JP4519972B2 - 化学機械研磨の制御可能圧力及びローディング領域を有するキャリヤヘッド - Google Patents

化学機械研磨の制御可能圧力及びローディング領域を有するキャリヤヘッド Download PDF

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Publication number
JP4519972B2
JP4519972B2 JP2000000117A JP2000000117A JP4519972B2 JP 4519972 B2 JP4519972 B2 JP 4519972B2 JP 2000000117 A JP2000000117 A JP 2000000117A JP 2000000117 A JP2000000117 A JP 2000000117A JP 4519972 B2 JP4519972 B2 JP 4519972B2
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Japan
Prior art keywords
carrier head
chamber
membrane
substrate
flexible
Prior art date
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Expired - Fee Related
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JP2000000117A
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English (en)
Japanese (ja)
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JP2000202762A5 (enExample
JP2000202762A (ja
Inventor
エム． ズニガ スティーヴン
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2000202762A5 publication Critical patent/JP2000202762A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000000117A 1998-12-30 2000-01-04 化学機械研磨の制御可能圧力及びローディング領域を有するキャリヤヘッド Expired - Fee Related JP4519972B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11418298P 1998-12-30 1998-12-30
US60/114182 1998-12-30

Publications (3)

Publication Number Publication Date
JP2000202762A JP2000202762A (ja) 2000-07-25
JP2000202762A5 JP2000202762A5 (enExample) 2007-02-22
JP4519972B2 true JP4519972B2 (ja) 2010-08-04

Family

ID=22353793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000000117A Expired - Fee Related JP4519972B2 (ja) 1998-12-30 2000-01-04 化学機械研磨の制御可能圧力及びローディング領域を有するキャリヤヘッド

Country Status (4)

Country Link
JP (1) JP4519972B2 (enExample)
KR (1) KR100636455B1 (enExample)
SG (1) SG82058A1 (enExample)
TW (1) TW434111B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210402546A1 (en) * 2020-06-24 2021-12-30 Applied Materials, Inc. Polishing carrier head with piezoelectric pressure control

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6776692B1 (en) * 1999-07-09 2004-08-17 Applied Materials Inc. Closed-loop control of wafer polishing in a chemical mechanical polishing system
KR100423909B1 (ko) * 2000-11-23 2004-03-24 삼성전자주식회사 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법
KR100492330B1 (ko) * 2002-10-30 2005-05-27 두산디앤디 주식회사 화학기계적 연마장치의 캐리어 헤드
JP3889744B2 (ja) 2003-12-05 2007-03-07 株式会社東芝 研磨ヘッドおよび研磨装置
US7530153B2 (en) 2005-09-21 2009-05-12 Applied Materials, Inc. Attaching components of a carrier head
KR100840013B1 (ko) * 2006-12-28 2008-06-20 주식회사 실트론 균일 압력 연마헤드
JP5236705B2 (ja) * 2010-09-08 2013-07-17 株式会社荏原製作所 研磨装置
US9610672B2 (en) * 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
KR102091418B1 (ko) * 2018-06-01 2020-04-23 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
WO2020167485A1 (en) 2019-02-14 2020-08-20 Axus Technology, Llc Substrate carrier head and processing system
KR102138700B1 (ko) * 2019-11-11 2020-07-29 (주)제이씨글로벌 화학적 기계적 연마장치용 연마헤드
JP7659565B2 (ja) * 2020-11-10 2025-04-09 アプライド マテリアルズ インコーポレイテッド 局所的なウエハ圧力を有する研磨ヘッド
US20220281064A1 (en) * 2021-03-04 2022-09-08 Applied Materials, Inc. Polishing carrier head with floating edge control
WO2022196631A1 (ja) * 2021-03-17 2022-09-22 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
US20220410340A1 (en) * 2021-06-25 2022-12-29 Globalwafers Co., Ltd. Polishing head assembly having recess and cap
CN114166952B (zh) * 2021-12-08 2023-08-29 北京晶亦精微科技股份有限公司 一种吸附检测装置及吸附检测方法
US12420376B2 (en) 2021-12-23 2025-09-23 Globalwafers Co., Ltd. Polishing head assembly having recess and cap
CN115256181B (zh) * 2022-09-23 2025-06-06 广东丰泰智能设备有限公司 一种全自动片材抛光机

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0811360B2 (ja) * 1987-01-19 1996-02-07 日本電信電話株式会社 均一加圧・接着方法
JPH01101386A (ja) * 1987-10-13 1989-04-19 Mitsubishi Metal Corp ウェーハの接着方法
JP3233664B2 (ja) * 1991-09-13 2001-11-26 土肥 俊郎 デバイス付きウェーハのプラナリゼーションポリッシング方法及びその装置
JPH08267357A (ja) * 1995-03-31 1996-10-15 Nec Corp 基板の研磨装置及びその研磨方法
ATE228915T1 (de) * 1996-01-24 2002-12-15 Lam Res Corp Halbleiterscheiben-polierkopf
JPH09246218A (ja) * 1996-03-07 1997-09-19 Hitachi Ltd 研磨方法および装置
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6019670A (en) * 1997-03-10 2000-02-01 Applied Materials, Inc. Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system
JPH10277928A (ja) * 1997-03-31 1998-10-20 Hitachi Ltd 研磨装置
US5957751A (en) * 1997-05-23 1999-09-28 Applied Materials, Inc. Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6277014B1 (en) * 1998-10-09 2001-08-21 Applied Materials, Inc. Carrier head with a flexible membrane for chemical mechanical polishing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210402546A1 (en) * 2020-06-24 2021-12-30 Applied Materials, Inc. Polishing carrier head with piezoelectric pressure control
US12030156B2 (en) * 2020-06-24 2024-07-09 Applied Materials, Inc. Polishing carrier head with piezoelectric pressure control

Also Published As

Publication number Publication date
TW434111B (en) 2001-05-16
SG82058A1 (en) 2001-07-24
KR100636455B1 (ko) 2006-10-18
KR20000048476A (ko) 2000-07-25
JP2000202762A (ja) 2000-07-25

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