台および基板処理装置 | |
| KR100275671B1 (ko) | 플라즈마 식각 설비 | |
| KR20080109646A (ko) | 탑재대 및 그것을 이용한 플라즈마 처리장치 | |
| US12120923B2 (en) | Display device and method for manufacturing same | |
| US6759350B2 (en) | Method for improving contact hole patterning | |
| JP2001127041A (ja) | 基板のプラズマ処理装置およびプラズマ処理方法 | |
| US20090056874A1 (en) | Lower electrode assembly for processing substrates | |
| KR20100081285A (ko) | 리프트핀 어셈블리 | |
| KR100601988B1 (ko) | 웨이퍼 가열 장비 | |
| JP2590759B2 (ja) | 偏光板貼付装置 | |
| JP2001217231A (ja) | ドライ・エッチング装置(DryEtchingApparatus) | |
| KR101256485B1 (ko) | 기판처리장치의 공정챔버 | |
| KR100648402B1 (ko) | 플라즈마 처리장치 | |
| US20080247114A1 (en) | Method for removing static electricity from a plate | |
| KR100553102B1 (ko) | 리프트 핀 모듈 및 그것을 구비하는 평판표시소자 제조장치 | |
| JPH10133229A (ja) | 液晶パネルの製造方法および製造装置 | |
| JP4913113B2 (ja) | 平板表示素子製造装置の下部電極組立体 | |
| KR100596329B1 (ko) | 플라즈마 처리장치의 접지수단 | |
| KR20060094408A (ko) | 플라즈마 처리장치 | |
| KR20040040240A (ko) | 건식 식각 챔버의 리프트 핀 구조 | |
| KR0168810B1 (ko) | 정전기 방지용 작업 테이블 | |
| KR20250059594A (ko) | 기판처리장치 및 기판처리장치의 기판홀더 어셈블리 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 12 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| FPAY | Annual fee payment |
Payment date: 20120914 Year of fee payment: 13 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 13 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R14-asn-PN2301 |
|
| FPAY | Annual fee payment |
Payment date: 20130830 Year of fee payment: 14 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 14 |
|
| FPAY | Annual fee payment |
Payment date: 20140901 Year of fee payment: 15 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 15 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 16 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20160923 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20160923 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |