FR2754388B1 - SEMICONDUCTOR DEVICE MODULE WITH CRUSHABLE PEARLS ON CONNECTIONS TO FACILITATE MOLDING - Google Patents

SEMICONDUCTOR DEVICE MODULE WITH CRUSHABLE PEARLS ON CONNECTIONS TO FACILITATE MOLDING

Info

Publication number
FR2754388B1
FR2754388B1 FR9710886A FR9710886A FR2754388B1 FR 2754388 B1 FR2754388 B1 FR 2754388B1 FR 9710886 A FR9710886 A FR 9710886A FR 9710886 A FR9710886 A FR 9710886A FR 2754388 B1 FR2754388 B1 FR 2754388B1
Authority
FR
France
Prior art keywords
terminals
semiconductor device
crushable
pearls
connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9710886A
Other languages
French (fr)
Other versions
FR2754388A1 (en
Inventor
Peter R Ewer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA
Publication of FR2754388A1 publication Critical patent/FR2754388A1/en
Application granted granted Critical
Publication of FR2754388B1 publication Critical patent/FR2754388B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A surface mount semiconductor package employs locking barbs 73,74 formed in a metal pad of a lead frame for locking a plastic housing 30 to the metal pad on which a semiconductor device is mounted. The lead frame includes terminals 32-36 having elongated crushable beads 100, 101 on their side surfaces adjacent the portions of the terminals 32-36 just outside the plastic housing 30. The beads 100, 101 are crushed inwardly by a molding tool when it closes to provide a seal which prevents the molding plastic from bleeding out and over the sides of the terminals 32-36 which extend beyond the housing 30 and which could interfere with solder connection to the terminals.
FR9710886A 1996-09-05 1997-09-02 SEMICONDUCTOR DEVICE MODULE WITH CRUSHABLE PEARLS ON CONNECTIONS TO FACILITATE MOLDING Expired - Fee Related FR2754388B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2545896P 1996-09-05 1996-09-05

Publications (2)

Publication Number Publication Date
FR2754388A1 FR2754388A1 (en) 1998-04-10
FR2754388B1 true FR2754388B1 (en) 1999-09-10

Family

ID=21826181

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9710886A Expired - Fee Related FR2754388B1 (en) 1996-09-05 1997-09-02 SEMICONDUCTOR DEVICE MODULE WITH CRUSHABLE PEARLS ON CONNECTIONS TO FACILITATE MOLDING

Country Status (8)

Country Link
JP (1) JPH10154776A (en)
CN (1) CN1183644A (en)
DE (1) DE19736895A1 (en)
FR (1) FR2754388B1 (en)
GB (1) GB2322966B (en)
IT (1) IT1294376B1 (en)
SG (1) SG60110A1 (en)
TW (1) TW464988B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6476481B2 (en) 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
FR2779868B1 (en) * 1998-06-10 2003-08-29 Sgs Thomson Microelectronics SURFACE MOUNT POWER BOX
JP5549612B2 (en) 2011-01-31 2014-07-16 三菱電機株式会社 Manufacturing method of semiconductor device
WO2019049213A1 (en) * 2017-09-05 2019-03-14 新電元工業株式会社 Semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
FR2454700A1 (en) * 1979-04-18 1980-11-14 Cepe ENCAPSULATION BOX FOR ELECTRONIC COMPONENT AND COMPONENT COMPRISING SUCH A BOX
US4778146A (en) * 1987-03-20 1988-10-18 Asm Fico Leadframe for flash-free insert molding and method therefor
US5184285A (en) * 1987-11-17 1993-02-02 Advanced Interconnections Corporation Socket constructed with molded-in lead frame providing means for installing additional component such as a chip capacitor
JPH02292836A (en) * 1989-05-02 1990-12-04 Nippon Steel Corp Film carrier for ic chip mounting

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Publication number Publication date
FR2754388A1 (en) 1998-04-10
DE19736895A1 (en) 1998-04-16
IT1294376B1 (en) 1999-03-24
TW464988B (en) 2001-11-21
GB2322966B (en) 2001-05-09
JPH10154776A (en) 1998-06-09
GB2322966A (en) 1998-09-09
GB9718852D0 (en) 1997-11-12
CN1183644A (en) 1998-06-03
ITMI972000A1 (en) 1999-03-03
SG60110A1 (en) 1999-02-22

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