TW436374B - Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization - Google Patents

Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization Download PDF

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Publication number
TW436374B
TW436374B TW088119569A TW88119569A TW436374B TW 436374 B TW436374 B TW 436374B TW 088119569 A TW088119569 A TW 088119569A TW 88119569 A TW88119569 A TW 88119569A TW 436374 B TW436374 B TW 436374B
Authority
TW
Taiwan
Prior art keywords
roller
pressure
patent application
polishing pad
pad
Prior art date
Application number
TW088119569A
Other languages
English (en)
Chinese (zh)
Inventor
Michael Labunsky
Tac Huynh
Anthony S Meyer
Andrew J Nagengast
Glenn W Travis
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of TW436374B publication Critical patent/TW436374B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/02—Wheels in one piece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW088119569A 1998-11-09 2000-01-24 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization TW436374B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/188,779 US6086460A (en) 1998-11-09 1998-11-09 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization

Publications (1)

Publication Number Publication Date
TW436374B true TW436374B (en) 2001-05-28

Family

ID=22694491

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088119569A TW436374B (en) 1998-11-09 2000-01-24 Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization

Country Status (7)

Country Link
US (2) US6086460A (https=)
EP (1) EP1128932A4 (https=)
JP (1) JP2002529924A (https=)
KR (1) KR100642405B1 (https=)
AU (1) AU1224400A (https=)
TW (1) TW436374B (https=)
WO (1) WO2000027585A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7425172B2 (en) 2003-03-25 2008-09-16 Nexplanar Corporation Customized polish pads for chemical mechanical planarization
TWI394637B (zh) * 2005-08-30 2013-05-01 東京精密股份有限公司 墊調節器、墊調節方法及拋光裝置
TWI451938B (zh) * 2010-05-10 2014-09-11 Samsung Electronics Co Ltd 化學機械研磨設備之調節器

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6086460A (en) * 1998-11-09 2000-07-11 Lam Research Corporation Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
US6248009B1 (en) * 1999-02-18 2001-06-19 Ebara Corporation Apparatus for cleaning substrate
JP4030247B2 (ja) * 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
US6196899B1 (en) * 1999-06-21 2001-03-06 Micron Technology, Inc. Polishing apparatus
US6244944B1 (en) 1999-08-31 2001-06-12 Micron Technology, Inc. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
US6306019B1 (en) 1999-12-30 2001-10-23 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6579797B1 (en) * 2000-01-25 2003-06-17 Agere Systems Inc. Cleaning brush conditioning apparatus
US6343977B1 (en) * 2000-03-14 2002-02-05 Worldwide Semiconductor Manufacturing Corp. Multi-zone conditioner for chemical mechanical polishing system
US6626743B1 (en) 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6361414B1 (en) 2000-06-30 2002-03-26 Lam Research Corporation Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
US6435952B1 (en) 2000-06-30 2002-08-20 Lam Research Corporation Apparatus and method for qualifying a chemical mechanical planarization process
US6468134B1 (en) * 2000-06-30 2002-10-22 Lam Research Corporation Method and apparatus for slurry distribution
US6645046B1 (en) 2000-06-30 2003-11-11 Lam Research Corporation Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
JP3768399B2 (ja) * 2000-11-17 2006-04-19 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
US6875091B2 (en) 2001-01-04 2005-04-05 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6554688B2 (en) 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6752698B1 (en) 2001-03-19 2004-06-22 Lam Research Corporation Method and apparatus for conditioning fixed-abrasive polishing pads
US6910949B1 (en) 2001-04-25 2005-06-28 Lam Research Corporation Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers
US6767427B2 (en) * 2001-06-07 2004-07-27 Lam Research Corporation Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
GB2392832B (en) * 2001-06-27 2004-12-15 Container Wash Systems Ltd Container washing apparatus
KR100462868B1 (ko) * 2001-06-29 2004-12-17 삼성전자주식회사 반도체 폴리싱 장치의 패드 컨디셔너
US6645052B2 (en) 2001-10-26 2003-11-11 Lam Research Corporation Method and apparatus for controlling CMP pad surface finish
US6561880B1 (en) * 2002-01-29 2003-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for cleaning the polishing pad of a linear polisher
AU2003218477A1 (en) * 2002-04-02 2003-10-20 Rodel Holdings, Inc. Composite conditioning tool
US6958005B1 (en) * 2004-03-30 2005-10-25 Lam Research Corporation Polishing pad conditioning system
US6969307B2 (en) * 2004-03-30 2005-11-29 Lam Research Corporation Polishing pad conditioning and polishing liquid dispersal system
US6935938B1 (en) 2004-03-31 2005-08-30 Lam Research Corporation Multiple-conditioning member device for chemical mechanical planarization conditioning
US8251776B2 (en) * 2006-01-23 2012-08-28 Freescale Semiconductor, Inc. Method and apparatus for conditioning a CMP pad
KR100943740B1 (ko) * 2008-06-02 2010-02-23 세메스 주식회사 Ｌｃｄ 패널 및 반도체 기판의 연마 장치
US20100062693A1 (en) * 2008-09-05 2010-03-11 Taiwan Semiconductor Manufacturing Co., Ltd. Two step method and apparatus for polishing metal and other films in semiconductor manufacturing
US20100291841A1 (en) * 2009-05-14 2010-11-18 Chien-Min Sung Methods and Systems for Water Jet Assisted CMP Processing
CN102049730B (zh) * 2010-12-29 2012-02-15 清华大学 一种用于化学机械抛光设备的晶圆交换装置
JP5878441B2 (ja) * 2012-08-20 2016-03-08 株式会社荏原製作所 基板洗浄装置及び基板処理装置
US20140310895A1 (en) * 2013-04-19 2014-10-23 Applied Materials, Inc. Scrubber brush force control assemblies, apparatus and methods for chemical mechanical polishing
JP5554440B2 (ja) * 2013-07-30 2014-07-23 ニッタ・ハース株式会社 研磨パッドのコンディショナー
KR102570853B1 (ko) * 2017-08-10 2023-08-25 도쿄엘렉트론가부시키가이샤 기판 이면 연마 부재의 드레싱 장치 및 드레싱 방법
JP7079164B2 (ja) 2018-07-06 2022-06-01 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
CN116276658A (zh) * 2023-03-13 2023-06-23 北京晶亦精微科技股份有限公司 一种抛磨机构及抛磨修整装置

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3753269A (en) * 1971-05-21 1973-08-21 R Budman Abrasive cloth cleaner
US4318250A (en) * 1980-03-31 1982-03-09 St. Florian Company, Ltd. Wafer grinder
US4672985A (en) * 1985-03-18 1987-06-16 Mohr Larry D Belt cleaning apparatus
US4720939A (en) * 1986-05-23 1988-01-26 Simpson Products, Inc. Wide belt sander cleaning device
DE3625286A1 (de) * 1986-07-25 1988-02-04 Flier Gustav Schleifscheibenreinigung durch beaufschlagung des kuehlwassers mit ultraschall, insbesondere in anwendung fuer schleifmaschinen
US4934102A (en) * 1988-10-04 1990-06-19 International Business Machines Corporation System for mechanical planarization
US5081051A (en) * 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
EP0517594B1 (fr) * 1991-06-06 1995-12-13 Commissariat A L'energie Atomique Machine de polissage à bande microabrasive tendue et à tête support de plaquette perfectionnée
WO1993001896A1 (en) * 1991-07-22 1993-02-04 Robert Keith Smith Belt cleaner
JP3036348B2 (ja) * 1994-03-23 2000-04-24 三菱マテリアル株式会社 ウェーハ研磨パッドのツルーイング装置
US5547417A (en) * 1994-03-21 1996-08-20 Intel Corporation Method and apparatus for conditioning a semiconductor polishing pad
US5622526A (en) * 1994-03-28 1997-04-22 J. D. Phillips Corporation Apparatus for trueing CBN abrasive belts and grinding wheels
US5536202A (en) * 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
DE69512971T2 (de) * 1994-08-09 2000-05-18 Ontrak Systems Inc., Milpitas Linear Poliergerät und Wafer Planarisierungsverfahren
US5575707A (en) * 1994-10-11 1996-11-19 Ontrak Systems, Inc. Polishing pad cluster for polishing a semiconductor wafer
US5593344A (en) * 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
US5643044A (en) * 1994-11-01 1997-07-01 Lund; Douglas E. Automatic chemical and mechanical polishing system for semiconductor wafers
US5775983A (en) * 1995-05-01 1998-07-07 Applied Materials, Inc. Apparatus and method for conditioning a chemical mechanical polishing pad
US5908530A (en) 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5611943A (en) * 1995-09-29 1997-03-18 Intel Corporation Method and apparatus for conditioning of chemical-mechanical polishing pads
US5655951A (en) * 1995-09-29 1997-08-12 Micron Technology, Inc. Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
US5779526A (en) * 1996-02-27 1998-07-14 Gill; Gerald L. Pad conditioner
JPH10118916A (ja) * 1996-10-24 1998-05-12 Sony Corp 化学的機械研磨法及びその装置
US5725417A (en) * 1996-11-05 1998-03-10 Micron Technology, Inc. Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates
US5871390A (en) 1997-02-06 1999-02-16 Lam Research Corporation Method and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishing
US6312319B1 (en) * 1997-04-04 2001-11-06 Timothy J. Donohue Polishing media magazine for improved polishing
US6239719B1 (en) * 1997-06-03 2001-05-29 At&T Wireless Services, Inc. Method for time-stamping a message based on a recipient location
JPH1110521A (ja) * 1997-06-17 1999-01-19 Sony Corp ウェーハ研磨装置
US5899798A (en) 1997-07-25 1999-05-04 Obsidian Inc. Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing
JPH1148122A (ja) * 1997-08-04 1999-02-23 Hitachi Ltd 化学的機械研磨装置およびこれを用いた半導体集積回路装置の製造方法
US6196896B1 (en) 1997-10-31 2001-03-06 Obsidian, Inc. Chemical mechanical polisher
JPH11300599A (ja) * 1998-04-23 1999-11-02 Speedfam-Ipec Co Ltd ワークの片面研磨方法及び装置
US5897426A (en) 1998-04-24 1999-04-27 Applied Materials, Inc. Chemical mechanical polishing with multiple polishing pads
JPH11333697A (ja) * 1998-05-28 1999-12-07 Nkk Corp Ｃｍｐ装置のドレッサーシステム
US6086460A (en) * 1998-11-09 2000-07-11 Lam Research Corporation Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7425172B2 (en) 2003-03-25 2008-09-16 Nexplanar Corporation Customized polish pads for chemical mechanical planarization
US7704122B2 (en) 2003-03-25 2010-04-27 Nexplanar Corporation Customized polish pads for chemical mechanical planarization
TWI394637B (zh) * 2005-08-30 2013-05-01 東京精密股份有限公司 墊調節器、墊調節方法及拋光裝置
TWI451938B (zh) * 2010-05-10 2014-09-11 Samsung Electronics Co Ltd 化學機械研磨設備之調節器

Also Published As

Publication number Publication date
US6086460A (en) 2000-07-11
WO2000027585A1 (en) 2000-05-18
KR100642405B1 (ko) 2006-11-03
US6328637B1 (en) 2001-12-11
KR20010092725A (ko) 2001-10-26
JP2002529924A (ja) 2002-09-10
EP1128932A1 (en) 2001-09-05
AU1224400A (en) 2000-05-29
EP1128932A4 (en) 2007-01-10

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees