TW472291B - Zone controlled radiant heating system utilizing focused reflector - Google Patents

Zone controlled radiant heating system utilizing focused reflector Download PDF

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Publication number
TW472291B
TW472291B TW089123724A TW89123724A TW472291B TW 472291 B TW472291 B TW 472291B TW 089123724 A TW089123724 A TW 089123724A TW 89123724 A TW89123724 A TW 89123724A TW 472291 B TW472291 B TW 472291B
Authority
TW
Taiwan
Prior art keywords
temperature
controller
substrate
patent application
scope
Prior art date
Application number
TW089123724A
Other languages
English (en)
Chinese (zh)
Inventor
David William Kinnard
Andre Gil Cardoso
Original Assignee
Axcelis Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Tech Inc filed Critical Axcelis Tech Inc
Application granted granted Critical
Publication of TW472291B publication Critical patent/TW472291B/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D9/00—Central heating systems employing combinations of heat transfer fluids covered by two or more of groups F24D1/00 - F24D7/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Plasma Technology (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Chemical Vapour Deposition (AREA)
TW089123724A 1999-11-09 2000-11-09 Zone controlled radiant heating system utilizing focused reflector TW472291B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/436,681 US6259072B1 (en) 1999-11-09 1999-11-09 Zone controlled radiant heating system utilizing focused reflector

Publications (1)

Publication Number Publication Date
TW472291B true TW472291B (en) 2002-01-11

Family

ID=23733396

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089123724A TW472291B (en) 1999-11-09 2000-11-09 Zone controlled radiant heating system utilizing focused reflector

Country Status (5)

Country Link
US (1) US6259072B1 (enExample)
EP (1) EP1100114A3 (enExample)
JP (1) JP4868193B2 (enExample)
KR (1) KR100674764B1 (enExample)
TW (1) TW472291B (enExample)

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CN111326396A (zh) * 2018-12-13 2020-06-23 夏泰鑫半导体(青岛)有限公司 处理晶圆的等离子体处理系统
US10937672B2 (en) 2015-10-09 2021-03-02 Beijing Naura Microelectronics Equipment Co., Ltd. Heating device and heating chamber

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KR100481180B1 (ko) * 2002-09-10 2005-04-07 삼성전자주식회사 포토레지스트 제거방법
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JP5169299B2 (ja) * 2008-02-22 2013-03-27 株式会社デンソー 半導体製造装置
JP5236591B2 (ja) * 2009-08-04 2013-07-17 株式会社アルバック プラズマ処理装置
US8548312B2 (en) 2010-02-19 2013-10-01 Applied Materials, Inc. High efficiency high accuracy heater driver
US10504719B2 (en) * 2012-04-25 2019-12-10 Applied Materials, Inc. Cooled reflective adapter plate for a deposition chamber
WO2015112969A1 (en) 2014-01-27 2015-07-30 Veeco Instruments. Inc. Wafer carrier having retention pockets with compound radii for chemical vapor deposition systems
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US10386821B2 (en) 2015-06-22 2019-08-20 Lam Research Corporation Systems and methods for calibrating scalar field contribution values for a limited number of sensors including a temperature value of an electrostatic chuck and estimating temperature distribution profiles based on calibrated values
US10381248B2 (en) * 2015-06-22 2019-08-13 Lam Research Corporation Auto-correction of electrostatic chuck temperature non-uniformity
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10937672B2 (en) 2015-10-09 2021-03-02 Beijing Naura Microelectronics Equipment Co., Ltd. Heating device and heating chamber
CN111326396A (zh) * 2018-12-13 2020-06-23 夏泰鑫半导体(青岛)有限公司 处理晶圆的等离子体处理系统
CN111326396B (zh) * 2018-12-13 2023-03-24 夏泰鑫半导体(青岛)有限公司 处理晶圆的等离子体处理系统

Also Published As

Publication number Publication date
EP1100114A3 (en) 2003-06-18
EP1100114A2 (en) 2001-05-16
KR20010051571A (ko) 2001-06-25
JP2001203195A (ja) 2001-07-27
US6259072B1 (en) 2001-07-10
KR100674764B1 (ko) 2007-01-25
JP4868193B2 (ja) 2012-02-01

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