TW434111B - Carrier head with controllable pressure and loading area for chemical mechanical polishing - Google Patents
Carrier head with controllable pressure and loading area for chemical mechanical polishing Download PDFInfo
- Publication number
- TW434111B TW434111B TW088123154A TW88123154A TW434111B TW 434111 B TW434111 B TW 434111B TW 088123154 A TW088123154 A TW 088123154A TW 88123154 A TW88123154 A TW 88123154A TW 434111 B TW434111 B TW 434111B
- Authority
- TW
- Taiwan
- Prior art keywords
- chamber
- substrate
- patent application
- scope
- item
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 46
- 239000000126 substance Substances 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 153
- 239000012528 membrane Substances 0.000 claims abstract description 84
- 125000006850 spacer group Chemical group 0.000 claims description 47
- 238000000227 grinding Methods 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 19
- 239000012530 fluid Substances 0.000 claims description 18
- 230000002079 cooperative effect Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 9
- 230000006835 compression Effects 0.000 claims description 7
- 238000007906 compression Methods 0.000 claims description 7
- 230000001276 controlling effect Effects 0.000 claims description 4
- 238000012856 packing Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 239000000428 dust Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000010408 film Substances 0.000 description 69
- 238000007667 floating Methods 0.000 description 47
- 238000009423 ventilation Methods 0.000 description 22
- 238000012546 transfer Methods 0.000 description 9
- 239000002002 slurry Substances 0.000 description 8
- 238000005096 rolling process Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000009530 blood pressure measurement Methods 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 240000000560 Citrus x paradisi Species 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11418298P | 1998-12-30 | 1998-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW434111B true TW434111B (en) | 2001-05-16 |
Family
ID=22353793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW088123154A TW434111B (en) | 1998-12-30 | 2000-02-10 | Carrier head with controllable pressure and loading area for chemical mechanical polishing |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4519972B2 (enExample) |
| KR (1) | KR100636455B1 (enExample) |
| SG (1) | SG82058A1 (enExample) |
| TW (1) | TW434111B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7530153B2 (en) | 2005-09-21 | 2009-05-12 | Applied Materials, Inc. | Attaching components of a carrier head |
| TWI821934B (zh) * | 2021-03-04 | 2023-11-11 | 美商應用材料股份有限公司 | 利用浮動邊緣控制的拋光承載頭 |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6776692B1 (en) * | 1999-07-09 | 2004-08-17 | Applied Materials Inc. | Closed-loop control of wafer polishing in a chemical mechanical polishing system |
| KR100423909B1 (ko) * | 2000-11-23 | 2004-03-24 | 삼성전자주식회사 | 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법 |
| KR100492330B1 (ko) * | 2002-10-30 | 2005-05-27 | 두산디앤디 주식회사 | 화학기계적 연마장치의 캐리어 헤드 |
| JP3889744B2 (ja) | 2003-12-05 | 2007-03-07 | 株式会社東芝 | 研磨ヘッドおよび研磨装置 |
| KR100840013B1 (ko) * | 2006-12-28 | 2008-06-20 | 주식회사 실트론 | 균일 압력 연마헤드 |
| JP5236705B2 (ja) * | 2010-09-08 | 2013-07-17 | 株式会社荏原製作所 | 研磨装置 |
| US9610672B2 (en) * | 2014-06-27 | 2017-04-04 | Applied Materials, Inc. | Configurable pressure design for multizone chemical mechanical planarization polishing head |
| KR102091418B1 (ko) * | 2018-06-01 | 2020-04-23 | 주식회사 케이씨텍 | 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인 |
| WO2020167485A1 (en) | 2019-02-14 | 2020-08-20 | Axus Technology, Llc | Substrate carrier head and processing system |
| KR102138700B1 (ko) * | 2019-11-11 | 2020-07-29 | (주)제이씨글로벌 | 화학적 기계적 연마장치용 연마헤드 |
| EP4171874A4 (en) * | 2020-06-24 | 2024-11-27 | Applied Materials, Inc. | POLISHING SUPPORT HEAD WITH PIEZOELECTRIC PRESSURE CONTROL |
| JP7659565B2 (ja) * | 2020-11-10 | 2025-04-09 | アプライド マテリアルズ インコーポレイテッド | 局所的なウエハ圧力を有する研磨ヘッド |
| WO2022196631A1 (ja) * | 2021-03-17 | 2022-09-22 | ミクロ技研株式会社 | 研磨ヘッド及び研磨処理装置 |
| US20220410340A1 (en) * | 2021-06-25 | 2022-12-29 | Globalwafers Co., Ltd. | Polishing head assembly having recess and cap |
| CN114166952B (zh) * | 2021-12-08 | 2023-08-29 | 北京晶亦精微科技股份有限公司 | 一种吸附检测装置及吸附检测方法 |
| US12420376B2 (en) | 2021-12-23 | 2025-09-23 | Globalwafers Co., Ltd. | Polishing head assembly having recess and cap |
| CN115256181B (zh) * | 2022-09-23 | 2025-06-06 | 广东丰泰智能设备有限公司 | 一种全自动片材抛光机 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0811360B2 (ja) * | 1987-01-19 | 1996-02-07 | 日本電信電話株式会社 | 均一加圧・接着方法 |
| JPH01101386A (ja) * | 1987-10-13 | 1989-04-19 | Mitsubishi Metal Corp | ウェーハの接着方法 |
| JP3233664B2 (ja) * | 1991-09-13 | 2001-11-26 | 土肥 俊郎 | デバイス付きウェーハのプラナリゼーションポリッシング方法及びその装置 |
| JPH08267357A (ja) * | 1995-03-31 | 1996-10-15 | Nec Corp | 基板の研磨装置及びその研磨方法 |
| ATE228915T1 (de) * | 1996-01-24 | 2002-12-15 | Lam Res Corp | Halbleiterscheiben-polierkopf |
| JPH09246218A (ja) * | 1996-03-07 | 1997-09-19 | Hitachi Ltd | 研磨方法および装置 |
| US6183354B1 (en) * | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
| US6019670A (en) * | 1997-03-10 | 2000-02-01 | Applied Materials, Inc. | Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system |
| JPH10277928A (ja) * | 1997-03-31 | 1998-10-20 | Hitachi Ltd | 研磨装置 |
| US5957751A (en) * | 1997-05-23 | 1999-09-28 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
| US6106379A (en) * | 1998-05-12 | 2000-08-22 | Speedfam-Ipec Corporation | Semiconductor wafer carrier with automatic ring extension |
| US5985094A (en) * | 1998-05-12 | 1999-11-16 | Speedfam-Ipec Corporation | Semiconductor wafer carrier |
| US6277014B1 (en) * | 1998-10-09 | 2001-08-21 | Applied Materials, Inc. | Carrier head with a flexible membrane for chemical mechanical polishing |
-
1999
- 1999-12-24 SG SG9906629A patent/SG82058A1/en unknown
- 1999-12-30 KR KR1019990066061A patent/KR100636455B1/ko not_active Expired - Fee Related
-
2000
- 2000-01-04 JP JP2000000117A patent/JP4519972B2/ja not_active Expired - Fee Related
- 2000-02-10 TW TW088123154A patent/TW434111B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7530153B2 (en) | 2005-09-21 | 2009-05-12 | Applied Materials, Inc. | Attaching components of a carrier head |
| TWI821934B (zh) * | 2021-03-04 | 2023-11-11 | 美商應用材料股份有限公司 | 利用浮動邊緣控制的拋光承載頭 |
Also Published As
| Publication number | Publication date |
|---|---|
| SG82058A1 (en) | 2001-07-24 |
| KR100636455B1 (ko) | 2006-10-18 |
| KR20000048476A (ko) | 2000-07-25 |
| JP4519972B2 (ja) | 2010-08-04 |
| JP2000202762A (ja) | 2000-07-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |