TW445554B - Flip chip bump bonding - Google Patents
Flip chip bump bonding Download PDFInfo
- Publication number
- TW445554B TW445554B TW089103182A TW89103182A TW445554B TW 445554 B TW445554 B TW 445554B TW 089103182 A TW089103182 A TW 089103182A TW 89103182 A TW89103182 A TW 89103182A TW 445554 B TW445554 B TW 445554B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- solder
- buffer layer
- ubm
- photoresist mask
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
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44555 4 at ______B7 五、發明說明(1 ) 發明領域 (請先閱讀背面之注意事項再填寫本頁) 一般而言,本發明與電子組裝技術有關,更明確地說 ,與以焊塊將I C晶片及之類物安裝於互連之基底’例如 矽、陶瓷或印刷電路板上有關 發明背景 電子裝置的製造已廣泛使用焊塊互連技術電氣連接組 件的封裝以及將其安裝於互連基底(例如印刷電路板)上 。互連基底包括數種型式的電子裝置支撐基底,包括矽及 陶瓷。爲便於說明,在本文中所討論的支撐基底是印刷電 路板。 現代化的組件封裝要既小且輕,且要可以使用細微圖 案的焊塊表面黏裝到印刷電路板上。典型上,焊塊或接墊 是成形在印刷電路板上,且組件封裝上有對應配對的陣歹[J 。加熱鎔化焊料以構成焊接與互連以完成組裝。此技術是 使用倒裝式晶片技術,組件封裝內之I C晶片的表面上配 置有接墊或焊塊,且晶片是面朝下黏裝於印刷電路板上。 經濟部智慧財產局員工消費合作社印製 在組裝前,焊塊先成彤在I /〇接墊陣列上。爲便於 定位或選擇性地施加焊料到接墊陣列,接墊的表面必須可 被焊料浸濕(wettable)。因此,要在組件上要被接合的焊接 位置上配置焊塊下金屬(under bump metallization,UBM )。 接著將焊料,典型上是以錫爲主的焊料,例如錫一鉛、錫 一銻、施加於U B Μ。 在IC晶片及互連基底上施加焊塊的方法愈來愈多。 -4 - 本紙張尺度適用中國國家標準(CNS)A4規格(210 « 297公爱) 445554 A7 _______B7_____ 五、發明說明(2 ) (請先閱讀背面之注意事項再填寫本頁) 最普通的方法是透過網板或印刷模板印刷焊糊的圖案,接 著移開模板並回流焊料。以相同的方法,但不使用焊糊, 透過一遮罩將焊料蒸鍍到U B Μ上。在這兩種情況中,當 爲順應愈來愈小的互連間距而不斷縮小模板或遮罩的特徵 尺寸時’可靠度的問題也跟著增加。一般來說,模板及遮 罩技術的極限爲焊塊的間距在大約2 0 0微米或以上。 使用較厚的光阻圖案並將焊料蒸鍍到圖案上,接著去 除不需要的部分,這樣可以製造出較細的圖案。不過,在 大基底或板上蒸鍍均勻的層*需要昂貴的設備,以外,一 般來說只限使用含鉛量高的焊料以得到合理的蒸鍍速率^ 使用電解液或無電解的方法電鍍焊料可以得到細微間 距陣列的焊塊。兩種技術都要使甩光學製版術定義焊塊, 且可以製造精密的配置、細線及焊塊等圖案。不過,使用 電解液或無電解的方法會發生其它的可靠度問題。它們需 要非常淸潔的處理環境,以及極度淸潔、電氣活性的基底 表面,這些都增加了成本與製程複雜度- 經濟部智慧財產局員工消費合作社印製 近來提出的焊塊施加方法,以簡單的焊糊技術,結合 細特徵與精密的光學製版術。在成形定義焊塊位置的 UBM之後,基底被覆以厚光阻層。接著曝光焊塊圖案並 顯影光阻,留下厚的遮罩圖案°在光阻遮罩中所開的孔要 比所需的焊塊尺寸大,以烘足夠的焊料容積從焊糊形成最 後的焊塊。以習用的方法將焊糊施加到光阻遮罩中的開孔 中。加熱焊糊以回流’焊塊即自對準僅可供浸濕的表面’ 即UBM。接著去除光阻。由於有光阻遮罩’因此可避免 -5- 本紙張尺度適用中國画家標準(CMS)A4規格(210 =< 297公a ) 44555 4 A- A/ ______B7____ 五、發明說明(3 ) (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 過量的焊料回流與橋接的危險=使用此種技術,可以製造 出間距小於2 0 0微米且可靠度高的焊塊。不過,此技術 的缺點是在焊塊成形後,要去除光阻遮罩很困難。這是因 爲在回流步驟期間’由於熱使得與光阻發生交鏈。當使用 高鎔點的焊料時’此情況更加明顯。在熱與光的雙重影響 下,預聚合物(prepolymei:)材料發生交鏈爲吾人所知。 在光學製版術中使用預聚合物材料,因此,在光化性的曝 光下將會發生某程度的交鏈。此程度足以使得被曝光材料 強固到可做爲光罩,但仍允許在稍後的處理中被去除。如 果光阻材料的交鏈超過設計的水準,就很難將其去除。如 果光阻材料所受到的熱處理比設計値嚴重,光阻材料會彤 成黏固的被覆物。因此可想見,焊料回流步驟期間留在原 處的光阻遮罩傾向發生過量的交鏈,以致很難去除。此外 ,在典型的應用中,要施加焊塊的I C晶片表面上塗布有 一層覆蓋層,通常是聚醯亞胺。光阻聚合物加熱後將黏在 聚醯亞胺上,甚至與其發生交鏈,如何去除光阻但不侵害 到I C的覆蓋層是一大問題。在很多情況,濕溶劑並不適 用。光阻的乾蝕,即灰化,將更爲有效,但乾蝕對顯影及 硬化之光阻與覆蓋層間的選擇性不佳。當此焊塊製程應用 在環氧樹脂-玻璃的互連基底上時,也會發生相同問題。 發明槪述 現已發展出解決上述光阻製程與焊塊製程不相容之問 題的技術。按照此技術,一緩衝層介於I C或互連基底與 本紙張尺度適用令囷圉家標準(CNS)A4規格(21〇χ 297公* ) -6 - W 445554 : 五、發明說明(4 ) (請先閱讀背面之注t事項再填寫本頁) 光阻層間。緩衝層以金屬薄層爲佳’它可防止光阻與與下 層表面間的黏著。緩衝層很容易沈積也很容易去除。它保 護下層,並允許使用有效的技術(如使用電漿乾蝕)去除 光阻。在較佳實施例中’成形緩衝層的步驟與成形U B Μ 合而爲一。 圖式簡單說明 圖1 _ 1 2的槪圖顯示光阻遮罩與焊塊成形之增進技 術的製程步驟。 元件對照表 11: I C晶片基底 1 2 :場氧化物 1 3 :鋁接點 1 4 :覆蓋層 2 1 :鈦層 2 2 :鉻/銅層 2 3 :銅層 經濟部智慧財產局員工消費合作社印製 2 4 :選用層 3 1 :蝕罩 5 1 :光阻遮罩 5 2 :窗口 6 1 :刮刀 6 2 :焊糊 本紙張尺度適用令固國家標準(CNS>A4規格(210 * 297公爱) 4 4555 4 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(5 ) 7 1 :焊塊 8 1 :基底表面 9 1 :緩衝層 9 2 :光阻遮罩 詳細說明 現請參閱圖1 ,部分的I C晶片基底、場氧化物及鋁 接點分別位在1 1 ' 1 2及1 3。聚醯亞胺的覆蓋層以 1 4表示。熟悉此方面技術之人士應瞭解,圖中並非是按 比例繪製。焊接位置1 3可以是層間金屬互連或基底接點 ,例如源、汲的窗口。下方半導體結構的細節並未顯示, 因爲這些不是本發明的重點。本發明的目的是在鋁焊接位 置1 3的表面提供一焊球或焊塊。由於焊料不會浸濕鋁接 點,因此,焊塊作業的第一步是成形UBM。UBM所使 用的金屬應包括與鋁黏附良好的層,以及能被典型錫焊料 配方浸濕的層。能符合這些要求的層結構是鈦、鉻及銅的 組合。 先沈積鈦•黏附於鋁,接著在鈦上沈積鉻/銅,最後 在鉻/銅上沈積銅I以提供可被焊料浸濕的表面。鉻/銅 提供鈦層與銅層間有效的過渡層。焊料合金會溶解銅且從 鈦去浸濕。因此,直接在鈦上的銅薄層將溶解到鎔融的焊 料中,接著焊料將從鈦層去浸濕。爲確保焊料與u B Μ間 介面的整體性1典型上會在鈦層與銅層間使用一鉻與銅的 合金層。另者,UBM也可包括鉻、鉻/銅、銅。也可使 (請先閱讀背面之注意事項再填寫本頁) -t .線_ 本紙張尺度適用中國國家標準(CNS)A4規格<210 X 297公釐) * Q - v “555 4 A7 B7 五、發明說明(6 ) 用其它的U BM材料。 上述各層習用濺射法成形,沈積它們有數種方法可供 選擇。鉻-銅層可濺射自合金靶,或先使用鉻耙濺射,接 著改用銅靶。 多層的U B Μ順序沈積形成如圖2所示的層結構。在 較佳實施例中1各層是在包含鈦靶、鉻靶及銅靶的濺射裝 置中濺射成形。濺射是習用的技術,在本描述中不再對其 詳細描述。也可使用其它沈積金屬層的技術,例如蒸鍍或 電鑛" 第一層2 1是鈦,厚度大約500-5000Α,以 1 000 - 3 000Α爲佳。鈦與鋁接點1 3及聚醯亞胺 的覆蓋餍間黏附性良好。它也不會被典型的焊料合金浸濕 。這是很重要的特性,稍後即可明白。 第二層2 2是薄的鉻/銅過渡層,提供鈦層與後續成 形的銅層間冶金上的穩固介面,且可被焊料浸濕。層2 2 最好是以濺射成形,厚度大約1 0 0 0 — 5 0 0 0 A ,以 2000-3000A爲佳。 經濟部智慧財產局員工消費合作社印製 接下來的層2 3是銅層,厚度大約1 0 0 0 -100〇0A ,以 2000 — 6000A 爲佳。銅層 23 可被焊塊一般所使用的焊料浸濕。銅與錫焊料共鎔的鎔點 較低,銅層表面在焊接溫度即溶解到焊塊中,構成物理與 電氣上的穩固結合。即使所有的銅都溶解到焊料層中,焊 料仍可浸濕鉻/銅層並與其黏附。 圖2顯示一選用的金層2 4,可以施加於銅層表面, -9- *---------—---* —— (請先閱讀背面之沈意事項再填寫本頁) -線· 本紙張尺度適用中國固家標準(CNS)A4规格(210 X 297公爱) A7 445554 _B7____ 五、發明說明(7 ) 以防止銅層表面氧化。選用之金層2 4的厚度大約5 0 0 -3000A,以 1000 — 2000A 爲佳。 (請先閱讀背面之注意事項再填寫本頁) 如圖3所示,施加一蝕罩3 1以遮住焊塊區。蝕罩最 好是習用的光阻,且成形的方法是在表面層上濺射光阻, 並以適當的光化輻射對其製作圖案。圖3顯示已製作完成 的光罩3 1。另者,遮罩技術也可以使用例如氧化物的硬 罩》 使用位於金層2 4 (如果有)上的光罩,以習用的蝕 劑蝕刻銅層2 3。金的蝕劑包括氰化鉀/氰化鐵溶液,碘 化物/碘溶液,以及王水。銅的蝕劑例如氯化鐵或硫酸與 鉻酸鉀的混合物。在不破壞上方銅層的情況下繼續進行銅 /鉻層2 2的蝕刻步驟。適合的蝕劑是以氫氧化鈉與氰化 鐵鉀爲基本溶液,添加銅的複合劑,例如氫氧化銨,以防 止形成鈍化層。 熟悉此方面技術之人士應瞭解,上述的技術是負製程 ’與1 9 9 7年4月2日提出的美國專利申請案0 8/ 8 2 5 ,9 2 3中所描述的相同。其它的多層UBM技術 也可使用,例如使用遮罩定義U B Μ接墊。 經濟部智慧財產局員工消費合作社印製 按本發明的實施例,鈦層2 1留在原處做爲障層。如 圖4所示。 接著使用習用的光阻技術施加光罩。成形光罩的方法 是在表面上濺射光阻,並以適當的光化輻射在光阻上製作 圖案。在圖5中,光罩位在5 1所示之處=它的圖案露出 U ΒΜ,並提供足夠的焊糊容積以形成所要大小的焊塊。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) -10: '44555 4 A7 B7 五、發明說明(8 ) <請先閱讀背面之注意事項再填寫本頁) 典型上,當焊糊回流成焊料時,體積大約縮小5 0 %。因 此,在光罩上之窗口 5 2的面積,乘上光罩的高度或厚度 ’應該大約等於所要的焊糊體積,且是焊塊體積的兩倍》 假設焊塊大致上是球形,1 〇 〇微米(直徑)的焊塊需要 大約3 3 m i 1 3的焊糊。在焊塊與光罩間留下一間隙有利 於光阻的去除,並提供遮罩開孔一合理的寬深比。開孔寬 度(直徑)與焊球寬度(直徑)的適當比例是1 . 1 -2 . 0。從以上的假設得知,光罩開孔(焊糊)的體積是 焊塊體積的兩倍,光罩的厚度爲t ,光罩中開孔的直徑爲 d i,相關焊塊的直徑大約爲d2,則: ^(di/2)2t-2C4X3)?r(d2)3 如果d ! = 1 . 1 — 2 . 〇 d 2,則可化簡爲t =( 0.33-l.l)d2。 接著使用標準程序將焊糊塡入光罩中的開孔5 2。圖 6說明此步驟,圖中顯示使用一習用的刮刀6 1施加焊糊 。刮刀6 1只是施加焊糊6 2之各種適用方法中的一種( 很明顯並未按比例繪製)。 經濟部智慧財產局員工消費合作社印製 圖7顯示焊料回流後的焊塊7 1 »回流的條件與所使 用的焊糊而異。例如使6 3/6 7的錫/鉛或9 5/5的 錫/鉛,典型上的熱處理是加熱3分鐘到達低於液化溫度 大約1 5 °C,接著再加熱3 0秒,到達高於液化溫度大約 2 0 - 3 0 °C,接著快速冷卻(大約2分鐘)到室溫。在 一般回流條件下,光罩5 1中的聚合物將歷經另一次的交 鏈,且將更硬化與更黏附於聚醯亞胺層1 4。圖7的結構 -11 - 本紙張尺度適用中囷固家標準(CNS)A4規格(210 X 297公釐) 445554 Α7 Β7 經濟部智慧財產局員工消費合作社印制^ 五、發明說明(9 ) 中因爲有緩衝層21而使上述情況得以避免。可以使用習 用的光阻濕溶劑將光罩去除,例如P R S 1 0 0 0加熱到 5 ◦ °C ,接著以標準電漿蝕刻去除殘餘的聚合物。除非有 緩衝層2 1 ,否則電漿蝕刻一般會侵蝕到下方的聚醯亞胺 層1 4。因此,由於有緩衝層的存在,因此可以使用較強 的光阻去除步驟,且不會破壞下方的基底。此可以將光阻 完全去除。 在去除光罩之後,接著使用焊塊與UB Μ做爲遮罩將 緩衝層2 1蝕離。蝕離緩衝層以使用標法的濕蝕法爲佳。 若爲鈦,可以使用1:3的水/乙二醇中加入2.5%的 H F將緩衝層去除。所得到的結構如圖8所示,基底表面 8 1非常乾淨。 還有其它成形緩衝層的方法。較佳且最具成本效益的 方法是緩衝層與U ΒΜ —體成形,如上所述。選擇鈦層做 爲緩衝層,因爲焊料不會浸濕鈦。此特性很重要,且表面 張力致成如圖7所示的焊塊。很明顯,此方法需要緩衝層 能導電,因爲它做爲UBM的一部分。不過,也可以使用 不導電的緩衝層,緩衝層是選擇性地施加|以露出UBM 。另一選擇是在基底上鍍非浸濕的金屬,並在施加焊糊光 阻遮罩前,或在施加焊糊光阻遮罩之後使用光學製版術露 出UBM,在此例中,可以使用焊糊遮罩去除UBM區域 的緩衝層材料。如圖9 — 1 2所示。 圖9顯示圖3下一步驟的結構,光罩3 1仍在原位置 。鈦層2 1在早先的實施例中被保留下做爲緩衝層,但在 [L---------嗦 i (請先閱讀背面之注意事項再填寫本頁) . |線_ 本紙張尺度適用中國國家標準(CNSM4規格(210 * 297公笼) -12- 445554 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(ίο ) 本例中與其它層2 2 - 2 4 —起蝕離。這是以負方法成形 U B Μ的一般程序。 接著沈積緩衝層9 1覆蓋整個表面,如圖1 〇所示 此層以使用非浸濕材料爲佳。本文所使用的”非浸濕”材 料一詞,是指材料不會被焊料浸濕。適用的材料包括鋁、 鈦、鉬、鎢。層9 1的厚度較不重要。然而它的厚度要厚 到足以做爲緩衝層,但要薄到很容易去除。〇 . 1 — 5微 米的範圍較適當。接著施加焊糊光阻遮罩9 2 ,如圖1 1 所示。以遮罩9 2蝕離露出的緩衝層9 1 。如果是鋁,例 如可以使用H F或p A E濕蝕。所得到的結構如圖1 2所 示’在光阻遮罩層9 2下有緩衝層9 1。接下來的製程已 在前文中討論。 如上所述,使用焊糊光阻遮罩製作緩衝層圖案很方便 ,且可節省製程成本。不過,當在去除厚的焊糊遮罩時, 覆蓋層會暴露在與圖1 2有關的製程步驟中 > 可能會發生 損壞的情形。因此,在某些例中,較佳的方法是在製作緩 衝層9 1的圖案時,使用單獨的光阻步驟,僅露出UBM 。在此例的結構中,外觀很像圖1 2 ,但緩衝層會蓋住覆 蓋層。 實例 使用 Sputtered Films 公司的 Endeavor cluster tool 沈積 UBM層21-24。接著以習用的光學製版術對已被覆的晶圓製 作圖案。將晶圓置入YES蒸氣打底烤爐中以黏著促進劑(例 (請先閱讀背面之沒意事項再填寫本頁) 4 _ 線 本紙張尺度適用中國國家標準(CNS>A4规格(21〇χ 297公釐) -13- 445554 A7 B7 經濟部智慧財產局員工消費合作社印製 玉、發明說明(11 ) 如HMDS)處理5分鐘。接著在MTI Flexifab track上旋附5 微米的AZ4620光阻,並在100 °C中軟烤(softbaked ) 1分鐘 。使用G C A縮小投影曝光系統曝光以製作圖案(時間: 30秒,或大約200毫焦耳),並以AZ400k顯影 劑顯影(時間2分鐘)。在進行蝕刻前,晶圓先在電熱板 上以1 3 0 °C硬烤(hardbaked ) 2分鐘。接著蝕刻銅與鉻 /銅層,並去除光阻。接著使用上述的光阻程序施加焊糊 光阻遮罩,並使用習用的刮刀將焊糊施加到已製作圖案的 遮罩中。焊糊光阻遮罩的厚度大約1 〇 〇微米,供塡入焊 糊的開孔直徑大約1 6 0微米。接著在熱氮氣中回流以形 成焊塊,直徑大約1 20微米。接著在PRS 1 〇〇〇中 以1 0 0°C 3 0分鐘以去除光阻,接著以電漿去除殘餘的 光阻°接著使用1/3的水/二乙醇中加入2 . 5%HF 的溶液蝕離鈦層。所得到的晶圓即具有選擇性施加的 U BM及焊塊,其四週的表面非常乾淨。 熟悉此方面技術之人士可對本發明做各種附加的修改 。所有與本說明書之特定教導間的差異,基本上都是靠本 發明的原理及它們的相等物,這些都是在本發明所描述及 申請專利範圍的範圍內。 I -------1 — — — — — — — # * I I (請先閱讀背面之注意事項再填寫本頁) 訂,- ;線
T 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -14-
Claims (1)
- d4555 4 as B8 C8 一一 D3 六、申請專利範闻 1 . ~種將i c晶片焊接到一支撐基底上的方法,該 I C晶片具有一覆蓋層,在該覆蓋層上具有複數個鋁質的 焊接位置,其步驟包括: (a )在鋁焊接位置上選擇性地施加焊塊下金屬( U B Μ ), (b )在該覆蓋層上沈積一緩衝層* (c )對該緩衝層製作圖案以露出該UBM至少一部 分, (d )在該緩衝層上成形光阻遮罩,該光阻遮罩覆蓋 該覆蓋層,它的開孔部分露出該U BM, (e )以焊糊塡充光阻遮罩的該開孔部分, (f )回流該焊糊,以在該U B Μ上形成焊塊, (g)去除該光阻遮罩,以及 (h )去除該緩衝層。 2 .如申請專利範圍第1項的方法,其中部分的該緩 衝層是該U BM的一部分, 3 .如申請專利範圍第2項的方法,其中該UBM是 層狀結構,包括至少兩金靨層,且至少其中之一的該金屬 層延伸覆蓋於該覆蓋層形成該緩衝層。 4 ·如申請專利範圍第3項的方法,其中該UBM是 層狀結構,包括鈦、鉻/銅、銅,且鈦層延伸於整個該覆 蓋層上以形成該緩衝層。 5 .如申請專利範圍第1項的方法,其中該覆蓋層是 聚醯亞胺。 (請先閱讀背面之注意事項再填寫本頁) >---- 經濟部智慧財產局員工消費合作钍印製 h°J II - n n m β ^^1 ί i - a^i I I 1^1 - - n : I I - f— n . 本紙張尺度適用中國0家標準<CNS)A4規格(210x297公釐〉 -15- 4 45 5 5 4 as C8 D8 六、申請專利範$ 6 · —種將I C晶片焊接到一支撐基底上的方法,該 I C晶片具有一覆蓋層,在該覆蓋層上具有複數個鋁質的 焊接位置,其步驟包括: (a )施加一金屬緩衝層覆蓋I C晶片, (b )在緩衝層上施加一 UBM層, (c )對U B Μ層製作圖案,以蓋住至少部分的該鋁 焊接位置,留下該緩衝層的部分露出; (d )在該緩衝層上成形光阻遮罩,該光阻遮罩的開 孔部分露出該U BM層, (e )以焊糊塡充光阻遮罩的開孔部分, (f )回流該焊糊,以在該UBM上形成焊塊, (g)去除該光阻遮罩,以及 (h )去除該緩衝層露出的部分。 7 .如申請專利範圍第6項的方法,其中緩衝層的材 料不會被焊料浸濕。 8. 如申請專利範圍第6項的方法’其中該光阻遮罩 的開孔部分露出圍繞於該U BM層四周周邊區域的該緩衝 層。 9. 一種將IC晶片焊接到一支撐基底上的方法’該 I C晶片具有一覆蓋層,在該覆蓋層上具有複數個鋁質的 焊接位置,其步驟包括: (a )在鋁焊接位置上選擇性地施加焊塊下金屬( U B Μ ), (b )在該I C晶片及該UBM上毯狀沈積一金屬層 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 I In If - n 1 n I 1 1 1^1 n tf n .^1 n n n n I ^1- J 本紙張尺度適用中國國家標準(CNS)A4規格(210 * 297公釐) -16- ,145 5 5 4 Α8 Β8 C8 D8 六、申請專利範圍 1 (C )在該金屬層上成形一層製作有圖案的光阻遮罩 ’其上的開孔露出該UBM上的該金屬層, (d )使用該製作有圖案的光阻遮罩做爲蝕罩,將該 U β Μ上的該金屬層部分蝕離, (e )以焊糊塡充光阻遮罩的開孔部分, (f )回流該焊糊,以在該U Β Μ上形成焊塊, (g)去除該光阻遮罩,以及 (h )去除該金屬層。 1 〇 .如申請專利範圍第9項的方法,其中第一 U BM層的材料不會被焊料浸濕。 1 1 .如申請專利範圍第1 〇項的方法’其中該覆蓋 層包括聚醯亞胺。 1 2 .如申請專利範圍第9項的方法’其中該光阻遮 罩的開孔部分露出圍繞於該U Β Μ層四周周邊區域的該緩 衝層。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 '^--------訂丨 ί n n —J I I n n n u n n I ϋ i n ϋ n n n tF —J n n * 本紙張尺度適用中國國家楳準(CNS)A4規格(210 * 297公t) -17-
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JP3413020B2 (ja) * | 1996-07-17 | 2003-06-03 | 株式会社東芝 | 半導体装置の製造方法 |
US5937320A (en) * | 1998-04-08 | 1999-08-10 | International Business Machines Corporation | Barrier layers for electroplated SnPb eutectic solder joints |
-
1999
- 1999-02-23 US US09/256,443 patent/US6232212B1/en not_active Expired - Lifetime
-
2000
- 2000-02-17 SG SG200000865A patent/SG84568A1/en unknown
- 2000-02-18 EP EP00301175A patent/EP1032030B1/en not_active Expired - Lifetime
- 2000-02-21 KR KR1020000008193A patent/KR100712772B1/ko active IP Right Grant
- 2000-02-22 JP JP2000044330A patent/JP3588027B2/ja not_active Expired - Lifetime
- 2000-04-08 TW TW089103182A patent/TW445554B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20000071360A (ko) | 2000-11-25 |
EP1032030A2 (en) | 2000-08-30 |
EP1032030B1 (en) | 2011-06-22 |
JP3588027B2 (ja) | 2004-11-10 |
JP2000243777A (ja) | 2000-09-08 |
US6232212B1 (en) | 2001-05-15 |
KR100712772B1 (ko) | 2007-04-30 |
SG84568A1 (en) | 2001-11-20 |
EP1032030A3 (en) | 2002-01-02 |
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