TW432579B - Stackable cassette for use with wafer cassettes - Google Patents

Stackable cassette for use with wafer cassettes Download PDF

Info

Publication number
TW432579B
TW432579B TW088108262A TW88108262A TW432579B TW 432579 B TW432579 B TW 432579B TW 088108262 A TW088108262 A TW 088108262A TW 88108262 A TW88108262 A TW 88108262A TW 432579 B TW432579 B TW 432579B
Authority
TW
Taiwan
Prior art keywords
cassette
wafer
processing
wafers
supports
Prior art date
Application number
TW088108262A
Other languages
English (en)
Chinese (zh)
Inventor
Ronald R Stevens
Ravinder Aggarwal
Original Assignee
Asm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Inc filed Critical Asm Inc
Application granted granted Critical
Publication of TW432579B publication Critical patent/TW432579B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Vacuum Packaging (AREA)
TW088108262A 1998-05-22 1999-05-20 Stackable cassette for use with wafer cassettes TW432579B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/083,833 US6162006A (en) 1998-05-22 1998-05-22 Stackable cassette for use with wafer cassettes

Publications (1)

Publication Number Publication Date
TW432579B true TW432579B (en) 2001-05-01

Family

ID=22180987

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088108262A TW432579B (en) 1998-05-22 1999-05-20 Stackable cassette for use with wafer cassettes

Country Status (6)

Country Link
US (1) US6162006A (enExample)
EP (2) EP1876640A2 (enExample)
JP (1) JP2002516231A (enExample)
KR (1) KR20010043728A (enExample)
TW (1) TW432579B (enExample)
WO (1) WO1999061320A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4253189B2 (ja) * 2001-02-16 2009-04-08 周司 宮崎 半導体評価装置のユーザインターフェース
KR100426810B1 (ko) * 2001-03-21 2004-04-08 삼성전자주식회사 웨이퍼 캐리어
DE10120701A1 (de) * 2001-04-27 2002-10-31 Infineon Technologies Ag Verfahren zur Steuerung eines Prozeßgerätes zur sequentiellen Verarbeitung von Halbleiterwafern
JP3757844B2 (ja) * 2001-10-19 2006-03-22 ソニー株式会社 半導体製造方法
US6756243B2 (en) * 2001-10-30 2004-06-29 Advanced Micro Devices, Inc. Method and apparatus for cascade control using integrated metrology
US8440048B2 (en) * 2009-01-28 2013-05-14 Asm America, Inc. Load lock having secondary isolation chamber
US8587331B2 (en) * 2009-12-31 2013-11-19 Tommie E. Berry Test systems and methods for testing electronic devices
EP2538713B1 (en) 2011-06-24 2014-08-06 Alcatel Lucent Performing measurements in a digital cellular wireless telecommunication network
DE102017204910B4 (de) 2017-03-23 2018-10-04 Singulus Technologies Ag Trägerkassette und Trägerkassettenstapel

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775281A (en) * 1986-12-02 1988-10-04 Teradyne, Inc. Apparatus and method for loading and unloading wafers
US5217340A (en) * 1989-01-28 1993-06-08 Kokusai Electric Co., Ltd. Wafer transfer mechanism in vertical CVD diffusion apparatus
DE4024973C2 (de) * 1990-08-07 1994-11-03 Ibm Anordnung zum Lagern, Transportieren und Einschleusen von Substraten
US5685684A (en) * 1990-11-26 1997-11-11 Hitachi, Ltd. Vacuum processing system
DE59611078D1 (de) * 1995-03-28 2004-10-14 Brooks Automation Gmbh Be- und Entladestation für Halbleiterbearbeitungsanlagen
JP3654684B2 (ja) * 1995-05-01 2005-06-02 東京エレクトロン株式会社 処理方法及び処理装置
JP3507587B2 (ja) * 1995-06-09 2004-03-15 東京エレクトロン株式会社 熱処理装置
DE19540963C2 (de) * 1995-11-03 1999-05-20 Jenoptik Jena Gmbh Transportbehälter für scheibenförmige Objekte
US5940175A (en) * 1996-11-01 1999-08-17 Msp Corporation Method and apparatus for surface inspection in a chamber

Also Published As

Publication number Publication date
WO1999061320A1 (en) 1999-12-02
EP1876640A2 (en) 2008-01-09
EP1129010A4 (en) 2005-07-06
KR20010043728A (ko) 2001-05-25
EP1129010A1 (en) 2001-09-05
US6162006A (en) 2000-12-19
JP2002516231A (ja) 2002-06-04

Similar Documents

Publication Publication Date Title
TWI424520B (zh) Detection device
TW432579B (en) Stackable cassette for use with wafer cassettes
US10424499B2 (en) Apparatus, method and non-transitory storage medium for accommodating and processing a substrate
TW575677B (en) Method of transferring substrates with two different substrate holding end effectors
TW509988B (en) Substrate processing apparatus and substrate processing method
JP2664725B2 (ja) 半導体ウェーハを収納し搬送する装置と，物品に対して一連の処理段階を遂行する装置
TW202129816A (zh) 處理晶圓之設備及處理生產晶圓之方法
TWI345063B (enExample)
TWI896510B (zh) 處理套組外殼系統
US20220285180A1 (en) Enclosure system structure
CN1333429C (zh) 承载体、承载体搬运器和半导体搬运设备的对准方法和装置
JP4880200B2 (ja) 半導体ロードポートアラインメント装置
JPH11354625A (ja) 基板カセット
TW201364B (enExample)
JPH0774229A (ja) 半導体基板位置検知装置
TW543135B (en) Wafer alignment device
JP2002231802A (ja) 互換性を備えたウェハー搬送容器
KR100319898B1 (ko) 웨이퍼의 치수인자 측정방법 및 그 장치
CN222653927U (zh) 晶圆装载机构及半导体工艺设备
KR100887023B1 (ko) 스탠더드 메커니컬 인터페이스 시스템의 파드 락 핀 지그
JP2000269302A (ja) 蓋開閉装置の位置調整治具および位置調整方法
JPS61228639A (ja) ウエハ処理装置
JPH0384944A (ja) 半導体検査装置及び検査方法
JP2003124291A (ja) 位置測定システム、ロードポート装置及び基板搬送方法
TW469555B (en) System and cassette for testing and transporting semiconductor chips

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees