TW440446B - Hearing aid with large diaphragm microphone element including a printed circuit board - Google Patents
Hearing aid with large diaphragm microphone element including a printed circuit board Download PDFInfo
- Publication number
- TW440446B TW440446B TW089100290A TW89100290A TW440446B TW 440446 B TW440446 B TW 440446B TW 089100290 A TW089100290 A TW 089100290A TW 89100290 A TW89100290 A TW 89100290A TW 440446 B TW440446 B TW 440446B
- Authority
- TW
- Taiwan
- Prior art keywords
- hearing aid
- diaphragm
- microphone
- patent application
- scope
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 65
- 239000002184 metal Substances 0.000 claims abstract description 65
- 238000000034 method Methods 0.000 claims description 44
- 239000000872 buffer Substances 0.000 claims description 35
- 230000009471 action Effects 0.000 claims description 33
- 230000035945 sensitivity Effects 0.000 claims description 33
- 239000003990 capacitor Substances 0.000 claims description 30
- 239000004593 Epoxy Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 27
- 230000002079 cooperative effect Effects 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 13
- 238000012545 processing Methods 0.000 claims description 13
- 230000006870 function Effects 0.000 claims description 10
- 239000012528 membrane Substances 0.000 claims description 9
- 230000004044 response Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 4
- 239000002131 composite material Substances 0.000 claims 2
- 238000004898 kneading Methods 0.000 claims 2
- 238000012550 audit Methods 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 238000013016 damping Methods 0.000 claims 1
- 238000002955 isolation Methods 0.000 claims 1
- 238000012423 maintenance Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- BQENMISTWGTJIJ-UHFFFAOYSA-N 2,3,3',4,5-pentachlorobiphenyl Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C(Cl)=C(Cl)C=2)Cl)=C1 BQENMISTWGTJIJ-UHFFFAOYSA-N 0.000 description 25
- 230000008901 benefit Effects 0.000 description 17
- 239000010410 layer Substances 0.000 description 11
- 230000002829 reductive effect Effects 0.000 description 10
- 239000011888 foil Substances 0.000 description 8
- 125000006850 spacer group Chemical group 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 230000003071 parasitic effect Effects 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- 230000005236 sound signal Effects 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 206010016803 Fluid overload Diseases 0.000 description 1
- 241000209140 Triticum Species 0.000 description 1
- 235000021307 Triticum Nutrition 0.000 description 1
- BPKGOZPBGXJDEP-UHFFFAOYSA-N [C].[Zn] Chemical compound [C].[Zn] BPKGOZPBGXJDEP-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- -1 basic Chemical compound 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 210000000613 ear canal Anatomy 0.000 description 1
- 210000003027 ear inner Anatomy 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000007737 ion beam deposition Methods 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013642 negative control Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/50—Customised settings for obtaining desired overall acoustical characteristics
- H04R25/505—Customised settings for obtaining desired overall acoustical characteristics using digital signal processing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/01—Electrostatic transducers characterised by the use of electrets
- H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2225/00—Details of deaf aids covered by H04R25/00, not provided for in any of its subgroups
- H04R2225/49—Reducing the effects of electromagnetic noise on the functioning of hearing aids, by, e.g. shielding, signal processing adaptation, selective (de)activation of electronic parts in hearing aid
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
- H04R2307/027—Diaphragms comprising metallic materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2410/00—Microphones
- H04R2410/01—Noise reduction using microphones having different directional characteristics
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2410/00—Microphones
- H04R2410/07—Mechanical or electrical reduction of wind noise generated by wind passing a microphone
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/603—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of mechanical or electronic switches or control elements
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Neurosurgery (AREA)
- Otolaryngology (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11501199P | 1999-01-07 | 1999-01-07 | |
| US13489699P | 1999-05-19 | 1999-05-19 | |
| US15787299P | 1999-10-06 | 1999-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW440446B true TW440446B (en) | 2001-06-16 |
Family
ID=27381592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW089100290A TW440446B (en) | 1999-01-07 | 2000-01-07 | Hearing aid with large diaphragm microphone element including a printed circuit board |
Country Status (5)
| Country | Link |
|---|---|
| US (4) | US6366678B1 (enExample) |
| EP (1) | EP1142442A2 (enExample) |
| JP (1) | JP2002534933A (enExample) |
| TW (1) | TW440446B (enExample) |
| WO (1) | WO2000041432A2 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8594349B2 (en) | 2009-04-09 | 2013-11-26 | Industrial Technology Research Institute | Flat speaker structure |
| TWI480718B (zh) * | 2010-01-29 | 2015-04-11 | Htc Corp | 電子裝置 |
| CN107360281A (zh) * | 2017-03-29 | 2017-11-17 | 重庆亚顺电子有限公司 | 手机听筒防尘装置 |
Families Citing this family (104)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6366678B1 (en) * | 1999-01-07 | 2002-04-02 | Sarnoff Corporation | Microphone assembly for hearing aid with JFET flip-chip buffer |
| US7003127B1 (en) * | 1999-01-07 | 2006-02-21 | Sarnoff Corporation | Hearing aid with large diaphragm microphone element including a printed circuit board |
| NL1011778C1 (nl) | 1999-04-13 | 2000-10-16 | Microtronic Nederland Bv | Microfoon voor een hoorapparaat en een hoorapparaat voorzien van een dergelijke microfoon. |
| US6522762B1 (en) * | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
| EP1254585A4 (en) | 1999-12-09 | 2008-10-29 | Sonionmicrotronic Nederland | MINIATURE MICROPHONE |
| US6760454B1 (en) * | 2000-08-04 | 2004-07-06 | Trw Inc. | Passive voice-activated microphone and transceiver system |
| DE10064359A1 (de) * | 2000-12-21 | 2002-07-11 | Microtronic Nederland Bv | Mikrophon |
| DK1241919T3 (da) * | 2001-03-12 | 2012-02-06 | Knowles Electronics Llc | Fremgangsmåde til reducering af forvrængning i en modtager |
| US7103196B2 (en) | 2001-03-12 | 2006-09-05 | Knowles Electronics, Llc. | Method for reducing distortion in a receiver |
| US7062058B2 (en) | 2001-04-18 | 2006-06-13 | Sonion Nederland B.V. | Cylindrical microphone having an electret assembly in the end cover |
| US7136496B2 (en) | 2001-04-18 | 2006-11-14 | Sonion Nederland B.V. | Electret assembly for a microphone having a backplate with improved charge stability |
| US6654473B2 (en) * | 2001-05-09 | 2003-11-25 | Knowles Electronics, Llc | Condenser microphone |
| JP4697763B2 (ja) * | 2001-07-31 | 2011-06-08 | パナソニック株式会社 | コンデンサマイクロホン |
| US7065224B2 (en) * | 2001-09-28 | 2006-06-20 | Sonionmicrotronic Nederland B.V. | Microphone for a hearing aid or listening device with improved internal damping and foreign material protection |
| US7239714B2 (en) | 2001-10-09 | 2007-07-03 | Sonion Nederland B.V. | Microphone having a flexible printed circuit board for mounting components |
| JP2003209899A (ja) * | 2002-01-11 | 2003-07-25 | Audio Technica Corp | コンデンサマイクロホン |
| US6570448B1 (en) * | 2002-01-23 | 2003-05-27 | Broadcom Corporation | System and method for a startup circuit for a differential CMOS amplifier |
| US8280082B2 (en) | 2002-10-08 | 2012-10-02 | Sonion Nederland B.V. | Electret assembly for a microphone having a backplate with improved charge stability |
| US20040179703A1 (en) * | 2003-03-11 | 2004-09-16 | Boor Steven E. | Modifiable buffer circuit for miniature microphone applications and method of adjusting thereof |
| ATE410820T1 (de) * | 2004-01-12 | 2008-10-15 | Sonion As | Verstärkerschaltung für kapazitive umformer |
| JP4310234B2 (ja) * | 2004-05-18 | 2009-08-05 | 株式会社オーディオテクニカ | コンデンサマイクロホン |
| JP4514565B2 (ja) * | 2004-08-31 | 2010-07-28 | 株式会社オーディオテクニカ | コンデンサマイクロホンユニット |
| US7692316B2 (en) | 2004-10-01 | 2010-04-06 | International Rectifier Corporation | Audio amplifier assembly |
| US7415121B2 (en) * | 2004-10-29 | 2008-08-19 | Sonion Nederland B.V. | Microphone with internal damping |
| KR20060094316A (ko) * | 2005-02-24 | 2006-08-29 | 주식회사 비에스이 | 콘덴서 마이크로폰 및 그 제조방법 |
| US20060245606A1 (en) * | 2005-04-27 | 2006-11-02 | Knowles Electronics, Llc | Electret condenser microphone and manufacturing method thereof |
| KR100675505B1 (ko) | 2005-04-29 | 2007-01-30 | 주식회사 비에스이 | 콘덴서 마이크로폰의 케이스 |
| EP1810548B1 (en) | 2005-05-24 | 2008-09-17 | Varibel B.V. | Connector assembly for connecting an earpiece of a hearing aid to a glasses temple |
| EP1727393A1 (en) * | 2005-05-24 | 2006-11-29 | Varibel B.V. | Connector assembly for connecting an earpiece of a hearing aid to a glasses temple |
| SG130158A1 (en) * | 2005-08-20 | 2007-03-20 | Bse Co Ltd | Silicon based condenser microphone and packaging method for the same |
| EP3886454A1 (en) | 2005-09-08 | 2021-09-29 | Oticon A/s | Audio device comprising a microphone and a protection screen, and protection screen for the audio device |
| US7756284B2 (en) * | 2006-01-30 | 2010-07-13 | Songbird Hearing, Inc. | Hearing aid circuit with integrated switch and battery |
| US7756285B2 (en) * | 2006-01-30 | 2010-07-13 | Songbird Hearing, Inc. | Hearing aid with tuned microphone cavity |
| USD563394S1 (en) * | 2006-08-24 | 2008-03-04 | Phitek Systems Limited | Set of earphones |
| US7681577B2 (en) * | 2006-10-23 | 2010-03-23 | Klipsch, Llc | Ear tip |
| JP4972391B2 (ja) * | 2006-12-13 | 2012-07-11 | 新光電気工業株式会社 | シールドケース付パッケージおよびシールドケース付パッケージの製造方法 |
| JP2010520728A (ja) * | 2007-03-05 | 2010-06-10 | ジートロニクス・インコーポレーテッド | 信号処理機能を有する小占有面積のマイクロホン・モジュール |
| DE102007021276A1 (de) * | 2007-05-07 | 2008-11-13 | Siemens Medical Instruments Pte. Ltd. | Hörhilfegerät mit einer Abschirmung |
| US8767983B2 (en) * | 2007-06-01 | 2014-07-01 | Infineon Technologies Ag | Module including a micro-electro-mechanical microphone |
| US9838059B2 (en) | 2007-06-21 | 2017-12-05 | Apple Inc. | Handheld electronic touch screen communication device |
| WO2009023738A2 (en) * | 2007-08-14 | 2009-02-19 | Insound Medical, Inc. | Combined microphone and receiver assembly for extended wear canal hearing devices |
| USD598431S1 (en) | 2007-08-31 | 2009-08-18 | Sony Corporation | Earphone |
| USD587247S1 (en) * | 2007-08-31 | 2009-02-24 | Sony Corporation | Earphone |
| EP2046072A3 (en) * | 2007-10-01 | 2009-11-04 | Sonion Nederland B.V. | A microphone assembly with a replaceable part |
| US8363871B2 (en) * | 2008-03-31 | 2013-01-29 | Cochlear Limited | Alternative mass arrangements for bone conduction devices |
| US20090259090A1 (en) * | 2008-03-31 | 2009-10-15 | Cochlear Limited | Bone conduction hearing device having acoustic feedback reduction system |
| WO2009125773A1 (ja) * | 2008-04-07 | 2009-10-15 | 国立大学法人埼玉大学 | 機械電気変換素子、機械電気変換装置及びその製造方法 |
| US20090257613A1 (en) * | 2008-04-14 | 2009-10-15 | Plantronics, Inc. | Microphone Screen With Common Mode Interference Reduction |
| USD603844S1 (en) | 2008-05-29 | 2009-11-10 | Klipsch, Llc | Headphone |
| USD624901S1 (en) * | 2008-05-29 | 2010-10-05 | Klipsch Group, Inc. | Headphone ear tips |
| TWI330501B (en) * | 2008-06-05 | 2010-09-11 | Ind Tech Res Inst | Flexible electret transducer assembly, speaker and method of making a flexible electret transducer assembly |
| US8073179B2 (en) * | 2008-06-12 | 2011-12-06 | Fortemedia, Inc. | MEMS microphone package with RF insensitive MEMS microphone chip |
| USD596616S1 (en) * | 2008-09-05 | 2009-07-21 | Apple Inc. | Earphone |
| US8265329B2 (en) | 2008-09-05 | 2012-09-11 | Apple Inc. | Compact housing for portable electronic device with internal speaker |
| US8126170B2 (en) | 2008-09-05 | 2012-02-28 | Apple Inc. | Electromagnetic interference shields with piezos |
| JP5502313B2 (ja) * | 2008-12-05 | 2014-05-28 | 船井電機株式会社 | マイクロホンユニット |
| TW201026217A (en) * | 2008-12-31 | 2010-07-01 | Htc Corp | Electronic device and high frequency circuit board thereof |
| US20100246143A1 (en) * | 2009-03-26 | 2010-09-30 | Richard Hung Minh Dinh | Electromagnetic Interference Shielding for Compact Electronic Devices |
| US8855350B2 (en) * | 2009-04-28 | 2014-10-07 | Cochlear Limited | Patterned implantable electret microphone |
| DE102009019446B4 (de) * | 2009-04-29 | 2014-11-13 | Epcos Ag | MEMS Mikrofon |
| CN101959105B (zh) * | 2009-07-12 | 2014-01-15 | 苏州敏芯微电子技术有限公司 | 静电式扬声器 |
| US8224006B2 (en) | 2009-08-28 | 2012-07-17 | Siemens Medical Instruments Pte. Ltd. | Hearing aid device and a method of manufacturing a hearing aid device |
| USD633086S1 (en) * | 2009-11-02 | 2011-02-22 | Foxconn Technology Co., Ltd. | Earphone |
| US9060229B2 (en) | 2010-03-30 | 2015-06-16 | Cochlear Limited | Low noise electret microphone |
| CA137303S (en) * | 2010-03-31 | 2011-05-16 | Valkee Oy | Ear piece for a light treatment device |
| US8503699B2 (en) | 2011-06-01 | 2013-08-06 | Infineon Technologies Ag | Plate, transducer and methods for making and operating a transducer |
| KR101276350B1 (ko) * | 2011-07-04 | 2013-06-18 | 주식회사 비에스이 | 스프링 베이스를 이용한 접합형 콘덴서 마이크로폰 |
| US8808906B2 (en) | 2011-11-23 | 2014-08-19 | Insound Medical, Inc. | Canal hearing devices and batteries for use with same |
| US9604325B2 (en) | 2011-11-23 | 2017-03-28 | Phonak, LLC | Canal hearing devices and batteries for use with same |
| US8761423B2 (en) * | 2011-11-23 | 2014-06-24 | Insound Medical, Inc. | Canal hearing devices and batteries for use with same |
| US8682016B2 (en) | 2011-11-23 | 2014-03-25 | Insound Medical, Inc. | Canal hearing devices and batteries for use with same |
| DK2699021T3 (en) * | 2012-08-13 | 2016-09-26 | Starkey Labs Inc | Method and apparatus for self-voice detection in a hearing-aid |
| US9272471B2 (en) | 2013-04-17 | 2016-03-01 | Apple Inc. | Switch modules with electromagnetic interference shielding structures |
| DE102013213891A1 (de) * | 2013-05-21 | 2014-11-27 | Siemens Medical Instruments Pte. Ltd. | Mikrofonanordnung |
| US9463118B2 (en) * | 2013-08-06 | 2016-10-11 | Applied Research Associates, Inc. | High fidelity blast hearing protection |
| US9584895B2 (en) | 2013-08-14 | 2017-02-28 | Klipsch Group, Inc. | Teardrop variable wall earbud |
| US9088846B2 (en) | 2013-08-14 | 2015-07-21 | Klipsch Group, Inc. | Oval variable wall earbud |
| US9369792B2 (en) | 2013-08-14 | 2016-06-14 | Klipsch Group, Inc. | Round variable wall earbud |
| JP6381947B2 (ja) | 2013-09-04 | 2018-08-29 | 日東電工株式会社 | 携帯機器、充電システム、及び、電源回路基板等 |
| USD727300S1 (en) * | 2013-12-17 | 2015-04-21 | Logitech Europe S.A. | Ear tip tester |
| USD727299S1 (en) * | 2013-12-17 | 2015-04-21 | Logitech Europe S.A. | Ear tip support |
| EP2957349A1 (en) | 2014-06-20 | 2015-12-23 | PARI Pharma GmbH | Aerosol generator and aerosol delivery device comprising the aerosol generator |
| WO2016018200A1 (en) | 2014-07-27 | 2016-02-04 | Sonova Ag | Batteries and battery manufacturing methods |
| CN104969572B (zh) * | 2014-08-26 | 2019-01-18 | 歌尔股份有限公司 | Pcb扬声器以及用于在pcb基板上微加工扬声器振膜的方法 |
| US9681228B2 (en) * | 2014-09-30 | 2017-06-13 | Apple Inc. | Capacitive position sensing for transducers |
| JP6632880B2 (ja) * | 2015-12-16 | 2020-01-22 | 株式会社オーディオテクニカ | コンデンサマイクロホンユニットおよびコンデンサマイクロホン |
| CN107005773A (zh) * | 2016-04-12 | 2017-08-01 | 深圳市鲁粤盛科技有限公司 | 一种车载传声器模组 |
| US10939192B2 (en) * | 2016-08-18 | 2021-03-02 | Harman International Industries, Incorporated | Electret condenser microphone and manufacturing method thereof |
| EP3343956B1 (en) | 2016-12-30 | 2021-03-10 | Sonion Nederland B.V. | A circuit and a receiver comprising the circuit |
| DE102017103803A1 (de) * | 2017-02-23 | 2018-08-23 | Infineon Technologies Ag | Eine Integrierte-Schaltung-Vorrichtung und eine Vorrichtung zum Schutz einer Schaltung |
| EP3367703B1 (en) * | 2017-02-27 | 2020-05-13 | Oticon A/s | Hearing device with a microphone structure |
| US10986435B2 (en) * | 2017-04-18 | 2021-04-20 | Massachusetts Institute Of Technology | Electrostatic acoustic transducer utilized in a hearing aid or audio processing system |
| JP6645487B2 (ja) * | 2017-10-30 | 2020-02-14 | セイコーエプソン株式会社 | プリント回路板 |
| WO2019226958A1 (en) | 2018-05-24 | 2019-11-28 | The Research Foundation For The State University Of New York | Capacitive sensor |
| CN108966102B (zh) * | 2018-08-17 | 2024-03-29 | 钰太芯微电子科技（上海）有限公司 | 一种光电微机电系统麦克风及电子设备 |
| CN109547907B (zh) * | 2019-01-23 | 2024-01-05 | 东莞泉声电子有限公司 | 驻极体电容传声器及其制作方法 |
| EP3739904B1 (de) * | 2019-05-14 | 2024-10-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Akustisches biegewandlersystem und akustische vorrichtung |
| FR3098673B1 (fr) * | 2019-07-12 | 2021-06-11 | Alain Magagnini | Microphone électret omnidirectionnel avec étage adaptateur d’impédance à amplificateur opérationnel en particulier pour des applications de détection sur piles |
| USD906297S1 (en) | 2019-09-13 | 2020-12-29 | Apple Inc. | Pair of earphones |
| CN113036379B (zh) * | 2021-03-17 | 2022-06-14 | 成都挚信电子技术有限责任公司 | 一种压控磁性阻抗变换器 |
| TWI889910B (zh) * | 2021-09-29 | 2025-07-11 | 宏達國際電子股份有限公司 | 麥克風及頭戴式顯示裝置 |
| WO2023055182A1 (ko) * | 2021-10-01 | 2023-04-06 | 삼성전자 주식회사 | 코인 셀 배터리를 포함하는 전자 장치 |
| US12144123B2 (en) | 2021-10-01 | 2024-11-12 | Samsung Electronics Co., Ltd. | Electronic device including coin-cell battery |
| US20240284084A1 (en) * | 2023-02-16 | 2024-08-22 | Bose Corporation | Extending antenna earth plane |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3300585A (en) * | 1963-09-04 | 1967-01-24 | Northern Electric Co | Self-polarized electrostatic microphone-semiconductor amplifier combination |
| NL7802688A (nl) * | 1978-03-13 | 1979-09-17 | Philips Nv | Inrichting voor het omzetten van akoestische in elektrische trillingen en omgekeerd, voor- zien van tenminste een kondensator elektreet- element aangesloten op een elektronische schakeling. |
| JPS622879Y2 (enExample) * | 1981-03-25 | 1987-01-22 | ||
| JPS5957100U (ja) * | 1982-10-08 | 1984-04-13 | 株式会社プリモ | セラミツクマイクロホン |
| US4533795A (en) * | 1983-07-07 | 1985-08-06 | American Telephone And Telegraph | Integrated electroacoustic transducer |
| US5303305A (en) * | 1986-04-18 | 1994-04-12 | Raimo Robert W | Solar powered hearing aid |
| US4764690A (en) | 1986-06-18 | 1988-08-16 | Lectret S.A. | Electret transducing |
| DE3807251A1 (de) | 1988-03-05 | 1989-09-14 | Sennheiser Electronic | Kapazitiver schallwandler |
| US5097224A (en) * | 1991-04-11 | 1992-03-17 | Telex Communications, Inc. | Self-biasing, low noise amplifier of extended dynamic range |
| NL9101563A (nl) * | 1991-09-17 | 1993-04-16 | Microtel Bv | Elektroacoustische transducent van het elektreet type. |
| US5388163A (en) * | 1991-12-23 | 1995-02-07 | At&T Corp. | Electret transducer array and fabrication technique |
| US5596222A (en) | 1994-08-12 | 1997-01-21 | The Charles Stark Draper Laboratory, Inc. | Wafer of transducer chips |
| US5589799A (en) * | 1994-09-29 | 1996-12-31 | Tibbetts Industries, Inc. | Low noise amplifier for microphone |
| DK172085B1 (da) | 1995-06-23 | 1997-10-13 | Microtronic As | Mikromekanisk mikrofon |
| NL1000878C2 (nl) | 1995-07-24 | 1997-01-28 | Microtronic Nederland Bv | Transducer. |
| DK94995A (da) | 1995-08-24 | 1997-02-25 | Microtronic As | Magnetfeltsensor |
| NL1002783C2 (nl) | 1996-04-03 | 1997-10-06 | Microtronic Nederland Bv | Geïntegreerde microfoon/versterker-eenheid, en versterkermodule daarvoor. |
| NL1002880C2 (nl) | 1996-04-16 | 1997-10-17 | Microtronic Nederland Bv | Elektroakoestische transducent. |
| US5856914A (en) | 1996-07-29 | 1999-01-05 | National Semiconductor Corporation | Micro-electronic assembly including a flip-chip mounted micro-device and method |
| CA2218307C (en) * | 1997-10-10 | 2006-01-03 | Gennum Corporation | Three dimensional packaging configuration for multi-chip module assembly |
| FI105880B (fi) * | 1998-06-18 | 2000-10-13 | Nokia Mobile Phones Ltd | Mikromekaanisen mikrofonin kiinnitys |
| US6088463A (en) * | 1998-10-30 | 2000-07-11 | Microtronic A/S | Solid state silicon-based condenser microphone |
| US6366678B1 (en) * | 1999-01-07 | 2002-04-02 | Sarnoff Corporation | Microphone assembly for hearing aid with JFET flip-chip buffer |
| US6456720B1 (en) * | 1999-12-10 | 2002-09-24 | Sonic Innovations | Flexible circuit board assembly for a hearing aid |
-
2000
- 2000-01-06 US US09/478,389 patent/US6366678B1/en not_active Expired - Lifetime
- 2000-01-06 EP EP00902342A patent/EP1142442A2/en not_active Withdrawn
- 2000-01-06 WO PCT/US2000/000322 patent/WO2000041432A2/en not_active Ceased
- 2000-01-06 JP JP2000593058A patent/JP2002534933A/ja active Pending
- 2000-01-07 TW TW089100290A patent/TW440446B/zh not_active IP Right Cessation
-
2002
- 2002-01-29 US US10/059,933 patent/US20020090102A1/en not_active Abandoned
-
2006
- 2006-02-21 US US11/359,990 patent/US7221768B2/en not_active Expired - Fee Related
- 2006-08-03 US US11/498,530 patent/US20070121967A1/en not_active Abandoned
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8594349B2 (en) | 2009-04-09 | 2013-11-26 | Industrial Technology Research Institute | Flat speaker structure |
| TWI480718B (zh) * | 2010-01-29 | 2015-04-11 | Htc Corp | 電子裝置 |
| CN107360281A (zh) * | 2017-03-29 | 2017-11-17 | 重庆亚顺电子有限公司 | 手机听筒防尘装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20070121967A1 (en) | 2007-05-31 |
| US20020090102A1 (en) | 2002-07-11 |
| JP2002534933A (ja) | 2002-10-15 |
| WO2000041432A2 (en) | 2000-07-13 |
| US6366678B1 (en) | 2002-04-02 |
| WO2000041432A3 (en) | 2000-11-30 |
| EP1142442A2 (en) | 2001-10-10 |
| US20060177083A1 (en) | 2006-08-10 |
| US7221768B2 (en) | 2007-05-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW440446B (en) | Hearing aid with large diaphragm microphone element including a printed circuit board | |
| US7003127B1 (en) | Hearing aid with large diaphragm microphone element including a printed circuit board | |
| US9843866B2 (en) | Piezoelectric bone conduction receiver and portable electronic device | |
| US4504703A (en) | Electro-acoustic transducer | |
| EP1507438B1 (en) | Sound reproduction device and portable terminal apparatus | |
| CN113965846B (zh) | 骨传导发声装置、骨传导发声装置装配方法及骨传导耳机 | |
| US20080130934A1 (en) | Microphone With a Low Frequency Noise Shunt | |
| JP2009111820A (ja) | 骨伝導イヤホン | |
| WO2000027166A9 (en) | Transducer concepts for hearing aids and other devices | |
| KR100540289B1 (ko) | 음향 진동 복합 모드의 다이나믹 마이크로 스피커 | |
| EP2369855B1 (en) | Electronic device with electret electro-acoustic transducer | |
| JPWO2005006809A1 (ja) | 圧電型振動発生器及びこれを用いた振動送音器 | |
| US6492761B1 (en) | Digital piezoelectric transducers and methods | |
| JPS5928799A (ja) | 静電形変換器 | |
| JP4002520B2 (ja) | 静電マイクロホン変換器 | |
| WO2024208662A1 (en) | Audio assembly for a hearing device | |
| JP2007174165A (ja) | マイクロホン及びこれを用いた補聴器 | |
| CN214756909U (zh) | 用于传声器的拾音组件和骨传导传声器以及电子产品 | |
| TW202228445A (zh) | 雙振膜雙音圈喇叭單體 | |
| KR100606165B1 (ko) | 마이크로폰용 다중 진동판 및 이를 이용한 콘덴서마이크로폰 | |
| CN219420810U (zh) | 电子设备和壳体 | |
| CN115334407B (zh) | 扬声器模组和音箱 | |
| JPH0125013Y2 (enExample) | ||
| JP3057898U (ja) | 圧電発音体 | |
| CN208128517U (zh) | 一种高功率微型扬声器 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |