TW464988B - Crushable bead on lead finger side surface to improve moldability - Google Patents

Crushable bead on lead finger side surface to improve moldability Download PDF

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Publication number
TW464988B
TW464988B TW86112826A TW86112826A TW464988B TW 464988 B TW464988 B TW 464988B TW 86112826 A TW86112826 A TW 86112826A TW 86112826 A TW86112826 A TW 86112826A TW 464988 B TW464988 B TW 464988B
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TW
Taiwan
Prior art keywords
semiconductor device
terminal
terminals
bead
beads
Prior art date
Application number
TW86112826A
Other languages
English (en)
Inventor
Peter R Ewer
Original Assignee
Int Rectifier Corp
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Publication date
Application filed by Int Rectifier Corp filed Critical Int Rectifier Corp
Application granted granted Critical
Publication of TW464988B publication Critical patent/TW464988B/zh

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

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464988 A7 B7 五、j明説明（1 ) 發明領域 本發明係與半導體裝置封裝及其導架相關，尤其 是與適於表面安裝的高功率半導體裝置有關。 發明背景 了表面女裝在絶緣的金屬基體（I ms )或者是其他平 坦文撐板表面上且用於高功率半導體裝置的封裝爲一熟 知的裝置。此封裝之一可參見美國專利申請萦案號 08/583,219，此索之申請曰期爲1996年〗月4曰，標題爲 "表面安裝半導體封裝"，該篇文章在此列爲本文之參考 文件。這些裝置極適於將表面安裝至平坦支撐板上的導 體圖樣中，該支撐板爲IMS結構（覆上薄絶緣膜之厚銅或 鋁基體，該絶緣膜具有一薄而上圖樣的銅或者是其他導 電可焊接之上表面）。 發明概述 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注^^項再填寫本頁) 本發明提供一嶄新的導架，此導架可用於接收一 或多個半導體晶粒，及在中心平坦塾子區域上的混# 物。其晶粒由在其底面上的墊子互連接，且其上方由这 备的線結合加以連接。導架具有兩功率端子，此端子^ 在矩形封裝的兩相鄰角落處互連接。功率端子以從外奇 連接在外殼上_的平坦㈣，而料殼係包封該中< 導架塾子的上方及側邊。多個控则插腳或端子，起右 這些插腳或端子爲導架的—部位，但是與外殼_後^ 熱沉墊子相隔離’從外殼的侧邊延伸，而該外殼與包名 本紙張尺度適用中國國家標隼（CNS ) Λ4規格（210X 297公麓} 464988 經濟部中央標隼局員工消費合作社印製 A7 , B7___ 五、發明説明（> ) 功率端子的側邊相對。 至少有兩個緊密間隔的控制端子或插腳，其可線 結合於外殼内之晶粒的栅極及陰極或電流感測端。也使 用一遠處的第三端子（距緊密間隔的第一及第二控制端 子）連接某些其他的端子，例如如果此晶粒包含在外殼 内時，此其他的端子可爲一半導體閘流管晶粒的栅極 端。 其他導架爲單一量测導體薄。端子延伸過鑄模外 殼邊界的端子可部份垂直移位以對導架提供改進的塑膠 鎖。端子及導架墊子的底面均共面。主熱沉墊子具有通 過其上而平行開槽，此開槽位在墊子上之晶粒的相反侧 以對塑膠外殼提供更進一步的塑膠鎖。從不開槽的内端 延伸出淺鴿尾形開槽以提供改進的塑膠鎖。 塾子的表面可爲一蛋奶餅形或連游形的表面以改 進底部晶粒表面電極與墊子之間的焊接作業。依據本發 明的特徵，安裝於熱沉或形成IMS板之導體熱圖樣的墊 子之底面可加以蛋奶餅形以改進墊子與熱沉之間的下部 烊接，且避免期間在導架底部中的内凹而產生的焊接空 泡ΰ 也對絶緣外殼的底部提供洗滌凹槽，此洗滌凹槽 完全延伸過封裝的寬度方向，且與包括輸入及輸出端子 的侧邊平行，且定位在端子及墊子之間。這些凹槽可增 加端子及墊子之間的表面軌距，且容許洗去在下部焊接 期間所產生的焊接流體。 本紙張尺度適用中國®家標隼ί CNS ) Λ4規格（2!〇><297公趋> ----------j *裝------訂· 一 银 (請先閲讀背面之注意事項再填寫本頁) _ 464988 經濟部中央標準局貝工消費合作社印製 明。 A7 五、發明説明 民據本發明的另一特 j子二其架子從凹槽的底端延m-短而淺的 度万向’因此吹進流體洗膝功r通過外殼底部的寬 如上所述，部份垂直地：去 腳以改進塑膠鎖。依據同的端子插 區域中部份的圓角端提供進一步的特徵，對移位 落而形成尖銳的端緣，因此】形刻痕或者是步階形角 子的底面。 ”方止鑄模期間塑膠滲入端 子，—特徵爲料子形成延伸的可研磨珠 表面上。去殼的正外侧之端子部位相鄰的侧 =焊:rr 一可能如果=話 本發明的另一特徵爲，提供一整體導架桿，此桿 連接在外殼之兩角落處及外殼内部的功率輸入端。來自 外殼内晶粒的線結合則配置在此單—桿上，此棹包八在 外殼之内◊該桿可改進線結合之連結，且作用如 的塑膠鎖。 一外殼 圖式之簡單説明 圖中所設計之例子僅爲説明本發明之較佳實廣 例’但是讀者須了解此圖中的例子並不用於限制本杳 —41ί I 裝 :- 訂 ( 線 (锖先閱讀背面之注項再填寫本頁) 本紙張尺度適用中國國家標準CCNS ) Α4規格（2!ΟΧ 297公釐） 經濟部中央標车局貝工消費合作杜印製 464988 A7 一__B7_ 五、發明説明（β ) 圖一爲本發明較佳實施例之封裝的頂視圖。 圖二爲本發明較佳實施例之封装的底視圖。 圖三爲本發明較佳實施例之封裝的侧視圖。 圖四爲本發明較佳實施例之封裝的主功率端子端 的端視圖。 圖五爲IMS文撐板的截面圖，該板子可安裝圖一至 4的封装。 圖7T爲圖一至四之封装中所使用之導架的頂視 圖。 圖七爲沿圖六之截面線卜7所視之圖六的截面圖。 圖八爲圖六之導架的底視圖。 圖九爲7中圓形區ΠΑ"的放大視圖。. 圖十爲圖三中圓形區域”Β”的放大詳細視圖，其顯 示一控制或鎖入塑膠外殼及嶄新的洗滌凹槽 結構中。 圖十一示本發明較佳實施例中平坦單一量測導架 的一部份’其中沒有端子導架移位現象。 圖十一示在端子導架移位後，圖十一的導架。 圖十二不圖十二中的角落區域"C”中步階形角落 的形成，此可形式塑膠在鑄模期間滲過端子 的底面。 圖十四爲圖六中圓形區域，iD"的放大視圖，且顯示 一塑膠鎖凹槽，此凹槽從導架中塑膠開槽的 —端延伸出來。 I--：-----—裝------訂-----ί 線 (請先閱讀背面之注意Ϋ項再填寫本頁) 本紙張尺度適用中國國家榡準（CNS ) A4規格（2ί0>< 297公浼） 464988 經濟部中央標準為員工消費合作社印裝 30 A7 B7 五，發明説明) 圖十五爲圖十四中線段15-1S所視之圖十四的截 面。 圖十六爲導架端子的頂視圖，且顯示在端子之側 邊的垂直可研磨衝擊塊或珠子，其密封鸽模 工具以防土塑膠滲入端子的曝露之可俾接表 面。 圖十七示圖十六的侧視圖。 圖十八示圖十六中導架’而半導體晶粒焊接於塾 子下方，且結合線連接晶粒與外部端子，且 顯示在形成鑄模外殼（圖中沒有顯示）後，整 齊的導架。 圖十九爲圖十八的電路圖。 圖二十顯示習知技術的架構，其中在端子上並沒 有提供備損（saCrificial)珠子，而該端子通 過該塑膠外殼。 圖二十一爲具有備損突出件之圖十的端子之透祝 圏。 圖一十二示在鑄模後的備損突出件。 圖二十三示鑄模作業前的鑄模及端子。 圖二十四示鑄模作業後的鑄模及端子。 元件符號説明 外殼 7 ^--------f I裝--------IT11---ί 線 (請先閱讀背面之注意事項再填寫本頁) __ 本紙張尺度適用中國國家標準（CNS ) Λ4規格（2]0><297公鸯 ^988 A7 B7 五、發明説明（b ) 31 墊子 33,34,35,36 騎于 41 絶緣體 42 可焊接層 5〇,51 洗滌凹槽 70 橫捍 汀’72 開槽 S0-83 凹槽 !〇〇 , 101 珠子 圖式之詳細説明 經濟部中央標隼局員工消費合作杜印繁 現在請參考圖一至四，圖中顯示本發明較隹實施 例之表面安裝封裝的外部，且該封襞包含一鑄槙的絶緣 塑膠外殼3〇，此外殼呈伸長之矩形，且包含有平坦之單 一規格導架的上表面及端部位，其中該導架可爲厚度約 1.27mrn的習用銅合金。在較佳實施例中，外殼3〇長約 29咖’寬約I4· 2酬’且高約4·27_。此將於下文中加以 説明，請參考附圖六，七，八。圖一至四中的導架元件 爲導熱沉塾子31，在矩形外殼3〇之一端角落上的功率端 32及33，和沿著外殼之反侧的控制端或插腳34，35及 36。端子3 2至36延伸到外殼端外约lnm處。最好端子34 及35緊密間隔’例如，中心對中心的距離約2.5nm，而 端子35及36則最好具有較寬廣的間隔’例如中心對中心 --------^ f裝------訂-----f 線 (請先閱讀背面之注^^項再填寫本頁) 本紙乐尺度適用中®囷家標隼（CNS) Λ4規格（210X 297公釐） 4 6 4 988 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（j ) 的距離约6 . Oram ◊ 如圖三所示，墊子31及端子32至36的底部表面共 面，且爲至如1 MS板之熱沉支撐中上圖樣之表面的可能 之連結。圖五示一代表性之IMS板的截面，該IMS板包含 導熱（銅或铭合金）基體40，此基體40覆上一極薄的絶緣 聚合物41。一上圖樣之薄導熱之可焊接層42配置在絶緣 體41的上方。可在可焊接層42上形成任何需要的圖樣， 但是，在圖5中，可焊接層42分開成部位42a及多個與端 子32至36相對齊的分段，在圖五中只顯示與如端子32及 34對齊的分段42b及Uc。因此，可方便地使用焊接延 伸，將圖一至4中封裝的底部可焊接至圖五的I MS板。 爲了輔助且改進下部焊接的操作程序，在墊子31 之反端及對應的端子32-33及34-34之線間且平行的塑膠 外殼3〇的底部形成流體洗滌凹槽5〇及51(見圖二及三）。 取好凹槽5 0及5 1具有一曲形截面且半徑長約〇 . 。在 下部悍接操作之後，這些凹槽對於洗去焊接流體相當有 助益，且更進一步增加在墊子n及端子Μ至％之間的塑 膠表面上的軌距〇 爲了改進流體洗滌的功能，已發現提供淺而短的 架子相當有用，如圖十中的架子⑽及“。架子6〇及61 的深度約O.lnm，且確信其對應的洗滌凹槽Μ及S1相間 隔，且在其上方將封裝焊接在基體之上。 在接受晶粒或者一外殼之前的導架如圖六，七及 八所示。墊子及端子Μ至％爲導架之整個部份，且分 --------|f —裝 訂^· ^線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（〇^)'4規格（2]0'/ 297公趁） d6 4 9B8 經濟部中央標率局員工消費合作社印掣 A7 B7 五、發明説明（β) 段結合’在過鑄模之後再予切開以隔離接點34至36與接 點32 ’ 33及墊子31 ’且彼此相隔離。導架也包含一重的 橫桿7〇(圖六至十八）’此橫桿7〇連接功率端32及33，且 更進一步動作如一塑膠鎖以輔助該導架使進入塑膠外殼 3〇中。桿7〇也成爲用於線結合的結合表面，此將於下文 中加以説明，並請參考附圖十八及十九。 墊子區域31具有兩平行的薄開槽71及72(圖六至 八，十四及I5) ’在鑄模搡作期間該開槽充塡塑膠，而 且也產生一塑膠鎖以幫助將墊子:^鎖入外殼3〇中。從開 槽Π及72之内壁延伸的對應短桿73及74產生另一塑膠 鎖，以更進一步固定導架於塑膠外殼中。 爲了能更進一步達到塑膠鎖的目的，鴿尾形凹槽 8〇至83(圖四’ “及丨5)從墊子之頂面上的開槽71及72 之端邵位向另一端部位延伸。在鑄模操作期間，這些凹 槽充填塑膠以更進一步將墊子31鎖入外殼中。 須了解墊子31的頂部中心表面具有一蛋奶餅形表 面85。墊子31的頂面可鍍上鎳，且具有淺而相間隔的刻 痕（最好淺约0.〇5咖）’最好是直徑約而繞〇.6_ 中心的點形刻痕。已知此蛋奶餅形圖樣改進了晶粒至蛋 奶餅形表面的下部焊接。依據本發明較佳實施例的另一 設計理念，墊子31的反侧也提供一蛋奶餅形圖樣S6(圖 八）。此表面相當平坦且平滑，但是已知如果該表面輊 輕地内凹，在下部焊接程序期間將形成不需要的焊接空 泡。依據本發明，在凹導架表面之底部上的蛋奶餅形圖 (請先閱讀背面之注意事項再填寫本頁) 訂-----^線 本紙張尺度通用宁國國家標準（CNS〉A4規格（210x297公楚 46^988 A7 _________^_ 五、，明説明（$ ) 樣將改進了 由增加其間焊接的溼氣及流量而烊接至一 平坦熱沉表面的能力。 圖十一示包含墊子31及接點％之導架一部份的焊 接5。起初此導架爲—具有平坦平面之下及下表面的平 坦架子。已發現經由圖十二所示的部份標示之掭作輕輊 =移動導架的端子部位，則該端子可牢牢地鎖入塑膠外 殼30中。對於一 127随厚度的導架，其實際的位移約爲 〇.5_。已知在鑄模操作期間（在此移位之後〉，在端子 36的底面，上及在其他的端子32至35上，塑膠傾向於流 入^十二之位置"C"中微圓的角落端。已知在各接點中b 角落’’C"處的矩形刻痕95(圖九及η)的標示可防止塑膠 ^造成的不必要之滲人。因爲此—方法不需要任何其他 狀空間，所以最好刻痕％由裁剪材料（與彎曲相反）形 成0 刻痕95約深〇*2雌，長O.hm。如圖六及7所示，刻 很95用於各補償端子32及36。 經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 嶄新之封裝的另一特徵爲各經塑膠外殼3〇延伸 =插腳端端子具有—或多個從端子之厚度方向延伸的小 =子。一般’珠子100, 1〇1的厚度從〇.〇5至〇.5咖。因 沾圖十”及十七所示’半徑約如G.2mm(對於 ，導架而言）的兩個研磨珠子1⑽，1〇1用於研磨一鑄模 ^具’或使其-部份平坦化，因此可防止歸滲入由珠 =0及101所形成之邊界外的其他區域。圖六及七顯示 珠子位在導架中所有需要的位置處。 本紙張尺度通用中國國家標準（ 匸奶）八4規格（210/297公釐） 經濟部中央標準局員工消費合作杜印掣 4 6 4 988 A7 ______B7_ 五、發明説明（θ) 圖十六，十七及二十至二十四説明端子36上對應 研磨珠子100及101的其他細部。因此，請參考附圖二 十，可發現在外殼3〇鑄模期間，在端子的侧邊存在一不 可控制的薄板塑膠iso，m之流動，該端子如在鑄模外 殼3〇外側的端子36。因爲此塑膠將會干擾端子3e上的焊 接，作業因此必需將此塑膠去除◊ 如圖十六，十七及二十一所示，可由端子36之侧 邊上的研磨珠子1〇〇及1()1解決此一問題。所以，在铸模 期間’如圖二十二所示，由鑄模研磨該珠子100及1(U ’ 使其動作如一防止塑膠向外淺漏或滲出的壩台。須了解 將珠子100及1〇1上研磨梯形平台。因此，如圖二十三， 二十四所示，鑄模U0具有錐形的通道部位141，此部位 可用於接收端子36。當鑄模靠近圖二十三之位置時，端 子36被強迫進入錐形通道U1，此通道將應用平台15〇及 1S1使對應的珠子1〇0及1()1變得平坦。因此，在鑄模期 間，研磨的珠子密封通道U1可避免塑膠滲入珠子1〇〇及 ι〇1的間隔區域中。通道hi的發散再容許在鑄模完成後 該塑膠可從端子％(及所有的端子μ至％〉中排出，如圖 二十四所示。 圖十八顯示兩半導體晶粒100及1;11已悍接至塾子 31之下部後的墊子；π。共封裝的晶粒11〇及U1可爲任何 型式者，但是在圖十八及圖中以對應的功率冗阶及快速 恢復二極體（FRED)加以顯示。 須了解在圖十九中，IGBT110的集極電極連接即仙 ____ 12
本紙張尺度適用中國國家標準（CNS )八4規格（2iGx 297公趁V I--------f. I 裝------訂-----{線 (請先閲讀背面之注意事項再填寫本頁) ^64988 A7 B7 五、發明説明（也） -極體的陰極’此係因爲電極焊接在導體 之故。所以，導體墊子31提供-機構，此2 〇 ^ 、孩共同封裝至一外部電路上。IGBTUo^j 士 f:。由：路加以結合’如至腦二極體111之陽極的線 接。線結合II2延續至橫桿π及端子32及33上且與之連 而且’從IGBT110的栅極墊子至栅極端35之間製造 一線結合115，且如圖十八所示，在端子34上提供一射 極KeWin連結ι16。 雖然文中已應用較佳實施例説明本發明’但是須 了解上文中的説明並非在於限制本發明的精確形式。熟 習本技術者可輕易地對上述實施例加以更改或變更，而 不偏離本發明的精神及觀點，且本發明的精神及觀點均 涵蓋在以下的申請專利範園内。 經濟部中央標準局貝工消費合作社印聚 13 本紙張尺度適用中國國家榡準（CNS ) Λ4規格（2】0X297公釐） ' „ V I--------f -¾------IT-----fil--------„---：------ (請先閱讀背面之注意事項再填寫本頁}

Claims (1)

  1. 464988 A8 B8 C8 D8 六、申請專利範圍 \ - -.i 申請專利範圍修正本(八十九年七月二十五日修正） 1. 一種表面安裝半導體裝置封裝，包含： 一半導體裝置； 一金屬墊子，用來安裝半導體裝置； 一外殼，由可流動材料所形成，此外殼鍵結到金 屬墊子上，且當可流動材料固化時，包封住此半 導體裝置； 至少一端子，此端子與該金屬墊子相間隔開，且 二者爲共平面；以及 至少一可硏磨，可壓碎的珠子，此珠子位於端子 的一側，該至少一可硏磨，可壓碎的珠子，在鑄 模裝置的通道接收到端子而形成外殼時，該珠子 的大小與位置被設計成能讓鑄模裝置的通道所改 變，並能配合該通道，防止外殼中可流動材料流 進形成該外殼的鑄模工具的通道內。 2. 如申請專利範圍第1項之表面安裝半導體裝置封裝， 其中該封裝包含多個端子，各端子之各側表面上具 有一可硏磨的珠子。 3. 如申請專利範圍第2項之表面安裝半導體裝置封裝， 其中在一端子上的至少一可硏磨珠子與在其他端子 (請先閲讀背面之注意事項再填寫本頁) 裝- 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS > A4現格（210X297公釐）
    濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 「、申請專利範圍 上的至少一可硏磨珠子間形成軸向對齊，而該其他 的端子位在封裝的一側。 4. 如申請專利範圍第3項之表面安裝半導體裝置封裝， 其中該可硏磨珠子的厚度介於約〇.〇5mm至0.5mm之 間。 5. 如申請專利範圍第3項之表面安裝半導體裝寘封裝， 其中該可硏磨珠子的半徑約〇.2mm。 6. 如申請專利範圍第1項之表面安裝半導體裝置封裝， 其中該可硏磨珠子包括一由鑄模裝置形成的梯形平 坦部位，該鑄模裝置可硏磨該珠子。 7. 如申請專利範圍第6項之表面安裝半導體裝置封裝， 其中該鑄模裝芦具有一錐形的通道部位，此部位可 用於接收端子及珠子，且當鑄模結束時，可使得該 珠子平坦化。 15 ^ Γ·^ 裳 訂 · 線 (請先閱讀背面之注意事項再填寫本頁) 本紙^逋用中國國家祿丰（CNS)八4胁（21〇><297公羡）
TW86112826A 1996-09-05 1997-12-13 Crushable bead on lead finger side surface to improve moldability TW464988B (en)

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US6476481B2 (en) 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
DE29924183U1 (de) 1998-05-05 2002-03-28 International Rectifier Corp., El Segundo, Calif. Gehäuse und Leitungsrahmen für ein Halbleiterbauelement hoher Stromleitfähigkeit, mit großflächigen Verbindungsschlüssen und veränderter Form
FR2779868B1 (fr) * 1998-06-10 2003-08-29 Sgs Thomson Microelectronics Boitier de puissance a montage en surface
JP5549612B2 (ja) 2011-01-31 2014-07-16 三菱電機株式会社 半導体装置の製造方法
JP6449523B1 (ja) * 2017-09-05 2019-01-09 新電元工業株式会社 半導体装置

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JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
FR2454700A1 (fr) * 1979-04-18 1980-11-14 Cepe Boitier d'encapsulation pour composant electronique et composant comportant un tel boitier
US4778146A (en) * 1987-03-20 1988-10-18 Asm Fico Leadframe for flash-free insert molding and method therefor
US5184285A (en) * 1987-11-17 1993-02-02 Advanced Interconnections Corporation Socket constructed with molded-in lead frame providing means for installing additional component such as a chip capacitor
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