TW428224B - Wafer heating method and device adopting the same - Google Patents

Wafer heating method and device adopting the same

Info

Publication number
TW428224B
TW428224B TW088122012A TW88122012A TW428224B TW 428224 B TW428224 B TW 428224B TW 088122012 A TW088122012 A TW 088122012A TW 88122012 A TW88122012 A TW 88122012A TW 428224 B TW428224 B TW 428224B
Authority
TW
Taiwan
Prior art keywords
wafer
heat medium
heat
vapor
heating
Prior art date
Application number
TW088122012A
Other languages
English (en)
Inventor
Chan-Hoon Park
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW428224B publication Critical patent/TW428224B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
TW088122012A 1999-07-26 1999-12-15 Wafer heating method and device adopting the same TW428224B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019990030350A KR100351049B1 (ko) 1999-07-26 1999-07-26 웨이퍼 가열 방법 및 이를 적용한 장치

Publications (1)

Publication Number Publication Date
TW428224B true TW428224B (en) 2001-04-01

Family

ID=36693973

Family Applications (2)

Application Number Title Priority Date Filing Date
TW088122012A TW428224B (en) 1999-07-26 1999-12-15 Wafer heating method and device adopting the same
TW089114514A TW473873B (en) 1999-07-26 2000-07-20 Method and apparatus for heating a wafer, and method and apparatus for baking a photoresist film on a wafer

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW089114514A TW473873B (en) 1999-07-26 2000-07-20 Method and apparatus for heating a wafer, and method and apparatus for baking a photoresist film on a wafer

Country Status (6)

Country Link
JP (2) JP2001085324A (zh)
KR (1) KR100351049B1 (zh)
CN (2) CN1193266C (zh)
DE (2) DE10036183B4 (zh)
GB (2) GB2352507A (zh)
TW (2) TW428224B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3882141B2 (ja) * 2002-06-13 2007-02-14 日鉱金属株式会社 気相成長装置および気相成長方法
US7170582B2 (en) * 2004-12-13 2007-01-30 Asml Netherlands B.V. Support device and lightographic apparatus
JP4657940B2 (ja) * 2006-02-10 2011-03-23 東京エレクトロン株式会社 基板の処理システム
JP2007258303A (ja) * 2006-03-22 2007-10-04 Tokyo Electron Ltd 基板熱処理装置
WO2008013443A2 (en) * 2006-07-28 2008-01-31 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
US20080142208A1 (en) * 2006-12-15 2008-06-19 Applied Materials, Inc. Method and apparatus for heating a substrate
US20080145038A1 (en) * 2006-12-15 2008-06-19 Applied Materials, Inc. Method and apparatus for heating a substrate
WO2010015511A1 (en) 2008-08-08 2010-02-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI757314B (zh) * 2016-07-28 2022-03-11 荷蘭商Ａｓｍｌ荷蘭公司 基板夾持裝置、用於製造此裝置之方法及用於處理或將樣本成像之儀器及方法
US20180096867A1 (en) * 2016-09-30 2018-04-05 Momentive Performance Materials Inc. Heating apparatus with controlled thermal contact
JP6837202B2 (ja) * 2017-01-23 2021-03-03 パナソニックＩｐマネジメント株式会社 基材加熱装置および方法および電子デバイスの製造方法
CN108662930A (zh) * 2017-09-28 2018-10-16 上海微电子装备（集团）股份有限公司 一种热板装置
CN108158040B (zh) * 2018-01-03 2023-11-21 云南中烟工业有限责任公司 一种均匀发热的mems电子烟芯片及其制造方法
CN108185526B (zh) * 2018-01-03 2023-09-01 云南中烟工业有限责任公司 一种集成二极管温度传感器的mems发热芯片及其制造方法
CN108158039B (zh) * 2018-01-03 2023-07-11 云南中烟工业有限责任公司 一种集成多个Pt温度传感器的MEMS发热芯片及其制造方法
CN108354228B (zh) * 2018-01-03 2023-07-25 云南中烟工业有限责任公司 一种集成Pt温度传感器的MEMS发热芯片及其制造方法
CN108538760B (zh) * 2018-04-03 2020-11-27 德淮半导体有限公司 热板结构
CN112789714A (zh) * 2018-08-01 2021-05-11 莫门蒂夫性能材料股份有限公司 可拆卸的热矫平器
KR102236933B1 (ko) * 2019-10-21 2021-04-05 정승수 반도체 및 디스플레이 패널 제조용 히터 블록
US11487206B2 (en) 2019-12-30 2022-11-01 Texas Instruments Incorporated Methods and apparatus for digital material deposition onto semiconductor wafers
JP7491556B2 (ja) * 2020-06-23 2024-05-28 トクデン株式会社 伝熱プレート

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2129018B (en) * 1982-08-30 1986-01-29 Ricoh Kk Vacuum evaporation apparatus
JPH06103670B2 (ja) * 1989-04-04 1994-12-14 三菱電機株式会社 半導体ウェハ加熱装置
DE3915039A1 (de) * 1989-05-08 1990-11-15 Balzers Hochvakuum Hubtisch
JP2935867B2 (ja) * 1990-03-28 1999-08-16 ホーヤ株式会社 基板熱処理装置
JP3119950B2 (ja) * 1992-09-30 2000-12-25 株式会社東芝 パターン形成方法
JP2907687B2 (ja) * 1993-06-10 1999-06-21 大日本スクリーン製造株式会社 基板加熱装置
JPH07152158A (ja) * 1993-11-30 1995-06-16 Sigma Merutetsuku Kk 基板加熱装置
JP3614503B2 (ja) * 1995-04-18 2005-01-26 富士写真フイルム株式会社 感光性平版印刷版の加熱処理方法及び装置
JP3983831B2 (ja) * 1995-05-30 2007-09-26 シグマメルテック株式会社 基板ベーキング装置及び基板ベーキング方法
JPH10189611A (ja) * 1996-12-24 1998-07-21 Sony Corp 半導体ウェーハの加熱装置
KR100339875B1 (ko) * 1998-12-28 2002-10-11 (주) 대홍기업 판형 히팅 장치

Also Published As

Publication number Publication date
JP2001093795A (ja) 2001-04-06
GB2352507A (en) 2001-01-31
KR20010011123A (ko) 2001-02-15
GB0018386D0 (en) 2000-09-13
CN1282003A (zh) 2001-01-31
DE10036001A1 (de) 2001-02-22
GB2352508A (en) 2001-01-31
CN1193266C (zh) 2005-03-16
CN1282005A (zh) 2001-01-31
JP2001085324A (ja) 2001-03-30
CN1249522C (zh) 2006-04-05
KR100351049B1 (ko) 2002-09-09
GB0018282D0 (en) 2000-09-13
TW473873B (en) 2002-01-21
DE10036183A1 (de) 2001-02-01
DE10036183B4 (de) 2004-06-17
GB2352508B (en) 2003-10-08

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees