IT1294376B1 - CRUSHABLE PROTUBERANCE ON THE LATERAL SURFACE OF CONDUCTIVE TERMINALS TO IMPROVE PRINTABILITY - Google Patents

CRUSHABLE PROTUBERANCE ON THE LATERAL SURFACE OF CONDUCTIVE TERMINALS TO IMPROVE PRINTABILITY

Info

Publication number
IT1294376B1
IT1294376B1 ITMI972000A IT1294376B1 IT 1294376 B1 IT1294376 B1 IT 1294376B1 IT MI972000 A ITMI972000 A IT MI972000A IT 1294376 B1 IT1294376 B1 IT 1294376B1
Authority
IT
Italy
Prior art keywords
terminals
crushable
protuberance
lateral surface
conductive terminals
Prior art date
Application number
Other languages
Italian (it)
Inventor
Peter R Ewer
Original Assignee
Int Rectifier Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Rectifier Corp filed Critical Int Rectifier Corp
Publication of ITMI972000A1 publication Critical patent/ITMI972000A1/en
Application granted granted Critical
Publication of IT1294376B1 publication Critical patent/IT1294376B1/en

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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A surface mount semiconductor package employs locking barbs 73,74 formed in a metal pad of a lead frame for locking a plastic housing 30 to the metal pad on which a semiconductor device is mounted. The lead frame includes terminals 32-36 having elongated crushable beads 100, 101 on their side surfaces adjacent the portions of the terminals 32-36 just outside the plastic housing 30. The beads 100, 101 are crushed inwardly by a molding tool when it closes to provide a seal which prevents the molding plastic from bleeding out and over the sides of the terminals 32-36 which extend beyond the housing 30 and which could interfere with solder connection to the terminals.
IT002000 1996-09-05 1997-09-03 CRUSHABLE PROTUBERANCE ON THE LATERAL SURFACE OF CONDUCTIVE TERMINALS TO IMPROVE PRINTABILITY IT1294376B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2545896P 1996-09-05 1996-09-05

Publications (2)

Publication Number Publication Date
ITMI972000A1 ITMI972000A1 (en) 1999-03-03
IT1294376B1 true IT1294376B1 (en) 1999-03-24

Family

ID=21826181

Family Applications (1)

Application Number Title Priority Date Filing Date
IT002000 IT1294376B1 (en) 1996-09-05 1997-09-03 CRUSHABLE PROTUBERANCE ON THE LATERAL SURFACE OF CONDUCTIVE TERMINALS TO IMPROVE PRINTABILITY

Country Status (8)

Country Link
JP (1) JPH10154776A (en)
CN (1) CN1183644A (en)
DE (1) DE19736895A1 (en)
FR (1) FR2754388B1 (en)
GB (1) GB2322966B (en)
IT (1) IT1294376B1 (en)
SG (1) SG60110A1 (en)
TW (1) TW464988B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6476481B2 (en) 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
FR2779868B1 (en) * 1998-06-10 2003-08-29 Sgs Thomson Microelectronics SURFACE MOUNT POWER BOX
JP5549612B2 (en) * 2011-01-31 2014-07-16 三菱電機株式会社 Manufacturing method of semiconductor device
CN111095545B (en) * 2017-09-05 2023-10-20 新电元工业株式会社 Semiconductor device with a semiconductor device having a plurality of semiconductor chips

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
FR2454700A1 (en) * 1979-04-18 1980-11-14 Cepe ENCAPSULATION BOX FOR ELECTRONIC COMPONENT AND COMPONENT COMPRISING SUCH A BOX
US4778146A (en) * 1987-03-20 1988-10-18 Asm Fico Leadframe for flash-free insert molding and method therefor
US5184285A (en) * 1987-11-17 1993-02-02 Advanced Interconnections Corporation Socket constructed with molded-in lead frame providing means for installing additional component such as a chip capacitor
JPH02292836A (en) * 1989-05-02 1990-12-04 Nippon Steel Corp Film carrier for ic chip mounting

Also Published As

Publication number Publication date
JPH10154776A (en) 1998-06-09
GB2322966B (en) 2001-05-09
ITMI972000A1 (en) 1999-03-03
SG60110A1 (en) 1999-02-22
FR2754388B1 (en) 1999-09-10
GB9718852D0 (en) 1997-11-12
CN1183644A (en) 1998-06-03
DE19736895A1 (en) 1998-04-16
FR2754388A1 (en) 1998-04-10
GB2322966A (en) 1998-09-09
TW464988B (en) 2001-11-21

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