TW455607B - Plated molded article and process for producing a plated molded article - Google Patents

Plated molded article and process for producing a plated molded article Download PDF

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Publication number
TW455607B
TW455607B TW85109217A TW85109217A TW455607B TW 455607 B TW455607 B TW 455607B TW 85109217 A TW85109217 A TW 85109217A TW 85109217 A TW85109217 A TW 85109217A TW 455607 B TW455607 B TW 455607B
Authority
TW
Taiwan
Prior art keywords
weight
component
parts
plated
molded article
Prior art date
Application number
TW85109217A
Other languages
English (en)
Chinese (zh)
Inventor
Yusuke Otsuki
Akihiko Okada
Original Assignee
Idemitsu Petrochemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP19280395A external-priority patent/JP3362754B2/ja
Priority claimed from JP24280395A external-priority patent/JPH0987455A/ja
Application filed by Idemitsu Petrochemical Co filed Critical Idemitsu Petrochemical Co
Application granted granted Critical
Publication of TW455607B publication Critical patent/TW455607B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/06Coating with compositions not containing macromolecular substances
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02Homopolymers or copolymers of hydrocarbons
    • C08L25/04Homopolymers or copolymers of styrene
    • C08L25/06Polystyrene
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1639Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641Organic substrates, e.g. resin, plastic
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913Rod, strand, filament or fiber
    • Y10T428/298Physical dimension
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31Surface property or characteristic of web, sheet or block
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • Y10T428/31692Next to addition polymer from unsaturated monomers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroplating Methods And Accessories (AREA)
TW85109217A 1995-07-28 1996-07-29 Plated molded article and process for producing a plated molded article TW455607B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP19280395A JP3362754B2 (ja) 1995-07-28 1995-07-28 メッキ成形体の製造方法及びその方法で得られたメッキ成形体
JP24280395A JPH0987455A (ja) 1995-09-21 1995-09-21 メッキ用成形体
JP31816395 1995-12-06
JP32417695 1995-12-13

Publications (1)

Publication Number Publication Date
TW455607B true TW455607B (en) 2001-09-21

Family

ID=27475610

Family Applications (1)

Application Number Title Priority Date Filing Date
TW85109217A TW455607B (en) 1995-07-28 1996-07-29 Plated molded article and process for producing a plated molded article

Country Status (6)

Country Link
US (2) US6027817A (enExample)
EP (1) EP0787762A1 (enExample)
KR (1) KR970706340A (enExample)
CN (1) CN1159201A (enExample)
TW (1) TW455607B (enExample)
WO (1) WO1997005192A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0787762A1 (en) * 1995-07-28 1997-08-06 Idemitsu Petrochemical Co., Ltd. Plated molding and process for preparing plated moldings
JPH11217463A (ja) * 1998-01-30 1999-08-10 Yazaki Corp 補強充填剤
JP2000080482A (ja) * 1998-07-10 2000-03-21 Nihon Seimitsu Co Ltd 合成樹脂のイオンプレ―ティング方法とイオンプレ―ティング被膜を有する合成樹脂成型品
IT1302000B1 (it) * 1998-08-05 2000-07-20 Enichem Spa Composizioni polimeriche ad elevata tenacita' a base di polimerivinilaromatici a struttura predominantemente sindiotattica.
US6413652B1 (en) 2000-05-05 2002-07-02 Solvay Engineered Polymers Platable engineered polyolefin alloys
US6509107B2 (en) * 2000-05-05 2003-01-21 Solvay Engineered Polymers Platable engineered polyolefin alloys
EP1408068A4 (en) * 2001-05-30 2005-01-05 Idemitsu Petrochemical Co CHEMICAL-RESISTANT POLYSTYRENE RESIN COMPOSITION AND FORM BODY
US6824889B2 (en) 2002-07-03 2004-11-30 Solvay Engineered Polymers, Inc. Platable engineered polyolefin alloys and articles containing same
DE602005023979D1 (de) * 2005-08-03 2010-11-18 Straumann Holding Ag Halteelement für ein Zahnimplantat
US8383243B2 (en) * 2008-12-10 2013-02-26 Xerox Corporation Composite containing polymer, filler and metal plating catalyst, method of making same, and article manufactured therefrom
DE102016124439A1 (de) * 2016-12-15 2018-06-21 Leibniz-Institut Für Polymerforschung Dresden E.V. Verfahren zur Modifizierung von Kunststoffoberflächen und modifizierte Kunststoffoberflächen mit chemisch funktionalisierten Mikrokavitäten
DE112019003308T5 (de) * 2018-06-29 2021-04-22 Idemitsu Kosan Co., Ltd. Harz-metall-verbundkörper und verfahren zu seiner herstellung
WO2020004596A1 (ja) * 2018-06-29 2020-01-02 出光興産株式会社 樹脂金属複合体及びその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1669701A1 (de) * 1967-06-09 1971-03-18 Basf Ag Verfahren zur Herstellung von metallischen UEberzuegen auf Formteilen aus schlagzaehen Polystyrolformmassen
DE1769926A1 (de) * 1967-08-11 1972-03-09 Sumitomo Chemical Co Formmassen auf Basis kristalliner Polymerisate von Olefinen und Verfahren zum stromlosen Plattieren und gegebenenfalls anschliessenden Elektroplattieren von Formkoerpern aus den Formmassen
US3533828A (en) * 1968-04-08 1970-10-13 Cosden Oil & Chem Co Metal plating of plastic surfaces
US3663325A (en) * 1970-06-11 1972-05-16 Showa Denko Kk Surface treating method for moldings of polystyrene type resins
JPS5143504B2 (enExample) * 1972-12-26 1976-11-22
US3918927A (en) * 1974-06-20 1975-11-11 Phillips Petroleum Co Electroplating polypropylene
US4349421A (en) * 1979-09-17 1982-09-14 Allied Corporation Preparation of metal plated polyamide thermoplastic articles having mirror-like metal finish
JPS57123231A (en) * 1981-01-22 1982-07-31 Toyobo Co Ltd Metal-plated polyamide molded product and preparation of same
EP0102133A3 (en) * 1982-03-26 1985-04-10 General Electric Company Metallized article composed of polyphenylene ether resin, high impact polystyrene, alumina and, optionally, a styrene-butadiene radial teleblock copolymer
US5004649A (en) * 1988-04-13 1991-04-02 Idemitsu Kosan Co., Ltd. Resin laminates and a process for production thereof
JP2633335B2 (ja) * 1988-11-26 1997-07-23 出光興産株式会社 金属化フィルム及びその製造方法
US5232744A (en) * 1991-02-21 1993-08-03 C. Uyemura & Co., Ltd. Electroless composite plating bath and method
EP0787762A1 (en) * 1995-07-28 1997-08-06 Idemitsu Petrochemical Co., Ltd. Plated molding and process for preparing plated moldings
US5702284A (en) * 1996-03-19 1997-12-30 Gallegos; Carlos R. Party wheel
US5702584A (en) 1996-07-01 1997-12-30 Ford Motor Company Enhanced plating adhesion through the use of metallized fillers in plastic substrate

Also Published As

Publication number Publication date
EP0787762A4 (enExample) 1997-09-03
KR970706340A (ko) 1997-11-03
EP0787762A1 (en) 1997-08-06
US6261697B1 (en) 2001-07-17
CN1159201A (zh) 1997-09-10
US6027817A (en) 2000-02-22
WO1997005192A1 (en) 1997-02-13

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees