TW466579B - Method and apparatus for processing substrate - Google Patents

Method and apparatus for processing substrate

Info

Publication number
TW466579B
TW466579B TW086116059A TW86116059A TW466579B TW 466579 B TW466579 B TW 466579B TW 086116059 A TW086116059 A TW 086116059A TW 86116059 A TW86116059 A TW 86116059A TW 466579 B TW466579 B TW 466579B
Authority
TW
Taiwan
Prior art keywords
processing
substrate
transfer zone
unit
transfer
Prior art date
Application number
TW086116059A
Other languages
English (en)
Inventor
Masami Akumoto
Yoichi Deguchi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP30549096A external-priority patent/JP3305215B2/ja
Priority claimed from JP30549196A external-priority patent/JP3254148B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TW466579B publication Critical patent/TW466579B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW086116059A 1996-11-01 1997-10-29 Method and apparatus for processing substrate TW466579B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30549096A JP3305215B2 (ja) 1996-11-01 1996-11-01 ガス処理方法および装置
JP30549196A JP3254148B2 (ja) 1996-11-01 1996-11-01 処理装置

Publications (1)

Publication Number Publication Date
TW466579B true TW466579B (en) 2001-12-01

Family

ID=26564320

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086116059A TW466579B (en) 1996-11-01 1997-10-29 Method and apparatus for processing substrate

Country Status (4)

Country Link
US (1) US6024502A (zh)
KR (1) KR100379649B1 (zh)
SG (1) SG67433A1 (zh)
TW (1) TW466579B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6287025B1 (en) * 1998-08-14 2001-09-11 Tokyo Electron Limited Substrate processing apparatus
JP3442669B2 (ja) * 1998-10-20 2003-09-02 東京エレクトロン株式会社 基板処理装置
US6616394B1 (en) 1998-12-30 2003-09-09 Silicon Valley Group Apparatus for processing wafers
KR100574140B1 (ko) * 1999-07-02 2006-04-25 동경 엘렉트론 주식회사 반도체 제조 설비, 반도체 제조 장치 및 반도체 제조 방법
SG89379A1 (en) * 2000-02-22 2002-06-18 Tokyo Electron Ltd Treatment apparatus
JP3648129B2 (ja) * 2000-05-10 2005-05-18 東京エレクトロン株式会社 塗布現像処理方法及び塗布現像処理システム
JP4376072B2 (ja) * 2004-01-16 2009-12-02 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP4762743B2 (ja) * 2006-02-09 2011-08-31 東京エレクトロン株式会社 熱処理装置
JP4985183B2 (ja) 2007-07-26 2012-07-25 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに記憶媒体
KR102315663B1 (ko) * 2019-10-23 2021-10-21 세메스 주식회사 기판 처리 방법 및 기판 처리 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0170391B1 (ko) * 1989-06-16 1999-03-30 다카시마 히로시 피처리체 처리장치 및 처리방법
JP2919925B2 (ja) * 1990-07-26 1999-07-19 東京エレクトロン株式会社 処理装置
JP2906006B2 (ja) * 1992-10-15 1999-06-14 東京エレクトロン株式会社 処理方法及びその装置
JP2870719B2 (ja) * 1993-01-29 1999-03-17 東京エレクトロン株式会社 処理装置
TW297910B (zh) * 1995-02-02 1997-02-11 Tokyo Electron Co Ltd
TW309503B (zh) * 1995-06-27 1997-07-01 Tokyo Electron Co Ltd
US5763006A (en) * 1996-10-04 1998-06-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for automatic purge of HMDS vapor piping

Also Published As

Publication number Publication date
US6024502A (en) 2000-02-15
SG67433A1 (en) 1999-09-21
KR19980041991A (ko) 1998-08-17
KR100379649B1 (ko) 2003-07-22

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent