JP2002516231A - ウェハカセットとともに用いる積み重ね可能なカセット - Google Patents
ウェハカセットとともに用いる積み重ね可能なカセットInfo
- Publication number
- JP2002516231A JP2002516231A JP2000550744A JP2000550744A JP2002516231A JP 2002516231 A JP2002516231 A JP 2002516231A JP 2000550744 A JP2000550744 A JP 2000550744A JP 2000550744 A JP2000550744 A JP 2000550744A JP 2002516231 A JP2002516231 A JP 2002516231A
- Authority
- JP
- Japan
- Prior art keywords
- cassette
- wafer
- processing
- wafers
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 262
- 238000012545 processing Methods 0.000 claims abstract description 108
- 238000012360 testing method Methods 0.000 claims abstract description 73
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims description 40
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000007689 inspection Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 101100121112 Oryza sativa subsp. indica 20ox2 gene Proteins 0.000 description 1
- 101100121113 Oryza sativa subsp. japonica GA20OX2 gene Proteins 0.000 description 1
- 235000006595 Roystonea elata Nutrition 0.000 description 1
- 244000126647 Roystonea oleracea Species 0.000 description 1
- 235000008947 Roystonea oleracea Nutrition 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Vacuum Packaging (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/083,833 US6162006A (en) | 1998-05-22 | 1998-05-22 | Stackable cassette for use with wafer cassettes |
| US09/083,833 | 1998-05-22 | ||
| PCT/US1999/011188 WO1999061320A1 (en) | 1998-05-22 | 1999-05-20 | Stackable cassette for use with wafer cassettes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002516231A true JP2002516231A (ja) | 2002-06-04 |
| JP2002516231A5 JP2002516231A5 (enExample) | 2006-07-06 |
Family
ID=22180987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000550744A Pending JP2002516231A (ja) | 1998-05-22 | 1999-05-20 | ウェハカセットとともに用いる積み重ね可能なカセット |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6162006A (enExample) |
| EP (2) | EP1876640A2 (enExample) |
| JP (1) | JP2002516231A (enExample) |
| KR (1) | KR20010043728A (enExample) |
| TW (1) | TW432579B (enExample) |
| WO (1) | WO1999061320A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4253189B2 (ja) * | 2001-02-16 | 2009-04-08 | 周司 宮崎 | 半導体評価装置のユーザインターフェース |
| KR100426810B1 (ko) * | 2001-03-21 | 2004-04-08 | 삼성전자주식회사 | 웨이퍼 캐리어 |
| DE10120701A1 (de) * | 2001-04-27 | 2002-10-31 | Infineon Technologies Ag | Verfahren zur Steuerung eines Prozeßgerätes zur sequentiellen Verarbeitung von Halbleiterwafern |
| JP3757844B2 (ja) * | 2001-10-19 | 2006-03-22 | ソニー株式会社 | 半導体製造方法 |
| US6756243B2 (en) * | 2001-10-30 | 2004-06-29 | Advanced Micro Devices, Inc. | Method and apparatus for cascade control using integrated metrology |
| US8440048B2 (en) * | 2009-01-28 | 2013-05-14 | Asm America, Inc. | Load lock having secondary isolation chamber |
| US8587331B2 (en) * | 2009-12-31 | 2013-11-19 | Tommie E. Berry | Test systems and methods for testing electronic devices |
| EP2538713B1 (en) | 2011-06-24 | 2014-08-06 | Alcatel Lucent | Performing measurements in a digital cellular wireless telecommunication network |
| DE102017204910B4 (de) | 2017-03-23 | 2018-10-04 | Singulus Technologies Ag | Trägerkassette und Trägerkassettenstapel |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4775281A (en) * | 1986-12-02 | 1988-10-04 | Teradyne, Inc. | Apparatus and method for loading and unloading wafers |
| US5217340A (en) * | 1989-01-28 | 1993-06-08 | Kokusai Electric Co., Ltd. | Wafer transfer mechanism in vertical CVD diffusion apparatus |
| DE4024973C2 (de) * | 1990-08-07 | 1994-11-03 | Ibm | Anordnung zum Lagern, Transportieren und Einschleusen von Substraten |
| US5685684A (en) * | 1990-11-26 | 1997-11-11 | Hitachi, Ltd. | Vacuum processing system |
| DE59611078D1 (de) * | 1995-03-28 | 2004-10-14 | Brooks Automation Gmbh | Be- und Entladestation für Halbleiterbearbeitungsanlagen |
| JP3654684B2 (ja) * | 1995-05-01 | 2005-06-02 | 東京エレクトロン株式会社 | 処理方法及び処理装置 |
| JP3507587B2 (ja) * | 1995-06-09 | 2004-03-15 | 東京エレクトロン株式会社 | 熱処理装置 |
| DE19540963C2 (de) * | 1995-11-03 | 1999-05-20 | Jenoptik Jena Gmbh | Transportbehälter für scheibenförmige Objekte |
| US5940175A (en) * | 1996-11-01 | 1999-08-17 | Msp Corporation | Method and apparatus for surface inspection in a chamber |
-
1998
- 1998-05-22 US US09/083,833 patent/US6162006A/en not_active Expired - Lifetime
-
1999
- 1999-05-20 EP EP07019695A patent/EP1876640A2/en not_active Withdrawn
- 1999-05-20 EP EP99925708A patent/EP1129010A4/en not_active Withdrawn
- 1999-05-20 JP JP2000550744A patent/JP2002516231A/ja active Pending
- 1999-05-20 KR KR1020007013047A patent/KR20010043728A/ko not_active Abandoned
- 1999-05-20 TW TW088108262A patent/TW432579B/zh not_active IP Right Cessation
- 1999-05-20 WO PCT/US1999/011188 patent/WO1999061320A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| TW432579B (en) | 2001-05-01 |
| WO1999061320A1 (en) | 1999-12-02 |
| EP1876640A2 (en) | 2008-01-09 |
| EP1129010A4 (en) | 2005-07-06 |
| KR20010043728A (ko) | 2001-05-25 |
| EP1129010A1 (en) | 2001-09-05 |
| US6162006A (en) | 2000-12-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060516 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060516 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081105 |
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| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20090130 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20090206 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090701 |