TW466718B - Electronic device and semiconductor package - Google Patents

Electronic device and semiconductor package Download PDF

Info

Publication number
TW466718B
TW466718B TW087113727A TW87113727A TW466718B TW 466718 B TW466718 B TW 466718B TW 087113727 A TW087113727 A TW 087113727A TW 87113727 A TW87113727 A TW 87113727A TW 466718 B TW466718 B TW 466718B
Authority
TW
Taiwan
Prior art keywords
wiring
semiconductor package
electronic device
wiring film
thermal expansion
Prior art date
Application number
TW087113727A
Other languages
English (en)
Chinese (zh)
Inventor
Morihiko Ikemizu
Nobuaki Oie
Ken Iwasaki
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of TW466718B publication Critical patent/TW466718B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW087113727A 1997-08-29 1998-08-20 Electronic device and semiconductor package TW466718B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP23369597 1997-08-29
JP20400298A JP3724954B2 (ja) 1997-08-29 1998-07-17 電子装置および半導体パッケージ

Publications (1)

Publication Number Publication Date
TW466718B true TW466718B (en) 2001-12-01

Family

ID=26514231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087113727A TW466718B (en) 1997-08-29 1998-08-20 Electronic device and semiconductor package

Country Status (4)

Country Link
US (1) US6097085A (https=)
JP (1) JP3724954B2 (https=)
KR (1) KR100308137B1 (https=)
TW (1) TW466718B (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6861290B1 (en) 1995-12-19 2005-03-01 Micron Technology, Inc. Flip-chip adaptor package for bare die
US5719440A (en) 1995-12-19 1998-02-17 Micron Technology, Inc. Flip chip adaptor package for bare die
USRE43112E1 (en) 1998-05-04 2012-01-17 Round Rock Research, Llc Stackable ball grid array package
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
US6198166B1 (en) * 1999-07-01 2001-03-06 Intersil Corporation Power semiconductor mounting package containing ball grid array
KR100377471B1 (ko) * 1999-12-10 2003-03-26 앰코 테크놀로지 코리아 주식회사 반도체패키지 및 그 제조방법
JP2002057252A (ja) * 2000-08-07 2002-02-22 Hitachi Ltd 半導体装置及びその製造方法
KR100680731B1 (ko) * 2000-09-01 2007-02-09 삼성전자주식회사 반도체 패키지 및 제조방법
JP2002270717A (ja) * 2001-03-12 2002-09-20 Rohm Co Ltd 半導体装置
US20030218246A1 (en) * 2002-05-22 2003-11-27 Hirofumi Abe Semiconductor device passing large electric current
CN101409239B (zh) * 2003-05-23 2011-10-05 富士通株式会社 布线板制造方法
TWI246760B (en) * 2004-12-22 2006-01-01 Siliconware Precision Industries Co Ltd Heat dissipating semiconductor package and fabrication method thereof
US7851904B2 (en) * 2006-12-06 2010-12-14 Panasonic Corporation Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure
DE102008006390A1 (de) * 2008-01-28 2009-07-30 Tesa Ag Verfahren zur Verklebung von flexiblen Leiterplatten mit Polymermaterialien zur partiellen oder vollständigen Versteifung
US8804339B2 (en) 2011-02-28 2014-08-12 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same
CN102790034A (zh) * 2011-05-17 2012-11-21 飞思卡尔半导体公司 具有散热器的半导体器件
KR101432486B1 (ko) * 2012-10-08 2014-08-21 에스티에스반도체통신 주식회사 집적회로 패키지 제조방법
US20210043466A1 (en) * 2019-08-06 2021-02-11 Texas Instruments Incorporated Universal semiconductor package molds

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08213497A (ja) * 1995-02-03 1996-08-20 Fujitsu Ltd 半導体装置及びその製造方法
SG45122A1 (en) * 1995-10-28 1998-01-16 Inst Of Microelectronics Low cost and highly reliable chip-sized package
JPH09181209A (ja) * 1995-12-26 1997-07-11 Hitachi Ltd 半導体装置およびその製造方法
US5760465A (en) * 1996-02-01 1998-06-02 International Business Machines Corporation Electronic package with strain relief means
US5900312A (en) * 1996-11-08 1999-05-04 W. L. Gore & Associates, Inc. Integrated circuit chip package assembly
US5835355A (en) * 1997-09-22 1998-11-10 Lsi Logic Corporation Tape ball grid array package with perforated metal stiffener

Also Published As

Publication number Publication date
US6097085A (en) 2000-08-01
JPH11135679A (ja) 1999-05-21
JP3724954B2 (ja) 2005-12-07
KR19990023924A (ko) 1999-03-25
KR100308137B1 (ko) 2001-12-17

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees