SG60110A1 - Crushable bead on lead finger side surface to improve moldability - Google Patents

Crushable bead on lead finger side surface to improve moldability

Info

Publication number
SG60110A1
SG60110A1 SG1997003180A SG1997003180A SG60110A1 SG 60110 A1 SG60110 A1 SG 60110A1 SG 1997003180 A SG1997003180 A SG 1997003180A SG 1997003180 A SG1997003180 A SG 1997003180A SG 60110 A1 SG60110 A1 SG 60110A1
Authority
SG
Singapore
Prior art keywords
terminals
lead finger
finger side
crushable
improve moldability
Prior art date
Application number
SG1997003180A
Inventor
Peter R Ewer
Original Assignee
Int Rectifier Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Rectifier Corp filed Critical Int Rectifier Corp
Publication of SG60110A1 publication Critical patent/SG60110A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A surface mount semiconductor package employs locking barbs 73,74 formed in a metal pad of a lead frame for locking a plastic housing 30 to the metal pad on which a semiconductor device is mounted. The lead frame includes terminals 32-36 having elongated crushable beads 100, 101 on their side surfaces adjacent the portions of the terminals 32-36 just outside the plastic housing 30. The beads 100, 101 are crushed inwardly by a molding tool when it closes to provide a seal which prevents the molding plastic from bleeding out and over the sides of the terminals 32-36 which extend beyond the housing 30 and which could interfere with solder connection to the terminals.
SG1997003180A 1996-09-05 1997-08-29 Crushable bead on lead finger side surface to improve moldability SG60110A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2545896P 1996-09-05 1996-09-05

Publications (1)

Publication Number Publication Date
SG60110A1 true SG60110A1 (en) 1999-02-22

Family

ID=21826181

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997003180A SG60110A1 (en) 1996-09-05 1997-08-29 Crushable bead on lead finger side surface to improve moldability

Country Status (8)

Country Link
JP (1) JPH10154776A (en)
CN (1) CN1183644A (en)
DE (1) DE19736895A1 (en)
FR (1) FR2754388B1 (en)
GB (1) GB2322966B (en)
IT (1) IT1294376B1 (en)
SG (1) SG60110A1 (en)
TW (1) TW464988B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29924183U1 (en) 1998-05-05 2002-03-28 International Rectifier Corp., El Segundo, Calif. Housing and lead frame for a semiconductor component with high current conductivity, with large-area connection connections and a modified shape
US6476481B2 (en) 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
FR2779868B1 (en) * 1998-06-10 2003-08-29 Sgs Thomson Microelectronics SURFACE MOUNT POWER BOX
JP5549612B2 (en) * 2011-01-31 2014-07-16 三菱電機株式会社 Manufacturing method of semiconductor device
JP6449523B1 (en) * 2017-09-05 2019-01-09 新電元工業株式会社 Semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
FR2454700A1 (en) * 1979-04-18 1980-11-14 Cepe ENCAPSULATION BOX FOR ELECTRONIC COMPONENT AND COMPONENT COMPRISING SUCH A BOX
US4778146A (en) * 1987-03-20 1988-10-18 Asm Fico Leadframe for flash-free insert molding and method therefor
US5184285A (en) * 1987-11-17 1993-02-02 Advanced Interconnections Corporation Socket constructed with molded-in lead frame providing means for installing additional component such as a chip capacitor
JPH02292836A (en) * 1989-05-02 1990-12-04 Nippon Steel Corp Film carrier for ic chip mounting

Also Published As

Publication number Publication date
GB9718852D0 (en) 1997-11-12
FR2754388B1 (en) 1999-09-10
GB2322966A (en) 1998-09-09
ITMI972000A1 (en) 1999-03-03
GB2322966B (en) 2001-05-09
CN1183644A (en) 1998-06-03
FR2754388A1 (en) 1998-04-10
DE19736895A1 (en) 1998-04-16
JPH10154776A (en) 1998-06-09
TW464988B (en) 2001-11-21
IT1294376B1 (en) 1999-03-24

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