KR970706340A - 도금성형체 및 도금성형체의 제조방법(plated molded article and process for producing a plated molded article) - Google Patents

도금성형체 및 도금성형체의 제조방법(plated molded article and process for producing a plated molded article) Download PDF

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Publication number
KR970706340A
KR970706340A KR1019970701822A KR19970701822A KR970706340A KR 970706340 A KR970706340 A KR 970706340A KR 1019970701822 A KR1019970701822 A KR 1019970701822A KR 19970701822 A KR19970701822 A KR 19970701822A KR 970706340 A KR970706340 A KR 970706340A
Authority
KR
South Korea
Prior art keywords
weight
parts
oxidizer
soluble
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019970701822A
Other languages
English (en)
Korean (ko)
Inventor
유스케 오쓰키
아키히코 오카다
Original Assignee
가와노 에이지로
이데미쓰 세키유 가가쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP19280395A external-priority patent/JP3362754B2/ja
Priority claimed from JP24280395A external-priority patent/JPH0987455A/ja
Application filed by 가와노 에이지로, 이데미쓰 세키유 가가쿠 가부시키가이샤 filed Critical 가와노 에이지로
Publication of KR970706340A publication Critical patent/KR970706340A/ko
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/06—Coating with compositions not containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/06—Polystyrene
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/298—Physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1019970701822A 1995-07-28 1996-07-26 도금성형체 및 도금성형체의 제조방법(plated molded article and process for producing a plated molded article) Ceased KR970706340A (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP192803 1995-07-28
JP19280395A JP3362754B2 (ja) 1995-07-28 1995-07-28 メッキ成形体の製造方法及びその方法で得られたメッキ成形体
JP24280395A JPH0987455A (ja) 1995-09-21 1995-09-21 メッキ用成形体
JP242803 1995-09-21
JP318163 1995-12-06
JP31816395 1995-12-06
JP32417695 1995-12-13
JP324176 1995-12-13
PCT/JP1996/002105 WO1997005192A1 (en) 1995-07-28 1996-07-26 Plated molding and process for preparing plated moldings

Publications (1)

Publication Number Publication Date
KR970706340A true KR970706340A (ko) 1997-11-03

Family

ID=27475610

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970701822A Ceased KR970706340A (ko) 1995-07-28 1996-07-26 도금성형체 및 도금성형체의 제조방법(plated molded article and process for producing a plated molded article)

Country Status (6)

Country Link
US (2) US6027817A (enExample)
EP (1) EP0787762A1 (enExample)
KR (1) KR970706340A (enExample)
CN (1) CN1159201A (enExample)
TW (1) TW455607B (enExample)
WO (1) WO1997005192A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997005192A1 (en) * 1995-07-28 1997-02-13 Idemitsu Petrochemical Co., Ltd. Plated molding and process for preparing plated moldings
JPH11217463A (ja) * 1998-01-30 1999-08-10 Yazaki Corp 補強充填剤
JP2000080482A (ja) * 1998-07-10 2000-03-21 Nihon Seimitsu Co Ltd 合成樹脂のイオンプレ―ティング方法とイオンプレ―ティング被膜を有する合成樹脂成型品
IT1302000B1 (it) * 1998-08-05 2000-07-20 Enichem Spa Composizioni polimeriche ad elevata tenacita' a base di polimerivinilaromatici a struttura predominantemente sindiotattica.
US6413652B1 (en) 2000-05-05 2002-07-02 Solvay Engineered Polymers Platable engineered polyolefin alloys
US6509107B2 (en) * 2000-05-05 2003-01-21 Solvay Engineered Polymers Platable engineered polyolefin alloys
EP1408068A4 (en) * 2001-05-30 2005-01-05 Idemitsu Petrochemical Co CHEMICAL-RESISTANT POLYSTYRENE RESIN COMPOSITION AND FORM BODY
US6824889B2 (en) 2002-07-03 2004-11-30 Solvay Engineered Polymers, Inc. Platable engineered polyolefin alloys and articles containing same
ES2351277T3 (es) * 2005-08-03 2011-02-02 Straumann Holding Ag Elemento de sujeción para un implante dental.
US8383243B2 (en) * 2008-12-10 2013-02-26 Xerox Corporation Composite containing polymer, filler and metal plating catalyst, method of making same, and article manufactured therefrom
DE102016124439A1 (de) * 2016-12-15 2018-06-21 Leibniz-Institut Für Polymerforschung Dresden E.V. Verfahren zur Modifizierung von Kunststoffoberflächen und modifizierte Kunststoffoberflächen mit chemisch funktionalisierten Mikrokavitäten
WO2020004597A1 (ja) * 2018-06-29 2020-01-02 出光興産株式会社 樹脂金属複合体及びその製造方法
JP7139027B2 (ja) * 2018-06-29 2022-09-20 出光興産株式会社 樹脂金属複合体及びその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1669701A1 (de) * 1967-06-09 1971-03-18 Basf Ag Verfahren zur Herstellung von metallischen UEberzuegen auf Formteilen aus schlagzaehen Polystyrolformmassen
DE1769926A1 (de) * 1967-08-11 1972-03-09 Sumitomo Chemical Co Formmassen auf Basis kristalliner Polymerisate von Olefinen und Verfahren zum stromlosen Plattieren und gegebenenfalls anschliessenden Elektroplattieren von Formkoerpern aus den Formmassen
US3533828A (en) * 1968-04-08 1970-10-13 Cosden Oil & Chem Co Metal plating of plastic surfaces
US3663325A (en) * 1970-06-11 1972-05-16 Showa Denko Kk Surface treating method for moldings of polystyrene type resins
JPS5143504B2 (enExample) * 1972-12-26 1976-11-22
US3918927A (en) * 1974-06-20 1975-11-11 Phillips Petroleum Co Electroplating polypropylene
US4349421A (en) * 1979-09-17 1982-09-14 Allied Corporation Preparation of metal plated polyamide thermoplastic articles having mirror-like metal finish
JPS57123231A (en) * 1981-01-22 1982-07-31 Toyobo Co Ltd Metal-plated polyamide molded product and preparation of same
EP0102133A3 (en) * 1982-03-26 1985-04-10 General Electric Company Metallized article composed of polyphenylene ether resin, high impact polystyrene, alumina and, optionally, a styrene-butadiene radial teleblock copolymer
US5004649A (en) * 1988-04-13 1991-04-02 Idemitsu Kosan Co., Ltd. Resin laminates and a process for production thereof
JP2633335B2 (ja) * 1988-11-26 1997-07-23 出光興産株式会社 金属化フィルム及びその製造方法
US5232744A (en) * 1991-02-21 1993-08-03 C. Uyemura & Co., Ltd. Electroless composite plating bath and method
WO1997005192A1 (en) * 1995-07-28 1997-02-13 Idemitsu Petrochemical Co., Ltd. Plated molding and process for preparing plated moldings
US5702284A (en) * 1996-03-19 1997-12-30 Gallegos; Carlos R. Party wheel
US5702584A (en) 1996-07-01 1997-12-30 Ford Motor Company Enhanced plating adhesion through the use of metallized fillers in plastic substrate

Also Published As

Publication number Publication date
US6261697B1 (en) 2001-07-17
EP0787762A4 (enExample) 1997-09-03
EP0787762A1 (en) 1997-08-06
WO1997005192A1 (en) 1997-02-13
TW455607B (en) 2001-09-21
US6027817A (en) 2000-02-22
CN1159201A (zh) 1997-09-10

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