KR920020667A - 웨이퍼 중심 조종장치 - Google Patents

웨이퍼 중심 조종장치 Download PDF

Info

Publication number
KR920020667A
KR920020667A KR1019920005746A KR920005746A KR920020667A KR 920020667 A KR920020667 A KR 920020667A KR 1019920005746 A KR1019920005746 A KR 1019920005746A KR 920005746 A KR920005746 A KR 920005746A KR 920020667 A KR920020667 A KR 920020667A
Authority
KR
South Korea
Prior art keywords
wafer
location
center
transfer
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019920005746A
Other languages
English (en)
Korean (ko)
Inventor
리 벨라미 브라드
Original Assignee
프랑크 엠 사죠벡
이턴 코오포레이숀
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 프랑크 엠 사죠벡, 이턴 코오포레이숀 filed Critical 프랑크 엠 사죠벡
Publication of KR920020667A publication Critical patent/KR920020667A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019920005746A 1991-04-09 1992-04-07 웨이퍼 중심 조종장치 Ceased KR920020667A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US68228591A 1991-04-09 1991-04-09
US682285 1991-04-09

Publications (1)

Publication Number Publication Date
KR920020667A true KR920020667A (ko) 1992-11-21

Family

ID=24739028

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920005746A Ceased KR920020667A (ko) 1991-04-09 1992-04-07 웨이퍼 중심 조종장치

Country Status (4)

Country Link
EP (1) EP0508748A3 (enExample)
JP (1) JPH05144924A (enExample)
KR (1) KR920020667A (enExample)
TW (1) TW201364B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69329269T2 (de) * 1992-11-12 2000-12-28 Applied Materials, Inc. System und Verfahren für automatische Positionierung eines Substrats in einem Prozessraum
US5768125A (en) * 1995-12-08 1998-06-16 Asm International N.V. Apparatus for transferring a substantially circular article
US6502054B1 (en) 1999-11-22 2002-12-31 Lam Research Corporation Method of and apparatus for dynamic alignment of substrates
US6629053B1 (en) 1999-11-22 2003-09-30 Lam Research Corporation Method and apparatus for determining substrate offset using optimization techniques
CN115360132B (zh) * 2022-07-22 2025-10-21 中国电子科技集团公司第十一研究所 一种芯片及叠层芯片的找中方法及装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4603897A (en) * 1983-05-20 1986-08-05 Poconics International, Inc. Vacuum pickup apparatus
US4752898A (en) * 1987-01-28 1988-06-21 Tencor Instruments Edge finding in wafers
US4819167A (en) * 1987-04-20 1989-04-04 Applied Materials, Inc. System and method for detecting the center of an integrated circuit wafer
US4833790A (en) * 1987-05-11 1989-05-30 Lam Research Method and system for locating and positioning circular workpieces
JPH0620097B2 (ja) * 1987-10-20 1994-03-16 富士通株式会社 ウエハ位置決め装置

Also Published As

Publication number Publication date
EP0508748A2 (en) 1992-10-14
JPH05144924A (ja) 1993-06-11
EP0508748A3 (en) 1993-02-03
TW201364B (enExample) 1993-03-01

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19920407

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19941129

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19920407

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19980223

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 19980528

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 19980223

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I