TW201364B - - Google Patents

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Publication number
TW201364B
TW201364B TW081102437A TW81102437A TW201364B TW 201364 B TW201364 B TW 201364B TW 081102437 A TW081102437 A TW 081102437A TW 81102437 A TW81102437 A TW 81102437A TW 201364 B TW201364 B TW 201364B
Authority
TW
Taiwan
Prior art keywords
wafer
station
crystal
center
transfer
Prior art date
Application number
TW081102437A
Other languages
English (en)
Chinese (zh)
Original Assignee
Ito Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ito Co Ltd filed Critical Ito Co Ltd
Application granted granted Critical
Publication of TW201364B publication Critical patent/TW201364B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW081102437A 1991-04-09 1992-03-31 TW201364B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68228591A 1991-04-09 1991-04-09

Publications (1)

Publication Number Publication Date
TW201364B true TW201364B (enExample) 1993-03-01

Family

ID=24739028

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081102437A TW201364B (enExample) 1991-04-09 1992-03-31

Country Status (4)

Country Link
EP (1) EP0508748A3 (enExample)
JP (1) JPH05144924A (enExample)
KR (1) KR920020667A (enExample)
TW (1) TW201364B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69329269T2 (de) * 1992-11-12 2000-12-28 Applied Materials, Inc. System und Verfahren für automatische Positionierung eines Substrats in einem Prozessraum
US5768125A (en) * 1995-12-08 1998-06-16 Asm International N.V. Apparatus for transferring a substantially circular article
US6502054B1 (en) 1999-11-22 2002-12-31 Lam Research Corporation Method of and apparatus for dynamic alignment of substrates
US6629053B1 (en) 1999-11-22 2003-09-30 Lam Research Corporation Method and apparatus for determining substrate offset using optimization techniques
CN115360132B (zh) * 2022-07-22 2025-10-21 中国电子科技集团公司第十一研究所 一种芯片及叠层芯片的找中方法及装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603897A (en) * 1983-05-20 1986-08-05 Poconics International, Inc. Vacuum pickup apparatus
US4752898A (en) * 1987-01-28 1988-06-21 Tencor Instruments Edge finding in wafers
US4819167A (en) * 1987-04-20 1989-04-04 Applied Materials, Inc. System and method for detecting the center of an integrated circuit wafer
US4833790A (en) * 1987-05-11 1989-05-30 Lam Research Method and system for locating and positioning circular workpieces
JPH0620097B2 (ja) * 1987-10-20 1994-03-16 富士通株式会社 ウエハ位置決め装置

Also Published As

Publication number Publication date
EP0508748A2 (en) 1992-10-14
JPH05144924A (ja) 1993-06-11
EP0508748A3 (en) 1993-02-03
KR920020667A (ko) 1992-11-21

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